Computer external radiator convenient for disassembly and maintenance

Abstract

The utility model discloses a computer external radiator that is easy to disassemble and maintain, including a mainboard, a CPU installation area is arranged in the middle of the upper end of the mainboard; a heat dissipation mechanism for dissipating heat for the CPU is arranged on the upper end of the mainboard, and the heat dissipation mechanism includes a heat conduction plate, a heat conduction copper tube, and a heat dissipation fin plate. The upper end of the mainboard is provided with a heat conduction plate, and a plurality of heat conduction copper tubes are inserted and arranged inside the heat conduction plate. A plurality of heat dissipation fin plates are fixedly arranged on the upper end of the heat conduction copper tube, and a clamping mechanism for fixing each other is arranged between the mainboard and the heat conduction plate, and the clamping mechanism includes a mounting column, a sliding groove, a rotating groove, a connecting block, a connecting column, and a clamping block. The utility model uses a quick clamping method to fit the heat conduction part of the radiator to the CPU; in this way, when the radiator needs to be disassembled later, it can be quickly disassembled, cleaned, and cleaned, and the subsequent installation is also very convenient, thereby greatly improving the convenience of use of the device.

Description

Technical Field

[0001] The utility model relates to the technical field of radiators, in particular to an external radiator for a computer which is convenient for disassembly and maintenance. Background Art

[0002] The function of a computer radiator is to absorb and dissipate heat inside the computer to ensure the normal operating temperature of computer components.

[0003] When the computer is running, it will generate a lot of heat, especially the CPU, graphics card, motherboard chipset and other high heat generating components. If this heat is not dissipated in time, it will cause the computer to overheat, affect its normal operation, and may even burn some components. Therefore, the role of the radiator becomes particularly important.

[0004] In the prior art, computer CPU radiators are often fixed to the CPU with screws so that the heat conducting part of the radiator fits tightly with the CPU (usually the heat conducting parts of the CPU and the radiator are coated with heat dissipation silicone grease). However, the method of fixing with screws is inconvenient for subsequent disassembly and maintenance. First, tools are required for installation. Second, the installation space between the CPU and the motherboard is small, and it is inconvenient to turn the screws. Therefore, in order to solve this problem, an improved computer external radiator that is easy to disassemble and maintain is needed. Utility Model Content

[0005] The utility model aims to provide an external radiator for a computer which is easy to disassemble and maintain, so as to solve the problems raised in the above-mentioned background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a computer external radiator that is easy to disassemble and maintain, comprising a mainboard, a CPU installation area is arranged in the middle of the upper end of the mainboard; a heat dissipation mechanism for dissipating heat for the CPU is arranged on the upper end of the mainboard, the heat dissipation mechanism comprises a heat conducting plate, a heat conducting copper tube, and a heat dissipation fin plate, a heat conducting plate is arranged on the upper end of the mainboard, a plurality of heat conducting copper tubes are inserted in the heat conducting plate, a plurality of heat dissipation fin plates are fixedly arranged on the upper end of the heat conducting copper tube, a clamping mechanism for fixing each other is arranged between the mainboard and the heat conducting plate, the clamping mechanism comprises a mounting column, a sliding groove, a rotating groove, a connecting block, a connecting column, and a clamping block, the mounting columns are fixedly arranged at the four corners of the CPU installation area on the upper end of the mainboard, a sliding groove is opened on the outer surface of the mounting column, a rotating groove is opened on the surface of the mounting column at the lower end of the sliding groove, a connecting block is fixedly arranged at the four corners of the outer surface of the heat conducting plate, a connecting column is movably inserted in the connecting block, and a clamping block is fixedly arranged at the lower end of the connecting column.

[0007] Preferably, a fixed frame is fixedly arranged between the heat dissipation fin plates, and a heat dissipation fan is fixedly arranged inside the fixed frame, and the heat dissipation fan drives the air flow to flow between the heat dissipation fin plates; the heat dissipation effect can be greatly improved.

[0008] Preferably, a twisting block is fixedly provided on the upper end of the connecting column, and a spring is sleeved on the outer surface of the connecting column between the twisting block and the connecting block. The spring can push the connecting block after the card block is inserted into the card slot, so that the connecting block drives the heat conducting plate to be tightly attached to the outer surface of the CPU; thereby heat transfer can be performed; but in practice, heat dissipation silicone grease should be applied between the heat conducting plate and the outer surface of the CPU; to further improve the heat conduction effect.

[0009] Preferably, the mounting column is hollow, and the connecting column and the card block can be easily inserted through the hollow mounting column; finally, the card block can be moved along the sliding groove to the rotating groove position; then the connecting column and the card block are rotated; so that the card block is inserted into the rotating groove.

[0010] Preferably, a card slot is opened on one side of the rotating slot, and the card block at the lower end of the connecting column is inserted into the card slot; the heat dissipation mechanism and the mainboard can be fixed. At this time, under the action of the spring, the card block cannot be detached from the card slot without human operation; it also cannot be rotated out of the rotating slot.

