A horizontal staggered air cooling device

Abstract

The utility model relates to the technical field of chassis heat dissipation, and in particular to a horizontal staggered air-cooled heat dissipation device, comprising a chassis body, upper parts of both side surfaces of the chassis body are provided with heat dissipation holes, the top surface of the interior of the chassis body is provided with a fan body, one side of the fan body is provided with fins, one side surface of the interior of the chassis body is provided with a motherboard and a graphics card respectively, one side surface of the motherboard and the graphics card is provided with a heat dissipation plate, the inner side of the top surface of the heat dissipation plate is provided with a heat pipe, a power supply is provided at the bottom end of the interior of the chassis body, heat is dissipated to the heating accessories in the chassis through the heat dissipation structure, the air inlet and the air outlet are connected and unobstructed, a good heat dissipation air duct is formed, the heat in the machine can be efficiently discharged, and because the air duct is relatively independent, the wind entering the chassis is not easy to swirl in the chassis, and at the same time the dust accumulation in the chassis can be greatly reduced, the heat dissipation efficiency of the chassis is effectively improved, and the "stuffy tank" phenomenon caused by the heat accumulation in the chassis is effectively reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of chassis heat dissipation, in particular to a horizontal staggered air-cooling heat dissipation device. Background Art

[0002] After searching the existing Chinese patent document with announcement number CN217689982U, a tower radiator is disclosed, comprising a base, a heat fin group arranged on the top of the base, and a fan assembly arranged on one side of the heat fin group, the fan assembly comprising a mounting plate slidably connected to the heat fin group, and a heat fan detachably connected to the mounting plate, the heat dissipation fin group comprising a plurality of heat fins arranged in parallel along a vertical direction, and grooves are symmetrically arranged at both ends of the plurality of heat fins to form a slide groove for the mounting plate to slide, the device has a simple structure, the mounting plate is slidably connected to the heat fin group, and can be quickly positioned and installed, and a limiting structure is arranged on the mounting plate to facilitate the heat dissipation fan to be connected through fasteners after alignment, which not only realizes rapid disassembly and assembly of the heat dissipation fan, but also ensures the stability of the installation of the heat dissipation fan.

[0003] After searching the existing Chinese patent document with announcement number CN218630715U, a downward pressure CPU heat sink is disclosed, including a plurality of heat sinks buckled in sequence, the heat sinks are provided with a receiving slot running through along the axial direction of the fin group, and the opposite sides of the heat sinks are provided with a snap-fit ​​groove; a heat sink fan buckled and connected to the fin group, and snap-fit ​​pieces are provided on both sides of the heat sink fan; the snap-fit ​​pieces and the snap-fit ​​grooves are arranged in a fitting manner; a connecting heat pipe is inserted into the fin group through the receiving slot; and a connecting base connected to the connecting heat pipe. The device realizes a snap-fit ​​connection between the heat sink fan and the heat sink fins by providing a snap-fit ​​groove on the heat sink fins and a corresponding snap-fit ​​piece on the heat sink fan, without welding a screw interface on the fin group, thereby improving production efficiency and reducing production costs; by providing a receiving slot, when the connecting heat pipe is inserted into the fin group, it will be completely received in the fin group and will not extend outward, so the overall size can be reduced, and it is more suitable for installation in a MINI chassis.

[0004] The existing active heat dissipation of personal computers is basically divided into air cooling and water cooling, and the mainstream air cooling is mainly tower type and horizontal type (mostly downward pressure type). In a standard case that can accommodate the ATX version, the internal space is large enough and the layout of the air duct is relatively flexible. Whether it is air cooling or water cooling, the heat dissipation problem is well solved. However, for small cases, especially 10 liters or even smaller cases, it becomes difficult to use existing horizontal radiators to dissipate heat. Especially for configurations with high power consumption, conventional horizontal radiators overlap the fan and the motherboard in the longitudinal direction, causing the air duct to be blocked. After the wind enters the case from the outside of the case, it will swirl inside the case. The hot air blown down from the radiator will also blow to other accessories with low heat generation, which can easily become a "stuffy tank" with poor heat dissipation. Dust that enters the case with the wind can also easily accumulate in the case due to the blocked air duct. In addition, due to the problem of the bending angle, the heat pipe of the conventional horizontal radiator will be inconsistent with the direction of gravity of the refrigerant to a certain extent, affecting the working efficiency of the refrigerant, and then affecting the heat dissipation efficiency. Water cooling requires a lot of chassis space, and there are hidden dangers of leakage and blockage in water cooling, and the maintenance cost is high. Utility Model Content

