A driver support structure

Abstract

The present application provides a driver bracket structure, which includes: an upper circuit board, a wiring harness, a bracket and a lower circuit board; the upper circuit board and the lower circuit board are arranged on the upper and lower sides of the bracket, and a plurality of wiring harness fixing points are arranged on the surface of the upper circuit board; a wiring groove is arranged in the bracket; the wiring harness is connected to the upper circuit board and the lower circuit board, and is arranged on the bracket based on the wiring harness fixing points and the wiring groove. The present application provides a driver bracket structure for solving the problems of low internal space utilization, poor heat dissipation and electromagnetic interference of the driver.

Description

Technical Field

[0001] The present application belongs to the technical field of brackets, and in particular, relates to a driver bracket structure. Background Art

[0002] The existing drivers need to be equipped with components such as the main control board and the power board, and the main control board and the power board need to be equipped with many different electronic components, and then installed in other electronic devices. As the layout of the various components inside the driver squeezes each other's space, and because the existing driver bracket wiring is mostly wired around the bracket, the harness fixing points are mostly set on the surrounding outer contour walls or there are no harness fixing points, resulting in a relatively messy arrangement of the harness inside the driver bracket and a certain degree of difficulty in fixing the harness, which in turn leads to low utilization of the internal space of the bracket and signal interference. In addition, in order to ensure that the various electronic components in the driver can dissipate heat well, the existing technology fixes the main control board and the power board on both sides of the radiator for heat dissipation, thereby improving the reliability of the functions of each electronic device. Since various types of heating plates with different powers need to be transferred inside the driver, in order to improve the heat dissipation efficiency of the heating plates, the prior art often requires that each heating plate be installed and matched with a heat sink of its own power, which increases the manufacturing cost of manufacturing different heat sinks. In order to avoid mutual interference between electronic components, different heat sinks need to have a certain interval between them, which increases the size of the driver, and further limits the trend of miniaturization of electronic equipment. In order to reduce the size of the driver, the heat dissipation performance of the electronic components needs to be abandoned, which reduces the heat dissipation performance and affects the performance of the electronic equipment. Therefore, there is a contradiction between the internal heat dissipation and volume of the driver.

[0003] Therefore, how to provide a driver structure to solve the above problems has become an urgent problem to be solved by those skilled in the art. Summary of the invention

[0004] The purpose of the present application is to provide a driver bracket structure for solving the problems of low internal space utilization and heat dissipation of the driver.

[0005] In a first aspect, the present application provides a driver bracket structure.

[0006] In the present application, the driver bracket structure includes: an upper circuit board, a wiring harness, a bracket and a lower circuit board;

[0007] The upper circuit board and the lower circuit board are arranged on the upper and lower sides of the bracket.

[0008] A plurality of wiring harness fixing points are arranged on the surface of the upper circuit board;

[0009] A wiring groove is provided in the bracket;

[0010] The wiring harness is connected to the upper circuit board and the lower circuit board, and is arranged on the bracket based on the wiring harness fixing point and the wiring groove.

[0011] In an implementation of the first aspect, the wiring groove is arranged in the middle space of the bracket cavity.

[0012] In an implementation of the first aspect, the wiring trough can be detachably installed on the bracket.

[0013] In an implementation of the first aspect, heat dissipation holes are arranged on side walls around the plastic bracket.

[0014] In an implementation manner of the first aspect, the wiring trough is provided with heat dissipation holes.

[0015] In an implementation manner of the first aspect, the heat dissipation holes are a mesh structure.

[0016] In an implementation manner of the first aspect, the wiring trough wraps the wiring harness therein.

[0017] In an implementation manner of the first aspect, the upper circuit board and the lower circuit board are fixed by fasteners and the bracket.

[0018] In an implementation manner of the first aspect, the bracket is a plastic bracket.

[0019] As described above, the driver bracket structure described in the present application has the following beneficial effects:

[0020] The middle space is effectively utilized to reduce the size of the driver and improve power density; the specific arrangement of the wiring harness ensures that no new signal interference will be generated; the establishment of mesh heat dissipation holes effectively discharges the heat blocked in the middle, controls the temperature rise, and extends the service life of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 Shown is a schematic diagram of the drive bracket structure described in an embodiment of the present application.

