Backlight module, liquid crystal display equipment and display device

Abstract

The utility model provides a backlight module. The backlight module comprises a first transparent substrate; the converging enhancement layer is located on the first surface of the first transparent substrate and comprises a plurality of prisms which are periodically arranged and are of pyramid structures; the light uniformizing structure layer is located on the converging enhancement layer and comprises a plurality of dimming patterns; the driving wiring layer is positioned on the dodging structure layer; the LED chip array is positioned on the driving wiring layer; the packaging layer covers the LED chip array; the reflecting layer is positioned on the packaging layer; wherein at least one of the plurality of dimming patterns comprises a plurality of dimming sub-patterns, the orthographic projection of the plurality of dimming sub-patterns on the first transparent substrate surrounds the orthographic projection of the corresponding LED chip on the first transparent substrate, and the transmissivity of the plurality of dimming sub-patterns is in positive correlation with the distance between the plurality of dimming sub-patterns and the corresponding LED chip. The utility model further relates to liquid crystal display equipment comprising the backlight module and a display device comprising the liquid crystal display equipment.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular, to a backlight module, a liquid crystal display device including the backlight module, and a display apparatus including the liquid crystal display device. Background Art

[0002] At present, display devices including liquid crystal display devices have been widely used in all aspects of daily life. Therefore, the requirements for lightness and thinness of liquid crystal display devices are also increasing. Existing liquid crystal display devices generally use three glass substrates and two separate polarizers, so they have a large thickness and weight. In addition, in order to improve the uniform light effect, the existing backlight module generally uses a thick diffuser plate or a multi-layer optical film layer, which makes the backlight module have a large thickness, which also makes it difficult to achieve the lightness and thinness of the liquid crystal display device. Utility Model Content

[0003] According to the first aspect of the present disclosure, a backlight module is provided, comprising: a first transparent substrate, comprising a first surface and a second surface parallel to each other; a convergence enhancement layer, located on the first surface of the first transparent substrate and comprising a plurality of prisms of a periodically arranged pyramid structure; a uniform light structure layer, located on the convergence enhancement layer and comprising a plurality of dimming patterns; a drive wiring layer, located on the uniform light structure layer and comprising a plurality of drive wirings; an LED chip array, comprising a plurality of LED chips, arranged on the drive wiring layer so that the plurality of LED chips are powered by the plurality of drive wirings; a packaging layer, located on the LED chip array and covering the LED chip array; a reflective layer, located on the packaging layer; wherein at least one of the plurality of dimming patterns comprises a plurality of dimming sub-patterns, the orthographic projections of the plurality of dimming sub-patterns on the first transparent substrate surround the orthographic projections of the corresponding LED chips on the first transparent substrate, and the transmittances of the plurality of dimming sub-patterns are positively correlated with their distances from the corresponding LED chips.

[0004] According to some exemplary embodiments, at least one dimming sub-pattern among the multiple sub-dimming patterns includes a dielectric film combination consisting of a first refractive index layer and a second refractive index layer, wherein the first refractive index layer and the second refractive index layer have different refractive indices, and each dimming sub-pattern includes a different number of stacked dielectric film combinations.

[0005] According to some exemplary embodiments, at least one dimming sub-pattern among the plurality of dimming sub-patterns includes a metal wire grid or a metal mesh structure, and the thickness of the metal wire grid or the metal mesh structure in each dimming sub-pattern is different.

[0006] According to some exemplary embodiments, at least one dimming sub-pattern among the plurality of dimming sub-patterns includes a metal wire grid or a metal mesh structure, and the metal wire grids in the metal mesh structures in the dimming sub-patterns have different line widths of metal routings.

[0007] According to some exemplary embodiments, an orthographic projection of the plurality of driving traces of the driving trace layer on the first transparent substrate has a grid shape including a plurality of grids, and a vertex of each grid corresponds to an LED chip.

[0008] According to some exemplary embodiments, the plurality of LED chips include blue LED chips, and the encapsulation layer includes a color conversion material therein for converting blue light into white light.

[0009] According to some exemplary embodiments, the plurality of LED chips include a blue LED chip, and a color conversion layer for converting blue light into white light is disposed between the encapsulation layer and the reflective layer.

[0010] According to some exemplary embodiments, the plurality of LED chips include white LED chips, and the encapsulation layer includes a transparent material.

