Embedded double-station burning equipment

Abstract

The utility model discloses embedded type double-station burning equipment. The embedded type double-station burning equipment comprises burning mechanisms which are arranged in pairs, the burning mechanism comprises a carrier plate body used for placing a chip, a movable probe plate, a detachable pressing assembly and a VPC module, the carrier plate body is located above the probe plate, the pressing assembly comprises a pressing driving part and a pressing plate, and when the probe plate moves to the position below the pressing assembly, the pressing driving part drives the pressing plate to press the chip. And the pressing driving part drives the pressing plate to move downwards so as to press the carrier plate body on the probe plate. According to the utility model, the burning efficiency of the chip is improved, and the switching test of different types of chips is facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of burning equipment, in particular to an embedded double-station burning equipment. Background Art

[0002] PCBA refers to the entire process of PCB blank board after SMT mounting or DIP plug-in, referred to as PCBA. PCB, printed circuit board, also known as printed circuit board, is an important electronic component, the support of electronic components, and the provider of circuit connection of electronic components. Because it is made by electronic printing technology, it is called "printed" circuit board. Before the emergence of printed circuit boards, the interconnection between electronic components was directly connected by wires to form a complete circuit. With the continuous updating of technology, the integration of electronic products is getting higher and higher, and the functions are getting more and more powerful. Almost most products have microprocessors, which complete the established functions through program design, update and burning.

[0003] The existing automatic burning machine has only a single burning station, which cannot improve the efficiency of chip burning. Therefore, it is necessary to provide a double-station burning device to solve the above problem. Utility Model Content

[0004] In order to overcome the above shortcomings, the purpose of the utility model is to provide an embedded dual-station burning device to improve the burning efficiency of chips and facilitate switching tests of different types of chips.

[0005] In order to achieve the above purpose, the technical solution adopted by the utility model is: an embedded double-station burning device, including a burning mechanism arranged in pairs; the burning mechanism includes a carrier body for placing chips, a movable probe needle board, a detachable pressing assembly and a VPC module, the carrier body is located above the probe needle board, the pressing assembly includes a pressing drive and a pressing plate, when the probe needle board moves to the bottom of the pressing assembly, the pressing drive drives the pressing plate to move downward to press the carrier body against the probe needle board.

[0006] The carrier body is used to load the chip that needs to be burned. When positioning the chip, a placement groove matching the chip can be opened on the surface of the carrier body, and a rotatable pressure plate can be set on its surface. The pressure plate is connected to the carrier body through a connecting shaft. After the chip is placed, the pressure plate is rotated to fix it on the carrier body. In this application, the above two structures for positioning the chip are not limited, as long as it can ensure that the chip will not be displaced during the subsequent burning process.

[0007] The carrier body is pressed against the probe needle board, so that the chip thereon is in full contact with the probes on the probe needle board, thereby ensuring the stability of the signal, thereby ensuring the efficiency of chip burning and the accuracy of subsequent chip detection.

[0008] Furthermore, it also includes a transfer component, which includes a movable support plate for placing the probe needle plate, a displacement drive member for driving the movement thereof, and spring limiters located on both sides of the probe needle plate. When the carrier body and the chip need to be placed, the displacement drive member drives the transfer support plate to move in a direction away from the pressing assembly, so that the probe needle plate and the pressing assembly are misaligned, thereby facilitating the placement of the carrier body with the chip installed; after the placement is completed, the displacement drive member can automatically transfer the carrier body to the bottom of the pressing assembly, and wait for the pressing assembly to tightly fit the chip and the probe needle plate, so that the chip and the probe are in close contact, thereby ensuring the transmission of the signal and the quality of burning.

[0009] Furthermore, the spring limiter comprises a spring limiter bar, a spring limiter support plate, and a plurality of limiter guide posts vertically arranged on the spring limiter support plate, and the limiter guide posts are partially covered with springs between the spring limiter bar and the spring limiter support plate. That is, the spring limiter bar can move up and down along the limiter guide posts when subjected to external pressure. The spring limiter support plate is also provided with limiter equal height screws penetrating the spring limiter bar, and the moving distance of the spring limiter bar in the vertical direction can be limited by the screws.