[0022] Figure 2 Shown is a schematic diagram of the setting of the upper circuit board fixing points of the upper circuit board of the driver bracket described in an embodiment of the present application.

[0023] Figure 3 Shown is a schematic diagram of the wiring harness fixing point setting of the upper circuit board of the driver bracket described in an embodiment of the present application.

[0024] Figure 4 Shown is a schematic diagram of the location setting of the drive bracket wiring groove according to an embodiment of the present application.

[0025] Figure 5Shown is a schematic diagram of another implementation of the location setting of the drive bracket wiring groove described in an embodiment of the present application.

[0026] Figure 6 Shown is a schematic diagram of the heat dissipation hole arrangement of the driver bracket described in an embodiment of the present application.

[0027] Figure 7 Shown is a schematic diagram of the completed assembly of the driver bracket described in an embodiment of the present application used in the field of frequency converters.

[0028] Component number description

[0029] 11 Upper circuit board

[0030] 12 Wire Harness

[0031] 13 Bracket

[0032] 14 Lower circuit board

[0033] 21 Upper circuit board fixing point

[0034] 22 Upper circuit board fixing point

[0035] 23 Upper circuit board fixing point

[0036] 24 Upper circuit board fixing point

[0037] 25 Upper circuit board fixing point

[0038] 31 Cable harness fixing point

[0039] 61 Cooling holes DETAILED DESCRIPTION

[0040] The following describes the embodiments of the present application through specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. The present application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict.

[0041] It should be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present application, and thus the drawings only show components related to the present application rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed at will, and the component layout may also be more complicated.

[0042] The following embodiments of the present application provide a drive bracket structure that solves the problems of low internal space utilization and heat dissipation of the drive.

[0043] The principle and implementation of a driver bracket structure of this embodiment will be described in detail below in conjunction with the accompanying drawings so that those skilled in the art can understand the driver bracket structure of this embodiment without creative work.

[0044] like Figure 1 As shown, this embodiment provides a driver bracket structure, which includes: an upper circuit board 11, a wiring harness 12, a bracket 13 and a lower circuit board 14;

[0045] The upper circuit board 11 and the lower circuit board 14 are arranged on the upper and lower sides of the bracket 13.

[0046] The surface of the upper circuit board 11 is provided with a plurality of wiring harness fixing points;

[0047] The bracket 13 is provided with a wiring groove;

[0048] The wiring harness 12 is connected to the upper circuit board 11 and the lower circuit board 14 , and is arranged on the bracket 13 based on the wiring harness fixing points and the wiring grooves.

[0049] See also Figure 2 , which is a schematic diagram of the circuit board fixing point setting of the upper circuit board of the present application. In this embodiment, the upper circuit board 11 is provided with 5 circuit board fixing points, namely upper circuit board fixing point 21, upper circuit board fixing point 22, upper circuit board fixing point 23, upper circuit board fixing point 24, and upper circuit board fixing point 25. The selection and design of the circuit board fixing points is an important link, which is related to the stability and reliability of the circuit board. The circuit board fixing method can be screw fixing method, welding fixing method, snap fixing method, riveting fixing method, gluing fixing method, and red glue fixing method. In practical applications, the corresponding fixing method can be selected considering factors such as product structure, cost, test requirements, use environment, and product grade to ensure the stability and safety of the circuit board during use.

[0050] See also Figure 3 , which is a schematic diagram of the wiring harness fixing point of the upper circuit board of the present application. In the present embodiment, the position of the wiring harness fixing point 31 can be set based on the position of the wiring trough, so as to realize the optimal design of wiring harness routing and fixing according to actual needs. At the same time, the wiring harness arrangement at a specific position ensures that the internal wiring of the equipment is neat, safe and stable, and ensures that no new signal interference is generated.

