Electrolytic capacitor structure and electronic equipment

Abstract

The present application discloses an electrolytic capacitor structure and an electronic device, belonging to the field of capacitors. The electrolytic capacitor structure includes a first insulating heat-conducting part and a plurality of capacitors, wherein the first insulating heat-conducting part is formed with a plurality of metal welding areas, one end of the plurality of capacitors is respectively welded and fixed to the plurality of metal welding areas, and the other end is used to be electrically connected to a circuit board through a pin, and the welding and fixing of the plurality of capacitors to the metal welding areas also helps to improve the heat dissipation effect. The metal welding area serves as a heat transmission channel, and can quickly export the heat generated by the capacitor. The welding and fixing method ensures good contact between the capacitor and the metal welding area, reduces the contact thermal resistance, and enables the heat to be more smoothly transferred to the heat sink or other heat dissipation device. The design of electrically connecting the pin to the circuit board also takes into account the need for heat dissipation. The pin is not only used for electrical connection, but also can be used as a channel for heat transfer to further disperse the heat to the circuit board. The heat dissipation effect of the electrolytic capacitor is further improved.

Description

Technical Field

[0001] The present application belongs to the field of capacitor technology, and in particular relates to an electrolytic capacitor structure and electronic equipment. Background Art

[0002] Electrolytic capacitors are widely used in new energy fields such as photovoltaics, energy storage, and wind power. They mainly support bus voltage, filter, and store energy. They are one of the key components of new energy power electronic equipment. Since new energy requires a longer shelf life for power electronic equipment, extending the life of electrolytic capacitors is very important. The life of electrolytic capacitors is strongly related to temperature. Electrolytic capacitors need to work within a suitable temperature range. For lower operating temperatures, the internal resistance of the device is larger and the life is shorter. For higher temperatures, according to statistics, the life will be reduced by half for every 10°C increase in temperature. Therefore, controlling the temperature of the electrolytic capacitor is the key to extending the life of the device.

[0003] In the prior art, electrolytic capacitors transfer heat to the liquid cooling plate through thermally conductive silicone pads, thermally conductive silicone grease layers or thermally conductive potting glue for heat dissipation. Electrolytic capacitors are made of an aluminum cylinder as the negative electrode, which is filled with liquid electrolyte and a curved aluminum strip inserted as the positive electrode. Therefore, the shell of the electrolytic capacitor itself is the negative electrode with strong electricity. When multiple electrolytic capacitors are set, the thermally conductive silicone pads, thermally conductive silicone grease layers or thermally conductive potting glue need to be set thicker to ensure a safe distance, resulting in poor heat dissipation effect of the electrolytic capacitor. Utility Model Content

[0004] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes an electrolytic capacitor structure and an electronic device, which can improve the heat dissipation effect of the electrolytic capacitor.

[0005] In a first aspect, the present application provides an electrolytic capacitor structure, comprising:

[0006] A first insulating heat-conducting portion, wherein the first insulating heat-conducting portion is formed with a plurality of metal welding areas; and

[0007] A plurality of capacitors, one end of each of the capacitors is respectively welded and fixed to the plurality of metal welding areas, and the other end is used for electrical connection with the circuit board through pins.

[0008] According to the electrolytic capacitor structure of the present application, first of all, the design of the first insulating and heat-conducting part means that it can not only play an insulating role to prevent current leakage or short circuit inside the capacitor, but also has good heat-conducting performance. This means that when heat is generated during the operation of the capacitor, this heat can be quickly conducted through the insulating and heat-conducting part, thereby effectively dispersing the heat over a larger area and reducing the accumulation of heat inside the capacitor. The welding and fixing of multiple capacitors to the metal welding area also helps to improve the heat dissipation effect. The metal welding area, as a heat transfer channel, can quickly export the heat generated by the capacitor. The welding and fixing method ensures good contact between the capacitor and the metal welding area, reduces the contact thermal resistance, and enables the heat to be transferred to the heat sink or other heat dissipation devices more smoothly. The design of electrically connecting to the circuit board through the pins also takes into account the heat dissipation requirements. The pins are not only used for electrical connection, but can also serve as a heat transfer channel to further disperse the heat generated by the capacitor onto the circuit board. In this way, the heat dissipation area of the entire circuit board is increased, further improving the heat dissipation effect of the electrolytic capacitor.

[0009] According to an embodiment of the present application, capacitors with the same voltage among the multiple capacitors are in the same metal welding area.

[0010] According to an embodiment of the present application, the first insulating and heat-conducting part includes a double-sided ceramic substrate, and the metal welding area is formed on the double-sided ceramic substrate; or

[0011] The first insulating and heat-conducting part includes a double-sided ceramic substrate and a first heat-conducting metal plate, and the metal welding area is formed on the surfaces of both the double-sided ceramic substrate and the first heat-conducting metal plate.

[0012] According to an embodiment of the present application, the double-sided ceramic substrate includes a ceramic layer and a metal layer. The thickness of the ceramic layer is T1, and the thickness of the metal layer is T2, where 0 mm < T1 ≤ 1 mm, and / or, 0.2 mm ≤ T2 ≤ 0.8 mm.

[0013] According to an embodiment of the present application, it further includes a second heat-conducting part. The second heat-conducting part is arranged on the side of the first insulating and heat-conducting part背离 the capacitor, and the second heat-conducting part is in contact with the first insulating and heat-conducting part.

[0014] According to an embodiment of the present application, the second heat-conducting part includes a second heat-conducting substrate, and the second heat-conducting substrate is in contact with the first insulating and heat-conducting part; or,

[0015] A heat dissipation structure is arranged on the side of the second heat-conducting part背离 the first insulating and heat-conducting part. The heat dissipation structure includes a plurality of heat dissipation parts, and there is a gap between adjacent two of the plurality of heat dissipation parts.

