An electronic device based on internal cooling

Abstract

The utility model relates to the technical field of electronic equipment, and discloses an electronic equipment based on internal blowing heat dissipation, comprising a shell, a fan respectively arranged in the shell, and a mainboard module covering a chip; an air outlet is arranged on the shell, the fan is electrically connected to the mainboard module, a first air outlet and a second air outlet are arranged on the fan, the first air outlet is directly opposite to the air outlet for directly blowing air outward, and the second air outlet is not directly opposite to the air outlet for blowing air inward; the electronic equipment also includes a heat-conducting component arranged in the shell, the heat-conducting component is heat-conductingly connected to the chip, the heat-conducting component extends to an adjacent position of the first air outlet, and the heat-conducting component also extends to an adjacent position of the second air outlet; the application mainly solves the technical problem of high internal chip temperature of existing electronic equipment adopting the internal blowing technology.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic equipment, in particular to an electronic equipment based on internal blowing heat dissipation. Background Art

[0002] The air outlet of the fan inside a traditional laptop is usually designed to face the air outlet of the shell, so as to quickly blow the internal heat to the outside and allow the cold air from the outside to enter the computer due to the pressure difference between the inside and the outside, thereby achieving the purpose of heat dissipation. However, with the continuous upgrading of software, the software has higher requirements for computing power, and as users use the computer for a longer time, the temperature of the shell of the laptop will be higher. The hot shell will seriously reduce the user's experience. In order to solve the problem of the shell temperature being too high and hot, the current laptop adopts the internal blowing technology. Specifically, the fan inside the laptop will be provided with at least two air outlets, one of which is facing the air outlet of the shell as mentioned above, and the other is facing the inside of the notebook, so that the fan can blow air inside to even the temperature of the shell and appropriately reduce the temperature of the shell. This internal blowing technology will sacrifice the temperature of the CPU chip and the GPU chip, so that the temperature of the CPU chip and the temperature of the GPU chip are both high, so that the performance of the laptop using the internal blowing technology is greatly limited due to the excessively high temperature of the internal chip. Based on the premise of adopting the internal blowing technology, how to reduce the temperature of the chip so as to further improve the performance of the laptop is a technical problem that urgently needs to be solved in this field. Utility Model Content

[0003] The utility model provides an electronic device based on internal blowing heat dissipation, which mainly solves the technical problem of high internal chip temperature of the existing notebook computer adopting the internal blowing technology.

[0004] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0005] An electronic device based on internal blowing heat dissipation comprises a housing, a fan and a mainboard module covering a chip, which are respectively arranged in the housing;

[0006] The housing is provided with an air outlet, the fan is electrically connected to the mainboard module, the fan is provided with a first air outlet and a second air outlet, the first air outlet is directly opposite to the air outlet to blow air directly outward, and the second air outlet is not directly opposite to the air outlet to blow air inward;

[0007] The electronic device further comprises a heat conducting component disposed in the housing, the heat conducting component is thermally connected to the chip, the heat conducting component extends to a position adjacent to the first air outlet, and the heat conducting component also extends to a position adjacent to the second air outlet.

[0008] In one of the technical solutions, the heat-conducting assembly includes a heat sink, a first heat sink, a second heat sink, a first heat-conducting member, and a second heat-conducting member;

[0009] The heat sink is thermally connected to the chip and is used to increase the heat dissipation area of ​​the chip. The first heat sink is arranged at an adjacent position to the first air blowing port, and the second heat sink is arranged at an adjacent position to the second air blowing port. The first heat conductive member is respectively connected to the heat sink and the first heat sink, and the second heat conductive member is respectively connected to the heat sink and the second heat sink.

[0010] In one of the technical solutions, the first heat sink includes a first heat-conducting surface and a plurality of first heat-dissipating fins connected to the first heat-conducting surface, the first heat-conducting member is connected to the first heat-conducting surface, and the plurality of first heat-dissipating fins are arranged at intervals so that a first heat-dissipating channel is formed between two adjacent first heat-dissipating fins, and an extension direction of the first heat-dissipating channel is the same as a flow direction of wind blown out from the first air outlet.