[0051] See also Figure 4, showing a schematic diagram of the wiring trough position setting of the present application. The wiring trough, also known as the wire trough or wiring trough, is an electrical tool used to organize and fix power lines, data lines and other wires. The design of the wiring trough needs to consider factors such as the material, size specifications, and line management of the wiring trough. In this embodiment, the wiring trough is arranged in the middle space of the cavity of the bracket 13; specifically, the wiring harness 12 is arranged on the bracket 13 based on the wiring harness fixing point 31 and the wiring trough, so that it is connected to the upper circuit board 11 and the lower circuit board 14. By setting the wiring trough at a specific position in the middle space of the cavity of the bracket 13, it can be ensured that the bracket 13 can avoid the specific signal source part of the lower circuit board 14 while fixing the upper circuit board 11, thereby improving the EMC performance. The effective use of the middle space reduces the size of the driver and improves the power density. Electromagnetic compatibility (EMC) refers to the ability of a device or system to operate in accordance with the requirements in its electromagnetic environment and not to produce intolerable electromagnetic disturbances to any device in its environment. Therefore, EMC includes two requirements: on the one hand, the electromagnetic disturbance (Electromagnetic Disturbance) generated by the equipment to the environment during normal operation cannot exceed a certain limit; on the other hand, it means that the equipment has a certain degree of immunity to the electromagnetic disturbance in the environment, that is, electromagnetic susceptibility (EMS). That is, the aggressiveness of the equipment itself to other equipment (EMI) and the ability of the equipment itself to resist interference from other equipment (EMS). This application standardizes the conduction path by designing wiring troughs at specific locations. At the same time, the signal lines are short, the vias are few, and the loop area is small, which greatly improves the EMC performance.

[0052] In one embodiment, the bracket 13 is a plastic bracket, such as PPO540 material: this material is an engineering plastic with excellent performance, high heat resistance, excellent electrical insulation, good chemical stability, low water absorption, high strength and toughness. In this embodiment, the wiring groove set on the bracket 13 adopts the above material to enable it to maintain good physical properties at high temperatures, not easy to corrode, withstand large impact loads, and also ensure that the driver can perform a full set of mechanical test requirements under the ES49-086 standard (such as vibration, random vibration, high temperature operation, etc.). In actual applications, the design of the driver bracket material will be optimized according to the specific driver model and use environment to meet different needs.

[0053] See also Figure 5 , Figure 5Another schematic diagram of the wiring trough position setting is shown. The wiring trough can be detachably installed on the bracket 13, and its position setting can be set in different positions according to the signal area of ​​the lower circuit board 14. The wiring trough position setting still follows the principle of avoiding the signal source area of ​​the lower circuit board 14. Through the above design, the wiring trough of the present application is easy to disassemble and reassemble. Only the upper circuit board 11 needs to be taken out to take out the wiring harness 12, and no extra screws are required to fix it, which is convenient for line management and maintenance.

[0054] See also Figure 6 , showing a schematic diagram of the heat dissipation hole arrangement of the present application, in this embodiment, the side walls of the bracket 13 are provided with heat dissipation holes 61, the wiring trough is provided with heat dissipation holes 61, and the heat dissipation holes 61 are mesh structures. The establishment of the mesh heat dissipation holes effectively discharges the heat blocked in the middle, controls the temperature rise, improves the heat dissipation performance of the equipment, and prolongs the service life of the device.

[0055] The heat dissipation holes are designed as a mesh structure, which can effectively dissipate heat and prevent dust and other particles from entering the inside of the device. In electronic devices, the design and layout of heat dissipation holes need to follow certain specifications to ensure air circulation and improve heat dissipation efficiency. In addition, the design of heat dissipation holes should not only consider functionality but also aesthetics. Hole elements can be expressed in various forms, such as heat dissipation holes, audio holes or decorative holes, and the use of these holes needs to follow the overall aesthetics of the product design. In this application, heat dissipation holes are a method of improving the heat dissipation effect of surface mount components and wiring harnesses by setting through holes. These through holes allow heat to be conducted through the circuit board to the back, thereby helping to dissipate heat. The mesh heat dissipation holes of this application are a key component of the device's heat dissipation system. Through carefully designed layout and shape, it ensures that the device can effectively dissipate heat during operation while keeping the inside of the device clean and with good air circulation.

[0056] In one embodiment, the wiring trough encloses the wiring harness 12. Specifically, the wiring harness 12 of the upper circuit board 11 is directly pressed into the wiring trough, which simplifies the factory production line installation and assembly process, reduces steps, and saves work hours.