[0016] According to an embodiment of the present application, the heat dissipation portion includes heat dissipation columns and / or heat dissipation fins.

[0017] According to an embodiment of the present application, the electrolytic capacitor structure further includes a liquid cooling component, and the liquid cooling component is used to perform heat exchange with the second heat conducting part and / or the first insulating heat conducting part.

[0018] According to one embodiment of the present application, it also includes an enclosure frame, which is installed on the second heat-conducting part or the liquid-cooling component. The enclosure frame is arranged around the plurality of capacitors, and together with the second heat-conducting part or the liquid-cooling component and the plurality of capacitors, a receiving groove is formed, and the receiving groove is filled with potting glue.

[0019] According to an embodiment of the present application, an explosion-proof groove is provided on the side wall or beside the pin of each capacitor; and / or,

[0020] The electrolytic capacitor structure further includes at least one temperature sensor, and the temperature sensor is used to detect the temperature of the plurality of capacitors.

[0021] In a second aspect, the present application provides an electronic device, which includes the electrolytic capacitor structure as described above.

[0022] According to the electronic device of the present application, the design of the first insulating heat-conducting part means that it can not only play an insulating role to prevent the current leakage or short circuit inside the capacitor, but also has good thermal conductivity. This means that when the capacitor generates heat during operation, the heat can be quickly conducted through the insulating heat-conducting part, thereby effectively dispersing the heat to a larger area and reducing the accumulation of heat inside the capacitor. The welding and fixing of multiple capacitors and metal welding areas also helps to improve the heat dissipation effect. The metal welding area serves as a heat transmission channel and can quickly export the heat generated by the capacitor. The welding and fixing method ensures good contact between the capacitor and the metal welding area, reduces the contact thermal resistance, and enables the heat to be more smoothly transferred to the heat sink or other heat dissipation devices. The design of electrically connecting the pin to the circuit board also takes into account the need for heat dissipation. The pin is not only used for electrical connection, but also can be used as a channel for heat transfer to further disperse the heat generated by the capacitor to the circuit board. In this way, the heat dissipation area of ​​the entire circuit board is increased, further improving the heat dissipation effect of the electrolytic capacitor.

[0023] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0025] Figure 1 It is one of the structural schematic diagrams of the electrolytic capacitor structure provided in the embodiment of the present application;

[0026] Figure 2 This is the second structural schematic diagram of the electrolytic capacitor structure provided in the embodiment of the present application;

[0027] Figure 3 This is the third structural schematic diagram of the electrolytic capacitor structure provided in the embodiment of the present application;

[0028] Figure 4 This is the fourth structural schematic diagram of the electrolytic capacitor structure provided in the embodiment of the present application;

[0029] Figure 5 This is the fifth structural schematic diagram of the electrolytic capacitor structure provided in the embodiment of the present application;

[0030] Figure 6 This is the sixth structural schematic diagram of the electrolytic capacitor structure provided in the embodiment of the present application;

[0031] Figure 7 This is the seventh structural schematic diagram of the electrolytic capacitor structure provided in the embodiment of the present application;

[0032] Figure 8 This is the eighth structural schematic diagram of the electrolytic capacitor structure provided in the embodiment of the present application;

[0033] Fig. 9 yes Figure 8 Exploded diagram of the electrolytic capacitor structure;

[0034] Fig.10 This is one of the structural schematic diagrams of the electronic device provided in the embodiment of the present application.

[0035] Reference numerals:

[0036] Electrolytic capacitor structure 100;

[0037] Capacitor unit 101;

[0038] A first insulating heat-conducting portion 110 , a metal welding area 110 a , a first heat-conducting metal plate 111 , a double-sided ceramic substrate 112 , a ceramic layer 1121 , and a metal layer 1122 ;

[0039] Capacitor 120;

[0040] Pin 130;

[0041] Circuit board 140;

[0042] A second heat conducting portion 150 and a second heat conducting substrate 151;

[0043] Heat dissipation structure 160, heat dissipation portion 161;

[0044] Liquid cooling assembly 170, liquid cooling plate 171;

[0045] Explosion-proof slot 180;

[0046] Temperature sensor 190;

[0047] Enclosure frame 1010;

[0048] Power semiconductor module 200;

[0049] Reactor 300;

[0050] Potting glue a;

[0051] Solder b;

[0052] Electronic device 1000. DETAILED DESCRIPTION

[0053] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0054] Reference below Figure 1-Figure 10 An electrolytic capacitor structure 100 and an electronic device 1000 according to an embodiment of the present application are described.

[0055] Reference Figures 1 to 3 The electrolytic capacitor structure 100 includes a first insulating heat-conducting portion 110 and a plurality of capacitors.

[0056] The first insulating heat-conducting part 110 is formed with a plurality of metal welding areas 110a. Thus, the design of the plurality of metal welding areas 110a allows the welding operation between the capacitor and the first insulating heat-conducting part 110 to be more flexible and efficient. Each welding area can be independently welded to the corresponding capacitor end point, which not only simplifies the welding process, but also improves the accuracy and stability of welding. The stable welding connection helps to ensure that the capacitor will not loosen or break due to vibration or temperature changes during operation. Since the metal welding area 110a is integrated with the first insulating heat-conducting part 110, they can work together to exert excellent thermal conductivity. When the capacitor generates heat during operation, the heat can be quickly transferred to the first insulating heat-conducting part 110 through the metal welding area 110a, thereby achieving uniform distribution and rapid conduction of heat. This helps to prevent heat from accumulating locally in the capacitor, thereby improving the overall heat dissipation effect of the electrolytic capacitor. The metal welding area 110a is not only used for welding the capacitor, but also can enhance the structural strength of the first insulating heat-conducting part 110. By welding, a firm connection is formed between the capacitor and the first insulating heat-conducting part 110 , which helps to improve the shock resistance and durability of the entire capacitor assembly.