[0011] In one of the technical solutions, the second heat sink includes a second heat-conducting surface and a plurality of second heat-dissipating fins connected to the second heat-conducting surface, the second heat-conducting member is connected to the second heat-conducting surface, and the plurality of second heat-dissipating fins are arranged at intervals so that a second heat-dissipating channel is formed between two adjacent second heat-dissipating fins, and the extension direction of the second heat-dissipating channel is the same as the flow direction of the wind blown out from the second air outlet.

[0012] In one of the technical solutions, the fan is provided with a notch structure, the second air outlet is provided at the notch structure, and the second radiator is also provided at the notch structure, so that the second radiator is close to the blades inside the fan.

[0013] In one of the technical solutions, the shortest distance between the second heat sink and the blades inside the fan is greater than 6 mm.

[0014] In one of the technical solutions, the first heat conductor is connected to the top of the first radiator, so that a first air outlet gap is provided between the first heat conductor and the mainboard module; the second heat conductor is connected to the top of the second radiator, so that a second air outlet gap is provided between the second heat conductor and the mainboard module; the second air outlet, the second heat dissipation channel, the second air outlet gap and the first air outlet gap are connected in sequence.

[0015] In one technical solution, the second heat conducting member includes a first end, a second end, and at least one bending portion connected between the first end and the second end;

[0016] The first end is thermally connected to the heat sink, the second end is connected to the second heat sink, and the bending angle of the bent portion is greater than three times the outer diameter of the second heat conductor.

[0017] In one of the technical solutions, the first heat conductor is connected to one end surface of the first radiator and together with the first radiator occupies the height of the first blowing port; the second heat conductor is connected to one end surface of the second radiator and together with the second radiator occupies the height of the second blowing port.

[0018] In one of the technical solutions, the first air outlet and the second air outlet are arranged on the same fan.

[0019] Compared with the prior art, the electronic device based on internal cooling provided by the utility model has at least the following beneficial effects:

[0020] The present solution adopts the internal blowing technology of setting both the first blowing port and the second blowing port, thereby solving the problem of excessive shell temperature and improving the user experience; secondly, the present solution also sets a thermal conductive component that is thermally connected to the chip, and the thermal conductive component can greatly increase the heat dissipation area of ​​the chip, thereby improving the heat dissipation efficiency of the chip and reducing the temperature of the chip. In addition, the present solution also designs the thermal conductive component to extend to the adjacent position of the first blowing port, and also designs the thermal conductive component to extend to the adjacent position of the second blowing port, thereby further improving the heat dissipation efficiency of the chip and further reducing the temperature of the chip, so that electronic devices (such as laptops) that use the internal blowing technology can perform at a higher performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 A structural diagram of the interior of an electronic device based on internal cooling provided by an embodiment of the present application;

[0023] Figure 2 A schematic diagram of the structure of a heat conduction component provided in an embodiment of the present application;

[0024] Figure 3 for Figure 2 A partial enlarged view of the middle A;

[0025] Figure 4 for Figure 2A partial enlarged view of point B in the middle;

[0026] Figure 5 for Figure 1 a front view of the structure shown;

[0027] Figure 6 A schematic diagram of the structure of a fan provided in an embodiment of the present application.

[0028] Reference numerals:

[0029] 1. Fan; 11. First air outlet; 12. Second air outlet; 13. Notch structure; 2. Mainboard module;

[0030] 3. heat-conducting component; 31. heat sink; 32. first heat sink; 321. first heat-conducting surface; 322. first heat-dissipating fin; 323. first heat-dissipating channel; 33. second heat sink; 331. second heat-conducting surface; 332. second heat-dissipating fin; 333. second heat-dissipating channel; 34. first heat-conducting member; 35. second heat-conducting member; 351. first end portion; 352. second end portion; 353. bending portion;

