A heat dissipation structure for an artificial intelligence computing server

By designing mobile temperature measurement mechanisms and heat dissipation components in the artificial intelligence computing power server, monitoring and circulating heat dissipation of the internal temperature of the chassis is solved, and the stable operation and service life of the server is ensured.

CN222704966UActive Publication Date: 2025-04-01BEIJING QIBU TIANXIA TECH CO LTD
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Patent Information

Application Number
CN202421058705.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-15
Publication Date
2025-04-01
Estimated Expiration
2034-05-15

AI Technical Summary

Technical Problem

The existing artificial intelligence computing power servers have low heat dissipation efficiency in high temperature environments, which can easily lead to heat collection and damage the server.

Method used

A thermal dissipation structure of an artificial intelligence computing power server is designed, including a mobile temperature measurement mechanism and thermal dissipation components. The mobile temperature measuring mechanism uses a micro motor to drive the screw and the temperature sensor to achieve temperature monitoring, and the heat dissipation component can circulate heat dissipation through a water pump and a heat dissipation fan.

Benefits of technology

Effectively monitor and reduce the temperature inside the chassis, avoid overheating and damage to electrical components, ensure stable operation of the server and extend service life.

✦ Generated by Eureka AI based on patent content.

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    Figure CN222704966U_ABST
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Abstract

The utility model belongs to the field of heat dissipation, especially a heat dissipation structure of an artificial intelligence computing server. In view of the problem that the existing server has low heat dissipation efficiency in a high-temperature environment and is prone to heat collection for a long time, the following solution is proposed, which includes a chassis, the front side of which is provided with a USB interface, a power key, a restart key, a hard disk indicator light and a power indicator light, and a ventilation hole is opened on one side of the chassis; a mobile temperature measuring mechanism, which is arranged inside the chassis and used to move and detect the temperature inside the chassis; a heat dissipation component, which is arranged inside the chassis and used to dissipate heat and cool the internal components of the chassis. The utility model realizes comprehensive monitoring of temperature through a mobile temperature measuring mechanism, and can realize the effect of circulating heat dissipation of the chassis, thereby realizing efficient heat dissipation and cooling, ensuring the stable operation of the server, and improving the service life of the server.
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Description

Technical Field

[0001] The utility model relates to the field of heat dissipation technology, and in particular to a heat dissipation structure of an artificial intelligence computing power server. Background Art

[0002] A computing server is a server that is specially designed for high-performance computing and data processing tasks. It has powerful computing power and high-speed data processing capabilities, and is usually used for complex scientific computing, data analysis, artificial intelligence training and reasoning, and other tasks.

[0003] AI computing servers usually need to face high computing-intensive tasks, so the heat dissipation structure is crucial. The heat dissipation structure refers to the components and designs used for heat dissipation, which effectively conducts and dissipates the heat generated by the server to keep the server running stably within a suitable temperature range. However, the existing servers have low heat dissipation efficiency in high-temperature environments, which can easily lead to heat accumulation over a long period of time.

[0004] Therefore, the purpose of this utility model is to provide an artificial intelligence computing server heat dissipation structure to solve the problems raised in the above background technology. Utility Model Content

[0005] The purpose of the utility model is to solve the shortcomings of the prior art that the heat dissipation efficiency is low in a high-temperature environment and heat collection is easily caused for a long time, and to propose a heat dissipation structure for an artificial intelligence computing power server.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] An artificial intelligence computing server heat dissipation structure, comprising:

[0008] A chassis, wherein a USB port, a power button, a restart button, a hard disk indicator light, and a power indicator light are arranged on the front side of the chassis, and a ventilation hole is arranged on one side of the chassis;

[0009] A mobile temperature measuring mechanism is arranged inside the chassis and is used to move and detect the temperature inside the chassis;

[0010] The heat dissipation component is arranged inside the chassis and is used to dissipate heat and cool the internal components of the chassis.

[0011] In a possible design, the mobile temperature measuring mechanism includes a fixed frame fixedly arranged on one side of the inner wall of the chassis, a screw rod is rotatably arranged inside the fixed frame, a moving block is threadedly connected to the outside of the screw rod, and the moving block is slidably connected to the fixed frame, a temperature sensor is fixedly arranged on one side of the moving block, a micro motor is fixedly arranged on the bottom of the fixed frame, and one end of the output shaft of the micro motor rotates and passes through the bottom of the fixed frame and is fixedly connected to the screw rod.