[0057] It should be noted that two adjacent metal welding areas 110a among the plurality of metal welding areas 110a may be spaced apart from each other or may be connected as a whole. Specifically, the present application does not limit this.

[0058] One end of the plurality of capacitors is respectively welded and fixed with the plurality of metal welding areas 110a, and the other end is used to be electrically connected to the circuit board 140 through the pin 130. In this way, the metal welding area 110a not only provides a stable electrical connection, but also serves as a channel for heat conduction. The heat generated by the capacitor during operation can be quickly transferred to other parts of the electrolytic capacitor structure 100 through the welding area, and then radiated through other heat dissipation mechanisms, thereby improving the overall heat dissipation efficiency. The other end of the capacitor is electrically connected to the circuit board 140 through the pin 130, and this design makes the layout of the capacitor on the circuit board 140 more flexible. The pin 130 can adjust the length and position according to actual needs, adapt to different circuit board 140 designs and space limitations, and realize the precise docking of the capacitor with the circuit board 140. Although the welded fixed end provides a stable connection, the other end connected by the pin 130 makes the capacitor relatively easy to operate when it needs to be repaired or replaced. The pin 130 connection can be disassembled and reconnected by plugging or welding, thereby reducing the difficulty and cost of repair. This design not only ensures a stable connection between the capacitor and the electrolytic capacitor structure 100 and between the capacitor and the circuit board 140, but also optimizes heat conduction and circuit layout, thereby improving the overall performance and reliability of the electrolytic capacitor.

[0059] According to the electrolytic capacitor structure 100 of the present application, the design of the first insulating heat-conducting part 110 means that it can not only play an insulating role, prevent the current leakage or short circuit inside the capacitor, but also has good thermal conductivity. This means that when the capacitor generates heat during operation, the heat can be quickly conducted through the insulating heat-conducting part, thereby effectively dispersing the heat to a larger area and reducing the accumulation of heat inside the capacitor. The welding and fixing of multiple capacitors and the metal welding area 110a also helps to improve the heat dissipation effect. The metal welding area 110a serves as a heat transmission channel and can quickly export the heat generated by the capacitor. The welding and fixing method ensures good contact between the capacitor and the metal welding area 110a, reduces the contact thermal resistance, and enables the heat to be more smoothly transferred to the heat sink or other heat dissipation devices. The design of electrically connecting the pin 130 to the circuit board 140 also takes into account the need for heat dissipation. The pin 130 is not only used for electrical connection, but also can be used as a channel for heat transfer to further disperse the heat generated by the capacitor to the circuit board 140. In this way, the heat dissipation area of ​​the entire circuit board 140 is increased, further improving the heat dissipation effect of the electrolytic capacitor.

[0060] In one embodiment, the capacitors with the same voltage among the multiple capacitors are in the same metal welding area 110a, so that a certain safety distance can be ensured between them. This can effectively reduce the potential risks caused by electrical interference between different capacitors. Electrical interference may cause unstable or damaged capacitor performance, so maintaining an appropriate safety distance is crucial to improving the electrical performance and reliability of the electrolytic capacitor structure 100. When capacitors with the same voltage are connected to the same metal welding area 110a, by reasonably designing the layout and size of the welding area, it can be ensured that a sufficient safety distance is maintained between the capacitors, thereby preventing failures or safety accidents caused by electrical breakdown. During maintenance and overhaul, staff need to approach the capacitors for operation. Classifying and connecting capacitors with the same voltage to the same metal welding area 110a helps staff to quickly identify and operate capacitors with the same voltage level, reducing the possibility of misoperation. At the same time, maintaining an appropriate safety distance also helps to reduce the risk of electric shock to staff and improve operational safety. Connecting capacitors with the same voltage to the same metal welding area 110a and ensuring that an appropriate safety distance is maintained between them helps to make the design of the electrolytic capacitor structure 100 comply with relevant safety standards and specifications, thereby improving the compliance and market competitiveness of the product. In addition, this design can also greatly simplify the wiring inside the electrolytic capacitor structure 100. This not only makes the entire structure neater and more compact, but also helps to reduce the risk of electrical failures that may be caused by complex wiring. At the same time, this design also simplifies the welding process and improves production efficiency. Since capacitors with the same voltage are connected together, electrical interference or misconnection between capacitors with different voltage levels can be effectively avoided. This helps to improve the electrical safety of the entire electrolytic capacitor structure 100 and reduce equipment failures or safety accidents caused by electrical problems. The heat generated by capacitors with the same voltage is similar during work, and connecting them to the same metal welding area 110a helps to achieve centralized management and effective conduction of heat. As a channel for heat transmission, the metal welding area 110a can quickly disperse the heat generated by multiple capacitors to a larger area, thereby improving heat dissipation efficiency and preventing heat accumulation.

[0061] Reference Figure 2 and Figure 3In one embodiment, the first insulating heat-conducting part 110 includes a double-sided ceramic substrate 112, and the double-sided ceramic substrate 112 is formed with the metal welding area 110a. In this way, the ceramic substrate has extremely high insulation performance, which enables the entire structure to maintain stable electrical performance under high-voltage and high-current working environments, and effectively prevents the occurrence of electrical breakdown and short circuit phenomena. The ceramic substrate also has excellent thermal conductivity, which can quickly conduct the heat generated by the capacitor during operation to prevent heat from accumulating inside the capacitor, thereby ensuring the stable operation of the capacitor and extending its service life. The ceramic substrate has high hardness and strength, so that the entire structure can maintain structural integrity when subjected to external force impact or vibration, and reduce electrical failures caused by mechanical damage. The metal welding area 110a is formed on the ceramic substrate, so that the capacitor can be easily welded and connected to the electrolytic capacitor structure 100. This connection method is not only stable and reliable, but also can simplify the production process and improve production efficiency. The ceramic substrate has excellent high-temperature stability and can maintain stable performance in a high-temperature environment, which enables the entire structure to work normally under high-temperature working conditions, and broadens the application range of the electrolytic capacitor structure 100.

