A special electroplating device for ultra-thin FPC

Abstract

A special electroplating device for ultra-thin FPC, comprising an electroplating tank, a fixing component, an FPC fixture, an anode plate, a stirring component and a flow guide, wherein the electroplating tank is designed to be open at the upper end, the fixing component, the anode plate, the stirring component and the flow guide are all installed in the electroplating tank, the FPC fixture is engaged with the fixing component, wherein the anode plate is located at the front and rear sides of the middle of the FPC fixture, the stirring component is located at the front and rear sides of the two ends of the FPC fixture, and the flow guide is located at the left and right sides of the two ends of the FPC fixture; the flow guide is designed in a double "T" shape structure, comprising a mounting plate and two flow guide plates integrally arranged on one side of the mounting plate and perpendicular to the mounting plate. The utility model guides the electroplating liquid in the electroplating process by designing a flow guide, so that the flow direction of the electroplating liquid is parallel to the surface of the FPC board, which greatly reduces the phenomenon of depression and wrinkles on the FPC surface caused by the impact of the electroplating liquid on the FPC board; the utility model is highly practical and has a strong promotion significance.

Description

Technical Field

[0001] The utility model relates to a circuit board processing device, in particular to a special electroplating device for ultra-thin FPC. Background Art

[0002] Flexible printed circuits (FPCs), or FPCs, are highly reliable and flexible printed circuit boards made from polyimide or polyester film. They offer high wiring density, light weight, thinness, and excellent bendability, offering many advantages over rigid printed circuit boards. FPCs can be bent, rolled, and folded freely, allowing for arbitrary spatial layouts and movement and expansion within three dimensions, enabling the integration of component assembly and wiring connections. The bent FPCs integrate individual electronic modules into the internal cavity of electronic products, significantly reducing the volume occupied by these modules.

[0003] During the electroplating process, stirring components are designed to agitate the plating solution within the tank, thereby improving plating efficiency and results. However, for flexible FPCs, the agitated flow of the plating solution often exerts forces on the board, causing dents and wrinkles, which in turn affects the surface plating effect. Utility Model Content

[0004] Based on this, it is necessary to provide a special electroplating device for ultra-thin FPC to address the shortcomings of the existing technology.

[0005] A dedicated electroplating device for ultra-thin FPCs comprises a plating tank, a fixing assembly, an FPC fixture, an anode plate, a stirring assembly, and a flow guide. The plating tank is open at the top, and the fixing assembly, anode plate, stirring assembly, and flow guide are all installed within the plating tank. The FPC fixture is snapped onto the fixing assembly, with the anode plate located at the front and rear ends of the FPC fixture, the stirring assembly located at the front and rear ends of the FPC fixture, and the flow guide located at the left and right ends of the FPC fixture. The flow guide has a double "T"-shaped structure, comprising a mounting plate and two flow guide plates integrally mounted on one side of the mounting plate and perpendicular to the mounting plate. The mounting plate is fixed to the bottom of the plating tank and located outside the fixing assembly. The two flow guide plates are respectively clamped to the front and rear ends of the fixing assembly and complement the front and rear ends of the anode plate.

[0006] Furthermore, the fixing assembly includes two sets of fixing posts. A slide rail is provided at the bottom of the electroplating tank. The two sets of fixing posts are respectively mounted on the slide rail and arranged in a left-right opposite relationship. The fixing posts are provided with a fixing slot with an upper end and a side opening. The two ends of the FPC clamp are respectively mounted in the fixing slot.

[0007] Furthermore, the FPC clamp includes two clamping frames arranged in a central symmetrical manner, a plating window is provided in the middle of the clamping frame, and fixed terminals are provided at both ends. The clamping frame is also provided with a limit snap block and a limit snap hole, and the limit snap block and the limit snap hole are both located between the plating window and the fixed terminal.

[0008] Furthermore, a clamping step is provided on the edge of the electroplating window, and the left and right sides of the clamping step are designed in a wavy tooth structure.

[0009] Furthermore, the stirring assembly includes a plurality of stirring drums, each of which includes a cylinder and a plurality of stirring blades. The cylinder is installed at the bottom of the electroplating tank and is located outside the gap between the anode plate and the guide member, and the plurality of stirring blades are evenly distributed outside the cylinder at the same inclination angle.

[0010] Furthermore, the dedicated electroplating device for ultra-thin FPC also includes a defoamer, which is fixedly installed at the bottom of the electroplating tank and located between the stirring components.

[0011] Furthermore, the dedicated electroplating device for ultra-thin FPC also includes an upper cover, which is installed at the upper end of the electroplating tank and can be slid left and right to open and close.

