Chassis structure

Abstract

The utility model provides a chassis structure, which includes: a chassis, the chassis has a containing cavity inside, and the chassis surface is provided with a radiator avoidance port; a heating element, the heating element is arranged in the containing cavity; a radiator, the radiator is installed outside the chassis, the radiator is located at the radiator avoidance port, and the radiator avoidance port is blocked, and the heating element and the radiator are heat-conductingly matched; a heat insulating member, the heat insulating member is located on a side of the radiator close to the chassis, the heat insulating member is provided with an avoidance hole, and the heating element is inserted into the avoidance hole. The chassis structure of the utility model solves the technical problem in the related art that the chassis structure is prone to excessively high temperature of the internal space due to poor heat dissipation, thereby causing abnormal operation of components or shortened life.

Description

Technical Field

[0001] The utility model relates to the field of electrical equipment, in particular to a chassis structure. Background Art

[0002] The chassis structure is a structure that many electrical devices have. It mainly plays the role of isolation and protection, but due to the existence of the chassis shell, it will also affect the heat dissipation of internal components to a certain extent. The chassis structure in the related art has a great influence on the heat dissipation of internal components, especially when the ambient temperature is high, the temperature of the internal space of the chassis will also rise to a very high level, resulting in difficulty in heat dissipation of internal components, and then abnormal operation and shortened lifespan.

[0003] For example, the current mainstream design of photovoltaic inverters has a protection level of IP65 or above, and there are many heat-generating devices inside, such as IGBT, MOSFET, etc. These heat-generating devices of photovoltaic inverters in related technologies achieve heat dissipation through bonding heat sinks. When the ambient temperature reaches 40°C, the heat sink temperature will exceed 90°C. However, the operating temperature requirements of many devices inside the equipment are relatively low. For example, the operating temperature of electrolytic capacitors and film capacitors is preferably lower than 85°C to ensure the design life of the whole machine. If the internal ambient temperature of the photovoltaic inverter can be controlled at 75°C or lower, the life of the whole machine will be greatly increased.

[0004] It can be seen that the chassis structure in the related art is prone to excessively high temperature in the internal space due to poor heat dissipation, which in turn causes abnormal operation of components or shortened lifespan. Currently, no effective solution has been proposed for this technical problem. Utility Model Content

[0005] The main purpose of the utility model is to provide a chassis structure to solve the technical problem in the prior art that the chassis structure is prone to excessively high temperature in the internal space due to poor heat dissipation, thereby causing abnormal operation of components or shortened lifespan.

[0006] In order to achieve the above-mentioned purpose, the utility model provides a chassis structure, which includes: a chassis, the chassis has a accommodating cavity inside, and the chassis surface is provided with a radiator avoidance port; a heating element, the heating element is arranged in the accommodating cavity; a radiator, the radiator is installed on the outside of the chassis, the radiator is located at the radiator avoidance port, the radiator blocks the radiator avoidance port, and the heating element and the radiator cooperate in thermal conductivity; a thermal insulation member, the thermal insulation member is located on a side of the radiator close to the chassis, the thermal insulation member is provided with an avoidance hole, and the heating element is inserted into the avoidance hole.

[0007] Furthermore, the heat insulating member is arranged on the inner wall of the chassis.

[0008] Furthermore, the heat insulating member and the radiator are spaced apart, and an air cavity is formed between the heat insulating member and the radiator.

[0009] Furthermore, a raised support portion is provided on the inner wall of the chassis close to the radiator, and the heat insulating member is installed on the support portion.

[0010] Furthermore, the support portion is an annular structure, and the support portion is arranged around the radiator avoidance opening.

[0011] Furthermore, the outer edge size of the projection of the support portion in the preset plane is larger than the size of the projection of the heat sink in the preset plane, wherein the preset plane is a plane perpendicular to the protruding direction of the support portion.

[0012] Furthermore, the size of the avoidance hole matches the cross-sectional size of the heating element.

[0013] Furthermore, there are multiple heating elements and multiple avoidance holes, and the multiple heating elements and the multiple avoidance holes are arranged in a one-to-one correspondence.

[0014] Furthermore, the chassis structure also includes a circuit board, the heating element is mounted on the circuit board, and a side of the heating element away from the circuit board is thermally matched with the heat sink.