[0062] Figure 1 , Figure 5 as well as Figure 6 In one embodiment, the first insulating heat-conducting part 110 includes a double-sided ceramic substrate 112 and a first heat-conducting metal plate 111, and the metal welding area 110a is formed on the surface of the double-sided ceramic substrate 112 and the first heat-conducting metal plate 111. In this way, the ceramic substrate itself has excellent thermal conductivity, and combined with the first heat-conducting metal plate 111, the thermal conductivity of the entire structure can be further enhanced. This combined design enables heat to be transferred from the capacitor to the external heat dissipation system more quickly, effectively preventing heat accumulation and excessive temperature rise, and ensuring that the electrolytic capacitor structure 100 can also operate stably in a high temperature environment. The combination of the ceramic substrate and the metal plate not only provides good insulation performance, but also significantly enhances the mechanical strength of the entire structure. This structure can resist external impact and vibration, maintain stable electrical connection and heat dissipation effect, thereby improving the reliability and durability of the electrolytic capacitor structure 100. The double-sided ceramic substrate 112 serves as an insulating layer, which effectively isolates the electrical interference between the capacitor and the external environment, and ensures the stability of the electrical performance of the electrolytic capacitor structure 100. At the same time, the formation of the metal welding area 110a makes the connection between the capacitor and the heat-conducting structure more compact and reliable, reducing the risk of electrical failure. By forming the metal welding area 110a on the surface of the ceramic substrate and the metal plate at the same time, the capacitor and the heat-conducting structure can be welded at one time, simplifying the production process and improving production efficiency. In addition, this design also helps to reduce production costs and improve product competitiveness.

[0063] It should be noted that there are various materials for the first heat-conducting metal plate 111. For example, the material for the first heat-conducting metal plate 111 may include at least one of silver, copper, or aluminum. Thus, both copper and aluminum are excellent heat-conducting materials, and among them, copper has better heat conductivity. In applications that require efficient heat conduction, using a copper welding part can quickly transfer heat from the welding point, reduce thermal stress, minimize welding deformation, and improve welding quality. Although aluminum has slightly inferior heat conductivity compared to copper, it can also play a good heat-conducting role in certain applications, and at the same time, it has a lower cost and is more economical.

[0064] In addition, the double-sided ceramic substrate 112 can be customized according to specific requirements, including the size, shape, heat-conducting performance of the double-sided ceramic substrate 112, as well as the material and thickness of the metal layer 1122, etc.

[0065] Figure 1 , Figure 3 , Figure 5 and Figure 6 , in an embodiment, the double-sided ceramic substrate 112 includes a ceramic layer 1121 and a metal layer 1122. The thickness of the ceramic layer 1121 is T1, and the thickness of the metal layer 1122 is T2. Wherein, 0mm < T1 ≤ 1mm, and / or, 0.2mm ≤ T2 ≤ 0.8mm. Thus, the ceramic layer 1121 has excellent heat-conducting performance and can quickly transfer heat from the capacitor to the external heat dissipation system. By precisely controlling the thickness T1 of the ceramic layer 1121 between 0mm and 1mm, efficient heat transfer can be ensured, heat accumulation can be prevented, and thus the heat dissipation efficiency of the electrolytic capacitor structure 100 can be improved. The metal layer 1122 not only provides good electrical conductivity but also enhances the mechanical strength of the double-sided ceramic substrate 112. The thickness T2 of the metal layer 1122 being between 0.2mm and 0.8mm enables the substrate to have sufficient strength to resist external impacts and vibrations while maintaining appropriate flexibility to adapt to different installation and working environments. By reasonably designing the thicknesses of the ceramic layer 1121 and the metal layer 1122, the double-sided ceramic substrate 112 can maintain stable electrical performance. The insulating property of the ceramic layer 1121 effectively isolates the electrical interference between the capacitor and the external environment, while the metal layer 1122 ensures the reliability of the electrical connection.

[0066] When 0mm < T1 ≤ 1mm, the thermal resistance of the ceramic layer 1121 can be reduced, and the heat dissipation effect can be improved. When 0.2mm ≤ T2 ≤ 0.8mm, the reliability and heat conductivity of the double-sided ceramic substrate 112 can be improved. In addition, when T1 and T2 both meet the above ranges, the double-sided ceramic substrate 112 has a good heat conduction effect while maintaining sufficient mechanical strength.

[0067] It should be noted that the materials made of the ceramic layer 1121 include Al2O3, AlN, and Si3N4. In this way, these materials have excellent thermal conductivity and can effectively transfer heat. Aluminum oxide (Al2O3) and silicon nitride (Si3N4) are representatives of ceramic materials with good thermal conductivity, and aluminum nitride (AlN) is one of the ceramic materials with better thermal conductivity. The ceramic layer 1121 made of these materials can provide an efficient heat transfer path, thereby helping to reduce the temperature near the heat source. Aluminum oxide (Al2O3) and silicon nitride (Si3N4) are both ceramic materials with high mechanical strength and can withstand large mechanical stress and pressure. This is very important for the first insulating heat-conducting part 110 that needs to withstand external loads or vibrations, and can maintain its structural stability and long-term reliability. These ceramic materials have good chemical stability and can resist common chemical corrosion and erosion. This enables the ceramic layer 1121 to maintain its performance and stability in harsh working environments and extend the service life of the first insulating heat-conducting part 110. Alumina (Al2O3), aluminum nitride (AlN) and silicon nitride (Si3N4) are all excellent electrical insulating materials with extremely high resistivity and dielectric strength, which helps prevent electrical short circuits or arcing in the first insulating heat-conducting part 110 and improves the electrical safety and reliability of the device.

