breaker

Abstract

The embodiment of the present disclosure provides a circuit breaker. The circuit breaker includes a heat sink; a base, which is arranged on the heat sink and forms a housing chamber with the heat sink; a circuit board, which is located in the housing chamber and includes a first surface facing the heat sink; an electronic device, which is located in the housing chamber and arranged on the first surface; a first insulating heat dissipation adhesive, which wraps the electronic device; and a second insulating heat dissipation adhesive, which fills a portion of the housing chamber and contacts the heat sink and the first insulating heat dissipation adhesive.

Description

Technical Field

[0001] Embodiments of the present disclosure generally relate to the technical field of electrical equipment, and more particularly, to a circuit breaker. Background Art

[0002] The circuit breaker can control the opening and closing of the circuit current by opening and closing the electronic components. Since the electronic components need to bear high current and high voltage during operation, high requirements are placed on heat dissipation and insulation.

[0003] For electronic devices disposed on the back side of a circuit board, how to meet the insulation requirements and heat dissipation requirements of the electronic devices is a technical problem that urgently needs to be solved. Utility Model Content

[0004] An object of the present disclosure is to provide a circuit breaker to at least partially solve the above problems.

[0005] In one aspect of the present disclosure, a circuit breaker is provided, which includes a heat sink; a base, which is arranged on the heat sink and forms a housing chamber with the heat sink; a circuit board, which is located in the housing chamber and includes a first surface facing the heat sink; an electronic device, which is located in the housing chamber and arranged on the first surface; a first insulating heat dissipation adhesive, which wraps the electronic device; and a second insulating heat dissipation adhesive, which fills a portion of the housing chamber and is in contact with the heat sink and the first insulating heat dissipation adhesive.

[0006] According to the embodiment of the present disclosure, when the electronic device is arranged on the first surface, the electronic device is firstly wrapped by the first insulating heat dissipation adhesive to achieve insulation and heat dissipation, and then the second insulating heat dissipation adhesive is in contact with the heat dissipation element and the first insulating heat dissipation adhesive to achieve heat dissipation. Therefore, the circuit breaker according to the embodiment of the present disclosure includes a two-step glue filling process, which ensures that the periphery of the electronic device and the space between the electronic device and the heat dissipation element are evenly filled with glue, and no bubbles are generated during the glue filling process, thereby ensuring the insulation requirements and heat dissipation requirements of the electronic device.

[0007] In some embodiments, the second insulating heat dissipation adhesive is in contact with the first surface.

[0008] In some embodiments, the circuit breaker further includes a third insulating heat dissipation adhesive, the circuit board includes a second surface facing away from the heat sink, and the third insulating heat dissipation adhesive fills a portion of the accommodating chamber and covers the second surface.

[0009] In some embodiments, a through hole is provided on the base, a portion of the second insulating heat dissipation adhesive fills the through hole to contact the heat dissipation element, and the electronic device is arranged at a position corresponding to the through hole.

[0010] In some embodiments, the circuit breaker further includes a mounting base disposed on the first surface, the electronic device is disposed in the mounting base and can be connected to the circuit board through the mounting base, the first insulating heat dissipation adhesive fills the mounting base, and the second insulating heat dissipation adhesive contacts the mounting base.

[0011] In some embodiments, the mounting base includes a top plate arranged on the first surface, a pair of first side plates connected to the top plate, and a pair of second side plates connected to the top plate, the top plate, the pair of first side plates, and the pair of second side plates constitute an installation cavity, the electronic device is arranged in the installation cavity, and the first insulating heat dissipation glue fills the installation cavity.

[0012] In some embodiments, the top plate is provided with pin holes, and pins of the electronic device pass through the pin holes and are connected to the circuit board.

[0013] In some embodiments, a first positioning column is disposed on a side of the top plate adjacent to the heat sink, and the first positioning column is connected to the electronic device.

[0014] In some embodiments, a support column is disposed on a side of the top plate facing away from the heat sink, and the support column is in contact with the first surface.

[0015] In some embodiments, the electronic device includes at least one of a MOS tube, an IGBT, and a thyristor.