[0005] The technical problem to be solved by the utility model is to overcome the defects of the prior art and provide a horizontal staggered air-cooled heat dissipation device, which aims to solve the technical problems that the refrigerant in the heat pipe of the air-cooled radiator in the existing chassis is subjected to inconsistent directions of gravity, affecting the working efficiency of the refrigerant and further affecting the heat dissipation efficiency; and the unreasonable design of the radiator structure layout causes the hot air to swirl in the machine, causing a "stuffy tank" phenomenon, and causes dust to accumulate in the machine.

[0006] In order to solve the above technical problems, the utility model provides the following technical solutions:

[0007] The utility model discloses a horizontal staggered air-cooling heat dissipation device, comprising a chassis body, upper parts of both side surfaces of the chassis body are provided with heat dissipation holes, a fan body is provided on the top surface of the interior of the chassis body, a fin is provided on one side of the fan body, a motherboard and a graphics card are provided on one side surface of the interior of the chassis body respectively, a heat dissipation plate is provided on one side surface of the motherboard and the graphics card, a heat pipe is provided on the inner side of the top surface of the heat dissipation plate, a power supply is provided on the bottom end of the interior of the chassis body, the chassis body and the fins are spliced ​​and assembled, the fins are rectangular, sleeved with the fan body, and fixed to the top surface of the interior of the chassis body, the chassis body, the motherboard and the graphics card are all spliced ​​and assembled, the heat pipe and the heat dissipation plate are both provided in two groups, corresponding to the CPU area on the motherboard and the GPU area on the graphics card respectively, the chassis body and the power supply are spliced ​​and assembled, the power supply and the motherboard are stacked, the projection of the power supply is in the plane of the motherboard, the projection of the fins is outside the motherboard, so that the heat dissipation air duct of the fins is not blocked by the motherboard, and the fins and the heat dissipation plate are connected by the heat pipe.

[0008] As a further description of the above technical solution:

[0009] The chassis body is in the shape of a cuboid, the heat dissipation holes are in the shape of a rectangle, and an air inlet and an air outlet are formed by the heat dissipation holes on both sides of the chassis body.

[0010] As a further description of the above technical solution:

[0011] The chassis body and the fan body are spliced ​​and assembled, and the fan body is an integrated fan arrangement, which is arranged in a plurality of groups and arranged in sequence in a horizontal direction.

[0012] The utility model has the following beneficial effects:

[0013] In the utility model, the heat dissipation structure is used to dissipate the heat of the heat-generating accessories in the chassis, and the air inlet and the air outlet are connected and unobstructed to form a good heat dissipation duct. The heat in the machine can be efficiently discharged, and because the air duct is relatively independent, the wind entering the chassis is not easy to swirl in the chassis. At the same time, the dust accumulation in the chassis can be greatly reduced, effectively improving the heat dissipation efficiency of the chassis and effectively reducing the "stuffy tank" phenomenon caused by heat accumulation inside the chassis. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0015] Figure 1 It is a schematic diagram of the internal structure of the chassis body of the utility model;

[0016] Figure 2 It is a schematic diagram of the chassis body structure of the utility model;

[0017] Figure 3 It is a schematic diagram of the structure of the radiator of the utility model;

[0018] Figure 4 It is a side view schematic diagram of the internal structure of the chassis body of the utility model;

[0019] In the figure: 1. Chassis body; 2. Heat dissipation holes; 3. Fan body; 4. Fins; 5. Motherboard; 6. Graphics card; 7. Heat sink; 8. Heat pipe; 9. Power supply. DETAILED DESCRIPTION

[0020] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0021] In the drawings, the same reference numerals all refer to the same components.