[0068] Reference Figure 2 , Figure 4 as well as Figure 5 In one embodiment, the electrolytic capacitor structure 100 further includes a second heat conducting portion 150, which is disposed on a side of the first insulating heat conducting portion 110 away from the capacitor, and the second heat conducting portion 150 is in contact with the first insulating heat conducting portion 110. Thus, the addition of the second heat conducting portion 150 further enhances the heat dissipation capability of the electrolytic capacitor structure 100. By being in contact with the first insulating heat conducting portion 110, the second heat conducting portion 150 can further diffuse the heat conducted from the first insulating heat conducting portion 110 to a larger area, accelerate the heat dissipation, and thus effectively reduce the temperature of the electrolytic capacitor structure 100, ensuring the stable operation of the capacitor and extending its service life.

[0069] The combined use of the first insulating heat-conducting part 110 and the second heat-conducting part 150 can optimize the distribution of heat. The first insulating heat-conducting part 110 is mainly responsible for quickly conducting the heat generated by the capacitor to the second heat-conducting part 150, while the second heat-conducting part 150 is responsible for evenly distributing the heat to a larger heat dissipation area, preventing heat from accumulating locally and improving the overall heat dissipation efficiency. The second heat-conducting part 150 is attached to the first insulating heat-conducting part 110 to form a more stable structural system. This design not only enhances the mechanical strength of the electrolytic capacitor structure 100, but also reduces the looseness or damage of the structure caused by vibration or impact, and improves the reliability and durability of the electrolytic capacitor structure 100. By attaching the second heat-conducting part 150 to the first insulating heat-conducting part 110, the installation process of the electrolytic capacitor structure 100 can be simplified. At the same time, this design also makes subsequent maintenance work more convenient and reduces maintenance costs and time.

[0070] Reference Figure 1 In one embodiment, the second heat-conducting part 150 is fixed to the first insulating heat-conducting part 110 by welding. Thus, by welding the second heat-conducting part 150 to the first insulating heat-conducting part 110, it is ensured that the connection therebetween has a high structural stability. This stability helps to reduce problems such as loosening, falling off or deformation that may occur during use, thereby improving the reliability of the entire heat conduction. The welded connection can form a continuous heat conduction path and reduce the loss of heat during the transfer process. By welding the second heat-conducting part 150 to the first insulating heat-conducting part 110, it is ensured that heat can be smoothly transferred from one component to another, thereby improving the thermal conduction efficiency of the capacitor.

[0071] It should be noted that, refer to Figure 1 The capacitor and the first insulating heat-conducting part 110 and the second heat-conducting part 150 are fixed by welding through solder b. Specifically, the solder b includes solder paste.

[0072] In one embodiment, the second heat-conducting part 150 includes a second heat-conducting substrate 151, and the second heat-conducting substrate 151 is attached to the first insulating heat-conducting part 110, so that the second heat-conducting substrate 151 is attached to the first insulating heat-conducting part 110 to form a close heat-conducting interface. This design can ensure that heat is quickly and effectively transferred from the first insulating heat-conducting part 110 to the second heat-conducting substrate 151, thereby avoiding the accumulation of heat and local overheating. Efficient heat conduction helps to maintain the stable operating temperature of the electrolytic capacitor structure 100 and prolong its service life. As a part of the electrolytic capacitor structure 100, the second heat-conducting substrate 151 further enhances the overall heat dissipation capacity. It can quickly disperse the received heat to a larger heat dissipation area to improve the heat dissipation efficiency. By optimizing the heat dissipation path and increasing the heat dissipation area, the second heat-conducting substrate 151 helps to reduce the temperature of the electrolytic capacitor structure 100 and improve its performance stability. As the main component of the second heat-conducting part 150, the second heat-conducting substrate 151 is relatively simple in design and easy to manufacture and process. The contact connection with the first insulating heat-conducting part 110 also simplifies the overall structure of the electrolytic capacitor structure 100, reducing the complexity and cost of installation. This design not only improves production efficiency, but also helps to reduce potential failure points and improve product reliability.

[0073] It should be noted that the second heat-conducting substrate 151 can be made of a heat-conducting material compatible with the material of the first insulating heat-conducting part 110 to ensure close fit and efficient heat transfer between the two. This material compatibility helps to reduce thermal stress problems caused by mismatched thermal expansion coefficients between different materials and improve the long-term stability of the electrolytic capacitor structure 100.

[0074] In addition, by introducing the second heat-conducting substrate 151, the thermal management design of the first insulating heat-conducting part 110 becomes more flexible and optimized. In addition, the material, thickness, shape and other parameters of the second heat-conducting substrate 151 can be adjusted according to specific application requirements and heat dissipation requirements to achieve the best heat conduction effect and heat dissipation performance. This application does not limit this.

[0075] Reference Figure 5 and Figure 6In one embodiment, when the first insulating heat-conducting part 110 includes a double-sided ceramic substrate 112 and a first heat-conducting metal plate 111, and the first heat-conducting metal plate 111 is connected to the capacitor, and the double-sided ceramic substrate 112 and the first heat-conducting metal plate 111 are stacked, the second heat-conducting substrate 151 includes a second heat-conducting metal, so that since the first heat-conducting metal plate 111 is directly connected to the capacitor, it can quickly absorb the heat generated by the capacitor. At the same time, the double-sided ceramic substrate 112 acts as an insulating layer to ensure that the heat will not cause electrical failures during the conduction process. When the heat is transferred to the second heat-conducting substrate 151, since the second heat-conducting substrate 151 is made of heat-conducting metal, it can quickly disperse and transfer the heat to ensure that the heat will not accumulate in the electrolytic capacitor structure 100. The material compatibility between the first heat-conducting metal plate 111 and the second heat-conducting metal is good, which helps to reduce the thermal stress problem caused by the mismatch of thermal expansion coefficients between different materials.