[0010] Furthermore, it also includes a needle plate guide bar supporting the movable support plate, wherein the needle plate guide bar is provided with a slide rail along its length direction, and the slide rail is slidably connected to the movable support plate through a slider. The slide rail can guide the moving direction of the movable support plate, thereby ensuring that the carrier plate body can be moved to the bottom of the pressing assembly.

[0011] Furthermore, the movable support plate is provided with a carrier limit plate, the carrier limit plate is provided with a carrier proximity switch, and the carrier body is provided with a carrier sensing module on one side close to the carrier limit plate. The carrier proximity switch can limit the position of the carrier body initially placed on the spring limit strip, and when the carrier sensing module on the carrier body touches the carrier proximity switch, it indicates that the movement of the carrier body along the Y-axis direction has reached the desired position.

[0012] Furthermore, the pressing assembly also includes a plurality of pressing alignment guide pins and an elastic pressing rod arranged on the lower surface of the pressing plate. The pressing alignment guide pins correspond to the position of the probe needle plate and can be inserted into the alignment guide sleeve on the probe needle plate through the alignment guide groove on the carrier body after pressing down. The elastic pressing rod can play a buffering role when the pressing plate is pressed on the probe needle plate, avoiding the impact force from being too large to damage the probe needle plate, and effectively improving the service life of the probe needle plate.

[0013] Furthermore, the pressing assembly is connected to the fixed plate through a fixture quick-change assembly, and the fixture quick-change assembly includes a movable plate and a quick-change support plate arranged on the lower surface of the fixed plate, and a quick-change guide bar is arranged on both sides of the bottom of the movable plate, and a limited space for accommodating the quick-change support plate is reserved between the quick-change guide bar and the movable plate, and the quick-change support plate is detachably connected to the pressing plate through a quick-change extension column. Through the detachable connection between the fixture quick-change assembly and the pressing assembly, when different pressing plates need to be replaced according to different chip needs, the fixture quick-change assembly can be pulled to remove it and the pressing assembly from the operating frame, and then replace different pressing assemblies, which is convenient for the staff to replace the operation, shortens the replacement time, and also adapts to different chips for subsequent burning and testing.

[0014] Furthermore, it also includes a limit drive component and a quick-change proximity switch arranged on the movable plate, and the quick-change proximity switch corresponds to the position of the quick-change sensing module on the quick-change support plate.

[0015] After replacing the pressing assembly, when the fixture quick change assembly is installed again, the contact between the quick change sensing module and the quick change proximity switch is used to determine whether the fixture quick change assembly is installed in place.

[0016] Furthermore, it also includes a module replacement component connected to the VPC module, the module replacement component includes a tensioning cylinder, the top of the tensioning cylinder piston rod is hinged with a shank gear, the gear end of the shank gear is meshed with a rack horizontally arranged on the limit seat, and the limit seat is connected to the rack through a connecting shaft, and the limit seat is fixedly connected to the side of the VPC module. The end of the tensioning cylinder away from the piston rod is hinged to the operating frame through a cylinder support. When the tensioning cylinder piston rod is extended, the gear end of the shank gear rotates counterclockwise, driving the rack to move in a direction away from the carrier body for feeding, thereby moving the VPC module to the rear side of the operating frame, making it easy to connect the interface on the VPC module to the interfaces of other different test instruments and meters to achieve multiple product switching tests; when the tensioning cylinder piston rod is retracted, the VPC module can be moved to its original position.

[0017] Furthermore, it also includes an operating frame, the burning mechanism is located on the operating frame, and a plurality of chip detectors electrically connected to the VPC module are provided on the operating frame. The chip and the chip detector can be connected through the connection of the interface on the VPC module, so that the chip can be automatically detected after burning. It should be noted that the chip detectors connected to the VPC module here are respectively used to test the performance, quality or function of the chip after burning, and some of the above-mentioned chip detectors are prior art, and their structures are not described in detail here.