[0011] According to some exemplary embodiments, the reflective layer includes a texture for scattering light on a surface thereof facing the first transparent substrate.

[0012] According to some exemplary embodiments, the reflective layer includes a plurality of bubbles therein.

[0013] According to some exemplary embodiments, a scattering layer for scattering light is disposed between the reflective layer and the encapsulation layer.

[0014] According to a second aspect of the present disclosure, a liquid crystal display device is provided, comprising: a backlight module according to the first aspect of the present disclosure and its exemplary embodiments; and a liquid crystal display panel located on a second surface of a first transparent substrate of the backlight module.

[0015] According to some exemplary embodiments, the liquid crystal display panel includes: a first metal wire grid layer, located on the second surface of the first transparent substrate; a display array wiring layer, located on the first metal wire grid layer; a second transparent substrate, which includes a first surface and a second surface parallel to each other, and the first surface of the second transparent substrate is parallel to and opposite to the second surface of the first transparent substrate; a color filter layer, located on the first surface of the second transparent substrate; a second metal wire grid layer, located on the first surface of the second transparent substrate, and the arrangement direction of the metal wire grid in the second metal wire grid layer is perpendicular to the arrangement direction of the metal wire grid in the first metal wire grid layer; and a liquid crystal material is sealed between the color filter layer and the display array wiring layer.

[0016] According to a third aspect of the present disclosure, a display device is provided, which includes the liquid crystal display apparatus according to the second aspect of the present disclosure and each exemplary embodiment thereof. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Hereinafter, various exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings; in the accompanying drawings:

[0018] Figure 1 A liquid crystal display device in the related art is schematically shown;

[0019] Figure 2 The backlight module provided according to the embodiment of the present disclosure is schematically shown;

[0020] FIG. 3A to FIG. 3C The following schematically illustrate the methods and apparatuses that can be used according to some embodiments of the present disclosure. Figure 2 The structure of the scattering layer and / or the reflecting layer in the backlight module shown;

[0021] Figure 4A and Figure 4B It is a schematic diagram of the angular spectrum of light emitted by each LED chip;

[0022] Figure 5 Schematically illustrating a drive wiring design in a drive wiring layer provided according to an embodiment of the present disclosure;

[0023] Figure 6 The light intensity distribution of a single LED and the corresponding dimming pattern are schematically shown;

[0024] Figure 7 The uniform light control provided according to the embodiment of the present disclosure is schematically shown;

[0025] Figure 8 The effect of multilayer dielectric films on light transmittance is schematically shown;

[0026] Fig. 9 The structure of a one-dimensional metal wire grid and a two-dimensional metal grid for light homogenization control provided according to an embodiment of the present disclosure is schematically shown;

[0027] Fig. 10A , Fig. 10B and Fig. 10C The effects of the corresponding parameters of the metal wire grid and the metal mesh on the light transmittance and polarization degree are schematically shown respectively;

[0028] Fig.11 Schematically illustrates a method for using a Figure 2 The structure of the convergence enhancement layer in the backlight module shown;

[0029] Fig.12 The light passing through Fig.11 Angular spectrum distribution after the convergence enhancement layer shown in;

[0030] Fig.13 Schematically shows a liquid crystal display device provided according to an embodiment of the present disclosure;

[0031] Fig.14 A display device provided according to an embodiment of the present disclosure is schematically shown.

[0032] It should be understood that the accompanying drawings are only schematic illustrations of exemplary embodiments of the present disclosure, and are not intended to limit the present disclosure, nor are they necessarily drawn to scale. In addition, in the accompanying drawings, identical or similar features are indicated by identical or similar reference numerals. DETAILED DESCRIPTION

[0033] Various exemplary embodiments of the present disclosure are described below in conjunction with the accompanying drawings so that those skilled in the art can fully understand and implement the technical solutions according to the present disclosure.