[0012] To sum up, the beneficial effects of the special electroplating device for ultra-thin FPC of the utility model are: by designing a guide member to guide the plating liquid during the electroplating process, the flow direction of the plating liquid is made parallel to the surface of the FPC board, which greatly reduces the impact of the plating liquid on the FPC board and causes depressions and wrinkles on the FPC surface, thereby improving the electroplating effect of the FPC; the fixed component is designed with an adjustable width, so that it can fix and limit clamps of different specifications, and finally realize the electroplating processing of different FPCs; the FPC clamp is designed with a clamping step with wavy teeth, which can clamp the FPC more firmly to make it taut and flat; the stirring component can stir the plating liquid to keep it flowing, thereby improving the efficiency and effect of electroplating; the defoaming machine is designed to eliminate the foam that may be generated during the stirring process of the plating liquid, reducing its influence on the electroplating effect; the upper cover is designed to cover and seal the electroplating tank, thereby avoiding splashing or pollution of the plating liquid; the utility model is highly practical and has a strong promotion significance. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic structural diagram of a dedicated electroplating device for ultra-thin FPCs according to the present invention;

[0014] Figure 2 for Figure 1 Schematic diagram of the decomposition structure;

[0015] Figure 3 for Figure 2 Schematic diagram of the structure of the middle fixed frame;

[0016] Figure 4 for Figure 2 Schematic diagram of the exploded structure of the FPC fixture;

[0017] Figure 5 for Figure 2 Schematic diagram of the structure of the stirring component;

[0018] Figure 6 for Figure 2 Schematic diagram of the structure of the middle guide piece. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solutions and advantages of the utility model more clearly understood, the utility model is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the utility model and are not intended to limit the utility model.

[0020] like Figures 1 to 6 As shown, the utility model provides a special electroplating device 100 for ultra-thin FPC, which includes an electroplating tank 10, a fixing component 20, an FPC fixture 30, an anode plate 40, a stirring component 50 and a guide member 60. The electroplating tank 10 is designed to be open at the upper end, and the fixing component 20, the anode plate 40, the stirring component 50 and the guide member 60 are all installed in the electroplating tank 10. The FPC fixture 30 is engaged with the fixing component 20, wherein the anode plate 40 is located on the front and back sides of the middle part of the FPC fixture 30, the stirring component 50 is located on the front and back sides of both ends of the FPC fixture 30, and the guide member 60 is located on the left and right sides of both ends of the FPC fixture 30.

[0021] The fixing assembly 20 includes two sets of fixing posts 21. The bottom of the electroplating tank 10 is also provided with a slide rail 11. The two sets of fixing posts 21 are respectively mounted on the slide rail 11 and arranged in a left-right, opposing relationship. Each fixing post 21 has a fixing slot 211 open at the top and one side. The ends of the FPC fixture 30 are respectively mounted in the fixing slot 211. The fixing posts 21 mounted on the slide rail 11 can be adjusted in distance by sliding left and right, thereby accommodating FPC fixtures 30 of different lengths and securing FPCs of varying specifications.

[0022] The FPC fixture 30 includes two symmetrically arranged clamping frames 31. A plating window 311 is located in the center of the clamping frames 31, and fixed terminals 312 are located at both ends. The clamping frames 31 are also provided with a limiting snap-fit ​​block 313 and a limiting snap-fit ​​hole 314, both of which are located between the plating window 311 and the fixed terminals 312. The edges of the plating window 311 are also provided with a clamping step 315, with the left and right sides of the clamping step 315 having a wavy tooth structure. The two clamping frames 31 can easily clamp and secure an ultra-thin FPC, while the wavy tooth structure of the clamping step 315 can more firmly secure the FPC end, preventing the FPC from loosening or shifting during the electroplating process.

[0023] The stirring assembly 50 includes a plurality of stirring rollers 51, each comprising a barrel 511 and a plurality of stirring blades 512. The barrel 511 is mounted at the bottom of the electroplating tank 10, outside the gap between the anode plate 40 and the flow guide 60. The stirring blades 512 are evenly distributed outside the barrel 511 at the same inclination angle. The stirring blades 512, with the same inclination angle, are rotated by the barrel 511, thereby moving the electroplating solution in a predetermined direction. This flowing electroplating solution can more fully contact the FPC surface, thereby improving electroplating efficiency and quality.

[0024] The deflector 60 has a double "T"-shaped structure, comprising a mounting plate 61 and two deflector plates 62 integrally mounted on one side of the mounting plate 61 and perpendicular to the mounting plate 61. The mounting plate 61 is fixed to the bottom of the plating tank 10 and located outside the fixed assembly 20. The two deflector plates 62 are respectively clamped to the front and rear sides of the fixed assembly 20 and complement the front and rear sides of the anode plate 40. The double-T-shaped deflector 60, in conjunction with the anode plate 40, guides the plating solution stirred by the stirring assembly 50, thereby preventing the flowing plating solution from impacting the FPC, causing dents and wrinkles.