[0016] It should be understood that the content described in this section is not intended to limit the key features or important features of the embodiments of the present disclosure, nor is it intended to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above and other features, advantages and aspects of the embodiments of the present disclosure will become more apparent with reference to the following detailed description in conjunction with the accompanying drawings. In the accompanying drawings, the same or similar reference numerals represent the same or similar elements, wherein:

[0018] Figure 1 shows a cross-sectional view of a circuit breaker according to some embodiments of the present disclosure;

[0019] Figure 2 A schematic diagram of the structure of a heat sink and a base according to some embodiments of the present disclosure is shown;

[0020] Figure 3 A schematic diagram of the structure of a circuit board, an electronic device and a mounting seat according to some embodiments of the present disclosure is shown;

[0021] Figure 4A schematic structural diagram of a mounting base according to some embodiments of the present disclosure is shown;

[0022] Figure 5 Shows Figure 4 The mounting base shown is a schematic structural diagram from another viewing angle;

[0023] Figures 6 to 9 A schematic diagram of the assembly of a circuit breaker according to some embodiments of the present disclosure is shown.

[0024] Description of reference numerals:

[0025] 100 is a circuit breaker, 101 is a receiving chamber, and 102 is an installation chamber;

[0026] 1 is a heat sink;

[0027] 2 is a base, 21 is a perforation;

[0028] 3 is a circuit board, 31 is a first surface, and 32 is a second surface;

[0029] 4 is an electronic device, 41 is a pin, and 42 is a metal shell;

[0030] 5 is a first insulating heat dissipation adhesive; 6 is a second insulating heat dissipation adhesive; 7 is a third insulating heat dissipation adhesive;

[0031] 8 is a mounting seat, 81 is a top plate, 811 is a pin hole, 812 is a first positioning column, 813 is a supporting column, 814 is a second positioning column, 82 is a first side plate, and 83 is a second side plate. DETAILED DESCRIPTION

[0032] The preferred embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the preferred embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided to make the present disclosure more thorough and complete, and to fully convey the scope of the present disclosure to those skilled in the art.

[0033] As used herein, the term "including" and its variations mean open inclusion, i.e., "including but not limited to". Unless otherwise stated, the term "or" means "and / or". The term "based on" means "based at least in part on". The terms "an example embodiment" and "an embodiment" mean "at least one example embodiment". The term "another embodiment" means "at least one additional embodiment". The terms "first", "second", etc. may refer to different or the same objects.

[0034] As described above, the circuit breaker can control the on / off of the circuit current by opening and closing electronic devices such as thyristors, MOS tubes, and insulated gate bipolar transistors (IGBTs). Since electronic devices are usually connected in series in the circuit and need to bear high current and high voltage during operation, high requirements are placed on the heat dissipation and insulation of electronic devices.

[0035] Conventional heat dissipation for electronic devices is to stick heat dissipation glue on a metal heat sink. The smaller the distance between the two, the better the heat dissipation effect. However, for electronic devices with exposed metal, in order to meet insulation requirements, it is necessary to add insulation material between the exposed metal and the heat sink. The greater the distance between the two, the better the insulation effect. This affects the heat dissipation effect on the one hand, and increases the complexity of product assembly and process control on the other.

[0036] For the above heat dissipation method, insulating heat dissipation glue can be used to achieve the heat dissipation requirements and insulation requirements. However, the inventors noticed that when the electronic device that needs heat dissipation is soldered on the back of the circuit board, if the insulating heat dissipation glue is filled from the front, it is difficult to completely fill the insulating heat dissipation glue around the electronic device. Therefore, how to ensure that the insulating heat dissipation glue is completely filled around the electronic device to meet the insulation requirements and heat dissipation requirements of the electronic device is a technical problem that needs to be solved urgently.

[0037] The embodiment of the present disclosure provides a circuit breaker 100 to at least partially solve the above problems. Figures 1 to 9 The principles of the present disclosure are described. Figure 1 1 shows a cross-sectional view of a circuit breaker 100 according to some embodiments of the present disclosure. Figure 1 As shown, the circuit breaker 100 described herein generally includes a heat sink 1, a base 2, a circuit board 3, an electronic device 4, a first insulating heat dissipation adhesive 5, a second insulating heat dissipation adhesive 6, a third insulating heat dissipation adhesive 7 and a mounting seat 8.

[0038] The heat sink 1 according to the embodiment of the present disclosure may be made of various types of materials that are currently known or available in the future, as long as it has good heat dissipation performance, and the embodiment of the present disclosure is not limited to this.