[0034] See also Figure 1 , which schematically shows a liquid crystal display device in the related art. Figure 1 As shown, the liquid crystal display device 100 includes a first glass substrate 101, a reflective layer 102 is disposed on the upper surface of the first glass substrate 101, and a light emitting diode (LED) chip array 103 is disposed on the reflective layer 120, which includes a plurality of LED chips 104 arranged in an array form, and each LED chip 104 emits light along Figure 1 It propagates upward in the direction indicated by arrow A. Figure 1In the liquid crystal display device 100 shown, the LED chip 104 is a blue light LED chip. Continuing along the direction indicated by the arrow A, the liquid crystal display device 100 also includes a diffusion plate 105 located above the LED chip array 103. In order to facilitate the diffusion of the light emitted by the LED chip 104, a certain optical distance OD is maintained between the diffusion plate 105 and the LED chip array 103. A color conversion layer 106 is arranged above the diffusion plate 105, which is used to convert the blue light emitted by the LED chip 104 into white light. For example, the color conversion layer 106 can be implemented as a quantum dot film. A first prism layer 107 and a second prism layer 108 are sequentially arranged on the color conversion layer 106, which are used to enhance the convergence of the white light from the color conversion layer 106. A diffusion film 109 is arranged on the second prism layer 108, which is used to diffuse and homogenize the white light after the convergence enhancement. Continuing along the direction indicated by arrow A, a first polarizer 110 is disposed above the diffusion film 109, a second glass substrate 111 is disposed above the first polarizer 110, and a display array wiring layer 112 is disposed on the upper surface of the second glass substrate 111. Continuing along the direction indicated by arrow A, a third glass substrate 115 is disposed above the display array wiring layer 112, and a color filter layer 114 is disposed on the lower surface of the second glass substrate 115, and a second polarizer 116 is disposed above the color filter layer 114. The liquid crystal material is sealed and sandwiched between the color filter layer 114 and the display array wiring layer 112 to form a liquid crystal layer 113.

[0035] It can be seen that in the liquid crystal display device 100 in the related art, on the one hand, in order to ensure the diffusion of light emitted from the LED chip 104 to achieve a better uniform light effect, it is necessary to set a certain optical distance OD between the LED chip array 103 and the diffusion plate 105, or use a thicker diffusion plate 105, which makes it difficult to reduce the thickness of the backlight module in the liquid crystal display device 100; on the other hand, the liquid crystal display device 100 uses three glass substrates and two separate polarizers, which makes the weight and thickness of the liquid crystal display device 100 large, making it difficult to achieve lightweight and thin liquid crystal display device.

[0036] See also Figure 2 , which schematically shows a backlight module provided according to an embodiment of the present disclosure, and the backlight module can be used in a liquid crystal display device. Figure 2 As shown, the backlight module 200 includes: a transparent substrate 201, a convergence enhancement layer 202, a uniform light structure layer 203, a drive wiring layer 204, an LED chip array 205, a packaging layer 206, a scattering layer 207 and a reflective layer 208. The transparent substrate 201 can be a glass substrate or a transparent resin substrate, or can be formed of any suitable transparent material. The present disclosure does not impose any restrictions on the material forming the transparent substrate. The light emitted by each LED chip 205a in the LED chip array 205 is along the same Figure 2 The light propagates downward in the direction opposite to the direction indicated by the arrow A in FIG. 2 , passes through the encapsulation layer 206 and the scattering layer 207 , is reflected by the reflection layer 208 , and then propagates upward in the direction indicated by the arrow A. Therefore, the backlight module 200 is a direct-type backlight module.

[0037] The LED chip array 205 may include a plurality of LED chips 205a. The size of the LED chip 205a may be set within a range of 10 to 150 μm. The arrangement of these LED chips 205a may be a square arrangement, a rectangular arrangement, or an equilateral triangle arrangement, with the minimum number of chips, the minimum optical path, and the maximum LED chip spacing, as long as the light uniformity can meet the product requirements. The following description will take the arrangement of LED chips as an equilateral triangle arrangement as an example, but it should be understood that this is merely exemplary and not restrictive. The present disclosure does not impose any restrictions on the specific arrangement of LED chips.