[0018] Beneficial effects of the utility model:

[0019] In the utility model, the carrier board body, the probe needle board, the pressing assembly and the VPC module cooperate with each other. The pressing assembly can be disassembled and replaced to adapt to different chips for burning, effectively improving the applicability of the burning equipment and facilitating the switching test of different types of chips. The pressing assembly can press the carrier board body against the probe needle board so that the chip is in full contact with the probes on the probe needle board, and the burning mechanism is arranged in pairs, and the double station can further improve the burning efficiency of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is an isometric view of the overall structure of an embodiment of the utility model;

[0021] Figure 2 It is an isometric view of the overall structure of the burning mechanism of one embodiment of the utility model;

[0022] Figure 3 This is a schematic diagram of the structure of a press-down assembly and a fixture quick-change assembly according to an embodiment of the utility model;

[0023] Figure 4 This is another structural schematic diagram of a pressing assembly and a clamp quick-change assembly according to an embodiment of the utility model;

[0024] Figure 5 It is a partial structural isometric view of an embodiment of the utility model;

[0025] Figure 6 for Figure 5 A is a schematic diagram of the enlarged structure of the middle part;

[0026] Figure 7 This is a schematic diagram of the structure of a transfer assembly and a carrier body according to an embodiment of the utility model;

[0027] In the figure: 1. operating frame; 2. burning mechanism; 3. carrier body; 4. transfer assembly; 41. displacement drive member; 42. slide rail; 43. needle plate guide rail; 44. moving support plate; 45. spring limit bar; 5. probe needle plate; 6. carrier plate slide buckle; 7. carrier plate sensing module; 8. carrier plate proximity switch; 9. carrier plate limit plate; 10. pressing assembly; 101. pressing drive member; 102. pressing alignment guide column; 103. elastic pressure rod; 104. pressing plate; 1 1. Fixed plate; 12. Quick-change fixture assembly; 121. Quick-change support plate; 122. Quick-change proximity switch; 123. Movable plate; 124. Quick-change guide rail; 125. Quick-change handle; 126. Quick-change extension column; 127. Limit drive; 13. Guide column; 14. VPC module; 15. Module replacement assembly; 151. Tension cylinder; 152. Cylinder support; 153. Gear with handle; 154. Limit seat; 155. Rack; 156. Connecting shaft. DETAILED DESCRIPTION

[0028] The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present invention.

[0029] See attached Figures 1 to 7 As shown, an embedded double-station burning device in this embodiment includes a burning mechanism 2 arranged in pairs; the burning mechanism 2 includes a carrier body 3 for placing a chip, a movable probe needle plate 5, a detachable pressing assembly 10 and a VPC module 14, the carrier body 3 is located above the probe needle plate 5, the pressing assembly 10 includes a pressing drive 101 and a pressing plate 104, when the probe needle plate 5 moves to below the pressing assembly 10, the pressing drive 101 drives the pressing plate 104 to move downward to press the carrier body 3 against the probe needle plate 5.

[0030] The carrier body 3 is used to load the chip that needs to be burned. When positioning the chip, a placement groove matching the chip can be opened on the surface of the carrier body 3, and a rotatable pressure plate can be set on its surface. The pressure plate is connected to the carrier body 3 through a connecting shaft 156. After the chip is placed, the pressure plate is rotated to fix it on the carrier body 3. In this application, the above two structures for positioning the chip are not limited, as long as it can be ensured that the chip will not be displaced during the subsequent burning process.

[0031] The probe needle plate 5 is movable, and can be misaligned with the pressing assembly 10 when placing the carrier body 3 and the chip, so as to avoid position interference between the two when they are placed, thereby facilitating the placement operation of the staff.

[0032] The carrier body 3 is pressed against the probe needle board 5 so that the chip thereon is in full contact with the probes on the probe needle board 5, thereby ensuring signal stability, thereby ensuring chip programming efficiency and subsequent chip detection accuracy.

