External heat dissipation mechanism of server

Abstract

The utility model relates to the technical field of servers, and discloses an external heat dissipation mechanism of a server, including a first box body and a second box body, an air cooling component arranged inside a cold air channel to reduce the air temperature; and a cooling component arranged at the bottom of a semiconductor refrigeration plate to keep the coolant inside a liquid storage cavity at a low temperature. The utility model is fixed on one side of a server cabinet by an external mounting component, which will not occupy the internal space of the compressed server cabinet, and avoid affecting the layout of the server wiring; the coolant inside the liquid storage cavity is driven by a liquid pump to circulate through a first liquid infusion pipe, a liquid inlet pipe, a circulating rib pipe, a liquid outlet pipe, and a second liquid infusion pipe in sequence, and when the coolant flows through the heat-conducting tube, the overall temperature of the heat-conducting tube is reduced, and then the external air enters the heat-conducting tube, and the heat-conducting tube absorbs the heat in the air, so that the air entering the server is always kept at a low temperature, ensuring the heat absorption and heat dissipation effect of the air.

Description

Technical Field

[0001] The utility model relates to the technical field of servers, in particular to an external heat dissipation mechanism of a server. Background Art

[0002] As a type of computer, a server runs faster, has a higher load, and is more expensive than an ordinary computer. It can provide computing or application services to other clients in the network. The server will generate more heat when it is working, especially some large network platforms, which usually use multiple servers together. Multiple servers are placed in a cabinet. A lot of heat will accumulate when working, so a heat dissipation mechanism is needed to quickly discharge the heat from the cabinet to ensure stable operation of the server.

[0003] When the external cooling mechanism of the existing server is in use, it is generally driven by a large number of fans to continuously blow the external air through the server to take away the heat. However, the air entering the cabinet in this way is not further cooled, and the heat absorption and heat dissipation capacity is limited, and the heat dissipation efficiency and heat dissipation effect are poor. At the same time, a large number of fans occupy the internal space of the cabinet, affecting the layout of the server cables, and consuming a lot of energy, which is not conducive to long-term use. Utility Model Content

[0004] The purpose of the utility model is to provide an external heat dissipation mechanism for a server to solve the problems raised in the above background technology.

[0005] To achieve the above object, the utility model provides the following technical solution: an external heat dissipation mechanism of a server, comprising a first box and a second box, the top of the second box is connected to the first box, a cold air channel is provided inside the first box, an asbestos insulation board is provided outside the cold air channel, and further comprising:

[0006] An air cooling component is arranged inside the cold air channel to reduce the air temperature. An exhaust component is arranged at one end of the first box body to introduce external air into the air cooling component. An installation component is arranged at the other end of the first box body to facilitate assembly with the server cabinet. A liquid storage cavity is arranged at the bottom of the inner cavity of the second box body, and a semiconductor cooling plate is fixedly installed on the top of the liquid storage cavity.

[0007] A cooling component is arranged at the bottom of the semiconductor refrigeration plate to keep the coolant inside the liquid storage cavity at a low temperature. A heat dissipation component is arranged inside the second box body to discharge the working heat of the semiconductor refrigeration plate. A liquid pump is fixedly installed on one side of the second box body, and the water inlet of the liquid pump is connected to the inside of the liquid pump.

[0008] Preferably, the air cooling component includes a cross rod fixed inside the cold air channel, there are two cross rods and they are arranged in parallel, a plurality of heat-conducting tubes are arranged between the cross rods, the plurality of heat-conducting tubes are mutually sleeved to form a concentric circle structure, guide plates are vertically installed on the outer side and the inner side of the heat-conducting tube, the heat-conducting tubes are respectively connected to the cross rods at both ends, a liquid outlet pipe is fixedly installed on one side of the heat-conducting tube, and a liquid inlet pipe is fixedly installed on the other side of the heat-conducting tube, a plurality of circulation rib tubes are symmetrically arranged between the liquid outlet pipe and the liquid inlet pipe, the circulation rib tubes are respectively connected to the liquid outlet pipe and the liquid inlet pipe, the liquid outlet of the liquid pump is connected to a first infusion pipe, one end of the liquid inlet pipe is connected to the first infusion pipe, a second infusion pipe is arranged on one side of the first infusion pipe, one end of the liquid outlet pipe is connected to the second infusion pipe, and the bottom end of the second infusion pipe passes through the second box and is connected to the water inlet of the liquid storage chamber.