[0038] The encapsulation layer 206 is configured to cover the LED chip array 205. In some embodiments, each LED chip 205a in the LED chip array 205 may be a blue light LED chip, for example, emitting blue light with a wavelength of 450nm. Accordingly, the encapsulation layer 206 may include a color conversion material to convert the blue light emitted by the blue light LED chip into white light. In other embodiments, a separate color conversion layer may also be provided between the encapsulation layer 206 and the scattering layer 207 to convert the blue light emitted by the blue light LED chip into white light. The color conversion material may be a quantum dot material, a fluorescent material, or a nitride color conversion material. The present disclosure does not limit the color conversion material, as long as it has a high conversion efficiency and is easy to mix evenly in the encapsulation layer. As a non-limiting example, the color conversion material may be K2SiF6:Mn 4+ (KSF) color conversion material, the particle diameter of which can be between 1 and 50 μm, and in some embodiments, the particle diameter of which can be between 5 and 30 μm. The KSF color conversion material can be mixed in the encapsulation layer 206, or a separate color conversion layer can be formed, thereby converting the blue light emitted by the blue LED chip into white light. The thickness of the encapsulation layer 206 can be between 0.2 and 2 mm. In some embodiments, in order to achieve lightness and thinness, the thickness of the encapsulation layer 206 can be between 0.3 and 0.5 mm. In addition, in the case of forming a separate color conversion layer, the thickness of the color conversion layer can be 0.3 mm. It should be understood that in other embodiments of the present disclosure, each LED chip 205a in the LED chip array 205 can also be a white light LED chip. In this case, the encapsulation layer 206 can be formed of any suitable transparent material without the need to incorporate a color conversion material.

[0039] The scattering layer 207 is used to scatter the light emitted by the LED chip 205a so as to facilitate the homogenization of the light. The reflective layer 208 is used to reflect the light so that it propagates upward in the direction indicated by the arrow A. It should be understood that the scattering layer 207 can be a separate film layer, but it can also be a part of the reflective layer 208. For example, the scattering layer 207 can be a scattering structure formed on the surface of the reflective layer 208. The reflective layer 208 can be formed of any suitable material with high reflectivity, such as a film layer of silver or aluminum, but it can also be a glue material such as white oil, or it can be a film material such as a white reflective film. The present disclosure does not limit the specific material used to form the reflective layer. In order to maximize the reflectivity, when silver or aluminum is used to form a film layer, the film layer thickness needs to be greater than 60nm, and in some embodiments, the film layer thickness can be in the range of 60 to 150nm. If a glue material such as white oil is used, the film layer thickness needs to be greater than 0.01mm, and in some embodiments, the film layer thickness can be in the range of 0.03 to 0.3mm. If a film material such as a white reflective film is used, the film layer thickness must be greater than 0.01 mm. In some embodiments, the film layer thickness may be in the range of 0.03 to 0.3 mm.

[0040] The scattering layer 207 and the reflective layer 208 may have various possible implementation forms. FIG. 3A to FIG. 3C , which schematically shows a method for implementing the method according to some exemplary embodiments of the present disclosure. Figure 2 The structure of the scattering layer and / or the reflecting layer in the backlight module shown. Figure 3A As shown, the reflective layer 208a in this embodiment has a texture 208a-1 formed on its upper surface adjacent to the encapsulation layer 206 by patterning, and the texture 208a-1 forms a scattering structure for scattering light, so that the reflective layer 208a can both reflect and scatter the incident light. In other words, the reflective layer 208a has both the functions of reflection and scattering. Figure 3B As shown, in this embodiment, a glue layer 208b-1 such as a resin layer is disposed between the reflective layer 208b and the encapsulation layer 206, and one side of the glue layer 208b-1 adjacent to the reflective layer 208b is patterned, so that when the reflective layer 208b is disposed, the reflective material will fill the patterned structure in the side of the glue layer 208b-1, thereby forming a texture structure that scatters light. Figure 3C As shown, the reflective layer 208c may include a plurality of bubbles 208c-1, so that the reflective layer 208c can both reflect and scatter the incident light. For example, the reflective layer 208c may be formed by a white reflective film layer with air bubbles. In addition, it should be understood that in other embodiments, when the light uniforming effect of the uniform light structure layer 203 and the driving wiring layer 204 is strong enough, the scattering layer may not be provided in the backlight module, or the reflective layer may not include a scattering structure.

[0041] See also Figure 4A and Figure 4B , which schematically shows the angular spectrum distribution of the light emitted by each LED chip. Specifically, Figure 4A The light intensity distribution in the angle range of approximately -60 degrees to 60 degrees is shown after the light emitted by the LED chip 205a passes through the encapsulation layer 206 and is converted by the color conversion material therein. Figure 4B The light intensity distribution of the light emitted by the LED chip 205a within an angle range of approximately -60 degrees to 60 degrees after passing through the packaging layer 206 and the color conversion material therein, and then passing through the scattering structure is shown. It can be seen that after the light emitted by the LED chip 205a passes through the scattering structure, the point light emission will be scattered into a large light spot, but it still presents a similar Lambertian light distribution, so the light needs to be further homogenized in subsequent links to meet the homogenization requirements of the backlight.

