A cooling liquid stirring device for silicon wafer wire cutting

Abstract

The utility model relates to the field of silicon wafer wire cutting, and specifically discloses a cooling liquid stirring device for silicon wafer wire cutting, comprising a stirring tank, an upper cover plate is arranged above the stirring tank, a stirring mechanism is arranged below the upper cover plate, an inner cooling pipe is installed inside the stirring tank below the stirring mechanism, the stirring mechanism comprises: a mounting seat, a blade connecting rod, a stirring blade, an outer cooling bin is provided inside the stirring tank, a water injection connecting pipe is installed on one side of the lower end of the outer cooling bin, a drain valve pipe is installed on the other side of the lower end of the inner cooling pipe, a partition is installed inside the outer cooling bin, a water inlet pipe is installed below one side of the stirring tank, and a drain pipe is installed above the other side of the stirring tank. After the water source is connected to the water inlet pipe and the water injection connecting pipe, water will fill the inner part of the outer cooling bin and the inner cooling pipe, so that the outer side and the inner side of the stirring tank can be cooled synchronously to ensure that the temperature of the internal coolant does not rise too high.

Description

Technical Field

[0001] The utility model relates to the field of silicon wafer wire cutting, in particular to a cooling liquid stirring device for silicon wafer wire cutting. Background Art

[0002] Silicon wafers are important materials for making integrated circuits. Various semiconductor devices can be made by photolithography, ion implantation and other methods. The cutting fluid used in the silicon wafer cutting process can play a cooling role, dissipate the heat generated by the cutting machine, and reduce cutting stress. The coolant used in silicon wafer cutting is mostly a mixture of multiple liquids mixed and stirred into a mixed liquid for use. Since various types of coolants in wire cutting contain oil or soap components, they need to be stirred for a long time.

[0003] However, after a long period of stirring, the overall temperature of the coolant will rise, which will affect the cooling effect of the coolant. Utility Model Content

[0004] In view of the deficiencies in the prior art, the utility model provides a cooling liquid stirring device for silicon wafer wire cutting, which solves the problems mentioned in the above background.

[0005] The utility model provides the following technical scheme: a cooling liquid stirring device for silicon wafer wire cutting, comprising a stirring tank, an upper cover plate is arranged above the stirring tank, a stirring mechanism is arranged below the upper cover plate, an inner cooling pipe is installed inside the stirring tank below the stirring mechanism, the stirring mechanism comprises: a mounting seat, a paddle connecting rod, and a stirring paddle, an outer cooling bin is opened inside the stirring tank, a water injection connecting pipe is installed on one side of the lower end of the outer cooling bin, a drain valve pipe is installed on the other side of the lower end of the inner cooling pipe, a partition is installed inside the outer cooling bin, a water inlet pipe is installed below one side of the stirring tank, and a drain pipe is installed above the other side of the stirring tank.

[0006] As a further solution of the utility model: a stirring motor is installed on the upper surface of the upper cover plate, and a driving shaft is connected between the stirring motor and the mounting seat.

[0007] As a further solution of the utility model: a support frame is installed on the outer side of the lower end of the mixing tank, a clamping pad is installed on the lower surface of the upper cover plate, and a movable ball is provided on the lower surface of the mounting seat above the inner cooling pipe.

[0008] As a further solution of the utility model: the paddle connecting rod is fixedly connected to the mounting seat, and the stirring paddle and the paddle connecting rod are fixed by bolts.

[0009] As a further solution of the utility model: the water inlet pipe and the drain pipe are both arranged through the external cooling bin, and the partition is fixedly connected to the external cooling bin.

[0010] As a further solution of the present invention: the drive shaft is fixedly connected to the mounting seat.

[0011] As a further solution of the utility model: the water injection connecting pipe and the drainage valve pipe are both arranged to penetrate the inner cooling pipe.

[0012] As a further solution of the utility model: the stirring motor is clamped with the stirring tank through the clamping pad.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] After connecting to an external water source via the water inlet pipe and the water injection pipe, water will fill the outside cooling bin and the inside of the inner cooling pipe, thereby achieving synchronous cooling of the outside and inside of the mixing tank to ensure that the temperature of the internal coolant does not rise too high.

[0015] The movable ball pair on the lower surface of the mounting seat inside the driving mechanism contacts the upper surface of the inner cooling tube to assist movement, and the paddle connecting rod and stirring paddles installed in an array on the lower surface of the mounting seat can ensure the mixing efficiency of the internal raw materials. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the structure of a cooling liquid stirring device for silicon wafer wire cutting;

[0017] Figure 2 It is a structural schematic diagram of a stirring mechanism in a cooling liquid stirring device for silicon wafer wire cutting;

[0018] Figure 3 A cross-sectional view of a stirring tank in a cooling liquid stirring device for silicon wafer wire cutting;

[0019] Figure 4 The figure is a top view of a stirring tank in a cooling liquid stirring device for wire cutting of silicon wafers.