[0009] Preferably, the exhaust assembly includes an air inlet arranged at one end of the first box body, the cold air channel is connected to the outside through the air inlet, a first fan is installed inside the air inlet, and a first filter is fixedly connected to a port at one end of the air inlet away from the first box body.

[0010] Preferably, the installation assembly comprises a third box body fixed to one end of the first box body, a quadrilateral frame is fixedly connected to the outer side of the third box body, and a plurality of positioning holes are symmetrically provided on the quadrilateral frame.

[0011] Preferably, the cooling component includes a second heat-conducting plate fixed to the bottom of the semiconductor refrigeration plate, a plurality of second heat-conducting fins are symmetrically installed on the bottom of the second heat-conducting plate, the bottom of the second heat-conducting fins penetrates into the liquid storage cavity, an insulation layer is provided on the outside of the liquid storage cavity, the insulation layer is made of polyurethane foam material, liquid ports are provided at the top and bottom of the liquid storage cavity, and a solenoid valve is installed inside the liquid port.

[0012] Preferably, the heat dissipation component includes a first heat conducting plate fixed on the top of the semiconductor refrigeration plate, a plurality of first heat conducting fins are symmetrically installed on the top of the first heat conducting plate, air outlets are provided on both sides of the second box body, a second fan is installed inside the air outlet, and a second filter is fixedly connected to an end port of the air outlet away from the second box body.

[0013] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0014] The utility model is fixed on one side of the server cabinet by external positioning of the mounting assembly, so that the internal space of the compressed server cabinet is not occupied, the layout of the server wiring is avoided to be affected, and disassembly and maintenance are convenient; the exhaust assembly is used to draw the external air into the cold air channel, and then the cooling liquid in the liquid storage chamber is driven by the liquid pump to circulate between the first box body and the second box body through the first liquid infusion pipe, the liquid inlet pipe, the circulation rib pipe, the liquid outlet pipe, and the second liquid infusion pipe in sequence; when the cooling liquid flows through the heat-conducting tube, the overall temperature of the heat-conducting tube is reduced, and then the external air enters the heat-conducting tube, and the heat-conducting tube absorbs the heat in the air, so that the air entering the server is always kept at a low temperature, ensuring the heat absorption and heat dissipation effect of the air. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic diagram of the structure of an external heat dissipation mechanism of a server provided by the utility model;

[0016] Figure 2 A schematic diagram of the structure of the installation assembly provided by the utility model;

[0017] Figure 3 A schematic diagram of the heat dissipation assembly structure provided by the utility model;

[0018] Figure 4 This is a schematic diagram of the cooling component structure provided by the utility model;

[0019] Figure 5 A schematic diagram of the structure of the air cooling component provided by the utility model;

[0020] Figure 6 This is a schematic diagram of the circulating fin tube structure provided by the utility model.