[0042] Continue to see Figure 2 In the backlight module 200, a driving wiring layer 204 is provided above the LED chip array 205, for supplying power to each chip 205a in the LED chip array 205. Figure 5 , which schematically shows the orthographic projection of a plurality of driving wirings in the driving wiring layer provided according to an embodiment of the present disclosure on the transparent substrate 201. Figure 5 As shown, the positive projection of each driving line in the driving line layer 204 on the transparent substrate 201 has a grid shape including a plurality of triangular meshes, and each vertex of each triangular mesh corresponds to an LED chip 205a. In this way, the light incident on the driving line layer 204 can be initially homogenized to meet the initial requirements of the product for light uniformity. In addition, the width of the driving line is designed based on the fact that it is invisible on the upper surface of the transparent substrate 201, so its width can be less than or equal to 50μm. In some embodiments, the width of the driving line can be less than 30μm.

[0043] Continue to see Figure 2 In the backlight module 200, a light uniformity structure layer 203 is arranged above the driving wiring layer 204, which controls the light output by using different transmittances in different areas, thereby achieving maximum uniformity of light. Figure 6 , which schematically shows the light intensity distribution of a single LED and the corresponding dimming pattern. Figure 6 As shown in the view (a) in FIG. 1 , a plurality of annular regions R1, R2, ..., RN can be divided around the LED chip 205a, wherein the light intensity of the light emitted by the LED chip 205a is the highest in the annular region R1, the second highest in the annular region R2, and the lowest in the annular region RN. Therefore, Figure 6As shown in view (b) in FIG, a corresponding dimming pattern is set for each LED chip 205a in the uniform light structure layer 203, which includes a plurality of dimming sub-patterns, the orthographic projections of these dimming sub-patterns on the transparent substrate 201 surround the orthographic projections of the corresponding LED chip 205a on the transparent substrate 201, and the transmittance of these dimming sub-patterns is positively correlated with the distance from the LED chip 205a. As an example, the transmittance of the dimming sub-pattern farther from the LED chip 205a in the dimming pattern is higher. Specifically, a dimming sub-pattern S1 is set for the annular region R1, a dimming sub-pattern S2 is set for the annular region R2, and a dimming sub-pattern SN is set for the annular region RN, and the transmittance of the dimming sub-pattern S1 is the smallest, while the transmittance of the dimming sub-pattern SN is the largest. Thus, by controlling the light output with different transmittances in different regions, the uniform light structure layer 203 can achieve the maximum degree of uniformity of light.

[0044] See also Figure 7 , which schematically illustrates the uniform light control provided according to an embodiment of the present disclosure. Figure 7 As shown, after the light emitted by each LED chip 205a is reflected back by the reflective layer 208, it is firstly homogenized by the grid shape formed by each driving wiring in the driving wiring layer 204, and then the homogenization control is performed by controlling the light output in different areas with different transmittances through the dimming pattern corresponding to each LED chip 205a in the homogenization structure layer 203, so as to achieve the maximum degree of homogenization of the light. It should be understood that in some embodiments, it is also possible not to use each driving wiring in the driving wiring layer 204 to achieve homogenization, but only use the homogenization structure layer 203 to achieve homogenization control.

[0045] In some embodiments of the present disclosure, in order to achieve different transmittances for each dimming sub-pattern in the dimming pattern of the light homogenizing structure layer 203, a different film layer structure may be designed for at least one dimming sub-pattern. For example, different transmittances may be achieved by using a dielectric film combination of high and low refractive index materials, that is, at least one dimming sub-pattern may include a dielectric film combination consisting of a first refractive index layer and a second refractive index layer, wherein the first refractive index layer and the second refractive index layer have different refractive indices, and each dimming sub-pattern includes a different number of dielectric combination layers. In some embodiments, a dielectric film combination (MgF2 / ZnS) is used. n (Wherein, the refractive index of ZnS (zinc sulfide) is 2.35, the refractive index of MgF2 (magnesium fluoride) is 1.38, and the light enters the MgF2 layer and exits the ZnS layer.) By designing the parameter n, different transmittances can be achieved. In general, the larger the value of the parameter n, the smaller the transmittance of the dielectric film combination. Figure 8 , which schematically shows the dielectric film combination (MgF2 / ZnS) nImpact on transmittance: The average transmittance of both P-polarized light and S-polarized light is about 30%.