[0033] The downward pressing driving member 101 may be a telescopic cylinder, a driving module or other mechanism that can push the downward pressing plate 104 to move downward. In some embodiments, the downward pressing driving member 101 is at least one downward pressing cylinder vertically arranged on the fixed plate 11, and the bottom of the piston rod of the downward pressing cylinder is detachably connected to the downward pressing plate 104 through equal height screws, which facilitates the disassembly of the downward pressing assembly 10. Specifically, two downward pressing cylinders are provided, and they are detachably connected to the diagonal sides of the downward pressing plate 104, respectively, so as to ensure that the downward pressing plate 104 is more stable when pressed downward.

[0034] It also includes a transfer assembly 4, which includes a movable support plate 44 for placing the probe needle plate 5, a displacement drive 41 for driving the movement thereof, and spring stoppers located on both sides of the probe needle plate 5. When the carrier body 3 and the chip need to be placed, the displacement drive 41 drives the transfer support plate to move in a direction away from the pressing assembly 10, so that the probe needle plate 5 and the pressing assembly 10 are misaligned, thereby facilitating the placement of the carrier body 3 with the chip installed; after the placement is completed, the displacement drive 41 can automatically transfer the carrier body 3 to the bottom of the pressing assembly 10, and wait for the pressing assembly 10 to tightly fit the chip and the probe needle plate 5, so that the chip and the probe are in close contact, thereby ensuring the transmission of the signal and the quality of burning.

[0035] The displacement driving member 41 may be a telescopic cylinder or a linear module, including but not limited to the above two driving modes, as long as the movement of the movable support plate 44 can be achieved.

[0036] It should be noted that a plurality of alignment guide sleeves are disposed on the upper surface of the probe needle plate 5 , and a plurality of alignment guide grooves are also provided on the carrier body 3 corresponding to the alignment guide sleeves, so as to guide the carrier body 3 when pressed down.

[0037] The spring limiter comprises a spring limiter strip 45, a spring limiter support plate, and a plurality of limiter guide posts vertically arranged on the spring limiter support plate, wherein the limiter guide posts located between the spring limiter strip 45 and the spring limiter support plate are covered with springs. That is, the spring limiter strip 45 can move up and down along the limiter guide posts when subjected to external pressure. The spring limiter support plate is also provided with a limiter screw that penetrates the spring limiter strip 45, and the moving distance of the spring limiter strip 45 in the vertical direction can be limited by the screw.

[0038] The spring limit bar 45 is used to support the carrier body 3, and the two sides of the carrier body 3 are placed on the spring limit bar 45, and the spring limit bar 45 is provided with a rotating carrier slider 6 at least at one end along the length direction thereof. After the carrier body 3 is placed on the spring limit bar 45, the carrier slider 6 is rotated to limit the carrier body 3 from the four corners, and the limit guide column can also be inserted into the limit guide groove on the carrier body 3, so as to position the initial placement of the carrier body 3. The accuracy of the placement of the carrier body 3 is ensured, thereby ensuring the burning efficiency of the chip placed thereon.

[0039] The needle plate guide bar 43 is also included to support the movable support plate 44. The needle plate guide bar 43 is provided with a slide rail 42 along its length direction. The slide rail 42 is slidably connected to the movable support plate 44 through a slider. The slide rail 42 can guide the moving direction of the movable support plate 44, so as to ensure that the carrier body 3 can be moved to the bottom of the pressing assembly 10.

[0040] The movable support plate 44 is provided with a carrier limit plate 9, the carrier limit plate 9 is provided with a carrier proximity switch 8, and the carrier body 3 is provided with a carrier sensing module 7 on the side close to the carrier limit plate 9. The carrier proximity switch 8 can limit the position of the carrier body 3 initially placed on the spring limit bar 45. When the carrier sensing module 7 on the carrier body 3 touches the carrier proximity switch 8, it indicates that the carrier body 3 has moved in the Y-axis direction. It should be noted that the Y-axis direction is parallel to the length direction of the slide rail 42. The carrier sensing module 7 is a plurality of brass screws.