[0012] In a possible design, the heat dissipation component includes a heat dissipation water tank fixedly arranged inside the chassis on one side of the vent, two water pipes are sealed and connected on one side of the heat dissipation water tank, one end of the two water pipes are sealed and connected to the same water pump, the two water pipes are respectively connected to the input end and the output end of the water pump, a contact sheet is arranged on one side of the water pump, a connecting frame that can be connected to an electrical component is arranged on the water pump, and two heat dissipation fans are symmetrically fixed on one side of the heat dissipation water tank.

[0013] In a possible design, the rear side of the chassis is rectangular and has six through holes, and a dynamic balancing fan is fixedly installed inside the six through holes.

[0014] In a possible design, an inspection port is opened on one side of the chassis, and a mounting frame is fixedly provided on one side of the inspection port, and a dustproof net is fixedly provided on the inner circle of the mounting frame.

[0015] In a possible design, a ventilation hole is opened on the top of the chassis, and a filter is arranged on the top of the chassis above the ventilation hole.

[0016] In a possible design, the bottom of the chassis is rectangular and fixed with four rubber pads, and the bottoms of the four rubber pads are all provided with protective stripes.

[0017] In the present application, when starting to use, first install the side of the water pump with the contact sheet on the high-power electrical component through the connecting frame on the water pump, then connect the server to the corresponding equipment and turn on the power to make the server start working. When the server is working, the micro motor starts working, and one end of the micro motor output shaft drives the screw to rotate. When the screw rotates, the moving block and the temperature sensor thereon are driven to move. Through the reverse and forward rotation of the micro motor, the moving block and the temperature sensor thereon realize reciprocating motion, so as to monitor the temperature inside the chassis. When the temperature sensor detects that the temperature inside the chassis has increased, the temperature sensor will send a signal to the dynamic balancing fan to make the dynamic balancing fan work. When the dynamic balancing fan rotates, it will discharge the hot air inside the chassis to the outside of the chassis, so that the air inside and outside the chassis is replaced. To lower the temperature inside the chassis, when the temperature of the high-power component is too high, the water pump receives a signal to start the water pump and the cooling fan at the same time. The water pump draws the water-cooling liquid inside the cooling water tank into the water pump through the water pipe, and transfers the heat from the high-power component to the water pump through the contact sheet. The water pump absorbs the heat and transfers the heat to the water-cooling liquid. The water-cooling liquid that absorbs the heat is then transported to the cooling water tank through another water pipe. The fins on the cooling water tank disperse the temperature inside the water-cooling liquid, and then the cooling fan blows air on the cooling water tank, so that the water-cooling liquid that absorbs the heat in the cooling water tank is quickly cooled down, and then the water-cooling liquid is pumped out by the water pump to dissipate heat and cool down the high-power components again, thereby achieving the effect of circulating heat dissipation, thereby avoiding the electrical components inside the chassis from being in an overheated state for a long time, causing damage and affecting their normal operation.

[0018] The utility model has the following beneficial effects:

[0019] In the utility model, by setting a mobile temperature measuring mechanism, one end of the micro motor output shaft drives the screw to rotate, and the screw rotates while driving the moving block and the temperature sensor thereon to move. Through the reverse and forward rotation of the micro motor, the moving block and the temperature sensor thereon realize reciprocating motion, thereby monitoring the temperature inside the chassis;

[0020] The utility model provides a heat dissipation component. When the temperature of the high-power component is too high, the water pump receives a signal, so that the water pump and the cooling fan are started at the same time. The water pump sucks the water-cooling liquid inside the cooling water tank into the water pump through the water pipe, transfers the heat on the high-power component to the water pump through the contact sheet, absorbs the heat and transfers the heat to the water-cooling liquid. The water-cooling liquid that absorbs the heat is then transported to the cooling water tank through another water pipe. The fins on the cooling water tank disperse the temperature inside the water-cooling liquid. The cooling fan blows air on the cooling water tank, so that the water-cooling liquid that absorbs the heat in the cooling water tank is quickly cooled down. Then the water-cooling liquid is pumped out by the water pump to dissipate the heat and cool down the high-power component again, thereby achieving the effect of circulating heat dissipation, thereby preventing the electrical components inside the chassis from being in an overheated state for a long time and causing damage, thereby affecting their normal operation.