[0046] In other embodiments of the present disclosure, in order to achieve different transmittances for each dimming sub-pattern in the dimming pattern of the light uniforming structure layer 203, a different metal micro-nano periodic structure may be provided in at least one dimming sub-pattern. Fig. 9 ,in, Fig. 9 FIG. 1 schematically shows the structure of a metal wire grid for light homogenization control according to an embodiment of the present disclosure. Fig. 9 The view (b) schematically shows the structure of the metal grid for light homogenization control provided according to the embodiment of the present disclosure. As can be seen from the figure, the metal wire grid is a one-dimensional micro-nano periodic structure, and the metal grid is a two-dimensional micro-nano periodic structure. By changing the thickness of the metal wiring in the micro-nano periodic structure or the width of the metal wiring, the transmittance and polarization degree of light can be controlled. Fig. 10A , Fig. 10B and Fig. 10C , which schematically shows the influence of the corresponding parameters of the metal wire grid and the metal mesh on the light transmittance and polarization degree. Fig. 10A As shown, a micro-nano periodic structure of metal aluminum is set on a gallium nitride (GaN) substrate, and the top surface of the metal trace is covered with a silicon dioxide (SiO2) cover layer. The height of the metal trace (that is, the thickness of the metal trace) is h1, the thickness of the SiO2 cover layer is h2, the width of the metal trace is W, and the pitch of the metal wire grid is P. Fig. 10B The figure schematically shows the influence of changing the height of the metal wiring of the metal aluminum on the transmittance and polarization degree of the incident light. Fig. 10C The figure schematically shows the effect of changing the width of the metal trace of aluminum on the transmittance and polarization degree of the incident light. Fig. 10B and Fig. 10C The content shown is that by changing the thickness and / or width of the metal traces, the transmittance and polarization of the incident light can be controlled. Figure 6 In some embodiments, for multiple dimming sub-patterns, the thickness of the metal routing of each dimming sub-pattern can be made different, so that the transmittance of the dimming sub-pattern farther from the corresponding LED chip is higher; in other embodiments, for multiple dimming sub-patterns, the width of the metal routing of at least one dimming sub-pattern can be made different, and it can be set so that the width of the metal routing in the dimming sub-pattern farther from the corresponding LED chip is smaller (that is, the transmittance of the dimming sub-pattern farther from the corresponding LED chip is higher). It should be understood that when a metal wire grid or a metal mesh is used in the uniform light structure layer 203 to achieve uniform light, an insulating layer should be provided between the uniform light structure layer 203 and the driving routing layer 204 to avoid a short circuit between the two.

[0047] Continue to see Figure 2 The convergence enhancement layer 202 in the backlight module 200 is used to converge the uniform white light from the uniform light structure layer 203 to the viewing angle to maximize the brightness at the normal viewing angle. The convergence enhancement layer 202 may include a plurality of periodically arranged positive pyramid structure prisms 202a. It should be understood that the pyramid structure prisms may be periodically arranged positive pyramid structures, inverted pyramid structures, or random pyramid structures. Fig.11 , wherein views (a), (b) and (c) respectively show a positive pyramid structure, an inverted pyramid structure and a random pyramid structure. The bottom size of the pyramid structure can be in the range of (10-500 μm)×(10-500 μm), the height can be between 5 and 250 μm, and the duty cycle can be greater than 50%. Figure 2 In the illustrated embodiment, the pyramid-shaped prism 202a may have a positive pyramid structure, the bottom size of which may be (50 μm ± 10 μm) × (50 μm ± 10 μm), the height may be 20 μm ± 5 μm, and the duty cycle may be 100% (i.e., the bottom of the pyramid structure is closely connected). In other embodiments, the pyramid-shaped prism 202a may have a random pyramid structure. See Fig.12 , wherein views (a), (b) and (c) respectively show the angular spectrum distribution of uniform white light after passing through a positive pyramid structure, an inverted pyramid structure and a random pyramid structure.