[0021] In the figure: 1, first box; 2, second box; 3, exhaust assembly; 31, air inlet; 32, first fan; 33, first filter; 4, cold air channel; 5, asbestos insulation board; 6, installation assembly; 61, third box; 62, quadrilateral frame; 63, positioning hole; 7, air cooling assembly; 71, heat conduction tube; 72, guide plate; 73, cross rod; 74, liquid outlet pipe; 75, liquid inlet pipe; 76, first outlet pipe Liquid pipe; 77, second liquid infusion pipe; 78, circulation fin tube; 8, liquid storage chamber; 9, liquid pump; 10, semiconductor refrigeration sheet; 11, heat dissipation component; 111, first heat conduction plate; 112, first heat conduction fin plate; 113, air outlet; 114, second filter; 115, second fan; 12, cooling component; 121, second heat conduction plate; 122, second heat conduction fin plate; 123, thermal insulation layer; 124, liquid port. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] See also Figure 1-6 As shown, an external heat dissipation mechanism of a server includes a first box body 1 and a second box body 2, the top of the second box body 2 is connected to the first box body 1, a cold air channel 4 is arranged inside the first box body 1, and an asbestos insulation board 5 is arranged on the outside of the cold air channel 4. By arranging the asbestos insulation board 5, the loss of coldness is avoided and energy consumption is reduced; it also includes: an air cooling component 7 arranged inside the cold air channel 4 to reduce the air temperature, by arranging the air cooling component 7, the air entering the cold air channel 4 is cooled, and the cooled air enters the server to absorb heat and dissipate heat better, which is more conducive to dissipating the working heat of the server; an exhaust component 3 is arranged at one end of the first box body 1 to introduce external air into the air cooling component 7, by arranging the exhaust component 3, while introducing external air into the air cooling component 7, impurities in the air can be blocked, thereby avoiding impurities from entering the server and causing damage to precision electronic devices; a mounting component 6 is arranged at the other end of the first box body 1 to facilitate assembly with the server cabinet, and by arranging the mounting component 6, the heat dissipation mechanism can be positioned and fixed in the server cabinet in an external manner The outer side of the second box body 2 will not occupy the internal space of the compression server cabinet, avoid affecting the layout of the server wiring, and facilitate disassembly and maintenance; a liquid storage chamber 8 is provided at the bottom of the inner cavity of the second box body 2, and a semiconductor refrigeration plate 10 is fixedly installed on the top of the liquid storage chamber 8. In actual use, the semiconductor refrigeration plate 10 should be arranged with the cold side facing the liquid storage chamber 8, which is conducive to cooling the cooling liquid in the liquid storage chamber 8; a cooling component 12 is arranged at the bottom of the semiconductor refrigeration plate 10 to keep the cooling liquid in the liquid storage chamber 8 at a low temperature. By setting the cooling component 12, the liquid storage The heat of the coolant in the cavity 8 is taken away, so that the coolant always maintains a low temperature state before entering the air-cooling component 7 for circulation, thereby ensuring the effect of the air-cooling component 7; a heat dissipation component 11 is provided inside the second box body 2, which can discharge the working heat of the semiconductor refrigeration plate 10. By setting the heat dissipation component 11, the hot surface working heat of the semiconductor refrigeration plate 10 can be discharged, thereby avoiding the semiconductor refrigeration plate 10 from being damaged due to overheating, and ensuring the stable operation of the semiconductor refrigeration plate 10; a liquid pump 9 is fixedly installed on one side of the second box body 2, and the water inlet of the liquid pump 9 is connected to the inside of the liquid pump 9.

[0024] The air cooling assembly 7 includes a cross rod 73 fixed inside the cold air channel 4. There are two cross rods 73 and they are arranged in parallel. A plurality of heat-conducting tubes 71 are arranged between the cross rods 73. The plurality of heat-conducting tubes 71 are mutually sleeved to form a concentric circle structure. Guide plates 72 are vertically installed on the outer and inner sides of the heat-conducting tubes 71. The heat-conducting tubes 71 are respectively connected to the cross rods 73 at both ends. A liquid outlet pipe 74 is fixedly installed on one side of the heat-conducting tube 71, and a liquid inlet pipe 75 is fixedly installed on the other side of the heat-conducting tube 71. A plurality of circulating rib tubes 78 are symmetrically arranged between the liquid outlet pipe 74 and the liquid inlet pipe 75. The circulating rib tubes 78 are respectively connected to the liquid outlet pipe 74 and the liquid inlet pipe 75. The liquid outlet of the liquid pump 9 is connected to a first infusion pipe 76. One end of the infusion pipe 75 is connected to the first infusion pipe 76. A second infusion pipe 77 is provided on one side of the first infusion pipe 76. One end of the liquid outlet pipe 74 is connected to the second infusion pipe 77. The bottom end of the second liquid infusion pipe 77 passes through the second box 2 and is connected to the water inlet of the liquid storage chamber 8. By setting up a liquid pump 9, the coolant in the liquid storage chamber 8 can circulate between the first box 1 and the second box 2 through the first liquid infusion pipe 76, the liquid inlet pipe 75, the circulating rib pipe 78, the liquid outlet pipe 74, and the second liquid infusion pipe 77 in sequence. When the coolant flows through the heat-conducting tube 71, it will take away the internal heat, so that the overall temperature of the heat-conducting tube 71 is reduced. Then the external air enters the heat-conducting tube 71 again, and the heat-conducting tube 71 absorbs the heat in the air. In this way, the air entering the server is always kept at a low temperature, ensuring the heat absorption and heat dissipation effect of the air. In addition, the guide plate 72 on the heat-conducting tube 71 does not hinder the external air from entering the server, while increasing the contact area between the heat-conducting tube 71 and the external air, so that the air is cooled more evenly, further improving the heat dissipation effect.