[0057] In one embodiment, the upper circuit board 11 and the lower circuit board 14 are fixed by fasteners and the bracket 13. In order to firmly mount the driver on the bracket, screws, clamps or other fixing devices are required. These devices can ensure that the driver will not be displaced due to vibration or other external forces during operation.

[0058] Drivers are devices used to control power mechanisms to complete specific actions. They have a wide range of applications, from robots to computer hardware. They are key components to ensure the normal operation of equipment. For example, in the field of variable frequency technology, variable frequency air conditioners mainly control the operating frequency of compressors and / or fans through inverters. The current conventional variable frequency control method is mainly to set up separate variable frequency drivers for the inverters of the compressor and each fan in the variable frequency air conditioner, and control different inverters through different variable frequency drivers. To this end, it is necessary to set up separate heat dissipation, communication, switching power supply and rectification structures for each variable frequency driver. The variable frequency driver is a power device, and its own loss heat generation, large structural volume, cooling and heat dissipation and other problems lead to this variable frequency control method not only requiring higher costs, but also occupying a larger internal space of the air conditioner, increasing the difficulty of assembling the air conditioner, and is not conducive to the promotion and use of variable frequency air conditioners. Therefore, the above problems can be solved by improving the driver bracket that fixes and supports the inverter.

[0059] See also Figure 7 , showing a schematic diagram of the completed assembly of the present application in the field of inverters. In this embodiment, by installing the driver bracket structure of the present application in the inverter, the wiring harness is arranged on the bracket based on the wiring harness fixing point and the specific wiring groove, so that it is connected to the filter board, that is, the upper circuit board 11 described in the present application, and the power board, that is, the lower circuit board 14 described in the present application, which can quickly dissipate heat from the inverter housing, effectively reduce the problem of inverter failure due to excessive temperature, and at the same time discharge the heat blocked in the middle, control the temperature rise, and extend the service life of the device; greatly improve the effective utilization of the internal space, improve the overall power density, and the bracket has high flexibility after installation, which is convenient for the maintenance and management of the line. At the same time, the volume of the whole system becomes smaller, which is convenient for installation and maintenance, improves the stability of the air-conditioning operation, and reduces costs.

[0060] The descriptions of the processes or structures corresponding to the above-mentioned figures have different emphases. For parts that are not described in detail in a certain process or structure, please refer to the relevant descriptions of other processes or structures.

[0061] The above embodiments are merely illustrative of the principles and effects of the present application and are not intended to limit the present application. Anyone familiar with the technology may modify or change the above embodiments without violating the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by a person of ordinary skill in the art without departing from the spirit and technical ideas disclosed in the present application shall still be covered by the claims of the present application.

Claims

1. A driver support structure, characterized in that: The driver bracket structure comprises: an upper circuit board, a wiring harness, a bracket and a lower circuit board; The upper circuit board and the lower circuit board are arranged on the upper and lower sides of the bracket. A plurality of wiring harness fixing points are arranged on the surface of the upper circuit board; A wiring groove is provided in the bracket; The wiring harness is connected to the upper circuit board and the lower circuit board, and is arranged on the bracket based on the wiring harness fixing point and the wiring groove.

2. The driver bracket structure according to claim 1, characterized in that: The wiring groove is arranged in the middle space of the bracket cavity.

3. The driver bracket structure according to claim 1, characterized in that: The wiring trough can be detachably installed in the bracket.

4. The driver support structure according to claim 1, characterized in that: Heat dissipation holes are arranged on the side walls around the bracket.

5. The driver support structure according to claim 1, characterized in that: The wiring trough is provided with heat dissipation holes.

6. The driver support structure according to claim 4 or 5, characterized in that: The heat dissipation holes are of a mesh structure.

7. The driver support structure according to claim 1, characterized in that: The wiring trough wraps the wiring harness therein.

8. The driver support structure according to claim 1, characterized in that: The upper circuit board and the lower circuit board are fixed by fasteners and the bracket.

9. The driver support structure according to claim 1, characterized in that: The bracket is a plastic bracket.

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