A carrier copper foil copper plating mechanism

Abstract

The utility model discloses a carrier copper foil copper plating mechanism, including an electroplating pool, a conveying device used in conjunction with the electroplating pool, the conveying device including a first group of conveying rollers and a second group of conveying rollers arranged on both sides of the top of the electroplating pool, and a pool bottom conveying roller arranged at the bottom of the electroplating pool, and an anode plate in the electroplating pool, which is parallel to the substrate part conveyed to the electroplating pool. Since the substrate in the electroplating pool of the utility model is parallel to the anode plate, and the distance between the two is controlled at 30-40 mm. Therefore, the anode plate can move the metal copper ions to the substrate in a face-to-face manner, covering the substrate, so as to improve the efficiency of electroplating and the quality of electroplating, and make the thickness of the metal coating on the surface of the substrate uniform.

Description

Technical Field

[0001] The utility model relates to the technical field of electroplating, in particular to electroplating equipment. Background Art

[0002] Electroplating is a material surface treatment process that uses the chemical reaction principle of electrolysis to lay a layer of metal on the surface of a conductor. Common types of electroplating include chrome plating, nickel plating, copper plating, zinc plating, etc.

[0003] The principle of electroplating is that under the action of power supply, current flows to the anode, the anode plate continuously loses electrons, and the metal copper ions that lose electrons diffuse into the plating solution (that is, the dissolution process of the anode); driven by the power supply potential, the lost electrons move in the opposite direction of the current and are enriched on the cathode through the DC power supply. The copper ions continuously gain electrons on the cathode and are reduced to a metal coating, that is, a layer of metal is laid on the surface of the conductor.

[0004] The patent document with the authorization announcement number CN217324362U discloses an adjustment and conveying device for a conductive cloth copper plating mechanism, which mainly relates to the field of conductive cloth copper plating. It includes an unwinding drive device, which includes an unwinding motor and upper and lower tightly matched unwinding rollers; the unwinding motor drives the roller shaft of the lower unwinding roller to rotate and then drives the upper unwinding roller to rotate, so that the conductive cloth passing through the gap between the upper and lower unwinding rollers is transported to the next process. The patent controls the running speed of the conductive cloth in the electrolytic cell by setting an unwinding drive device. Utility Model Content

[0005] The technical problem solved by the utility model is to improve the electroplating efficiency.

[0006] In order to solve the above technical problems, the utility model provides the following technical solutions: a carrier copper foil copper plating mechanism, including an electroplating pool and a conveying device used in conjunction with the electroplating pool, the conveying device including a first group of conveying rollers and a second group of conveying rollers arranged on both sides of the top of the electroplating pool, and a pool bottom conveying roller arranged at the bottom of the electroplating pool, the anode plate in the electroplating pool is parallel to the substrate portion conveyed to the electroplating pool.

[0007] During electroplating, the anode plate continuously loses electrons, and the metal copper ions that lose electrons diffuse into the plating solution, and under the drive of the power supply potential, move toward the substrate direction of the cathode, and are enriched on the substrate through the direct current power supply. The copper ions continuously obtain electrons on the substrate and are reduced to a metal coating. Since the substrate in the electroplating pool of the utility model is parallel to the anode plate, the distance between the substrate parallel to the anode plate and the anode plate is equal everywhere, so that the metal copper ions from the anode plate can move toward the substrate in an all-round manner and cover the substrate at the same time. The metal copper ions move a short distance in the plating solution and cover a wide area, which can improve the efficiency of electroplating and the quality of electroplating, and make the thickness of the metal coating on the surface of the substrate uniform.

[0008] The substrate delivered to the electroplating tank is in the shape of a parabola, and the anode plates are located on the two outer sides of the parabola, that is, the anode plates are respectively arranged on the two outer sides of the parabola, and each anode plate is parallel to the substrate it faces. Compared with a single anode plate, a pair of anode plates can significantly improve the efficiency of electroplating.

[0009] As an option, the distance between the anode plate and the substrate is 30-40 mm. According to experiments, the distance between the anode plate and its parallel substrate is kept between 30-40 mm, including 30 mm and 40 mm, which can effectively improve the efficiency of electroplating.