[0041] The pressing assembly 10 further includes a plurality of pressing alignment guide pins 102 and an elastic pressing rod 103 disposed on the lower surface of the pressing plate 104. The pressing alignment guide pins 102 correspond to the position of the probe needle plate 5 and can be inserted into the alignment guide sleeve on the probe needle plate 5 through the alignment guide groove on the carrier body 3 after pressing down. The elastic pressing rod 103 can play a buffering role when the pressing plate 104 is pressed on the probe needle plate 5, avoiding the impact force from being too large to damage the probe needle plate 5, and effectively improving the service life of the probe needle plate 5.

[0042] The pressing assembly 10 is connected to the fixed plate 11 through the clamp quick-change assembly 12. The clamp quick-change assembly 12 includes a movable plate 123 and a quick-change support plate 121 arranged on the lower surface of the fixed plate 11. A quick-change guide bar 124 is respectively arranged on both sides of the bottom of the movable plate 123. A limited space is reserved between the quick-change guide bar 124 and the movable plate 123 for accommodating the quick-change support plate 121. The quick-change support plate 121 is detachably connected to the pressing plate 104 through a quick-change extension column 126.

[0043] Through the detachable connection between the clamp quick-change assembly 12 and the down-pressing assembly 10, when replacing different down-pressing plates 104 according to different chip needs, the clamp quick-change assembly 12 can be pulled to remove it and the down-pressing assembly 10 from the operating frame 1, and then replaced with a different down-pressing assembly 10, which is convenient for the staff to replace the operation and shortens the replacement time. At the same time, it is also suitable for different chips for subsequent burning and testing.

[0044] The quick-change extension column 126 can be connected to the lower pressure plate 104 by means of height screws. The quick-change support plate 121 is also provided with a quick-change handle 125 for easy pulling and replacement. The fixing plate 11 is provided with a guide column 13 corresponding to the quick-change extension column 126 .

[0045] It also includes a limit driving member 127 and a quick-change proximity switch 122 arranged on the movable plate 123 . The quick-change proximity switch 122 corresponds to the position of the quick-change sensing module on the quick-change support plate 121 .

[0046] After the pressing assembly 10 is replaced, when the fixture quick-change assembly 12 is installed again, the contact between the quick-change sensing module and the quick-change proximity switch 122 is used to determine whether the fixture quick-change assembly 12 is installed in place.

[0047] The limit drive 127 has a pressing block at its driving end, which can press the quick-change support plate 121 placed in the above-mentioned limited space onto the quick-change guide rail 124, thereby preventing the pressing assembly 10 from moving randomly and affecting the subsequent pressing operation of the pressing plate 104, the carrier body 3, and the probe needle plate 5. The limit drive 127 can be a telescopic cylinder or a moving module.

[0048] It also includes a module replacement component 15 connected to the VPC module 14, and the module replacement component 15 includes a tensioning cylinder 151. A handle gear 153 is hinged on the top of the piston rod of the tensioning cylinder 151. The gear end of the handle gear 153 is meshed with a rack 155 horizontally arranged on a limit seat 154, and the limit seat 154 is connected to the rack 155 through a connecting shaft 156. The limit seat 154 is fixedly connected to the side of the VPC module 14.

[0049] See attached Figure 5 , 6 The end of the tensioning cylinder 151 away from the piston rod is hinged to the operating frame 1 through the cylinder support 152. When the piston rod of the tensioning cylinder 151 is extended, the gear end of the handle gear 153 rotates counterclockwise, driving the rack 155 to move in the direction away from the carrier body 3 for feeding, thereby moving the VPC module 14 to the rear side of the operating frame 1, making it convenient to connect the interface on the VPC module 14 to the interfaces of other different test instruments and meters to realize switching tests of multiple products; when the piston rod of the tensioning cylinder 151 is retracted, the VPC module 14 can be moved to its original position.