[0025] The exhaust assembly 3 includes an air inlet 31 arranged at one end of the first box body 1, and the cold air channel 4 is connected to the outside through the air inlet 31. A first fan 32 is installed inside the air inlet 31, and a first filter 33 is fixedly connected to the end of the air inlet 31 away from the first box body 1. By setting the first fan 32, external air can be introduced into the cold air channel 4 from the air inlet 31, and then the first filter 33 is used to intercept impurities in the air, so as to prevent impurities from entering the server and causing damage to precision electronic devices.

[0026] The mounting assembly 6 includes a third box body 61 fixed to one end of the first box body 1, and a quadrilateral frame 62 is fixedly connected to the outer side of the third box body 61. A plurality of positioning holes 63 are symmetrically provided on the quadrilateral frame 62. In actual use, a through groove corresponding to the third box body 61 can be pre-opened on the outer side of the server cabinet, and the positioning holes 63 can be used to position the heat dissipation mechanism and install it on the outer side of the server cabinet.

[0027] The cooling component 12 includes a second heat conducting plate 121 fixed to the bottom of the semiconductor refrigeration plate 10, and a plurality of second heat conducting fins 122 are symmetrically installed at the bottom of the second heat conducting plate 121. The bottom of the second heat conducting fins 122 penetrates into the liquid storage chamber 8, and an insulation layer 123 is provided on the outside of the liquid storage chamber 8. The insulation layer 123 is made of polyurethane foam material. By providing the insulation layer 123, the heat exchange rate between the coolant in the liquid storage chamber 8 and the external environment is slowed down, and the loss of cold is reduced; liquid ports 124 are provided at the top and bottom of the liquid storage chamber 8, and an electromagnetic valve is installed inside the liquid port 124. By providing the second heat conducting plate 121 and the second heat conducting fins 122, the coldness of the cold surface of the semiconductor refrigeration plate 10 can be transferred to one side of the liquid storage chamber 8, so that the coolant in the liquid storage chamber 8 is always kept at a low temperature, ensuring the effect of the air cooling component 7, and then the two liquid ports 124 are used to realize the injection of new coolant and the discharge of deteriorated coolant.

[0028] The heat dissipation assembly 11 includes a first heat conducting plate 111 fixed to the top of the semiconductor refrigeration sheet 10, and a plurality of first heat conducting fins 112 are symmetrically installed on the top of the first heat conducting plate 111. In actual use, the first heat conducting fins 112, the first heat conducting plate 111, the second heat conducting plate 121, the second heat conducting fins 122, the heat conducting tube 71, the guide plate 72, and the circulating fin tube 78 can all be made of copper or aluminum, which has good thermal conductivity, is conducive to heat exchange and transfer, and has low cost; both sides of the second box body 2 are provided with air outlets 1 13. A second fan 115 is installed inside the air outlet 113. A second filter 114 is fixedly connected to an end of the air outlet 113 away from the second box body 2. By arranging the first heat conducting plate 111 and the first heat conducting fin plate 112, the working heat generated by the hot surface of the semiconductor cooling plate 10 can be dissipated to the inside of the second box body 2, and then the second fan 115 can be used to discharge the working heat from the second box body 2 in time, thereby avoiding the damage of the semiconductor cooling plate 10 caused by the accumulation of working heat, and ensuring the stable operation of the semiconductor cooling plate 10.

[0029] Working principle: First, the heat dissipation mechanism is externally positioned and fixed on one side of the server cabinet through the installation component 6, so that it will not occupy the internal space of the compressed server cabinet, avoid affecting the server wiring layout, and facilitate disassembly and maintenance. Then, the exhaust component 3 is used to draw the external air into the cold air channel 4, and then the liquid pump 9 drives the coolant in the liquid storage chamber 8 to circulate between the first infusion pipe 76, the liquid inlet pipe 75, the circulating rib pipe 78, the liquid outlet pipe 74, and the second infusion pipe 77 in sequence. When the coolant flows through the heat-conducting tube 71, the overall temperature of the heat-conducting tube 71 will be reduced, and then the external air enters the heat-conducting tube 71, and the heat-conducting tube 71 absorbs the heat in the air, so that the air entering the server is always kept at a low temperature, ensuring the heat absorption and heat dissipation effect of the air.