[0048] See also Fig.13 , which schematically shows a liquid crystal display device provided according to an embodiment of the present disclosure. Fig.13 As shown, the liquid crystal display device 500 includes the above-mentioned Figure 2 The backlight module 200 described in the figure further includes a liquid crystal display panel 300, wherein the liquid crystal display panel 300 is arranged on the upper surface of the transparent substrate 201 in the backlight module 200 ( Fig.13 The direction indicated by arrow A is the upward direction). It should be understood that Fig.13 The liquid crystal display panel 300 shown is merely exemplary and not restrictive. Any suitable liquid crystal display panel can be disposed on the backlight module 200 to form a desired liquid crystal display device according to actual needs. Fig.13, the liquid crystal display panel 300 includes: a first metal wire grid layer 301, a fill layer 302, a display array wiring layer 303, a color filter layer 305, a transparent substrate 306, a second metal wire grid layer 307 and a liquid crystal material 304. The first metal wire grid layer 301 can be located on the upper surface of the transparent substrate 201 to achieve single polarization filtering transmission and another polarization reflection. The metal material forming the first metal wire grid layer 301 can be silver, aluminum, copper, gold, etc. The period of the metal wire grid structure can be between 20 and 250 nm, the thickness of the metal layer can be between 50 and 500 nm, and the duty cycle can be between 20% and 80%. In one embodiment, an aluminum film is used to make the first metal wire grid layer 301, then the film thickness is 100nm±40nm, the duty cycle is 50%±10%, and the wire grid period is 120nm±20nm. A fill layer 302 is set on the upper surface of the first metal wire grid layer 301. The display array wiring layer 303 is arranged on the upper surface of the filling layer 302. The transparent substrate 306 can also be a glass substrate or a transparent resin substrate, or can be formed of any suitable transparent material. A color filter layer 305 is arranged on the lower surface of the transparent substrate 306, and a second metal wire grid layer 307 is arranged on the upper surface of the transparent substrate 306 to achieve single polarization filtering transmission and another polarization reflection. The arrangement direction of the wire grid in the second metal wire grid layer 307 is perpendicular to the arrangement direction of the wire grid in the first metal wire grid layer 301. The metal material forming the second metal wire grid layer 307 can also be silver, aluminum, copper, gold, etc. The period of the metal wire grid structure can be between 20 and 250 nm, the thickness of the metal layer can be between 50 and 500 nm, and the duty cycle can be between 20% and 80%. In one embodiment, an aluminum film is used to make the second metal wire grid layer 307, then the film thickness is 100nm±40nm, the duty cycle is 50%±10%, and the wire grid period is 120nm±20nm. The liquid crystal material 304 is injected between the color filter layer 305 and the display array wiring layer 302 , and is sealed and sandwiched between the color filter layer 305 and the display array wiring layer 302 to form a liquid crystal layer.

[0049] By forming the first metal wire grid layer 301 on the upper surface of the transparent substrate 201, the liquid crystal display panel 300 and the backlight module 200 can share the transparent substrate 201, so that only two transparent substrates can be used in the liquid crystal display device 500. In addition, the first and second metal wire grid layers are used to replace the separate polarizers. Therefore, the thickness and weight of the liquid crystal display device 500 can be greatly reduced, which is conducive to achieving its lightness and thinness.

[0050] See also Fig.14 , which schematically shows a display device provided according to an embodiment of the present disclosure in the form of a block diagram. Fig.14As shown, the display device 600 includes a liquid crystal display device 610, and the liquid crystal display device 610 can be implemented as the above-mentioned combination Fig.13 The display device 600 may be any suitable device including a liquid crystal display device, including but not limited to: a television, an MNT display, a NB display, a TPC display, a mobile electronic device, an interactive display screen, an all-in-one conference machine, a monitoring machine and other display products.

[0051] The terms used in the present disclosure are only used to describe the embodiments in the present disclosure and are not intended to limit the present disclosure. As used in the present disclosure, the singular forms "one", "one" and "the" are intended to also include plural forms, unless the context clearly indicates otherwise. It is also to be understood that the terms "include" and "comprise" when used in the present disclosure refer to the presence of the features described, but do not exclude the presence of one or more other features or add one or more other features. As used in the present disclosure, the term "and / or" includes any and all combinations of one or more of the associated listed items. It will be understood that although the terms "first", "second", "third", etc. can be used to describe various features in the present disclosure, these features should not be limited by these terms. These terms are only used to distinguish one feature from another feature.

[0052] Unless otherwise defined, all terms (including technical and scientific terms) used in this disclosure have the same meaning as commonly understood by those of ordinary skill in the art to which this disclosure belongs. It is also understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the relevant art and / or the context of this specification, and will not be interpreted in an idealized or overly formal sense unless explicitly defined in this disclosure.