[0076] Reference Figure 6 In one embodiment, a heat dissipation structure 160 is provided on the side of the second heat conducting part 150 away from the first insulating heat conducting part 110, and the heat dissipation structure 160 includes a plurality of heat dissipation parts 161, and two adjacent heat dissipation parts 161 are arranged at intervals. In this way, the plurality of heat dissipation parts 161 are arranged at intervals, which can increase the surface area of ​​the heat dissipation structure 160, thereby improving the heat dissipation efficiency. This design allows heat to be dissipated into the air more quickly through the heat dissipation parts 161, effectively reducing the temperature of the electrolytic capacitor structure 100. The heat dissipation parts 161 arranged at intervals can avoid local accumulation of heat, so that the heat can be more evenly distributed over the entire heat dissipation structure 160. This optimization of heat distribution helps to reduce thermal stress and thermal deformation, and improve the stability and reliability of the electrolytic capacitor structure 100. Since the heat dissipation parts 161 are arranged at intervals, air can flow through the heat dissipation structure 160 more smoothly, reducing the generation of wind resistance and noise. This is particularly important for electronic devices 1000 that require low-noise operation, and can enhance the user experience. The heat dissipation parts 161 arranged at intervals make the heat dissipation structure 160 have certain flexibility and adaptability. Whether in a well-ventilated environment or in a confined space, this design can effectively dissipate heat, ensuring that the electrolytic capacitor structure 100 can operate stably in various working environments. The intervals between the heat dissipation parts 161 provide convenience for cleaning and maintenance. Dust and debris are not easy to accumulate on the heat dissipation structure 160, and even if they accumulate, they can be easily removed, thereby ensuring the long-term effectiveness of the heat dissipation structure 160 and the performance stability of the electrolytic capacitor structure 100.

[0077] It should be noted that, in order to improve the heat dissipation effect, auxiliary heat dissipation equipment such as fans may be installed to further enhance the heat dissipation effect. In addition, the heat exchange medium may include air or heat exchange liquid.

[0078] In one embodiment, the heat dissipation portion 161 includes heat dissipation columns and / or heat dissipation fins. In this way, the heat dissipation columns and heat dissipation fins, as effective heat dissipation elements, can significantly increase the heat dissipation area, thereby accelerating the transfer and dissipation of heat. The upright structure of the heat dissipation column allows the heat to be quickly conducted along the column, while the heat dissipation fins can further increase the contact area with the air and improve the heat dissipation efficiency. By rationally arranging the heat dissipation columns and heat dissipation fins, the heat can be distributed more evenly throughout the heat dissipation structure 160. This helps to avoid local accumulation of heat, reduce thermal stress and thermal deformation, and thus improve the stability and reliability of the electrolytic capacitor structure 100. The heat dissipation columns and heat dissipation fins can generally be produced using a simple manufacturing process, which reduces manufacturing costs. At the same time, due to their relatively simple structure, they are also convenient for subsequent maintenance and cleaning.

[0079] It should be noted that the heat dissipation column and the heat fin can be set either alone or at the same time. When both are set at the same time, the heat dissipation effect is best. In addition, the design of the heat dissipation column and the heat dissipation fin can be flexibly adjusted according to actual needs and working environment. For example, the height, number and shape, size, etc. of the heat dissipation column can be determined according to factors such as the power size of the electrolytic capacitor structure 100 and the working environment temperature to achieve the best heat dissipation effect.

[0080] Reference Figures 7 to 9 In one embodiment, the electrolytic capacitor structure 100 further includes a liquid cooling assembly 170, which is used to perform heat exchange with the second heat conducting part 150 and / or the first insulating heat conducting part 110. In this way, the liquid cooling assembly 170 can quickly absorb and take away the heat on the second heat conducting part 150 and / or the first insulating heat conducting part 110 by utilizing the cooling effect of the liquid, thereby achieving efficient heat dissipation. This heat dissipation method is more effective than traditional air cooling, and is particularly suitable for high-power, high-density electrolytic capacitor structures 100, which can significantly reduce the operating temperature of the capacitor and prevent overheating damage. The liquid cooling system can achieve precise control of the temperature of the electrolytic capacitor structure 100 by precisely controlling the flow rate and temperature of the coolant. This precise temperature control helps to maintain the stable performance of the capacitor and prevent performance degradation or failure due to temperature fluctuations. The liquid cooling assembly 170 can flexibly adapt to different working environments and installation conditions. Whether in a high temperature and high humidity environment or in a space-constrained installation location, the liquid cooling system can work effectively to ensure stable heat dissipation of the electrolytic capacitor structure 100. By introducing the liquid cooling assembly 170, the heat dissipation performance of the electrolytic capacitor structure 100 is significantly improved, thereby reducing the risk of failure and damage caused by overheating, which helps to improve the reliability and stability of the entire system and extend the service life of the equipment.