[0021] The utility model realizes comprehensive monitoring of temperature through a mobile temperature measuring mechanism, can realize the effect of circulating heat dissipation of the chassis, realizes efficient heat dissipation and cooling, ensures stable operation of the server, and prolongs the service life of the server. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic diagram of the overall main structure of a heat dissipation structure of an artificial intelligence computing server proposed by the utility model;

[0023] Figure 2 This is a schematic diagram of the overall side view of the heat dissipation structure of an artificial intelligence computing server proposed by the utility model;

[0024] Figure 3 This is a schematic diagram of the internal structure of a chassis of a heat dissipation structure of an artificial intelligence computing power server proposed in the utility model;

[0025] Figure 4 This is a schematic diagram of the enlarged structure of part A of the heat dissipation structure of an artificial intelligence computing power server proposed by the utility model;

[0026] Figure 5 This is a schematic diagram of the enlarged structure of part B of the heat dissipation structure of an artificial intelligence computing power server proposed by the utility model;

[0027] Figure 6 This is a schematic diagram of another chassis proposed by the utility model.

[0028] In the figure: 1. Chassis; 2. Fixing bracket; 3. Screw; 4. Temperature sensor; 5. Micro motor; 6. Cooling water tank; 7. Water pipe; 8. Water pump; 9. Contact piece; 10. Cooling fan; 11. Dynamic balancing fan; 12. Mounting bracket; 1201, Dust net; 13. Filter; 14. Ventilation port; 15. Rubber pad. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0030] Example 1

[0031] Reference Figure 1-5 , a heat dissipation structure, comprising:

[0032] The chassis 1 has a USB port, a power button, a restart button, a hard disk indicator light and a power indicator light on the front side thereof, which are convenient for users to perform daily operations and status monitoring. A vent 14 is provided on one side of the chassis 1 for air circulation inside the chassis 1, so as to facilitate the replacement of air inside and outside the chassis 1.

[0033] A mobile temperature measuring mechanism is provided inside the chassis 1, and the mobile temperature measuring mechanism is mainly composed of a fixed frame 2, a screw rod 3, a moving block, a temperature sensor 4 and a micro motor 5. The fixed frame 2 is fixed to one side of the inner wall of the chassis 1, and the screw rod 3 is rotatably arranged inside the fixed frame 2. The moving block is connected to the external thread of the screw rod 3 and can slide on the fixed frame 2. The temperature sensor 4 is fixedly arranged on one side of the moving block for real-time detection of the temperature inside the chassis 1. The micro motor 5 is fixedly arranged at the bottom of the fixed frame 2, and one end of the output shaft thereof rotates and passes through the bottom of the fixed frame 2 and is fixedly connected to the screw rod 3. When the micro motor 5 is working, it will drive the screw rod 3 to rotate, thereby driving the moving block to move on the fixed frame 2, so that the temperature sensor 4 can perform reciprocating motion and move temperature measurement inside the chassis 1, thereby realizing comprehensive monitoring of the temperature.

[0034] A heat dissipation component is also provided inside the chassis 1, and the heat dissipation component includes a heat dissipation water tank 6, a water pipe 7, a water pump 8, a contact piece 9 and a heat dissipation fan 10. The heat dissipation water tank 6 is fixedly provided inside the chassis 1, and is located on one side of the vent 14. Two water pipes 7 are sealed and connected to one side of the heat dissipation water tank 6. One end of the water pipe 7 is sealed and connected to the input end and the output end of the same water pump 8. A contact piece 9 is provided on one side of the water pump 8. The water pump 8 is also provided with a connecting frame that can be connected to an electrical component. When the temperature of the high-power component is too high, the water pump 8 receives a signal, so that the water pump 8 and the heat dissipation fan 10 are started at the same time, and the water pump 8 sucks the water-cooling liquid in the heat dissipation water tank 6 into the water pump through the water pipe 7. 8, the heat on the high-power component is transferred to the water pump 8 through the contact sheet 9, the water pump 8 absorbs the heat and transfers the heat to the water-cooling liquid, the water-cooling liquid that absorbs the heat is then transported to the heat dissipation water tank 6 through another water pipe 7, the fins on the heat dissipation water tank 6 disperse the temperature inside the water-cooling liquid, and then the heat dissipation fan 10 blows air on the heat dissipation water tank 6, so that the heat dissipation water-cooling liquid that absorbs the heat in the heat dissipation water tank 6 is quickly cooled, and then the water-cooling liquid is pumped out by the water pump 8 to dissipate and cool the high-power component again, thereby achieving the effect of circulating heat dissipation, thereby preventing the electrical components inside the chassis 1 from being in an overheated state for a long time and causing damage, affecting their normal operation.

[0035] In order to further improve the heat dissipation effect, six through holes are opened in a rectangular shape on the back side of the chassis 1, and a dynamic balancing fan 11 is fixedly installed inside each through hole. The setting of the dynamic balancing fan 11 can quickly discharge the heat inside the chassis 1, so that the air inside and outside the chassis 1 is replaced to enhance the heat dissipation effect. The use of the dynamic balancing fan 11 can reduce the resonance between the fan and the hard disk without affecting the data transmission speed of the hard disk.