[0022] Example 1

[0023] Reference Figure 1-4 , the utility model provides an embodiment: a horizontal staggered air-cooling heat dissipation device, comprising a chassis body 1, the upper parts of both side surfaces of the chassis body 1 are provided with heat dissipation holes 2, the upper part of the inner top surface of the chassis body 1 is provided with a fan body 3, and a fin 4 is provided on one side of the fan body 3, a motherboard 5 and a graphics card 6 are provided on one side surface of the inner side of the chassis body 1, respectively, and a heat sink 7 is provided on one side surface of the motherboard 5 and the graphics card 6, and a heat pipe 8 is provided on the inner side of the top surface of the heat sink 7, and a power supply 9 is provided at the bottom end of the inner side of the chassis body 1, the chassis body 1 and the fin 4 are spliced ​​and assembled, and the fin 4 is a rectangular parallelepiped, which is sleeved with the fan body 3 and fixed to the inner top surface of the chassis body 1, the chassis body 1 and the motherboard 5 and the graphics card 6 are all spliced ​​and assembled, and the heat pipe 8 and the heat sink 7 are both arranged in two groups, which correspond to the CPU area on the motherboard 5 and the GPU area on the graphics card 6 respectively, the chassis body 1 and the power supply 9 are spliced ​​and assembled, and the power supply 9 and the motherboard 5 are stacked, and the projection of the power supply 9 is in the plane of the motherboard 5, and the fin 4 and the heat sink 7 are connected by the heat pipe 8.

[0024] The chassis body 1 is in the shape of a rectangular parallelepiped, and the heat dissipation holes 2 are in the shape of a rectangle. An air inlet and an air outlet are formed by the heat dissipation holes 2 on both sides of the chassis body 1 .

[0025] The chassis body 1 and the fan body 3 are assembled by splicing, and the fan body 3 is an integrated fan arrangement, which is arranged in groups and arranged in sequence in a horizontal direction.

[0026] Specifically, the structure is composed of a chassis body 1, heat dissipation holes 2, a fan body 3, fins 4, a motherboard 5, a graphics card 6, a heat sink 7, a heat pipe 8 and a power supply 9 to form a horizontal staggered air-cooling heat dissipation device. The horizontal staggered air-cooling heat dissipation device is structurally optimized based on the existing air-cooling radiator, reasonably utilizes the internal space of the chassis body 1, changes the air duct configuration to facilitate air inlet and outlet, and is easier to install a heat dissipation device with a larger heat dissipation capacity in the chassis body 1 without increasing the thickness of the chassis body 1. The horizontal staggered air-cooling heat dissipation device is constructed by air-cooling heat dissipation components and the chassis body 1. The air-cooling heat dissipation component is fixed inside the chassis body 1. The air-cooling heat dissipation component includes a fan body 3 and a radiator. The radiator is composed of a heat pipe 8, a fin 4 and a heat dissipation plate 7. The radiator is arranged horizontally. The radiator can be divided into two groups based on the heat pipe 8, each of which is responsible for the heat dissipation of the motherboard 5 and the graphics card 6, making the motherboard 5 and the graphics card 6 easier to install, disassemble and debug. Under the premise that the radiator configuration does not change, in order to further reduce the volume of the chassis body 1, the motherboard 5 adopts an ITX version, the graphics card 6 is placed on the back of the motherboard 5, and the power supply 9 is flipped 90 degrees. It is placed flat on the bottom surface of the chassis body 1, and the projection of the heat dissipation fins 4 is outside the motherboard 5, so that the heat dissipation duct of the fins is not blocked by the motherboard. The fins 4 and the heat sink 7 are connected by heat pipes 8. The heat sink 7 and the heating device in the chassis body 1 are closely fitted to transfer heat for heat exchange. The arrangement of the radiator makes most of the heat pipes 8 consistent with the direction of gravity. Through the vertical placement of the heat pipes 8, the refrigerant cooled at the ends of the fins 4 will flow back to the heat sink 7 smoothly due to gravity, which is convenient for the refrigerant in the heat pipes 8 to be cooled and liquefied at the ends of the fins 4 more efficiently. The heat is refluxed to the end of the heat sink 7 to enhance heat dissipation. Compared with water-cooled heat dissipation, the radiator has a simple structure and stable and reliable performance. The heat pipe 8 is used to achieve air cooling, and there will be no problems such as pipe blockage and water cooling liquid leakage on the water-cooled radiator. The production difficulty is small, the cost is low, and the maintenance is convenient. For scenarios where there is no requirement for a discrete graphics card and only the core graphics card can meet the needs, the radiator only needs to dissipate heat for the motherboard 5. When the radiator size is the same, it can accommodate a higher heat dissipation configuration. When the configuration is the same, the required radiator is smaller and the size of the chassis body 1 is also smaller.