[0081] Reference Figures 7 to 9In one embodiment, the liquid cooling assembly 170 includes a liquid cooling plate 171, and the liquid cooling plate 171 is attached to the second heat conducting part 150 and / or the first insulating heat conducting part 110, so that the liquid cooling plate 171 is closely attached to the second heat conducting part 150 and / or the first insulating heat conducting part 110, ensuring good thermal contact between the two. This direct thermal contact method can minimize the thermal resistance in the heat transfer process, thereby improving the heat exchange efficiency. Heat can be transferred from the second heat conducting part 150 and / or the first insulating heat conducting part 110 to the coolant in the liquid cooling plate 171 more quickly, and then be effectively dissipated. The design of the liquid cooling plate 171 usually has a large contact area and can cover multiple parts of the second heat conducting part 150 and / or the first insulating heat conducting part 110. This makes the heat more evenly distributed on the second heat conducting part 150 and / or the first insulating heat conducting part 110, avoiding the generation of local hot spots. Uniform heat distribution helps to reduce thermal stress and improve the reliability and stability of electrolytic capacitors. The liquid cooling plate 171 is directly attached to the second heat conducting part 150 and / or the first insulating heat conducting part 110 without the need for an additional heat conducting medium or intermediate piece. This compact design helps to reduce the overall volume and weight of the electrolytic capacitor structure 100, making it more suitable for application scenarios with limited space. The direct attachment of the liquid cooling plate 171 to the second heat conducting part 150 and / or the first insulating heat conducting part 110 makes it easier to integrate the heat dissipation system into the electrolytic capacitor structure 100. At the same time, due to the relatively simple structure, maintenance is also more convenient.

[0082] Reference Figure 7 , multiple capacitors, the corresponding first insulating heat-conducting part 110 and the corresponding second heat-conducting part 150 together constitute a capacitor unit 101, and multiple capacitor units 101 are provided, and multiple capacitor units 101 can share a liquid cooling plate 171. In this way, by integrating multiple capacitor units 101 into a whole and sharing a liquid cooling plate 171 between them, the total volume required for the electrolytic capacitor structure 100 can be significantly reduced. This compact design allows more capacitor units 101 to be installed in a limited space, thereby improving space utilization. Multiple capacitor units 101 share a liquid cooling plate 171, which means that only one liquid cooling system is needed to provide cooling for all capacitor units 101. This greatly simplifies the design and maintenance of the heat dissipation system, reduces manufacturing costs, and improves the reliability of the system.

[0083] In one embodiment, the electrolytic capacitor structure 100 further includes an enclosure frame 1010, which is mounted on the second heat conducting part 150 or the liquid cooling component 170, and the enclosure frame 1010 is arranged around the peripheral side of the multiple capacitors, and is jointly enclosed with the second heat conducting part 150 or the liquid cooling component 170 and the multiple capacitors to form a receiving groove, and the receiving groove is filled with potting glue A, so that the existence of the enclosure frame 1010 makes the various components in the electrolytic capacitor structure 100 more stable, reducing the risk of loosening or displacement of components due to vibration or impact. This stability helps to maintain the normal operation of the capacitor and improve the reliability of the overall structure. By enclosing the receiving groove formed by the enclosure frame 1010, the second heat conducting part 150 or the liquid cooling component 170 and the capacitor, and filling the potting glue A therein, an excellent sealing effect can be achieved. This sealing performance effectively prevents harmful substances such as external dust and moisture from invading the interior of the capacitor, protecting the capacitor from environmental pollution and damage. The combination of the enclosure frame 1010 and the second heat-conducting part 150 or the liquid-cooling assembly 170 can form an efficient heat dissipation channel. Through the guidance of the enclosure frame 1010, heat can be transferred to the second heat-conducting part 150 or the liquid-cooling assembly 170 more quickly, thereby achieving efficient heat dissipation. This helps to reduce the operating temperature of the capacitor and improve its stability and life. The design of the enclosure frame 1010 makes the installation process of the electrolytic capacitor structure 100 more convenient. At the same time, due to the filling of the potting glue A, the components inside the capacitor are well fixed and protected, reducing the complexity and frequency of maintenance work.

[0084] In one embodiment, each of the side walls or pins 130 of the capacitor is provided with an explosion-proof groove 180. In this way, the main function of the explosion-proof groove 180 is to deform or rupture first when the internal pressure of the capacitor increases abnormally, thereby releasing the internal pressure and avoiding a violent explosion of the capacitor. This greatly improves the safety of the capacitor and reduces the risk of equipment damage or casualties that may be caused by the explosion of the capacitor. The design of the explosion-proof groove 180 enables the capacitor to respond quickly under abnormal conditions and prevent more serious consequences by releasing pressure. This design enhances the self-protection ability of the capacitor and improves the stability and reliability of its operation. The setting of the explosion-proof groove 180 also simplifies the safety protection measures of the capacitor. Compared with other complex safety mechanisms, the design of the explosion-proof groove 180 is more direct and effective, and the cost is relatively low, and it is easier to be widely used in capacitor manufacturing.

[0085] In one embodiment, the electrolytic capacitor structure 100 further includes at least one temperature sensor 190, which is used to detect the temperature of the plurality of capacitors. Thus, the temperature sensor 190 can monitor the temperature of the capacitor in real time to ensure that the capacitor operates within a normal operating temperature range. Once it is found that the temperature is too high, corresponding measures can be taken immediately, such as increasing heat dissipation, reducing workload, etc., to prevent the capacitor from being damaged due to overheating. By continuously monitoring the temperature of the capacitor, the temperature sensor 190 can detect potential faults or abnormal conditions in advance and issue early warning signals in time. This helps the operation and maintenance personnel to intervene in advance and take necessary precautions to avoid the capacitor from failing due to long-term high-temperature operation. According to the real-time temperature data provided by the temperature sensor 190, the working conditions of the electrolytic capacitor structure 100 can be adjusted, such as adjusting the working voltage, current or working environment, etc., to optimize the operating performance of the capacitor and extend its service life. The temperature sensor 190 can record the temperature data of the capacitor under different working conditions, providing valuable data support for subsequent performance analysis and troubleshooting. Through the analysis of these data, the working characteristics of the capacitor can be deeply understood, providing a basis for improving the design and optimizing the operation. Through real-time monitoring and early warning, the temperature sensor 190 helps to improve the reliability of the entire electrolytic capacitor structure 100. It can reduce capacitor damage and failures caused by overheating, reduce system maintenance costs, and improve the operating stability of the equipment.

