A kind of alloy resistor packaging mold

Abstract

The utility model relates to an alloy resistor packaging mold, which has a packaging substrate and a template. The packaging substrate is provided with a plurality of mold cavities arranged in a matrix. The template can be installed in the mold cavity of the packaging substrate. The mold cavity is provided with a plurality of packaging units arranged in a row, and the packaging units in the same row are horizontally connected. The template is provided with packaging grooves corresponding to the packaging units in a row. The side of the packaging groove is provided with a main glue channel, and the main glue channel is connected to the packaging groove through a glue channel. Elliptical positioning holes are provided on both sides of the template. The utility model reduces the size of the main glue channel and the glue channel, and can fill the glue groove more smoothly under the same total pressure, reducing the waste of glue cakes. The size of the glue channel is reduced, and the injection molded product can be further optimized, so that there is no residual glue tail at the product end. The template adopts an elliptical positioning hole, so that only two rows of positioning holes are needed to meet the lateral and longitudinal positioning requirements, and the installation and positioning are more convenient while ensuring accuracy.

Description

Technical Field

[0001] The utility model relates to the technical field of mold manufacturing, in particular to an alloy resistor packaging mold. Background Art

[0002] The processing of alloy resistors requires punching, packaging, degumming, sandblasting, printing, cutting and electroplating in sequence. The packaging is to place the material in a mold and then inject the resin material so that the resin covers the outside of the alloy resistor to form a protective layer.

[0003] In the prior art, the size of the glue port is designed to be large, and the residual glue will form a small tail on the product. The product needs to be de-glueed after each injection molding to remove the residual glue tail at the end of the product, which reduces the product qualification rate. Moreover, since the traditional packaging substrate is only provided with ten mold cavities, the production efficiency is low, and there is also the problem of insufficient glue injection. In addition, a lot of glue will remain in the runner, which greatly increases the amount of glue cake used.

[0004] Moreover, positioning and installation are very troublesome. In order to ensure accurate horizontal and vertical positioning, three rows of positioning holes need to be set on the template. Utility Model Content

[0005] In view of the above problems, the purpose of the utility model is to provide an alloy resistor packaging mold, which is convenient for installation and positioning, can effectively improve efficiency and save costs.

[0006] In order to solve the above technical problems, the technical solution adopted by the utility model is as follows: an alloy resistor packaging mold, comprising a packaging substrate and a template, the packaging substrate being provided with a plurality of mold cavities arranged in a matrix, the template being able to be installed in the mold cavities of the packaging substrate, the mold cavities being provided with a plurality of packaging units arranged in rows, and the packaging units in the same row being laterally connected, the template being provided with packaging grooves corresponding to the rows of packaging units, the sides of the packaging grooves being provided with main glue channels, the main glue channels being connected with the packaging grooves through branch glue channels, and elliptical positioning holes being provided on both sides of the template.

[0007] In the above technical solution, the size of the glue channel opening of the glue dividing channel is half of the height of the packaging body in the packaging unit, specifically 0.6 mm.

[0008] In the above technical solution, twelve mold cavities are provided on the packaging substrate.

[0009] In the above technical solution, the glue distribution channel is a tapered necking, and the small diameter end is connected to the packaging groove.

[0010] In the above technical solution, four positioning holes are respectively provided on both sides of the template.

[0011] In the above technical solution, the cross section of the main rubber channel is conical.

[0012] To sum up, the technical solution of the utility model has the following beneficial effects compared with the traditional technical means: the utility model reduces the size of the main glue channel and the sub-glue channel, can fill the glue groove under the same pressure, reduces the waste of glue cakes, and reduces the size of the sub-glue channel, which can further optimize the product after injection molding, and achieves no residual glue tail at the product end, so that the product qualification rate reaches more than 99%. In addition, we have optimized the traditional ten holes to twelve holes, which improves production efficiency.

[0013] The template uses elliptical positioning holes, so only two rows of positioning holes are needed to meet the horizontal and vertical positioning requirements, making installation and positioning more convenient while ensuring accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The foregoing and other objects, features and advantages of the present invention will become apparent from the following detailed description in conjunction with the accompanying drawings.

[0015] Figure 1 It is a schematic diagram of the packaging substrate in the utility model;

[0016] Figure 2 It is a schematic diagram of the template in the utility model;

[0017] Figure 3 for Figure 2 A partial enlarged view of

[0018] Figure 4 for Figure 2 Side view of

[0019] The numbers are as follows: 100, packaging substrate; 110, mold cavity; 111, packaging unit; 200, template; 210, packaging groove; 220, main glue channel; 230, sub-glue channel; 240, positioning hole. DETAILED DESCRIPTION

[0020] The following is an ideal embodiment of the utility model. Through the following description, relevant staff can make various changes and modifications without departing from the technical concept of the utility model. The technical scope of this utility model is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.

[0021] The utility model is further described with reference to the following drawings:

[0022] like Figures 1 to 4As shown, an alloy resistor packaging mold has a packaging substrate 100 and a template 200, the packaging substrate 100 is provided with a plurality of mold cavities 110 arranged in a matrix, the template 200 can be installed in the mold cavity 110 of the packaging substrate 100, the mold cavity 110 is provided with a plurality of packaging units 111 arranged in a row, and the packaging units 111 in the same row are horizontally connected, the template 200 is provided with packaging grooves 210 corresponding to the rows of packaging units 111, the side of the packaging groove 210 is provided with a main glue channel 220, the main glue channel 220 is communicated with the packaging groove 210 through a glue distribution channel 230, and elliptical positioning holes 240 are provided on both sides of the template 200.

[0023] The size of the glue channel opening of the glue channel 230 is half of the height of the packaging body in the packaging unit, which is changed from the existing 1.2 mm to 0.6 mm.

[0024] like Figure 1 As shown, twelve mold cavities 110 are provided on the packaging substrate 100 .

[0025] like Figure 3 As shown, the glue distribution channel 230 is a tapered neck, and the small diameter end is connected to the packaging groove 210 .

[0026] like Figure 2 As shown, four positioning holes 240 are respectively provided on two sides of the template 200 .

[0027] like Figure 4 As shown, the cross section of the main glue channel 220 is tapered.

[0028] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. An alloy resistor packaging mold, characterized in that: The invention comprises a packaging substrate and a template, wherein the packaging substrate is provided with a plurality of mold cavities arranged in a matrix, the template can be installed in the mold cavity of the packaging substrate, the mold cavity is provided with a plurality of packaging units arranged in a row, and the packaging units in the same row are horizontally connected, the template is provided with packaging grooves corresponding to the packaging units in a row, the side of the packaging groove is provided with a main glue channel, the main glue channel is communicated with the packaging groove through a branch glue channel, and elliptical positioning holes are provided on both sides of the template.

2. The alloy resistor packaging mold according to claim 1, characterized in that: The size of the glue channel opening of the glue distribution channel is half of the height of the packaging body in the packaging unit, specifically 0.6 mm.

3. The alloy resistor packaging mold according to claim 1, characterized in that: Twelve mold cavities are arranged on the packaging substrate.

4. The alloy resistor packaging mold according to claim 1, characterized in that: The glue distribution channel is a tapered necking, and the small diameter end is connected to the packaging groove.

5. The alloy resistor packaging mold according to claim 1, characterized in that: Four positioning holes are respectively arranged on both sides of the template.

6. The alloy resistor packaging mold according to claim 1, characterized in that: The cross section of the main glue channel is tapered.

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