[0039] Figure 2 FIG. 2 shows a schematic diagram of the structure of a heat sink 1 and a base 2 according to some embodiments of the present disclosure. Figure 1 to Figure 2 As shown, in some embodiments, the base 2 may include a plastic base. The base 2 is disposed on the heat sink 1. The base 2 and the heat sink 1 form a receiving chamber 101.

[0040] refer to Figure 1 to Figure 2In some embodiments, the circuit board 3 may include a printed circuit board. The circuit board 3 is located in the accommodating chamber 101. The circuit board 3 may include a first surface 31 and a second surface 32, wherein the first surface 31 may face the heat sink 1, and the second surface 32 may face away from the heat sink 1.

[0041] Continue to refer Figure 1 to Figure 2 In some embodiments, the electronic device 4 is located in the receiving chamber 101 , and the electronic device 4 is disposed on the first surface 31 . In other words, the electronic device 4 is located on the back side of the circuit board 3 .

[0042] Continue to refer Figure 1 to Figure 2 , it can be understood that, since the first insulating heat dissipation adhesive 5 wraps the electronic device 4. The second insulating heat dissipation adhesive 6 fills part of the accommodating chamber 101, and the second insulating heat dissipation adhesive 6 is in contact with the heat sink 1 and the first insulating heat dissipation adhesive 5. Therefore, at least part of the second insulating heat dissipation adhesive 6 can be located between the first insulating heat dissipation adhesive 5 and the heat sink 1, so that the heat on the electronic device 4 is transferred to the heat sink 1 through the first insulating heat dissipation adhesive 5 and the second insulating heat dissipation adhesive 6.

[0043] According to the embodiment of the present disclosure, when the electronic device 4 is disposed on the first surface 31, the electronic device 4 is firstly wrapped by the first insulating heat dissipation adhesive 5 to achieve insulation and heat dissipation, and then the second insulating heat dissipation adhesive 6 is in contact with the heat sink 1 and the first insulating heat dissipation adhesive 5 to achieve heat dissipation. Therefore, the circuit breaker 100 according to the embodiment of the present disclosure includes a two-step glue filling process, which ensures that the periphery of the electronic device 4 and between the electronic device 4 and the heat sink 1 are evenly filled with glue, and no bubbles are generated during the glue filling process, thereby ensuring the insulation requirements and heat dissipation requirements of the electronic device 4.

[0044] In addition, since the first surface 31 faces the heat sink 1 and the electronic device 4 is disposed on the first surface 31, the electronic device 4 is disposed adjacent to the heat sink 1. When the electronic device 4 is disposed adjacent to the heat sink 1, the second insulating heat sink adhesive 6 between the first insulating heat sink adhesive 5 and the heat sink 1 is thin, and excellent thermal conductivity can be achieved.

[0045] Continue to refer Figure 1 to Figure 2 In some embodiments, the third insulating heat dissipation adhesive 7 fills part of the accommodating chamber 101 and covers the second surface 32. Thus, the third insulating heat dissipation adhesive 7 can cover the components disposed on the second surface 32, thereby ensuring the insulation and heat dissipation requirements of other components.

[0046] It should be noted that, in some embodiments, the first insulating heat dissipation adhesive 5, the second insulating heat dissipation adhesive 6, and the third insulating heat dissipation adhesive 7 can use the same type of thermally conductive silicone, and there is no need to share multiple insulating and heat dissipation materials. In other embodiments, the first insulating heat dissipation adhesive 5, the second insulating heat dissipation adhesive 6, and the third insulating heat dissipation adhesive 7 can also use different types of thermally conductive silicone. This is not limited here.

[0047] Continue to refer Figure 1 to Figure 2 In some embodiments, a perforation 21 is provided on the base 2. Obviously, when the second insulating heat dissipation adhesive 6 is filled, part of the second insulating heat dissipation adhesive 6 can fill the perforation 21 to contact the heat dissipation element 1. The electronic device 4 is arranged at a position corresponding to the perforation 21. Thus, the rate at which the heat on the electronic device 4 is transferred to the heat dissipation element 1 can be increased.