[0053] In the description of this specification, the description of the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradicting each other and without violating technical principles, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, or may omit some technical features from the different embodiments or examples described in this specification, and the embodiments or examples obtained based on such combination, combination or omission are also considered to fall within the scope of the present disclosure.

[0054] Although the present disclosure has been described in detail in conjunction with some exemplary embodiments, it is not to be limited to the specific forms described in the present disclosure. Rather, the scope of the present disclosure is limited only by the appended claims.

Claims

1. A backlight module, characterized in that: include: A first transparent substrate including a first surface and a second surface parallel to each other; A convergence enhancement layer, located on the first surface of the first transparent substrate, and comprising a plurality of prisms of a periodically arranged pyramid structure; A light homogenization structure layer, located on the focusing enhancement layer, and comprising a plurality of dimming patterns; A driving wiring layer, located on the light homogenizing structure layer, including a plurality of driving wirings; An LED chip array, comprising a plurality of LED chips, arranged on the driving wiring layer so that the plurality of driving wirings can supply power to the plurality of LED chips; A packaging layer, located on the LED chip array and covering the LED chip array; A reflective layer, located on the packaging layer; Among them, at least one of the multiple dimming patterns includes multiple dimming sub-patterns, the orthographic projections of the multiple dimming sub-patterns on the first transparent substrate surround the orthographic projections of the corresponding LED chip on the first transparent substrate, and the transmittance of the multiple dimming sub-patterns is positively correlated with their distance from the corresponding LED chip.

2. The backlight module according to claim 1, wherein: At least one of the plurality of dimming sub-patterns includes a dielectric film combination consisting of a first refractive index layer and a second refractive index layer, wherein the first refractive index layer and the second refractive index layer have different refractive indices, and each dimming sub-pattern includes a different number of stacked dielectric film combinations.

3. The backlight module according to claim 1, wherein: At least one dimming sub-pattern among the plurality of dimming sub-patterns includes a metal wire grid or a metal mesh structure, and the thickness of the metal wire grid or the metal mesh structure in each dimming sub-pattern is different.

4. The backlight module according to claim 1, wherein: At least one dimming sub-pattern among the plurality of dimming sub-patterns includes a metal wire grid or a metal mesh structure, and the metal wire grids in the metal mesh structures or the metal routing lines in the dimming sub-patterns have different line widths.

5. The backlight module according to claim 1, wherein: The orthographic projection of the plurality of driving wirings of the driving wiring layer on the first transparent substrate has a grid shape including a plurality of grids, and a vertex of each grid corresponds to an LED chip.

6. The backlight module according to claim 1, wherein: The plurality of LED chips include a blue LED chip, and the encapsulation layer includes a color conversion material therein for converting blue light into white light.

7. The backlight module according to claim 1, wherein: The plurality of LED chips include a blue LED chip, and a color conversion layer for converting blue light into white light is disposed between the encapsulation layer and the reflective layer.

8. The backlight module according to claim 1, wherein: The plurality of LED chips include white LED chips, and the encapsulation layer includes a transparent material.

9. The backlight module according to claim 1, wherein: The reflective layer includes a texture for scattering light on a surface facing the first transparent substrate.

10. The backlight module according to claim 1, wherein: The reflective layer includes a plurality of bubbles.

11. The backlight module according to claim 1, wherein: A scattering layer for scattering light is arranged between the reflective layer and the encapsulation layer.

12. A liquid crystal display device, characterized in that: include: The backlight module according to any one of claims 1 to 11; as well as The liquid crystal display panel is located on the second surface of the first transparent substrate of the backlight module.

13. The liquid crystal display device according to claim 12, wherein: The liquid crystal display panel comprises: A first metal wire grid layer, located on the second surface of the first transparent substrate; A display array wiring layer, located on the first metal wire grid layer; a second transparent substrate including a first surface and a second surface parallel to each other, wherein the first surface of the second transparent substrate is parallel to and opposite to the second surface of the first transparent substrate; A color filter layer, located on the first surface of the second transparent substrate; A second metal wire grid layer, located on the first surface of the second transparent substrate, wherein the arrangement direction of the metal wire grids in the second metal wire grid layer is perpendicular to the arrangement direction of the metal wire grids in the first metal wire grid layer; The liquid crystal material is sealed and sandwiched between the color filter layer and the display array wiring layer.

14. A display device, characterized in that: Comprising a liquid crystal display device according to claim 12 or 13.

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