[0031] 4. First air outlet gap; 5. Second air outlet gap. DETAILED DESCRIPTION

[0032] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0033] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0034] It should be understood that the orientations or positional relationships indicated by terms such as "upper", "lower", "top", "bottom", "inside", and "outside" are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present application and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0035] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0036] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0037] Please also read Figures 1 to 6 The embodiment of the utility model provides an electronic device based on internal blowing heat dissipation. The electronic device of this embodiment mainly takes a laptop computer as an example. The electronic device includes a shell (not shown in the figure) and a fan 1 and a motherboard module 2 covering a chip, respectively arranged in the shell, wherein the shell is provided with an air outlet connected to the outside, wherein the fan 1 and the motherboard module 2 are electrically connected, the motherboard module 2 can control whether the fan 1 needs to be turned on according to the heat dissipation demand, and the motherboard module 2 can also control the speed of the fan 1 according to the heat dissipation demand, and the fan 1 is provided with a first blowing port 11 and a second blowing port 12, Figure 1 The thick arrow in the figure shows the air flow direction inside the laptop computer, wherein the first air outlet 11 is directly opposite to the air outlet of the shell to guide the hot air inside the shell to the outside as quickly as possible, wherein the second air outlet 12 is not directly opposite to the air outlet of the shell and blows air to the inside to even the temperature of the shell and appropriately reduce the temperature of the shell, thereby solving the problem of excessive temperature of the shell and improving the user experience. Based on the premise of adopting the internal blowing technology, in order to solve the problem of excessive temperature of the chip on the mainboard module 2, the electronic device of this embodiment also includes a heat-conducting component 3 arranged in the shell, and the heat-conducting component 3 is designed to be thermally connected to the chip. The heat-conducting component 3 can greatly increase the heat dissipation area of ​​the chip, thereby improving the heat dissipation efficiency of the chip, and thereby reducing the temperature of the chip. In addition, in this embodiment, the heat-conducting component 3 is designed to extend to the adjacent position of the first air outlet 11, and the heat-conducting component 3 is designed to extend to the adjacent position of the second air outlet 12, thereby further improving the heat dissipation efficiency of the chip, and thereby further reducing the temperature of the chip, so that the laptop computer using the internal blowing technology can perform at a higher performance.

[0038] In this embodiment, the heat conducting component 3 specifically includes a heat sink 31, a first heat sink 32, a second heat sink 33, a first heat conducting member 34 and a second heat conducting member 35, wherein the heat sink 31 is thermally connected to the chip to increase the heat dissipation area of ​​the chip, the first heat sink 32 is arranged at an adjacent position to the first air blowing port 11, and the second heat sink 33 is arranged at an adjacent position to the second air blowing port 12, the first heat conducting member 34 is respectively connected to the heat sink 31 and the first heat sink 32 to transfer the heat on the heat sink 31 to the first heat sink 32, and the second heat conducting member 35 is respectively connected to the heat sink 31 and the second heat sink 33 to transfer the heat on the heat sink 31 to the second heat sink 33. When working, the fan 1 starts, and the first air outlet 11 and the second air outlet 12 both blow air outwards. The air blown out from the first air outlet 11 will directly take away the heat of the first radiator 32, and the air blown out from the second air outlet 12 will directly take away the heat of the second radiator 33. Since the heat sink 31 is connected to the first radiator 32 through the first heat conductor 34, and the heat sink 31 is connected to the second radiator 33 through the second heat conductor 35, the air blown out from the first air outlet 11 and the air blown out from the second air outlet 12 can both take away the heat of the heat sink 31. Since the heat sink 31 and the chip are connected by heat conduction, the air blown out from the first air outlet 11 and the air blown out from the second air outlet 12 can both take away the heat of the chip. In other words, the air blown out from the second air outlet 12 can not only reduce the temperature of the shell, but also play a role in suppressing the temperature rise of the chip. The above-mentioned heat conduction component 3 has the advantages of simple structure and high heat dissipation efficiency.

[0039] In this embodiment, the first heat sink 32 specifically includes a first heat conducting surface 321 and a plurality of first heat dissipation fins 322 connected to the first heat conducting surface 321. The first heat conducting member 34 is connected to the first heat conducting surface 321. By setting the first heat conducting surface 321, it is possible to ensure that there is a sufficient contact area between the first heat conducting member 34 and the first heat sink 32, thereby ensuring that the heat on the first heat conducting member 34 can be transferred to the first heat sink 32 with a higher efficiency. The plurality of first heat dissipation fins 322 are arranged at intervals, so that a first heat dissipation channel 323 is formed between two adjacent first heat dissipation fins 322, and the extension direction of each first heat dissipation channel 323 is the same as the flow direction of the wind blown out from the first blowing port 11. The first heat sink 32 of this structure has the advantages of high thermal conductivity efficiency and high heat dissipation efficiency.

