A semiconductor aging hot and cold test device

Abstract

The utility model discloses a semiconductor aging hot and cold test device, including two transmission plates, both sides between the two opposite sides of the two transmission plates are rotatably connected with transmission rollers, the outer surfaces of the two transmission rollers are connected with a transmission belt, and one side of the transmission plate located in front is fixedly connected with a motor through a fixed frame, and the output shaft of the motor is fixedly connected with a rotating rod through a coupling. The utility model relates to the field of semiconductor testing technology. The semiconductor aging hot and cold test device is sequentially transmitted through semiconductors in a plurality of test frames, and is heated and cooled respectively by a heating wire and a semiconductor cooler, so that an electric fan blows out hot air and cold air, and the hot and cold air are circulated and mixed to room temperature through two ventilation pipes, so that the semiconductor can be conveniently tested at high temperature, room temperature and low temperature in turn, and the semiconductor can be quickly and conveniently restored to room temperature, which effectively improves the efficiency of semiconductor testing.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor testing, in particular to a semiconductor aging cold and hot testing device. Background Art

[0002] Whether from the perspective of science and technology or economic development, the importance of semiconductors is enormous. During the production and processing of semiconductors, hot and cold tests are often required to judge the semiconductor's tolerance to hot and cold shocks by its aging degree. Existing semiconductor testing equipment can usually only inspect and process a single semiconductor. In actual operation, in order to ensure detection efficiency, it is necessary to take out the semiconductor before it returns to normal temperature and then conduct the next set of tests. Therefore, there are certain limitations. Patent documents have now been made to improve this.

[0003] For example, Chinese patent CN216411471U discloses a semiconductor aging hot and cold test device, the technical solution of which includes a bottom plate and a turntable, a support cylinder is fixedly mounted on the top outer wall of the bottom plate, and the top end of the support cylinder is rotatably connected to the turntable through a bearing, a driving mechanism is installed on the opposite side of the support cylinder and the turntable, a plurality of equally distributed supporting mechanisms are fixedly mounted on the top outer wall of the turntable, a symmetrically distributed mounting frame 1 and mounting frame 2 are fixedly mounted on the top outer wall of the bottom plate, and a test assembly is installed on both the mounting frame 1 and the mounting frame 2; a semiconductor aging hot and cold test device, which is provided with a supporting mechanism, can effectively limit and place the semiconductor to be tested by using a bracket provided with a through hole and a supporting end rod, and can ensure that the semiconductor can be fully in contact with the air, thereby facilitating the subsequent heat exchange effect, so as to improve the effect of the semiconductor aging test.

[0004] Although the above patent facilitates the subsequent heat exchange to improve the effect of semiconductor aging test, when performing hot and cold alternating tests on semiconductor devices, it is necessary to wait for the surface temperature of the semiconductor devices to return to normal temperature, which takes a certain amount of time and affects the efficiency of semiconductor aging test. Utility Model Content

[0005] In view of the deficiencies in the prior art, the utility model provides a semiconductor aging hot and cold testing device, which solves the problem of consuming a certain amount of time waiting for the surface temperature of the semiconductor device to return to normal temperature.

[0006] To achieve the above purpose, the utility model is implemented by the following technical solutions: a semiconductor aging hot and cold test device, comprising two transmission plates, both sides between the opposite sides of the two transmission plates are rotatably connected with transmission rollers, the outer surfaces of the two transmission rollers are transmission-connected with a transmission belt, one side of the transmission plate located in the front is fixedly connected with a motor through a fixed frame, the output shaft of the motor is fixedly connected with a rotating rod through a coupling, one end of the rotating rod penetrates the transmission plate and is fixedly connected to the front of the right transmission roller, a plurality of test frames are arranged above the transmission belt, both sides of the top of the transmission plate are fixedly connected with support plates, a fixed box is fixedly connected between the opposite sides of the plurality of support plates, two partition plates are fixedly connected between the front and rear of the inner cavity of the fixed box, an electric fan is fixedly connected to the top of the fixed box and located on one side of the partition plate through an opening, a semiconductor cooler and a heating wire are fixedly installed from right to left in sequence between the front and rear of the inner cavity of the fixed box and located on both sides of the two partition plates, and a ventilation pipe is connected to one side of the partition plate.

[0007] Preferably, a plurality of limit plates are fixedly mounted on the outer surface of the transmission belt, and a movable plate is fixedly connected to the bottom of the test frame.

[0008] Preferably, a limiting groove matched with the limiting plate is provided at the bottom of the movable plate.