[0010] The anode plate of the utility model is arranged in an anode plate carrying frame, the anode plate carrying frame is installed in an electroplating cell, an anode plate conductive part is arranged above the anode plate carrying frame, the anode plate conductive part is connected to the top of the anode plate, and the anode plate conductive part is positioned on a pair of side walls of the electroplating cell.

[0011] A spray system that sprays upward is set below the anode plate, and the paint spray system sprays toward the anode plate to disturb the plating solution around the anode plate, which is beneficial to the rapid precipitation and flow of metal copper ions on the anode plate and the improvement of electroplating efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The utility model is further described below in conjunction with the accompanying drawings:

[0013] Figure 1 It is a front view of the carrier copper foil copper plating mechanism;

[0014] Figure 2 for Figure 1 A cross-sectional view of

[0015] Figure 3 for Figure 1 A top view of

[0016] Figure 4 for Figure 1 Rear view of

[0017] Figure 5 It is a three-dimensional diagram of the copper plating mechanism of the carrier copper foil;

[0018] Figure 6 for Figure 3 Enlarged view of point A in the middle;

[0019] Figure 7 for Figure 5 Enlarged view of point B in the middle.

[0020] Explanation of symbols in the figure:

[0021] 10. Electroplating bath;

[0022] 20. First group of conveying rollers; 21. First conductive conveying roller; 22. Cathode conductive structure; 221. Insulating box; 222. Conductive module; 223. Clamping structure;

[0023] 30. A second group of conveying rollers; 31. A second conductive conveying roller;

[0024] 40. Pool bottom conveyor roller;

[0025] 50. Anode plate; 51. Anode plate frame; 52. Anode plate conductive member; 53. Spraying system; 531. Bottom pipeline of the spraying system; 532. Spraying head;

[0026] 60. cleaning tank; 61. guide roller; 62. third set of conveying rollers; 63. cleaning tank conveying rollers;

[0027] 71. a first motor; 72. a second motor;

[0028] 80. Base material. DETAILED DESCRIPTION

[0029] like Figure 2 A carrier copper foil copper plating mechanism includes an electroplating cell 10 and a conveying device used in conjunction with the electroplating cell, wherein the conveying device includes a first group of conveying rollers 20 and a second group of conveying rollers 30 arranged on both sides of the top of the electroplating cell, and a bottom conveying roller 40 arranged at the bottom of the electroplating cell. An anode plate 50 in the electroplating cell is parallel to a substrate portion conveyed into the electroplating cell.

[0030] A cleaning pool 60 is arranged beside the electroplating pool 10, and guide rollers 61 and a third group of conveying rollers 62 are arranged on both sides of the top of the cleaning pool, respectively. The first group of conveying rollers 20, the second group of conveying rollers 30, the guide rollers 61, and the third group of conveying rollers 62 are linked by a first belt. Any conveying roller of the third group of conveying rollers 62 is connected to the first motor 71, and under the drive of the first motor, the first group of conveying rollers 20, the second group of conveying rollers 30, the guide rollers 61, and the third group of conveying rollers 62 are linked.

[0031] A cleaning tank conveying roller 63 is provided in the cleaning tank 60 , and the cleaning tank conveying roller is connected to the second motor 72 . The cleaning tank conveying roller 63 is linked with the tank bottom conveying roller 40 through a second belt.

[0032] The substrate 80 is sequentially conveyed forward by the first group of conveying rollers 20, the bottom conveying rollers 40, the second group of conveying rollers 30, the guide rollers 61, the cleaning tank conveying rollers 63, and the third group of conveying rollers 62, and sequentially passes through the electroplating tank 10 and the cleaning tank 60. The substrate 80 is parabolic in the electroplating tank 10 and the cleaning tank 60.