[0030] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0031] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An external heat dissipation mechanism of a server, comprising a first box (1) and a second box (2), wherein the top of the second box (2) is connected to the first box (1), a cold air channel (4) is provided inside the first box (1), and an asbestos insulation board (5) is provided outside the cold air channel (4), characterized in that: Also includes: An air cooling component (7) is arranged inside the cold air channel (4) and can reduce the air temperature. An exhaust component (3) is arranged at one end of the first box (1) and can introduce external air into the air cooling component (7). An installation component (6) is arranged at the other end of the first box (1) and is convenient for assembly with a server cabinet. A liquid storage cavity (8) is arranged at the bottom of the inner cavity of the second box (2), and a semiconductor cooling plate (10) is fixedly installed on the top of the liquid storage cavity (8). A cooling component (12) is arranged at the bottom of the semiconductor refrigeration plate (10) to keep the cooling liquid in the liquid storage chamber (8) at a low temperature. A heat dissipation component (11) is arranged inside the second box body (2) to discharge the working heat of the semiconductor refrigeration plate (10). A liquid pump (9) is fixedly installed on one side of the second box body (2). The water inlet of the liquid pump (9) is connected to the inside of the liquid pump (9).

2. The external heat dissipation mechanism of a server according to claim 1, characterized in that: The air cooling component (7) comprises a cross rod (73) fixed inside the cold air channel (4), there are two cross rods (73) and they are arranged in parallel, a plurality of heat-conducting tubes (71) are arranged between the cross rods (73), the plurality of heat-conducting tubes (71) are mutually sleeved to form a concentric circle structure, guide plates (72) are vertically installed on the outside and inside of the heat-conducting tube (71), the heat-conducting tube (71) is respectively connected to the cross rods (73) at both ends, a liquid outlet pipe (74) is fixedly installed on one side of the heat-conducting tube (71), and a liquid inlet pipe (75) is fixedly installed on the other side of the heat-conducting tube (71), the A plurality of circulating rib tubes (78) are symmetrically arranged between the liquid outlet tube (74) and the liquid inlet tube (75), and the circulating rib tubes (78) are respectively connected to the liquid outlet tube (74) and the liquid inlet tube (75). The liquid outlet of the liquid pump (9) is connected to a first liquid infusion tube (76), one end of the liquid inlet tube (75) is connected to the first liquid infusion tube (76), a second liquid infusion tube (77) is arranged on one side of the first liquid infusion tube (76), one end of the liquid outlet tube (74) is connected to the second liquid infusion tube (77), and the bottom end of the second liquid infusion tube (77) passes through the second box body (2) and is connected to the water inlet of the liquid storage chamber (8).

3. The external heat dissipation mechanism of a server according to claim 1, characterized in that: The exhaust assembly (3) comprises an air inlet (31) arranged at one end of the first box body (1); the cold air channel (4) is connected to the outside through the air inlet (31); a first fan (32) is installed inside the air inlet (31); and a first filter (33) is fixedly connected to a port at one end of the air inlet (31) away from the first box body (1).

4. The external heat dissipation mechanism of a server according to claim 1, characterized in that: The mounting assembly (6) comprises a third box body (61) fixed to one end of the first box body (1), a quadrilateral frame (62) being fixedly connected to the outer side of the third box body (61), and a plurality of positioning holes (63) being symmetrically provided on the quadrilateral frame (62).

5. The external heat dissipation mechanism of a server according to claim 1, characterized in that: The cooling component (12) comprises a second heat-conducting plate (121) fixed to the bottom of the semiconductor refrigeration plate (10), a plurality of second heat-conducting fins (122) are symmetrically installed at the bottom of the second heat-conducting plate (121), the bottom of the second heat-conducting fins (122) penetrates into the liquid storage cavity (8), a heat-insulating layer (123) is provided on the outside of the liquid storage cavity (8), the heat-insulating layer (123) is made of polyurethane foam material, the top and bottom of the liquid storage cavity (8) are provided with liquid ports (124), and a solenoid valve is installed inside the liquid port (124).

6. The external heat dissipation mechanism of a server according to claim 1, characterized in that: The heat dissipation component (11) comprises a first heat conducting plate (111) fixed to the top of the semiconductor refrigeration plate (10), a plurality of first heat conducting fins (112) are symmetrically mounted on the top of the first heat conducting plate (111), air outlets (113) are provided on both sides of the second box (2), a second fan (115) is mounted inside the air outlet (113), and a second filter (114) is fixedly connected to an end of the air outlet (113) away from the second box (2).

Images