[0011] Preferably, the heat conducting plate is made of copper material; the heat conducting plate made of copper material can provide excellent heat conducting and heat dissipating effects.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] 1. The entire fixing process of the utility model is convenient and quick, and there is no need to rotate the connecting column all the time; only a slight rotation is required; no specific tools are required; it can be adapted to a narrow chassis environment for operation; and thus it can be easily promoted and used.

[0014] 2. When the utility model needs to be disassembled, it only needs to slightly press the connecting column, and then rotate the clamping block in the opposite direction so that the clamping block is aligned with the slide groove for disassembly; the entire disassembly process of the device is also convenient and quick.

[0015] 3. The utility model utilizes threads to install the limit block, so that the position of the limit block can be adjusted as needed. When the limit block moves downward, it will squeeze the spring, and the spring will also be used to squeeze the connecting block and the heat conducting plate, so that the heat conducting plate and the CUP fit more closely; vice versa; in this way, after long-term use, the spring fatigues and the limit block can be appropriately moved downward; thereby ensuring the heat dissipation effect of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1This is a schematic diagram of the overall structure of an external radiator for a computer that is easy to disassemble and maintain according to the utility model;

[0017] Figure 2 This is an installation view of a heat dissipation fan in a computer external heat sink that is easy to disassemble and maintain according to the utility model;

[0018] Figure 3 This is an overall structural view of a mounting column in a computer external radiator that is easy to disassemble and maintain according to the utility model;

[0019] Figure 4 The utility model is a card block and a card slot in a computer external radiator which is easy to disassemble and maintain. Figure 1 ;

[0020] Figure 5 The utility model is a card block and a card slot in a computer external radiator which is easy to disassemble and maintain. Figure 2 ;

[0021] Figure 6 The utility model is a computer external radiator which is easy to disassemble and maintain Figure 1 Magnified view of point A in the middle.

[0022] In the figure: 1. Main board; 2. CPU installation area; 3. Heat conduction plate; 4. Heat conduction copper tube; 5. Heat dissipation fin plate; 6. Mounting column; 7. Sliding slot; 8. Rotation slot; 9. Card slot; 10. Connecting block; 11. Connecting column; 12. Card block; 13. Fixed frame; 14. Heat dissipation fan; 15. Limit block; 16. Spring. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] See also Figure 1-6The utility model provides a technical solution: an external heat sink for a computer that is easy to disassemble and maintain, comprising a mainboard 1, wherein a CPU installation area 2 is arranged in the middle of the upper end of the mainboard 1; a heat dissipation mechanism for dissipating heat for the CPU is arranged on the upper end of the mainboard 1, and the heat dissipation mechanism comprises a heat conduction plate 3, a heat conduction copper tube 4, and a heat dissipation fin plate 5. The heat conduction plate 3 is arranged on the upper end of the mainboard 1, and a plurality of heat conduction copper tubes 4 are inserted inside the heat conduction plate 3. A plurality of heat dissipation fin plates 5 are fixedly arranged on the upper end of the heat conduction copper tube 4, and a heat conduction fin plate 5 is arranged between the mainboard 1 and the heat conduction plate 3. The mutually fixed engaging mechanism comprises a mounting column 6, a sliding groove 7, a rotating groove 8, a connecting block 10, a connecting column 11 and a clamping block 12. The mounting columns 6 are fixedly arranged at the four corners of the CPU mounting area 2 on the upper end of the mainboard 1. The sliding groove 7 is provided on the outer surface of the mounting column 6. The rotating groove 8 is provided on the surface of the mounting column 6 at the lower end of the sliding groove 7. The connecting blocks 10 are fixedly arranged at the four corners of the outer surface of the heat conducting plate 3. The connecting columns 11 are movably interspersed inside the connecting blocks 10. The clamping block 12 is fixedly arranged at the lower end of the connecting column 11.

[0025] A fixed frame 13 is fixedly arranged between the heat dissipation fin plates 5, and a heat dissipation fan 14 is fixedly arranged inside the fixed frame 13. The heat dissipation fan 14 drives the air flow to flow between the heat dissipation fin plates 5, which can greatly improve the heat dissipation effect;

[0026] A limit block 15 is provided at the upper end of the connecting column 11 through a threaded movably screwed connection, and a spring 16 is sleeved between the limit block 15 and the connecting block 10 on the outer surface of the connecting column 11. The spring 16 can push the connecting block 10 after the block 12 is inserted into the slot 9, so that the connecting block 10 drives the heat conducting plate 3 to be close to the outer surface of the CPU; thereby heat conduction transfer can be performed; however, in reality, heat dissipation silicone grease should also be applied between the heat conducting plate 3 and the outer surface of the CPU; to further improve the heat conduction effect; and because the limit block 15 is installed by thread, the position of the limit block 15 can be adjusted as needed, and when the limit block 15 moves downward, the spring 16 will be squeezed, and the spring 16 will also be used to squeeze the connecting block 10 and the heat conducting plate 3, so that the heat conducting plate 3 and the CUP fit more closely; vice versa; in this way, after long-term use, the spring 16 is fatigued, and the limit block 15 can be appropriately moved downward; thereby, the heat dissipation effect of the device can be guaranteed;