[0009] Preferably, the front and rear parts of the top of the movable plate are fixedly connected with connecting plates.

[0010] Preferably, a plurality of ventilation holes are provided at the front and rear of the test frame.

[0011] Preferably, a through-hole plate is fixedly connected between the front and rear parts of the inner cavity of the fixed box and located on one side of the partition plate.

[0012] Beneficial Effects

[0013] The utility model provides a semiconductor aging hot and cold test device. Compared with the existing technology, it has the following beneficial effects:

[0014] (1) The utility model transmits the semiconductors in a plurality of test frames in sequence, heats and cools the semiconductors respectively through a heating wire and a semiconductor cooler, causes an electric fan to blow out hot air and cold air, and circulates the hot and cold air to mix at room temperature through two ventilation pipes, thereby conveniently testing the semiconductors at high temperature, room temperature and low temperature in sequence, and can conveniently and quickly restore the semiconductors to room temperature, effectively improving the efficiency of semiconductor testing.

[0015] (2) The utility model uses a transmission belt to drive the test frame to move in a timely and quantitative manner, so that multiple semiconductors are tested at high temperature, room temperature and low temperature in turn, thereby quickly testing the semiconductors and making the operation more convenient. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the external structure of the utility model;

[0017] Figure 2 It is a structural schematic diagram of the transmission roller, transmission belt, rotating rod, limiting plate and moving plate of the utility model;

[0018] Figure 3 This is a schematic diagram of the internal structure of the fixed box, electric fan, semiconductor cooler, heating wire, partition plate, port plate and ventilation pipe of the utility model;

[0019] Figure 4 It is a bottom view of the internal structure of the test frame, movable plate, limiting groove, connecting plate and air vents of the utility model.

[0020] In the figure: 1. transmission plate; 2. transmission roller; 3. transmission belt; 4. motor; 5. rotating rod; 6. support plate; 7. test frame; 8. fixing box; 9. electric fan; 10. semiconductor cooler; 11. heating wire; 12. partition plate; 13. port plate; 14. ventilation pipe; 15. limit plate; 16. movable plate; 17. limit groove; 18. connecting plate; 19. ventilation hole. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0022] See also Figure 1-4The utility model provides a technical solution: a semiconductor aging hot and cold test device, comprising two transmission plates 1, transmission rollers 2 are rotatably connected on both sides between the opposite sides of the two transmission plates 1, and a transmission belt 3 is transmission-connected between the outer surfaces of the two transmission rollers 2. A motor 4 is fixedly connected to one side of the front transmission plate 1 through a fixed frame. The motor 4 is a servo motor, which is electrically connected to an external power supply and controlled by a control switch. The output shaft of the motor 4 is fixedly connected to a rotating rod 5 through a coupling. One end of the rotating rod 5 passes through the transmission plate 1 and is fixedly connected to the front of the right transmission roller 2. A plurality of test frames 7 are arranged above the transmission belt 3. Support plates 6 are fixedly connected to both sides of the top of the transmission plate 1. The opposite sides of the plurality of support plates 6 A fixed box 8 is fixedly connected in between, two partition plates 12 are fixedly connected between the front and rear parts of the inner cavity of the fixed box 8, a through plate 13 is fixedly connected between the front and rear parts of the inner cavity of the fixed box 8 and on one side of the partition plate 12, an electric fan 9 is fixedly connected to the top of the fixed box 8 and on one side of the partition plate 12 through an opening, the electric fan 9 is electrically connected to an external power supply and is controlled by a control switch, a semiconductor cooler 10 and a heating wire 11 are fixedly installed in sequence from right to left between the front and rear parts of the inner cavity of the fixed box 8 and on both sides of the two partition plates 12, the semiconductor cooler 10 and the heating wire 11 are electrically connected to the external power supply and are controlled by a control switch, and a ventilation pipe 14 is connected to one side of the partition plate 12.

[0023] It should be noted that the motor 4 drives the rotating rod 5 to rotate at regular intervals, so that the rotating rod 5 drives the transmission belt 3 to transmit a certain distance at regular intervals, so that the transmission belt 3 drives the test frame 7 to move to the bottom of the next test step.

[0024] Furthermore, in order to drive the test frame 7 to move, a plurality of limit plates 15 are fixedly installed on the outer surface of the transmission belt 3 , a movable plate 16 is fixedly connected to the bottom of the test frame 7 , and a limit groove 17 adapted to the limit plate 15 is formed at the bottom of the movable plate 16 .