[0036] In order to facilitate the inspection of the inside of the chassis 1, an inspection port is also opened on one side of the chassis 1, and a mounting frame 12 is fixedly set on one side of the inspection port. A dustproof net 1201 is fixedly set on the inner circle of the mounting frame 12 to effectively prevent dust from entering the inside of the chassis 1 through the inspection port.

[0037] A ventilation hole is also provided on the top of the chassis 1 , and a filter 13 is arranged above the ventilation hole to facilitate the replacement of air inside and outside the chassis 1 and prevent dust from entering the chassis 1 through the ventilation hole.

[0038] This application can be used in the field of heat dissipation technology for artificial intelligence computing power servers, and can also be used in other fields applicable to this application.

[0039] Example 2

[0040] On the basis of embodiment one, embodiment two also includes: an artificial intelligence computing power server heat dissipation structure, which is applied to the technical field of artificial intelligence computing power server heat dissipation structure. In order to increase the stability of the chassis 1 and reduce vibration, four rubber pads 15 are fixedly arranged on the bottom of the chassis 1 in a rectangular shape. The bottom of the rubber pads 15 are provided with protective stripes, which can increase the friction between the placement surface and prevent the chassis 1 from sliding, and can also play a shock-absorbing role.

[0041] However, as is well known to those skilled in the art, the working principles and wiring methods of the temperature sensor 4, micro motor 5, heat sink 6, water pump 8, contact piece 9, heat sink fan 10 and dynamic balancing fan 11 are commonplace, and are all conventional means or common knowledge, and will not be elaborated here. Those skilled in the art can make any optional selections according to their needs or convenience.

[0042] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A heat dissipation structure of an artificial intelligence computing server, characterized in that: include: A chassis (1), wherein a USB interface, a power button, a restart button, a hard disk indicator light and a power indicator light are arranged on the front side of the chassis (1), and a ventilation hole (14) is arranged on one side of the chassis (1); A mobile temperature measuring mechanism, which is arranged inside the chassis (1) and is used to move and detect the temperature inside the chassis (1); A heat dissipation component is arranged inside the chassis (1) and is used to dissipate heat and cool down the internal components of the chassis (1).

2. The heat dissipation structure of an artificial intelligence computing server according to claim 1, characterized in that: The mobile temperature measuring mechanism comprises a fixed frame (2) fixedly arranged on one side of the inner wall of the chassis (1); a screw rod (3) is rotatably arranged inside the fixed frame (2); a moving block is externally threadedly connected to the screw rod (3); and the moving block is slidably connected to the fixed frame (2); a temperature sensor (4) is fixedly arranged on one side of the moving block; a micro motor (5) is fixedly arranged at the bottom of the fixed frame (2); one end of the output shaft of the micro motor (5) rotatably passes through the bottom of the fixed frame (2) and is fixedly connected to the screw rod (3).

3. The heat dissipation structure of an artificial intelligence computing server according to claim 2, characterized in that: The heat dissipation component comprises a heat dissipation water tank (6) fixedly arranged inside the chassis (1) and located on one side of the ventilation port (14); two water pipes (7) are sealed and connected to one side of the heat dissipation water tank (6); one end of the two water pipes (7) is sealed and connected to the same water pump (8); the two water pipes (7) are respectively connected to the input end and the output end of the water pump (8); a contact sheet (9) is arranged on one side of the water pump (8); a connecting frame capable of being connected to an electrical component is arranged on the water pump (8); and two heat dissipation fans (10) are symmetrically fixedly arranged on one side of the heat dissipation water tank (6).

4. The heat dissipation structure of an artificial intelligence computing server according to claim 3 is characterized in that: The rear side of the chassis (1) is rectangular and has six through holes, and a dynamic balancing fan (11) is fixedly arranged inside each of the six through holes.

5. The heat dissipation structure of an artificial intelligence computing server according to claim 4, characterized in that: A maintenance opening is provided on one side of the chassis (1), and a mounting frame (12) is fixedly provided on one side of the maintenance opening, and a dustproof net (1201) is fixedly provided on the inner ring of the mounting frame (12).

6. The heat dissipation structure of an artificial intelligence computing server according to claim 5, characterized in that: A ventilation hole is provided on the top of the chassis (1), and a filter screen (13) is provided on the top of the chassis (1) above the ventilation hole.

7. The heat dissipation structure of an artificial intelligence computing server according to claim 1, characterized in that: The bottom of the chassis (1) is rectangular and fixed with four rubber pads (15), and the bottoms of the four rubber pads (15) are all provided with protective stripes.