[0040] In this embodiment, the second heat sink 33 specifically includes a second heat conducting surface 331 and a plurality of second heat dissipating fins 332 connected to the second heat conducting surface 331. The second heat conducting member 35 is connected to the second heat conducting surface 331. By setting the second heat conducting surface 331, it is possible to ensure that there is a sufficient contact area between the second heat conducting member 35 and the second heat sink 33, thereby ensuring that the heat on the second heat conducting member 35 can be transferred to the second heat sink 33 with a higher efficiency. The plurality of second heat dissipating fins 332 are arranged at intervals, so that a second heat dissipating channel 333 is formed between two adjacent second heat dissipating fins 332. The extension direction of each second heat dissipating channel 333 is the same as the flow direction of the wind blown out from the second blowing port 12. The second heat sink 33 of this structure has the advantages of high thermal conductivity efficiency and high heat dissipation efficiency.

[0041] In this embodiment, if Figure 5 and Figure 6 As shown, the fan 1 is provided with a notch structure 13, the second air outlet 12 is provided at the notch structure 13, and the second heat sink 33 is also provided at the notch structure 13. By providing the notch structure 13, a space is reserved for the second heat sink 33 and the second heat conductor 35, so that the internal structure is more compact; in addition, the second heat sink 33 can be close to the blades inside the fan 1, thereby improving the heat dissipation efficiency of the chip. Further preferably, the shortest distance A between the second heat sink 33 and the blades inside the fan 1 is greater than 6mm. If the value of A is too small, it will affect the air outlet of the second air outlet 12, so that the shell temperature cannot be reduced to the preset range, and there will also be a problem that the fan 1 and the second heat sink 33 are prone to interference. If the value of A is too large, the heat dissipation efficiency of the chip is insufficient. The value of A in this embodiment is preferably 6mm-6.5mm.

[0042] In this embodiment, please refer to Figure 1 The first heat-conducting member 34 is connected to the top of the first heat sink 32, so that a first air outlet gap 4 is provided between the first heat-conducting member 34 and the mainboard module 2; the second heat-conducting member 35 is connected to the top of the second heat sink 33, so that a second air outlet gap 5 is provided between the second heat-conducting member 35 and the mainboard module 2. Moreover, after the fan 1 is started, part of the wind blown out from the second air outlet 12 passes through the second heat dissipation channel 333 to blow inward, and the other part passes through the second heat dissipation channel 333, the second air outlet gap 5 and the first air outlet gap 4 in sequence before being discharged to the outside. This design can ensure that the wind blown out from the second air outlet 12 can not only reduce the temperature of the shell, but also effectively suppress the temperature of the chip.

[0043] In this embodiment, please refer to Figure 2The second heat conducting member 35 includes a first end 351, a second end 352 and at least one bending portion 353 connected between the first end 351 and the second end 352, wherein the first end 351 is thermally connected to the heat sink 31, the second end 352 is connected to the second heat sink 33, and the bending angle of the bending portion 353 is greater than three times the outer diameter of the second heat conducting member 35. If the bending angle of the bending portion 353 is too small relative to its own outer diameter, the surface of the bending portion 353 will have more wrinkles. The more surface wrinkles there are, the greater the impact on the efficiency of heat transfer from the first end 351 to the second end 352. In other words, by designing the bending angle of the bending portion 353 to be greater than three times the outer diameter of the second heat conducting member 35, it can be ensured that the second heat conducting member 35 can quickly transfer the heat located on the heat sink 31 to the second heat sink 33, thereby improving the heat dissipation efficiency of the chip.

[0044] In this embodiment, the first heat conductor 34 is connected to one end face of the first radiator 32 and occupies the height of the first air outlet 11 together with the first radiator 32, and the second heat conductor 35 is connected to one end face of the second radiator 33 and occupies the height of the second air outlet 12 together with the second radiator 33, so that the housing of the electronic device can be designed to be relatively light and thin. In addition, the above-mentioned first air outlet 11 and second air outlet 12 are preferably both provided on the same fan 1 to save space inside the housing. In other embodiments, if there is extra space inside the electronic device, the first air outlet 11 can be provided on one of the fans 1, and the second air outlet 12 can be provided on the other fan 1.