[0086] It should be noted that the temperature sensor 190 may be an NTC, a chip, etc. It may be placed inside the capacitor to detect the temperature of the capacitor core, or it may be arranged in the first insulating heat-conducting part 110 to monitor the capacitor core temperature.

[0087] Reference Fig.10 In a second aspect, the present application further provides an electronic device 1000, wherein the electronic device 1000 includes the electrolytic capacitor structure 100 as described above.

[0088] According to the electronic device 1000 of the present application, according to the electrolytic capacitor structure 100 of the present application, the design of the first insulating heat-conducting part 110 means that it can not only play an insulating role, prevent the current leakage or short circuit inside the capacitor, but also has good thermal conductivity. This means that when the capacitor generates heat during operation, the heat can be quickly conducted through the insulating heat-conducting part, thereby effectively dispersing the heat to a larger area and reducing the accumulation of heat inside the capacitor. The welding and fixing of multiple capacitors and the metal welding area 110a also helps to improve the heat dissipation effect. The metal welding area 110a serves as a heat transmission channel and can quickly export the heat generated by the capacitor. The welding and fixing method ensures good contact between the capacitor and the metal welding area 110a, reduces the contact thermal resistance, and enables the heat to be more smoothly transferred to the heat sink or other heat dissipation devices. The design of electrically connecting the pin 130 to the circuit board 140 also takes into account the need for heat dissipation. The pin 130 is not only used for electrical connection, but also can be used as a channel for heat transfer to further disperse the heat generated by the capacitor to the circuit board 140. In this way, the heat dissipation area of ​​the entire circuit board 140 is increased, further improving the heat dissipation effect of the electrolytic capacitor.

[0089] In one embodiment, the electronic device 1000 further includes a power semiconductor module 200 and a reactor 300, and the power semiconductor module 200 and the reactor 300 are both mounted on the liquid cooling plate 171, so that the capacitor, the power semiconductor module 200 and the reactor 300 share the liquid cooling plate 171, making the structure of the electronic device 1000 compact. The provision of the liquid cooling plate 171 can keep the electronic device 1000 at a suitable temperature, thereby increasing the service life of the electronic device 1000.

[0090] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0091] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0092] In the description of this application, "first feature" or "second feature" may include one or more of the features.

[0093] In the description of the present application, “plurality” means two or more.

[0094] In the description of the present application, a first feature being “on” or “under” a second feature may include that the first and second features are directly in contact with each other, or may include that the first and second features are not in direct contact with each other but are in contact with each other via another feature therebetween.

[0095] In the description of the present application, “above”, “over” and “above” a first feature to a second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature.

[0096] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0097] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. An electrolytic capacitor structure, characterized in that: Comprising: A first insulating and heat-conducting part, wherein a plurality of metal welding areas are formed on the first insulating and heat-conducting part; And A plurality of capacitors, one ends of the plurality of capacitors are respectively welded and fixed to the plurality of metal welding areas, and the other ends are used for electrical connection with a circuit board through pins.

2. The electrolytic capacitor structure according to claim 1, characterized in that: Capacitors with the same voltage among the plurality of capacitors are located in the same metal welding area.

3. The electrolytic capacitor structure according to claim 1, characterized in that: The first insulating and heat-conducting part includes a double-sided ceramic substrate, and the double-sided ceramic substrate forms the metal welding areas; or The first insulating and heat-conducting part includes a double-sided ceramic substrate and a first heat-conducting metal plate, and the metal welding areas are formed on the surfaces of both the double-sided ceramic substrate and the first heat-conducting metal plate.

4. The electrolytic capacitor structure according to claim 3, characterized in that: The double-sided ceramic substrate includes a ceramic layer and a metal layer, the thickness of the ceramic layer is T1, and the thickness of the metal layer is T2, wherein, 0mm < T1 ≤ 1mm, and / or, 0.2mm ≤ T2 ≤ 0.8mm.

5. The electrolytic capacitor structure according to any one of claims 1 to 4, characterized in that: It further includes a second heat-conducting part, the second heat-conducting part is arranged on a side of the first insulating and heat-conducting part背离 the capacitors, and the second heat-conducting part is in contact with the first insulating and heat-conducting part.

6. The electrolytic capacitor structure according to claim 5, characterized in that: The second heat-conducting part includes a second heat-conducting substrate, and the second heat-conducting substrate is in contact with the first insulating and heat-conducting part; or, A heat dissipation structure is arranged on a side of the second heat-conducting part背离 the first insulating and heat-conducting part, the heat dissipation structure includes a plurality of heat dissipation parts, and there is a gap between adjacent two of the plurality of heat dissipation parts.

7. The electrolytic capacitor structure according to claim 6, characterized in that: The heat dissipation part includes a heat dissipation column and / or a heat dissipation fin.

8. The electrolytic capacitor structure according to claim 5, characterized in that: The electrolytic capacitor structure further includes a liquid cooling component, and the liquid cooling component is used for heat exchange with the second heat-conducting part and / or the first insulating and heat-conducting part.

9. The electrolytic capacitor structure according to claim 8, characterized in that: It further includes a surrounding frame, the surrounding frame is installed on the second heat-conducting part or the liquid cooling component, the surrounding frame surrounds the periphery of the plurality of capacitors, and a containing groove is jointly formed between the surrounding frame and the second heat-conducting part or the liquid cooling component and the plurality of capacitors, and potting glue is filled in the containing groove.

10. The electrolytic capacitor structure according to any one of claims 1 to 4, characterized in that: An explosion-proof groove is arranged beside the side wall or pins of each capacitor; and / or, The electrolytic capacitor structure further includes at least one temperature sensor, and the temperature sensor is used for detecting the temperature of the plurality of capacitors.

11. An electronic device, characterized in that: Comprising the electrolytic capacitor structure according to any one of claims 1 to 10.

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