[0015] Furthermore, a support foot is provided at the bottom of the chassis, and the radiator is arranged at the bottom of the chassis. Along the height direction of the chassis structure, the length of the support foot is greater than the length of the radiator.

[0016] The chassis structure using the technical solution of the utility model includes: a chassis, the chassis has a accommodating cavity inside, and the chassis surface is provided with a radiator avoidance port; a heating element, the heating element is arranged in the accommodating cavity; a radiator, the radiator is installed outside the chassis, the radiator is located at the radiator avoidance port, the radiator blocks the above-mentioned radiator avoidance port, and the heating element and the radiator are thermally matched; a heat insulating member, the heat insulating member is located on the side of the radiator close to the chassis, the heat insulating member is provided with an avoidance hole, and the heating element is inserted into the avoidance hole. With the chassis structure of this structural design, the heating element is arranged in the chassis to achieve a better protection effect. Since the heating element and the radiator are thermally matched, the heat generated by the heating element when working can be smoothly conducted to the radiator outside the chassis, and dissipated to the surrounding environment through the radiator. In this process, since a lot of heat is gathered at the radiator and the temperature is high, it is easy for heat to radiate into the accommodating cavity of the chassis. The present application designs a heat insulation part on the side of the radiator close to the chassis, which can effectively block the transfer of this part of heat to the accommodating cavity, thereby ensuring that the interior of the accommodating cavity is at a lower temperature, which is beneficial to ensuring the smooth operation and service life of the components inside the chassis, and solves the technical problem in the related technology that the chassis structure is prone to excessive internal space temperature due to poor heat dissipation, which in turn causes abnormal operation of components or shortened service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings constituting part of the present application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0018] Figure 1 It is a structural schematic diagram of an embodiment of a chassis structure according to the utility model;

[0019] Figure 2 for Figure 1 An enlarged schematic diagram of a partial structure of an embodiment of a chassis structure;

[0020] Figure 3 It is a structural schematic diagram of another embodiment of the chassis structure according to the utility model;

[0021] Figure 4 It is a schematic diagram of a chassis structure without a thermal insulation component.

[0022] The above drawings include the following reference numerals:

[0023] 1. Chassis; 10. Accommodating cavity; 11. Support part; 12. Support foot; 2. Circuit board; 3. Heating element; 4. Radiator; 5. Thermal insulation. DETAILED DESCRIPTION

[0024] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present utility model will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0025] Please refer to Figures 1 to 3 The utility model provides a chassis structure, which includes: a chassis 1, the chassis 1 has a accommodating cavity 10 inside, and a radiator avoidance port is provided on the surface of the chassis 1; a heating element 3, the heating element 3 is arranged in the accommodating cavity 10; a radiator 4, the radiator 4 is installed on the outside of the chassis 1, the radiator 4 is located at the radiator avoidance port, the radiator 4 blocks the above-mentioned radiator avoidance port to isolate the accommodating cavity 10 from the external space of the chassis 1 to achieve a higher IP level requirement, the heating element 3 and the radiator 4 are thermally coordinated; a heat insulating member 5, the heat insulating member 5 is located on a side of the radiator 4 close to the chassis 1, the heat insulating member 5 is provided with an avoidance hole, and the heating element 3 is inserted into the avoidance hole.

[0026] With the chassis structure of this structural design, the heating element 3 is arranged inside the chassis 1 to achieve a better protection effect. Due to the existence of the radiator avoidance port on the surface of the chassis 1, the radiator 4 outside the chassis 1 can be exposed to the inside of the chassis 1 through the radiator avoidance port, so the heating element 3 can cooperate with the radiator 4 in thermal conductivity, and the heat generated by the heating element 3 when working can be smoothly conducted to the radiator 4 outside the chassis 1, and dissipated to the surrounding environment through the radiator 4. In this process, since a lot of heat is gathered at the radiator 4 and the temperature is high, it is easy for heat to radiate into the accommodating cavity 10 of the chassis 1. The present application designs a heat insulation member 5 on the side of the radiator 4 close to the chassis 1, which can effectively block the transfer of this part of heat to the accommodating cavity 10, thereby ensuring that the inside of the accommodating cavity 10 is at a lower temperature, which is conducive to ensuring the smooth operation and service life of the components inside the chassis 1, and solves the technical problem that the chassis structure in the related art is prone to excessively high temperature in the internal space due to poor heat dissipation, thereby causing abnormal operation or shortened service life of the components.