[0048] Figure 3 FIG. 1 shows a schematic diagram of the structure of a circuit board 3, an electronic device 4 and a mounting seat 8 according to some embodiments of the present disclosure. Figure 3 As shown, in some embodiments, the mounting seat 8 is disposed on the first surface 31. The electronic device 4 is disposed in the mounting seat 8, and the electronic device 4 can pass through the mounting seat 8 to be connected to the circuit board 3. Figures 1 to 3 The first insulating heat dissipating adhesive 5 fills the mounting seat 8, and the first insulating heat dissipating adhesive 5 wraps the electronic device 4. The second insulating heat dissipating adhesive 6 may contact the mounting seat 8, specifically, the second insulating heat dissipating adhesive 6 contacts the outer surface of the mounting seat 8.

[0049] Figure 4 A schematic structural diagram of a mounting base 8 according to some embodiments of the present disclosure is shown. Figure 5 Shows Figure 4 The mounting base 8 is shown in another structural schematic diagram from another viewing angle. Figures 3 to 5 As shown, the mounting seat 8 may include a top plate 81, a pair of first side plates 82, and a pair of second side plates 83. The top plate 81 is disposed on the first surface 31. The pair of first side plates 82 is connected to the top plate 81. The pair of second side plates 83 is connected to the top plate 81. The top plate 81, the pair of first side plates 82, and the pair of second side plates 83 constitute an installation chamber 102. The electronic device 4 is disposed in the installation chamber 102, and the first insulating heat dissipation glue 5 fills the installation chamber 102.

[0050] Continue to refer Figures 3 to 5 In some embodiments, a pin hole 811 is provided on the top plate 81. The pin 41 of the electronic device 4 can pass through the pin hole 811, and the pin 41 is connected to the circuit board 3. The first insulating heat dissipation adhesive 5 needs to wrap the pin 41 of the electronic device 4 to prevent the risk of short circuit between the pins 41 due to insufficient distance. The first insulating heat dissipation adhesive 5 also needs to wrap the metal shell 42 on the outer surface of the electronic device 4.

[0051] Continue to refer Figures 3 to 5 In some embodiments, a first positioning column 812 may be provided on one side of the top plate 81 adjacent to the heat sink 1, and the first positioning column 812 is connected to the electronic device 4. Thus, the electronic device 4 and the mounting seat 8 are fixed.

[0052] Continue to refer Figures 3 to 5 In some embodiments, a support column 813 may be provided on the side of the top plate 81 facing away from the heat sink 1, and the support column 813 is located at the four corners of the top plate 81. The support column 813 contacts the first surface 31. Since the first surface 31 may be convex due to copper coating or wiring, the support column 813 is provided so that the surface of the top plate 81 can be spaced apart from the first surface 31 of the circuit board 3, thereby preventing the mounting seat 8 from being interfered and unable to be laid flat.

[0053] Continue to refer Figures 3 to 5 In some embodiments, a second positioning column 814 may be provided on the side of the top plate 81 facing away from the heat sink 1. Correspondingly, a positioning groove / positioning hole (not shown in the figure) cooperating with the second positioning column 814 is provided on the first surface 31. The second positioning column 814 can be inserted into the positioning groove / positioning hole, thereby facilitating the installation of the mounting seat 8 and limiting the mounting seat 8.

[0054] It is understandable that the electronic device 4 may include at least one of a MOS tube, an IGBT and a thyristor, which is not limited here.

[0055] Figures 6 to 9 The schematic diagram of the assembly of the circuit breaker 100 according to some embodiments of the present disclosure is shown below. Figures 6 to 9 Describe the assembly process of the circuit breaker 100:

[0056] like Figure 6 As shown, when the circuit board 3, the electronic device 4 and the mounting seat 8 are assembled, the first insulating heat dissipation adhesive 5 is filled in the mounting chamber 102. The first insulating heat dissipation adhesive 5 wraps the electronic device 4, wherein the pins 41 are also wrapped by the first insulating heat dissipation adhesive 5, and the metal shell 42 located on the outer surface of the electronic device 4 is also wrapped.

[0057] Continue to refer Figure 7 When the heat sink 1 and the base 2 are assembled, the second insulating heat dissipation adhesive 6 is filled in the accommodating chamber 101 , and the second insulating heat dissipation adhesive 6 fills the through hole 21 and contacts the heat sink 1 .