[0050] See attached Figure 1 , and also includes an operating frame 1, the burning mechanism 2 is located on the operating frame 1, and a plurality of chip detectors electrically connected to the VPC module 14 are provided on the operating frame 1. The chip and the chip detector can be connected through the connection of the interface on the VPC module 14, so that the chip can be automatically detected after burning. It should be noted that the chip detectors connected to the VPC module 14 are used to test the performance, quality or function of the chip after burning, and the above-mentioned chip detectors are all prior art, and their structures are not described in detail here.

[0051] The above implementation modes are only for illustrating the technical concept and features of the utility model, and their purpose is to allow people familiar with this technology to understand the content of the utility model and implement it. It cannot be used to limit the protection scope of the utility model. Any equivalent changes or modifications made according to the spirit of the utility model should be included in the protection scope of the utility model.

Claims

1. An embedded dual-station burning device, characterized in that: It comprises a burning mechanism arranged in pairs; the burning mechanism comprises a carrier body for placing the chip, a movable probe needle board, a detachable pressing assembly and a VPC module, the carrier body is located above the probe needle board, the pressing assembly comprises a pressing driving member and a pressing plate, when the probe needle board moves below the pressing driving member, the pressing driving member drives the pressing plate to move downward to press the carrier body against the probe needle board.

2. The embedded dual-station burning device according to claim 1, characterized in that: It also includes a transfer assembly, which includes a movable support plate for placing the probe needle plate, a displacement driving member for driving the movable support plate to move, and spring limit members located on both sides of the probe needle plate.

3. The embedded dual-station burning device according to claim 2, characterized in that: The spring limiting member comprises a spring limiting strip, a spring limiting support plate and a plurality of limiting guide posts vertically arranged on the spring limiting support plate, and a portion of the limiting guide post located between the spring limiting strip and the spring limiting support plate is covered with a spring.

4. The embedded dual-station burning device according to claim 2, characterized in that: It also includes a needle plate guide bar supporting the movable support plate, wherein the needle plate guide bar is provided with a slide rail along its length direction, and the slide rail is slidably connected with the movable support plate through a slider.

5. The embedded dual-station burning device according to claim 2, characterized in that: The movable support plate is provided with a carrier plate limiting plate, the carrier plate limiting plate is provided with a carrier plate proximity switch, and a carrier plate sensing module is provided on one side of the carrier plate body close to the carrier plate limiting plate.

6. The embedded dual-station burning device according to claim 1, characterized in that: The pressing assembly further comprises a plurality of pressing alignment guide posts and an elastic pressing rod arranged on the lower surface of the pressing plate.

7. The embedded dual-station burning device according to claim 1, characterized in that: The pressing down assembly is connected to the fixed plate through a clamp quick-change assembly, and the clamp quick-change assembly includes a movable plate and a quick-change support plate arranged on the lower surface of the fixed plate. A quick-change guide bar is respectively arranged on both sides of the bottom of the movable plate. A limited space is reserved between the quick-change guide bar and the movable plate for accommodating the quick-change support plate. The quick-change support plate is detachably connected to the pressing down plate through a quick-change extension column.

8. The embedded dual-station burning device according to claim 7, characterized in that: It also includes a limit drive component and a quick-change proximity switch arranged on the movable plate, and the quick-change proximity switch corresponds to the position of the quick-change sensing module on the quick-change support plate.

9. The embedded dual-station burning device according to claim 1, characterized in that: It also includes a module replacement component connected to the VPC module, the module replacement component includes a tensioning cylinder, a handle gear is hinged on the top of the tensioning cylinder piston rod, the gear end of the handle gear is meshed with a rack horizontally arranged on a limit seat, and the limit seat is connected to the rack through a connecting shaft, and the limit seat is fixedly connected to the side of the VPC module.

10. The embedded dual-station burning device according to claim 1, characterized in that: It also includes an operating frame, the burning mechanism is located on the operating frame, and a plurality of chip detectors electrically connected to the VPC module are arranged on the operating frame.

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