[0027] Figure 4 Schematic diagram of a chassis structure without a heat insulating member 5, as shown in Figure 4 As shown, in the case where the heat insulating member 5 is not provided, after the heating element 3 transfers the heat to the radiator 4, the radiator 4 accumulates more heat and the temperature rises, and then radiates the heat into the accommodating cavity 10 of the chassis 1 through the radiator avoidance port on the surface of the chassis 1, thereby causing a significant increase in the internal temperature of the chassis 1, affecting the normal operation or service life of the internal components.

[0028] The chassis structure of the present application can be applied to any electrical equipment with heat dissipation requirements, especially equipment with higher IP level requirements, such as wind inverters, photovoltaic inverters and other power products.

[0029] The chassis structure using the above structural design has other advantages compared with the traditional heat exchange chassis, such as: simple structure and low cost; no need for heat exchange fans, no increase in power consumption, high efficiency; no increase in the overall design volume cost and significant economic value, etc.

[0030] Among them, the above-mentioned heating element 3 can have various specific examples according to actual conditions, such as IGBT (Insulated Gate Bipolar Transistor, Chinese name insulated gate bipolar transistor) module, MOSFET (Metal-Oxide-Semiconductor Field-Effect-Transistor, Chinese name metal-oxide-semiconductor field-effect transistor) module, etc. As long as it generates heat when working, and the heat generated by it is judged according to actual conditions to have a predetermined effect on the temperature rise in the chassis 1, it can be treated as the above-mentioned heating element 3. Among them, the specific types of the heat sink 4 that can be selected according to actual conditions are also various, such as a skived tooth heat sink, a slotted tooth heat sink, a profile heat sink, etc.

[0031] Among them, the heat conduction matching, as the name implies, is a matching method that can achieve heat conduction. This matching can improve the heat transfer efficiency, so that the heat generated by the heating element 3 can be transferred to the radiator 4 more quickly, thereby dissipating the heat to the outside of the chassis in a timely manner. In actual implementation, any matching means that can achieve heat conduction can be used, for example, the heating element 3 and the radiator 4 can be directly in contact with each other, so as to perform direct heat conduction. For another example, a thermal conductive glue is provided between the heating element 3 and the radiator 4. For another example, other metal or non-metal materials with good thermal conductivity are provided between the heating element 3 and the radiator 4.

[0032] The above-mentioned heat insulating member 5 is a component having a heat insulating effect as its name implies, and in specific implementation, its specific type, material, etc. can be selected in a variety of ways as long as it can achieve the required heat isolation effect, such as heat insulating silica gel, glass fiber, ceramics, etc.

[0033] In this embodiment, the thermal insulation member 5 is designed on the inner wall of the chassis 1. After assembly, the thermal insulation member 5 is inside the chassis 1, the chassis structure has better structural integrity, and the thermal insulation member 5 is not easily damaged.

[0034] Of course, in actual implementation, there are other options for the location of the thermal insulation member 5 , as long as it can block the heat from being transferred to the accommodating cavity. For example, the thermal insulation member 5 is disposed between the outer surface of the chassis 1 and the radiator 4 .

[0035] In this embodiment, the heat insulating member 5 is spaced apart from the radiator 4, and an air cavity is formed between the heat insulating member 5 and the radiator 4. Since the heat insulating member 5 and the radiator 4 are spaced apart, the gap between the two forms the above-mentioned air cavity structure, which effectively reduces the direct contact area between the radiator 4 and the internal space of the chassis 1, and changes the structure from the original contact between the radiator 4 and the heat insulating member 5 to the contact between the air cavity and the heat insulating member 5, effectively reducing heat conduction, thereby better reducing the temperature rise of the internal space of the chassis 1.

[0036] In some embodiments, due to the large amount of heat dissipation required, the sizes of the radiator avoidance and the radiator 4 are both large, and the size of the thermal insulation 5 is also large. At this time, due to the lack of support in the middle part of the thermal insulation 5, it may bend under the influence of external factors such as gravity and vibration, causing the air cavity to become smaller or even disappear. In a preferred embodiment, an auxiliary support protrusion is provided on one side of the radiator 4 close to the thermal insulation 5, and the auxiliary support protrusion contacts the thermal insulation 5 to support it, maintain the normal shape of the thermal insulation 5, and thereby ensure the stability of the air cavity shape. In actual implementation, the shape, quantity and setting position of the auxiliary support protrusion can be flexibly adjusted according to needs to achieve the required support effect.