[0058] Continue to refer Figure 8 ,exist Figure 6 When the first insulating heat dissipation adhesive 5 is cured, Figure 6The assembly is inverted in the receiving chamber 101. The second insulating heat dissipation adhesive 6 can contact the first surface 31. Of course, the second insulating heat dissipation adhesive 6 can also overflow upward and at least partially cover the second surface 32. Figure 8 In the embodiment, the second insulating heat dissipating adhesive 6 is in contact with the first surface 31, and the second insulating heat dissipating adhesive 6 does not overflow upward.

[0059] Continue to refer Fig. 9 Finally, the third insulating heat dissipation adhesive 7 is filled into the accommodating chamber 101 so that the third insulating heat dissipation adhesive 7 covers the second surface 32 until the third insulating heat dissipation adhesive 7 covers the components on the second surface 32 .

[0060] The glue potting design according to the embodiment of the present disclosure can be applied to various circuit breakers 100 to at least partially solve the above problems. It should be understood that the glue potting design according to the embodiment of the present disclosure can also be applied to other electrical components, and the embodiment of the present disclosure is not limited to this.

[0061] The embodiments of the present disclosure have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of terms used herein is intended to best explain the principles of the embodiments, practical applications, or technical improvements in the market, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein.

Claims

1. A circuit breaker (100), characterized in that: The circuit breaker (100) comprises: Heat sink (1); A base (2) disposed on the heat sink (1) and forming a receiving chamber (101) with the heat sink (1); A circuit board (3) located in the accommodating chamber (101) and comprising a first surface (31) facing the heat sink (1); an electronic device (4), located in the containing chamber (101) and arranged on the first surface (31); A first insulating heat dissipation adhesive (5) wraps the electronic device (4); and The second insulating heat dissipation adhesive (6) fills part of the accommodating chamber (101) and is in contact with the heat dissipation element (1) and the first insulating heat dissipation adhesive (5).

2. The circuit breaker (100) according to claim 1, characterized in that: The second insulating heat dissipation adhesive (6) is in contact with the first surface (31).

3. The circuit breaker (100) according to claim 1, characterized in that: The circuit breaker (100) further comprises a third insulating heat dissipation adhesive (7), the circuit board (3) comprises a second surface (32) facing away from the heat dissipation element (1), and the third insulating heat dissipation adhesive (7) fills a portion of the accommodating chamber (101) and covers the second surface (32).

4. The circuit breaker (100) according to claim 1, characterized in that: The base (2) is provided with a through hole (21), a portion of the second insulating heat dissipation adhesive (6) fills the through hole (21) to contact the heat dissipation element (1), and the electronic device (4) is arranged at a position corresponding to the through hole (21).

5. The circuit breaker (100) according to claim 1, characterized in that: The circuit breaker (100) further comprises a mounting seat (8) arranged on the first surface (31), the electronic device (4) being arranged in the mounting seat (8) and being able to pass through the mounting seat (8) to be connected to the circuit board (3), the first insulating heat dissipation adhesive (5) filling the mounting seat (8), and the second insulating heat dissipation adhesive (6) contacting the mounting seat (8).

6. The circuit breaker (100) according to claim 5, characterized in that: The mounting seat (8) comprises a top plate (81) arranged on the first surface (31), a pair of first side plates (82) connected to the top plate (81), and a pair of second side plates (83) connected to the top plate (81); the top plate (81), the pair of first side plates (82), and the pair of second side plates (83) constitute a mounting chamber (102); the electronic device (4) is arranged in the mounting chamber (102), and the first insulating heat dissipation adhesive (5) fills the mounting chamber (102).

7. The circuit breaker (100) according to claim 6, characterized in that: The top plate (81) is provided with a pin hole (811), and the pin (41) of the electronic device (4) passes through the pin hole (811) and is connected to the circuit board (3).

8. The circuit breaker (100) according to claim 6, characterized in that: A first positioning column (812) is provided on one side of the top plate (81) adjacent to the heat sink (1), and the first positioning column (812) is connected to the electronic device (4).

9. The circuit breaker (100) according to claim 6, characterized in that: A support column (813) is provided on a side of the top plate (81) facing away from the heat sink (1), and the support column (813) is in contact with the first surface (31).

10. The circuit breaker (100) according to claim 1, characterized in that: The electronic device (4) comprises at least one of a MOS tube, an IGBT and a thyristor.

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