[0027] The mounting column 6 is hollow, and the connecting column 11 and the block 12 can be inserted conveniently through the hollow mounting column 6; finally, the block 12 can be moved to the position of the rotating groove 8 along the sliding groove 7; then the connecting column 11 and the block 12 are rotated; so that the block 12 is inserted into the rotating groove 8;

[0028] A card slot 9 is provided on one side of the rotating slot 8, and the card block 12 at the lower end of the connecting column 11 is inserted into the card slot 9; thus, the heat dissipation mechanism and the mainboard 1 are fixed. At this time, under the action of the spring 16, the card block 12 cannot be separated from the card slot 9 without human operation; and it cannot be rotated out of the rotating slot 8;

[0029] The heat conducting plate 3 is made of copper material; the heat conducting plate 3 made of copper material can provide excellent heat conduction and heat dissipation effects.

[0030] Working principle: When using the device, the CPU installation area 2 is used to install the CPU. When the heat dissipation mechanism needs to be installed later, a layer of heat dissipation silicone grease needs to be applied on the surface of the CPU first, which is also a conventional operation in the prior art;

[0031] The locking block 12 is then rotated to align with the sliding slot 7 at the lower end of the connecting post 11, and then the connecting post 11 is pressed downward; so that the locking slot 9 at the lower end of the connecting post 11 can be aligned with the rotation slot 8; the connecting post 11 is then rotated to make the locking block 12 rotate in the direction of the locking slot 9, and finally rotated to the bottom of the locking slot 9, and then the connecting post 11 is released; at this time, under the action of the spring 16, the connecting post 11 moves up slightly, so that the locking block 12 can be stuck in the inside of the locking slot 9, so that the final fixation can be completed. In this way, the entire fixing process of the device is convenient and fast, and there is no need to rotate the connecting post 11 all the time; only a slight rotation is required; no specific tools are required; it can adapt to the operation in a narrow chassis environment; so that it can be easily promoted and used; and when disassembly is required, only the connecting post 11 needs to be slightly pressed, and then the locking block 12 is rotated in the opposite direction so that the locking block 12 is aligned with the sliding slot for disassembly; the entire disassembly process of the device is also convenient and fast;

[0032] In addition, since the device uses threads to install the limit block 15, the position of the limit block 15 can be adjusted as needed. When the limit block 15 moves downward, it will squeeze the spring 16, and the spring 16 will also be used to squeeze the connecting block 10 and the heat conducting plate 3, so that the heat conducting plate 3 and the CUP fit more closely; vice versa; in this way, after long-term use, when the spring 16 is fatigued, the limit block 15 can be appropriately moved downward; thereby, the heat dissipation effect of the device can be ensured.

[0033] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0034] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A computer external radiator that is easy to disassemble and maintain, comprising a motherboard (1), characterized in that: A CPU installation area (2) is provided at the middle of the upper end of the mainboard (1); a heat dissipation mechanism for dissipating heat for the CPU is provided at the upper end of the mainboard (1), the heat dissipation mechanism comprising a heat conducting plate (3), a heat conducting copper tube (4), and a heat dissipation fin plate (5); a heat conducting plate (3) is provided at the upper end of the mainboard (1); a plurality of heat conducting copper tubes (4) are inserted into the interior of the heat conducting plate (3); a plurality of heat dissipation fin plates (5) are fixedly provided at the upper end of the heat conducting copper tube (4); a clamping mechanism for fixing the mainboard (1) and the heat conducting plate (3) to each other is provided between the mainboard (1) and the heat conducting plate (3); the clamping mechanism comprises a mounting column (6), a sliding plate (7), and a plurality of heat dissipation fin plates (5). The mainboard (1) comprises a plurality of mounting posts (6) fixedly arranged at the four corners of the CPU mounting area (2) on the upper end of the mainboard (1), a sliding slot (7) is provided on the outer surface of the mounting post (6), a rotating slot (8) is provided on the surface of the mounting post (6) at the lower end of the sliding slot (7), a connecting block (10) is fixedly arranged at the four corners of the outer surface of the heat conducting plate (3), a connecting post (11) is movably inserted inside the connecting block (10), and a clamping block (12) is fixedly arranged at the lower end of the connecting post (11).

2. The computer external radiator that is easy to disassemble and maintain according to claim 1, characterized in that: A fixed frame (13) is fixedly arranged between the heat dissipation fin plates (5), and a heat dissipation fan (14) is fixedly arranged inside the fixed frame (13).

3. The computer external radiator that is easy to disassemble and maintain according to claim 1, characterized in that: A limit block (15) is arranged at the upper end of the connecting column (11) through threaded engagement, and a spring (16) is sleeved on the outer surface of the connecting column (11) between the limit block (15) and the connecting block (10).

4. The computer external radiator that is easy to disassemble and maintain according to claim 1, characterized in that: The installation column (6) is hollow.

5. The computer external radiator that is easy to disassemble and maintain according to claim 1, characterized in that: A clamping groove (9) is provided on one side of the interior of the rotating groove (8).

6. The computer external radiator that is easy to disassemble and maintain according to claim 1, characterized in that: The heat conducting plate (3) is made of copper.

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