[0020] In the figure: 1. stirring tank; 2. upper cover plate; 3. stirring motor; 4. water inlet pipe; 5. drain pipe; 6. support frame; 101. external cooling chamber; 102. internal cooling pipe; 103. water injection pipe; 104. drain valve pipe; 105. partition; 201. clamping pad; 202. drive shaft; 203. mounting seat; 204. movable ball; 205. paddle connecting rod; 206. stirring paddle. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] like Figure 1-4 As shown, this embodiment provides a cooling liquid stirring device for silicon wafer wire cutting, including a stirring tank 1, an upper cover plate 2 is arranged above the stirring tank 1, a stirring mechanism is arranged below the upper cover plate 2, an inner cooling pipe 102 is installed inside the stirring tank 1 below the stirring mechanism, and the stirring mechanism includes: a mounting seat 203, a blade connecting rod 205, and a stirring blade 206, the blade connecting rod 205 is fixedly connected to the mounting seat 203, the stirring blade 206 is fixed to the blade connecting rod 205 by bolts, and an external cooling pipe 102 is arranged inside the stirring tank 1. The outer cooling tank 101 is provided with a water injection pipe 103 on one side of the lower end of the outer cooling tank 101, and a drain valve pipe 104 is provided on the other side of the lower end of the inner cooling pipe 102. The water injection pipe 103 and the drain valve pipe 104 are both connected with the inner cooling pipe 102. A partition 105 is provided inside the outer cooling tank 101, and the partition 105 is fixedly connected with the outer cooling tank 101. A water inlet pipe 4 is provided at the lower part of one side of the stirring tank 1, and a drain pipe 5 is provided at the upper part of the other side of the stirring tank 1. The water inlet pipe 4 and the drain pipe 5 are both connected with the outer cooling tank 101.

[0023] like Figure 2-4 As shown, in this embodiment, a stirring motor 3 is installed on the upper surface of the upper cover plate 2, a driving shaft 202 is connected between the stirring motor 3 and the mounting seat 203, the driving shaft 202 is fixedly connected to the mounting seat 203, a support frame 6 is installed on the outer side of the lower end of the stirring tank 1, a clamping pad 201 is installed on the lower surface of the upper cover plate 2, the stirring motor 3 is clamped with the stirring tank 1 through the clamping pad 201, and a movable ball 204 is provided on the lower surface of the mounting seat 203 above the inner cooling pipe 102.

[0024] The working principle of the utility model is as follows: when in use, after all the raw materials to be stirred and mixed are filled into the mixing tank 1, the upper cover plate 2 is clamped on the upper end of the mixing tank 1 by the clamping pad 201, and the movable balls 204 on the lower surface of the mounting seat 203 inside the driving mechanism are in contact with the upper surface of the inner cooling pipe 102. The driving shaft 202 is driven by the stirring motor 3 to rotate and drive the mounting seat 203 to rotate as a whole. Then, the movable balls 204 arranged will assist the rotation of the mounting seat 203, and the paddle connecting rod 204 arrayed on the lower surface of the mounting seat 203 will rotate. 5 drives the stirring blade 206 to stir and mix the raw materials inside the stirring tank 1. After the water source is connected to the water inlet pipe 4 and the water injection connecting pipe 103, the water will fill the inside of the external cooling bin 101 and the internal cooling pipe 102. The water in the external cooling bin 101 will rise under the action of the partition 105 and then be discharged under the action of the drain pipe 5. At the same time, the water in the internal cooling pipe 102 will also be discharged to the outside through the drain valve pipe 104. Therefore, the outside and inside of the stirring tank 1 can be cooled synchronously to ensure that the temperature of the internal coolant does not rise too high.

[0025] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or apparatus.

[0026] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A cooling liquid stirring device for silicon wafer wire cutting, comprising a stirring tank (1), characterized in that: An upper cover plate (2) is arranged above the stirring tank (1), a stirring mechanism is arranged below the upper cover plate (2), an inner cooling pipe (102) is installed below the stirring mechanism and located inside the stirring tank (1), the stirring mechanism comprising: a mounting seat (203), a blade connecting rod (205), and a stirring blade (206); an outer cooling bin (101) is provided inside the stirring tank (1), a water injection connecting pipe (103) is installed on one side of the lower end of the outer cooling bin (101), a drainage valve pipe (104) is installed on the other side of the lower end of the inner cooling pipe (102), a partition plate (105) is installed inside the outer cooling bin (101), a water inlet pipe (4) is installed below one side of the stirring tank (1), and a drainage pipe (5) is installed above the other side of the stirring tank (1).

2. A cooling liquid stirring device for silicon wafer wire cutting according to claim 1, characterized in that: A stirring motor (3) is mounted on the upper surface of the upper cover plate (2), and a driving shaft (202) is connected between the stirring motor (3) and the mounting seat (203).

3. A cooling liquid stirring device for silicon wafer wire cutting according to claim 2, characterized in that: A support frame (6) is installed on the outer side of the lower end of the stirring tank (1), a clamping pad (201) is installed on the lower surface of the upper cover plate (2), and a movable ball (204) is provided on the lower surface of the mounting seat (203) located above the inner cooling pipe (102).

4. The cooling liquid stirring device for silicon wafer wire cutting according to claim 1, characterized in that: The blade connecting rod (205) is fixedly connected to the mounting seat (203), and the stirring blade (206) is fixed to the blade connecting rod (205) by means of bolts.

5. The cooling liquid stirring device for silicon wafer wire cutting according to claim 1, characterized in that: The water inlet pipe (4) and the water discharge pipe (5) are both arranged to penetrate the external cooling bin (101), and the partition plate (105) is fixedly connected to the external cooling bin (101).

6. The cooling liquid stirring device for silicon wafer wire cutting according to claim 2, characterized in that: The driving shaft (202) is fixedly connected to the mounting seat (203).

7. The cooling liquid stirring device for silicon wafer wire cutting according to claim 1, characterized in that: The water injection connecting pipe (103) and the water discharge valve pipe (104) are both arranged to penetrate the inner cooling pipe (102).

8. The cooling liquid stirring device for silicon wafer wire cutting according to claim 3, characterized in that: The stirring motor (3) is clamped to the stirring tank (1) via the clamping pad (201).

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