[0037] like Figure 3 As shown, in one embodiment, a protruding support portion 11 is provided on the inner wall of the chassis 1 close to the radiator 4 , and the heat insulating member 5 is installed on the support portion 11 .

[0038] In this embodiment, a support portion 11 is designed on the inner wall of the case 1 on the side close to the radiator 4. The support portion 11 is a convex structure, and the heat insulating member 5 is installed on the support portion 11. Due to the existence of the support portion 11, the heat insulating member 5 can be propped up to a higher height, resulting in a larger air cavity between the heat insulating member 5 and the radiator 4, which can more significantly reduce the heat radiation received by the heat insulating member 5 from the radiator 4, thereby further reducing the temperature rise of the internal space of the case 1.

[0039] In a preferred embodiment, the support portion 11 is an annular structure, and the support portion 11 is arranged around the radiator avoidance opening. In this way, when the heat insulating member 5 is installed on the support portion 11, the contact between the two will block the radiator avoidance opening, so that heat can be prevented from entering the accommodating cavity 10 through the gap between the two, thereby controlling the temperature rise of the internal space of the chassis 1.

[0040] Preferably, the outer edge size of the projection of the support portion 11 in the preset plane is larger than the size of the projection of the heat sink 4 in the preset plane, wherein the preset plane is a plane perpendicular to the protruding direction of the support portion 11 .

[0041] That is to say, the outer edge contour of the support portion 11 is larger than that of the radiator 4. Since the support portion 11 is a raised structure, its thickness along the raised direction is larger, and heat is less likely to be transferred to the interior of the accommodating cavity 10 through the support portion 11. Therefore, it is beneficial to better control the temperature rise inside the chassis structure.

[0042] In this embodiment, the size of the avoidance hole matches the cross-sectional size of the heating element 3. That is, when the heating element 3 is installed in the avoidance hole, the side wall of the heating element 3 contacts the inner wall of the avoidance hole. In this way, the heat insulating member 5 can more fully isolate the radiator 4 from the internal space of the chassis 1, reduce the heat that penetrates into the accommodating cavity 10 through the gap, and thus better control the temperature rise inside the accommodating cavity 10.

[0043] In actual implementation, there may be multiple heating elements 3, and the avoidance holes are correspondingly provided in multiple numbers, and the multiple heating elements 3 are provided in one-to-one correspondence with the multiple avoidance holes, so as to achieve heat dissipation of the multiple heating elements 3 at the same time.

[0044] The chassis structure also includes a circuit board 2, which is fixedly arranged inside the chassis 1 and spaced apart from the radiator 4. The heating element 3 is mounted on the circuit board 2, and the side of the heating element 3 away from the circuit board 2 is thermally matched with the radiator 4. In actual implementation, the heating element 3 can be mounted on the circuit board 2 by welding, crimping, etc.

[0045] In addition, a support foot 12 may be provided at the bottom of the chassis 1 , and the radiator 4 is disposed at the bottom of the chassis 1 . Along the height direction of the chassis structure, the length of the support foot 12 is greater than the length of the radiator 4 .

[0046] In this embodiment, a support leg 12 is provided at the bottom of the chassis 1, and the chassis 1 can be supported by the support leg 12. After the chassis 1 is propped up, it is suspended, and a radiator 4 is designed in the bottom space, which not only realizes more efficient use of space, but also plays a protective role in shielding the radiator from dust. In the height direction of the chassis structure, the length of the support leg 12 is greater than the length of the radiator 4, which can ensure that the radiator 4 maintains a certain distance from the ground, which is conducive to air circulation and reduces scratches, thereby ensuring the heat dissipation effect.