[0027] Working principle: The heat from the graphics card 6 is transferred to the heat pipe 8 through the heat sink 7. The number of heat pipes 8 can be adjusted according to the heat dissipation power consumption of the whole machine. There is another heat sink 7 under the graphics card 6 to transfer the heat from the motherboard 5 to the heat pipe 8. The heat source on the motherboard 5 is mainly the CPU, supplemented by auxiliary devices around the CPU. The heat pipe 8 quickly conducts heat to the fin 4 above, and the fan body 3 conducts the heat on the fin 4 to the chassis body 1 through the heat dissipation holes 2 on the surface of one side of the chassis body 1 to form an air outlet. The back of the chassis body 1 is close to the fan body 3 and is provided with the same heat dissipation holes 2 at the position of the side cover of the chassis body 1 to form an air inlet. Cold air is sucked in by the fan body 3 from the air inlet of the heat dissipation holes 2 on one side of the chassis body 1, and blown to the fin 4, and the heat conducted from the motherboard 5 and the graphics card 6 by the heat pipe 8 through the heat sink 7 is blown out from the air outlet of the heat dissipation holes 2 on the other side of the chassis body 1. After the refrigerant in the heat pipe 8 is cooled at the fin 4, the overall arrangement of the pipeline along the direction of gravity is conducive to the efficient and smooth return of the refrigerant to the heat sink end, which is conducive to the efficient conduction of heat. Since the motherboard 5 and the graphics card 6 share the fin 4 of the radiator, when the power consumption of the motherboard 5 is high and the power consumption of the graphics card 6 is low or the power consumption of the motherboard 5 is low and the power consumption of the graphics card 6 is high, the high-power consumption accessories almost exclusively enjoy the fin 4, which is more conducive to heat dissipation.

[0028] Finally, it should be noted that the above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art can still modify the technical solutions recorded in the above embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A horizontal staggered air-cooling heat dissipation device, comprising a chassis body (1), characterized in that: The upper part of both sides of the chassis body (1) is provided with heat dissipation holes (2); the upper part of the inner top surface of the chassis body (1) is provided with a fan body (3); one side of the fan body (3) is provided with a fin (4); one side of the inner surface of the chassis body (1) is provided with a motherboard (5) and a graphics card (6); one side of the inner surface of the motherboard (5) and the graphics card (6) is provided with a heat dissipation plate (7); the inner side of the upper top surface of the heat dissipation plate (7) is provided with a heat pipe (8); the bottom of the inner part of the chassis body (1) is provided with a power supply (9); the chassis body (1) and the fin (4) are assembled by splicing. The fin (4) is in the form of a rectangular parallelepiped, sleeved with the fan body (3), and fixed to the top surface of the inner side of the chassis body (1). The chassis body (1), the motherboard (5), and the graphics card (6) are all spliced ​​together. The heat pipe (8) and the heat sink (7) are both arranged in two groups, corresponding to the CPU area on the motherboard (5) and the GPU area on the graphics card (6), respectively. The chassis body (1) and the power supply (9) are spliced ​​together. The power supply (9) and the motherboard (5) are stacked, and the projection of the power supply (9) is within the plane of the motherboard (5). The fin (4) and the heat sink (7) are connected via the heat pipe (8).

2. A horizontal staggered air-cooling heat dissipation device according to claim 1, characterized in that: The chassis body (1) is in the shape of a rectangular parallelepiped, and the heat dissipation holes (2) are in the shape of a rectangle. An air inlet and an air outlet are formed through the heat dissipation holes (2) on both sides of the chassis body (1).

3. A horizontal staggered air-cooling heat dissipation device according to claim 1, characterized in that: The chassis body (1) and the fan body (3) are spliced ​​and assembled, and the fan body (3) is an integrated fan arrangement, which is arranged in groups and arranged in sequence in a horizontal direction.

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