[0033] Combination Figure 2 , Figure 6 , Figure 7One of the first group of conveying rollers 20 is connected to the cathode of the power source and is set as the first conductive conveying roller 21. One of the second group of conveying rollers 30 is connected to the cathode of the power source and is set as the second conductive conveying roller 31. A cathode conductive structure 22 is provided at one end of any conductive conveying roller. The cathode conductive structure includes an insulating box 221, a conductive module 222 disposed in the insulating box and connected to the cathode of the power source, and a clamping structure 223 disposed on the conductive module. The clamping structure clamps the conductive conveying roller to achieve electrical connection between the conductive conveying roller and the cathode of the power source. The substrate 80 passing through the first group of conveying rollers 20 and the second group of conveying rollers 30 is electrically connected to the cathode of the power source due to contact with the first conductive conveying roller 21 and the second conductive conveying roller 31.

[0034] like Figure 2 Anode plates 50 are arranged in the electroplating tank 10. The number of anode plates 50 is a pair, which are located on both sides of the parabolic substrate in the electroplating tank 10. Moreover, each anode plate 50 is parallel to the substrate portion it faces, and the distance between each anode plate 50 and the substrate 60 is 30-40 mm. The anode plate 50 is located in an anode plate carrier frame 51. An anode plate conductive member 52 is arranged above the anode plate carrier frame. The anode plate conductive member is connected to the power anode to realize the electrical connection between the anode plate and the power anode.

[0035] During electroplating, the anode plate 50 continuously loses electrons, and the metal copper ions that lose electrons diffuse into the plating solution, and under the drive of the power supply potential, move toward the substrate 80 of the cathode, and are enriched on the substrate through the direct current power supply. The copper ions continuously obtain electrons on the substrate 80 and are reduced to a metal coating. Since the substrate in the electroplating cell 10 of the utility model is parallel to the anode plate 50, and the distance between the two is controlled to be 30-40 mm. Therefore, the anode plate 50 can move the metal copper ions to the substrate 80 face to face and cover the substrate, so as to improve the efficiency of electroplating and the quality of electroplating.

[0036] As an improvement, Figure 2 A spray system 53 for spraying upward is provided below the anode plate 50, and a bottom pipe 531 of the spray system passes downward through the bottom of the electroplating tank 10 and is connected to a circulation pipe, which is connected to the electroplating tank 10. Driven by a pump, the circulation pipe draws plating solution from the electroplating tank, and the plating solution is sprayed upward by a spray head 532 at the top of the spray system 53, disturbing the plating solution around the anode plate 50, which is beneficial for the rapid precipitation and flow of the metal copper ions on the anode plate.

[0037] After the electroplating is completed, the substrate enters the cleaning tank 60 for cleaning under the conveyance of the guide roller 61 , the cleaning tank conveying roller 63 , and the third group of conveying rollers 62 .

[0038] The utility model plates a thin copper layer on a soft substrate with a thickness of 1-3 microns, and then peels the thin copper layer off the substrate for processing circuit boards or new energy vehicle batteries.

[0039] The above contents are only preferred implementation modes of the present invention. For ordinary technicians in this field, according to the concept of the present invention, there may be changes in the specific implementation mode and application scope. The content of this specification should not be understood as limiting the present invention.

Claims

1. A copper foil plating mechanism for a carrier, comprising an electroplating pool (10), and a conveying device used in conjunction with the electroplating pool, wherein the conveying device comprises a first group of conveying rollers (20) and a second group of conveying rollers (30) arranged on both sides of the top of the electroplating pool, and a pool bottom conveying roller (40) arranged at the bottom of the electroplating pool, characterized in that: The anode plate (50) in the electroplating tank is parallel to the substrate portion conveyed into the electroplating tank.

2. A carrier copper foil copper plating mechanism as claimed in claim 1, characterized in that: The substrate transported into the electroplating bath (10) is in a parabola shape, and the anode plates (50) are located on both outer sides of the parabola.

3. A carrier copper foil copper plating mechanism as claimed in claim 1, characterized in that: The distance between the anode plate (50) and the substrate (60) is 30-40 mm.

4. A carrier copper foil copper plating mechanism as claimed in claim 1, characterized in that: The anode plate (50) is arranged in an anode plate carrying frame (51), and an anode plate conductive member (52) is arranged above the anode plate carrying frame.

5. A carrier copper foil copper plating mechanism as claimed in claim 1, characterized in that: A spray system (53) for spraying upward is arranged below the anode plate (50).

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