[0047] From the above description, it can be seen that the above embodiments of the utility model achieve the following technical effects:

[0048] The chassis structure of the utility model includes: a chassis 1, the chassis 1 has a receiving cavity 10 inside, and a radiator avoidance port is provided on the surface of the chassis 1; a heating element 3, the heating element 3 is arranged in the receiving cavity 10; a radiator 4, the radiator 4 is installed outside the chassis 1, the radiator 4 is located at the radiator avoidance port, and the radiator 4 blocks the above-mentioned radiator avoidance port to isolate the receiving cavity 10 from the external space of the chassis 1 to meet the higher IP grade requirements, and the heating element 3 and the radiator 4 are thermally conductive and matched; a heat insulating member 5, the heat insulating member 5 is located on the side of the radiator 4 close to the chassis 1, and the heat insulating member 5 is provided with an avoidance port, and the heating element 3 is inserted into the avoidance port. With the chassis structure of this structural design, the heating element 3 is arranged in the chassis 1 to achieve a better protection effect. Due to the presence of the radiator avoidance opening on the surface of the chassis 1, the radiator 4 outside the chassis 1 can be exposed to the inside of the chassis 1 through the radiator avoidance opening, so that the heating element 3 can cooperate with the radiator 4 in thermal conductivity, and the heat generated by the heating element 3 when working can be smoothly conducted to the radiator 4 outside the chassis 1, and dissipated to the surrounding environment through the radiator 4. In this process, since a lot of heat is gathered at the radiator 4 and the temperature is high, it is easy for heat to radiate into the accommodating cavity 10 of the chassis 1. The present application designs a heat insulating member 5 on the side of the radiator 4 close to the chassis 1, which can effectively block the transfer of this part of heat to the accommodating cavity 10, thereby ensuring that the inside of the accommodating cavity 10 is at a lower temperature, which is conducive to ensuring the smooth operation and service life of the components inside the chassis 1, and solves the technical problem in the related art that the chassis structure is prone to excessively high temperature in the internal space due to poor heat dissipation, thereby causing abnormal operation of the components or shortened service life.

[0049] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0050] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0051] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein, for example. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0052] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A chassis structure, characterized in that: include: A chassis (1), wherein the chassis (1) has a receiving cavity (10) inside, and a radiator avoidance opening is provided on the surface of the chassis (1); A heating element (3), the heating element (3) being arranged in the accommodating cavity (10); A radiator (4), the radiator (4) being installed outside the chassis (1), the radiator (4) being located at the radiator avoidance opening, the radiator (4) blocking the radiator avoidance opening, and the heating element (3) and the radiator (4) being thermally coordinated; A heat insulating member (5), the heat insulating member (5) being located on a side of the radiator (4) close to the chassis (1), the heat insulating member (5) being provided with an escape hole, the heating element (3) being inserted into the escape hole.

2. The chassis structure according to claim 1, characterized in that: The heat insulating member (5) is arranged on the inner wall of the chassis (1).

3. The chassis structure according to claim 1, characterized in that: The heat insulating member (5) and the radiator (4) are arranged at a distance from each other, and an air cavity is formed between the heat insulating member (5) and the radiator (4).

4. The chassis structure according to claim 3, characterized in that: A protruding support portion (11) is provided on the inner wall of the chassis (1) close to the radiator (4), and the heat insulating member (5) is mounted on the support portion (11).

5. The chassis structure according to claim 4, characterized in that: The support portion (11) is an annular structure, and the support portion (11) is arranged around the radiator avoidance opening.

6. The chassis structure according to claim 5, characterized in that: The outer edge size of the projection of the support portion (11) in a preset plane is larger than the size of the projection of the radiator (4) in the preset plane, wherein the preset plane is a plane perpendicular to the protruding direction of the support portion (11).

7. The chassis structure according to any one of claims 1 to 5, characterized in that: The size of the avoidance hole matches the cross-sectional size of the heating element (3).

8. The chassis structure according to any one of claims 1 to 5, characterized in that: There are a plurality of heating elements (3), and a plurality of avoidance holes; the plurality of heating elements (3) and the plurality of avoidance holes are arranged in a one-to-one correspondence.

9. The chassis structure according to any one of claims 1 to 5, characterized in that: The chassis structure also includes a circuit board (2), the heating element (3) is mounted on the circuit board (2), and a side of the heating element (3) away from the circuit board (2) is thermally matched with the heat sink (4).

10. The chassis structure according to any one of claims 1 to 5, characterized in that: The bottom of the chassis (1) is provided with a support foot (12), the radiator (4) is arranged at the bottom of the chassis (1), and along the height direction of the chassis structure, the length of the support foot (12) is greater than the length of the radiator (4).

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