[0025] The ultra-thin FPC electroplating apparatus 100 further includes a defoamer 70, which is fixedly mounted at the bottom of the electroplating tank 10 and located between the stirring components 50. The ultra-thin FPC electroplating apparatus 100 further includes an upper cover 80, which is mounted at the upper end of the electroplating tank 10 and can slide open and close. The defoamer 70 emits ultrasonic waves to break up and eliminate bubbles that may be present in the electroplating solution, thereby preventing them from adversely affecting the electroplating effect. The upper cover 80 ensures a sealed state during the FPC electroplating process, preventing waste or contamination caused by splashing of the electroplating solution, and preventing contamination of the electroplating solution from external sources that could affect the electroplating process.

[0026] In summary, the beneficial effects of the dedicated electroplating device 100 for ultra-thin FPCs of the present invention are as follows: by designing a flow guide 60 to guide the plating liquid during the electroplating process, the flow direction of the plating liquid is made parallel to the surface of the FPC board, which greatly reduces the impact of the plating liquid on the FPC board and causes depressions and wrinkles on the FPC surface, thereby improving the electroplating effect of the FPC; the fixing component 20 is designed with an adjustable width, so that it can fix and limit clamps of different specifications, and ultimately realize electroplating processing of different FPCs; the FPC clamp 30 is designed with a clamping step 315 with wavy teeth, which can more firmly clamp the FPC to make it taut and flat; the stirring component 50 can stir the plating liquid to keep it flowing, thereby improving the efficiency and effect of electroplating; the defoamer 70 is designed to eliminate foam that may be generated during the stirring of the plating liquid, reducing its impact on the electroplating effect; the upper cover 80 is designed to cover and seal the electroplating tank 10, thereby avoiding splashing or contamination of the plating liquid; the utility model is highly practical and has strong promotion significance.

[0027] The above-described embodiment merely represents one embodiment of the utility model. While the description is relatively specific and detailed, it should not be construed as limiting the scope of the utility model patent. It should be noted that a person skilled in the art may make various modifications and improvements without departing from the concept of the utility model, and these modifications and improvements fall within the scope of protection of the utility model. Therefore, the scope of protection of the utility model patent shall be determined by the appended claims.

Claims

1. A special electroplating device for ultra-thin FPC, characterized in that: The invention comprises an electroplating tank, a fixing component, an FPC fixture, an anode plate, a stirring component and a flow guide, wherein the electroplating tank is designed to be open at the upper end, the fixing component, the anode plate, the stirring component and the flow guide are all installed in the electroplating tank, the FPC fixture is clamped on the fixing component, wherein the anode plate is located at the front and rear sides of the middle part of the FPC fixture, the stirring component is located at the front and rear sides of both ends of the FPC fixture, and the flow guide is located at the left and right sides of both ends of the FPC fixture; the flow guide is designed in a double "T" shape structure, which comprises a mounting plate and two flow guide plates which are integrally arranged on one side of the mounting plate and are perpendicular to the mounting plate, the mounting plate is fixedly installed at the bottom of the electroplating tank and is located on the outside of the fixing component, the two flow guide plates are respectively clamped at the front and rear sides of the fixing component and are complementary to the front and rear sides of the anode plate.

2. The dedicated electroplating device for ultra-thin FPC as claimed in claim 1, characterized in that: The fixing assembly includes two groups of fixing columns. A slide rail is also provided at the bottom of the electroplating tank. The two groups of fixing columns are respectively mounted on the slide rail and are arranged opposite to each other on the left and right. The fixing columns are provided with a fixing groove with an upper end and a side opening, and the two ends of the FPC clamp are respectively mounted in the fixing groove.

3. The dedicated electroplating device for ultra-thin FPC as claimed in claim 1, characterized in that: The FPC clamp includes two clamp frames arranged in a central symmetrical manner, a plating window is provided in the middle of the clamp frame, and fixed terminals are provided at both ends. The clamp frame is also provided with a limit clamp block and a limit clamp hole, and the limit clamp block and the limit clamp hole are both located between the plating window and the fixed terminal.

4. The dedicated electroplating device for ultra-thin FPC as claimed in claim 3, characterized in that: A clamping step is also provided at the edge of the electroplating window, and the left and right sides of the clamping step are designed in a wave tooth structure.

5. The dedicated electroplating device for ultra-thin FPC as claimed in claim 1, characterized in that: The stirring assembly includes a plurality of stirring rollers, and the stirring rollers include a cylinder and a plurality of stirring blades; the cylinder is installed at the bottom of the electroplating tank and is located outside the gap between the anode plate and the guide member, and the plurality of stirring blades are evenly distributed on the outside of the cylinder at the same inclination angle.

6. The dedicated electroplating device for ultra-thin FPC as claimed in claim 1, characterized in that: It also includes a defoamer, which is fixedly installed at the bottom of the electroplating tank and located between the stirring components.

7. The dedicated electroplating device for ultra-thin FPC as claimed in claim 1, characterized in that: The device also comprises an upper cover which is mounted on the upper end of the electroplating tank and can be opened and closed by sliding left and right.

Images