[0025] It should be noted that after the semiconductor in the test frame 7 is tested, when it moves to the rightmost side, the test frame 7 is manually removed, and then the installed test frame 7 is installed on the left limiting plate 15, and a new semiconductor is placed in the left test frame 7.

[0026] Furthermore, in order to ventilate the test frame 7 , the front and rear of the top of the movable plate 16 are fixedly connected with connecting plates 18 , and the front and rear of the test frame 7 are provided with a plurality of ventilation holes 19 .

[0027] When in use, a semiconductor is placed on the connecting plate 18 in a plurality of test frames 7, and the rotating rod 5 is driven to rotate by controlling the motor 4, and the rotating rod 5 drives the transmission roller 2 to rotate, so that the transmission roller 2 drives the transmission belt 3 to transmit, and the transmission belt 3 drives the test frame 7 to move quantitatively through the limit plate 15 and the moving plate 16, so that the semiconductor moves to the bottom of the heating wire 11, so that the heating wire 11 is heated, and by controlling the plurality of electric fans 9 to blow air, the electric fans 9 blow the heat emitted by the heating wire 11 into the test frame 7 below, so as to perform a heating test on the semiconductor in the test frame 7;

[0028] After the semiconductor heating test is completed, the motor 4 is continuously controlled to drive the transmission belt 3 to transmit a certain distance, so that the semiconductor after the heating test is moved to the bottom of the ventilation pipe 14, and at the same time, the cold air of the semiconductor cooler 10 and the hot air of the heating wire 11 are transmitted to between the two partition plates 12 through the two ventilation pipes 14, so that the normal temperature wind cools the semiconductor below to a normal temperature state;

[0029] After the semiconductor reaches room temperature, and the semiconductor on the left has been heated and tested by the heating wire 11, the semiconductor in the test frame 7 is driven again by the transmission belt 3 to move the semiconductor to the bottom of the semiconductor cooler 10, and the electric fan 9 blows cold air through the semiconductor cooler 10 to perform a low-temperature test on the semiconductor. The semiconductor in the test frame 7 is driven by the transmission belt 3 to move in a timed and quantitative manner, and the semiconductor is tested in a flow-type manner at high temperature, room temperature and low temperature in turn.

Claims

1. A semiconductor aging hot and cold test device, comprising two transmission plates (1), characterized in that: The two sides of the two transmission plates (1) are rotatably connected with transmission rollers (2), the outer surfaces of the two transmission rollers (2) are transmission-connected with a transmission belt (3), one side of the transmission plate (1) located in the front is fixedly connected with a motor (4) through a fixed frame, the output shaft of the motor (4) is fixedly connected with a rotating rod (5) through a coupling, one end of the rotating rod (5) passes through the transmission plate (1) and is fixedly connected to the front part of the right transmission roller (2), a plurality of test frames (7) are arranged above the transmission belt (3), and the two sides of the top of the transmission plate (1) are fixedly connected with A support plate (6), a fixed box (8) is fixedly connected between the opposite sides of a plurality of the support plates (6), two partition plates (12) are fixedly connected between the front and rear parts of the inner cavity of the fixed box (8), an electric fan (9) is fixedly connected to the top of the fixed box (8) and located on one side of the partition plate (12) through an opening, a semiconductor cooler (10) and a heating wire (11) are fixedly installed in sequence from right to left between the front and rear parts of the inner cavity of the fixed box (8) and located on both sides of the two partition plates (12), and a ventilation pipe (14) is connected to one side of the partition plate (12).

2. A semiconductor aging hot and cold test device according to claim 1, characterized in that: A plurality of limiting plates (15) are fixedly mounted on the outer surface of the transmission belt (3), and a movable plate (16) is fixedly connected to the bottom of the test frame (7).

3. A semiconductor aging hot and cold test device according to claim 2, characterized in that: The bottom of the movable plate (16) is provided with a limiting groove (17) adapted to the limiting plate (15).

4. A semiconductor aging hot and cold test device according to claim 2, characterized in that: The front and rear parts of the top of the movable plate (16) are both fixedly connected with connecting plates (18).

5. The semiconductor aging hot and cold test device according to claim 1, characterized in that: The front and rear parts of the test frame (7) are both provided with a plurality of ventilation holes (19).

6. A semiconductor aging hot and cold test device according to claim 1, characterized in that: A through-hole plate (13) is fixedly connected between the front and rear parts of the inner cavity of the fixed box (8) and located on one side of the partition plate (12).

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