[0045] The above are only preferred embodiments of the present invention, and only specifically describe the technical principles of the present invention. These descriptions are only for the purpose of explaining the principles of the present invention, and cannot be interpreted as limiting the scope of protection of the present invention in any way. Based on the explanation here, any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention, and other specific implementation methods of the present invention that can be associated with by technicians in this field without creative labor, should be included in the scope of protection of the present invention.

Claims

1. An electronic device based on internal cooling, characterized in that: It includes a housing, a fan and a mainboard module covering a chip, which are respectively arranged in the housing; The housing is provided with an air outlet, the fan is provided with a first air outlet and a second air outlet, the first air outlet is directly opposite to the air outlet to blow air directly outward, and the second air outlet is not directly opposite to the air outlet to blow air inward; The electronic device further comprises a heat conducting component disposed in the housing, the heat conducting component is thermally connected to the chip, the heat conducting component extends to a position adjacent to the first air outlet, and the heat conducting component also extends to a position adjacent to the second air outlet.

2. The electronic device based on internal cooling according to claim 1, characterized in that: The heat conduction assembly comprises a heat sink, a first heat sink, a second heat sink, a first heat conduction member and a second heat conduction member; The heat sink is thermally connected to the chip and is used to increase the heat dissipation area of ​​the chip. The first heat sink is arranged at an adjacent position to the first air blowing port, and the second heat sink is arranged at an adjacent position to the second air blowing port. The first heat conductive member is respectively connected to the heat sink and the first heat sink, and the second heat conductive member is respectively connected to the heat sink and the second heat sink.

3. The electronic device based on internal cooling according to claim 2, characterized in that: The first heat sink includes a first heat-conducting surface and a plurality of first heat-dissipating fins connected to the first heat-conducting surface. The first heat-conducting member is connected to the first heat-conducting surface. The plurality of first heat-dissipating fins are arranged at intervals so that a first heat-dissipating channel is formed between two adjacent first heat-dissipating fins. The extension direction of the first heat-dissipating channel is the same as the flow direction of the wind blown out from the first air outlet.

4. The electronic device based on internal cooling according to claim 2, characterized in that: The second heat sink includes a second heat-conducting surface and a plurality of second heat-dissipating fins connected to the second heat-conducting surface. The second heat-conducting member is connected to the second heat-conducting surface. The plurality of second heat-dissipating fins are arranged at intervals so that a second heat-dissipating channel is formed between two adjacent second heat-dissipating fins. The extension direction of the second heat-dissipating channel is the same as the flow direction of the wind blown out from the second air outlet.

5. The electronic device based on internal cooling according to claim 2, characterized in that: The fan is provided with a notch structure, the second air outlet is provided at the notch structure, and the second radiator is also provided at the notch structure, so that the second radiator is close to the fan blades inside the fan.

6. The electronic device based on internal cooling according to claim 5, characterized in that: The shortest distance between the second heat sink and the blades inside the fan is greater than 6 mm.

7. The electronic device based on internal cooling according to claim 4, characterized in that: The first heat-conducting member is connected to the top of the first radiator, so that a first air outlet gap is formed between the first heat-conducting member and the mainboard module; the second heat-conducting member is connected to the top of the second radiator, so that a second air outlet gap is formed between the second heat-conducting member and the mainboard module; the second air outlet, the second heat dissipation channel, the second air outlet gap and the first air outlet gap are connected in sequence.

8. The electronic device based on internal cooling according to claim 2, characterized in that: The second heat conducting member comprises a first end portion, a second end portion and at least one bending portion connected between the first end portion and the second end portion; The first end is thermally connected to the heat sink, the second end is connected to the second heat sink, and the bending angle of the bent portion is greater than three times the outer diameter of the second heat conductor.

9. The electronic device based on internal cooling according to claim 2, characterized in that: The first heat-conducting member is connected to one end surface of the first radiator and occupies the height of the first air outlet together with the first radiator; the second heat-conducting member is connected to one end surface of the second radiator and occupies the height of the second air outlet together with the second radiator.

10. The electronic device based on internal cooling according to any one of claims 1 to 9, characterized in that: The first air outlet and the second air outlet are arranged on the same fan.

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