Optical module

Abstract

The utility model discloses an optical module which comprises an emission shell, a first opening is formed in one side of the emission shell, and an electric connector is arranged at the first opening. One side of the electric connector is located inside the transmitting shell, and the other side of the electric connector is located outside the transmitting shell. And the laser is positioned in the transmitting shell. The first end of the first connecting part of the electric connector is positioned inside the transmitting shell, and the second end is positioned outside the transmitting shell; the second connecting part is located above the first connecting part, and the first end of the first connecting part is flush with the first end of the second connecting part; the second end of the first connecting part protrudes out of the first end of the second connecting part. The upper surface of the first connecting part is provided with a grounding layer, and the grounding layer covers the first connecting part. The second connecting part comprises a grounding pin and a grounding via hole. The grounding pin is electrically connected with the laser; and the grounding via hole is connected with the grounding pin and the grounding layer. The grounding layer can be electrically connected with the grounding pin and the laser through the grounding via hole, thereby providing ground backflow for a high-speed signal, and improving the signal transmission quality.

Description

Technical Field

[0001] The present application relates to the field of communication technology, and in particular to an optical module. Background Art

[0002] With the development of new services and application models such as cloud computing, mobile Internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules are one of the key components in optical communication equipment, and with the development of optical communication technology, the transmission rate of optical modules continues to increase.

[0003] In high-speed information transceiver systems, high-density optical modules need to be used to replace traditional optical modules. Multi-channel optical transceiver technology can concentrate more optical emitting components and optical receiving components in a smaller space. In a limited space, improving the signal quality of optical emitting components helps to ensure product stability. Utility Model Content

[0004] The present application provides an optical transmission component and an optical module to improve the quality of communication signals.

[0005] In order to solve the above technical problems, the embodiments of the present application disclose the following technical solutions:

[0006] The embodiment of the present application discloses a light emitting component, comprising:

[0007] A launching shell, a side wall of which one end is provided with a first opening, and an electrical connector is provided at the first opening;

[0008] A laser, located inside the transmitting housing;

[0009] Wherein, the electrical connector comprises:

[0010] A first connecting portion, a first end of which is located inside the launching shell and a second end of which is located outside the launching shell;

[0011] A second connection portion is located above the first connection portion, wherein the first end of the first connection portion is flush with the first end of the second connection portion; and the second end of the first connection portion protrudes from the first end of the second connection portion;

[0012] A grounding layer is provided on the upper surface of the first connecting portion, and the grounding layer covers the first connecting portion;

[0013] The second connecting portion comprises:

[0014] A ground pin, located on an upper surface of the second connecting portion and electrically connected to the laser;

[0015] A ground via, one end of which is connected to the ground pin, and the other end of which is connected to the ground layer.

[0016] Compared with the prior art, this application has the following beneficial effects:

[0017] The present application discloses an optical module, comprising: a transmitting shell, one side of which is provided with a first opening, and an electrical connector is provided at the first opening. An optical fiber adapter is connected to the first through hole. One side of the electrical connector is located inside the transmitting shell, and the other side is located outside the transmitting shell. A laser is located inside the transmitting shell. The electrical connector comprises: a first connecting part and a second connecting part. Among them, the first end of the first connecting part is located inside the transmitting shell, and the second end is located outside the transmitting shell; the second connecting part is located above the first connecting part, and the first end of the first connecting part is flush with the first end of the second connecting part; the second end of the first connecting part protrudes from the first end of the second connecting part. A grounding layer is provided on the upper surface of the first connecting part, and the grounding layer covers the first connecting part. The second connecting part comprises: a grounding pin and a grounding via. The grounding pin is located on the upper surface of the second connecting part and is electrically connected to the laser; one end of the grounding via is connected to the grounding pin, and the other end is connected to the grounding layer. The grounding layer can be electrically connected to the grounding pin and the laser through the grounding via, providing ground return for high-speed signals and improving signal transmission quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0019] Figure 1 A partial architecture diagram of an optical communication system provided according to some embodiments of the present disclosure;

[0020] Figure 2 A partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

[0021] Figure 3 A structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0022] Figure 4 An exploded view of an optical module provided according to some embodiments of the present disclosure;

[0023] Figure 5 A schematic diagram of a light emitting component and a circuit board structure provided according to some embodiments of the present disclosure;

[0024] Figure 6A partial schematic diagram of a light emitting component and a circuit board provided according to some embodiments of the present disclosure;

[0025] Figure 7 A schematic diagram of an exploded view of a light emitting component and a circuit board provided according to some embodiments of the present disclosure;

[0026] Figure 8 A schematic diagram of an exploded view of a light emitting component provided according to some embodiments;

[0027] Fig. 9 A schematic diagram of the structure of an electrical connector provided according to some embodiments;

[0028] Fig.10 A partial cross-sectional view of a light emitting component and a circuit board according to some embodiments Figure 1 ;

[0029] Fig.11 A schematic cross-sectional view of a light emitting component connected to a circuit board according to some embodiments Figure 2 . DETAILED DESCRIPTION

[0030] Some embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. However, the described embodiments are only a part of the embodiments of the present disclosure, rather than all of the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0031] Unless the context requires otherwise, throughout the specification and claims, the term "including" is interpreted as open and inclusive, that is, "including, but not limited to"; the terms "first" and "second" cannot be understood to indicate or imply relative importance or indicate an upper limit of quantity; the term "plurality" means two or more; the term "connection" should be understood in a broad sense, for example, "connection" can be a fixed connection, a detachable connection, or an integral connection, and can be directly connected or indirectly connected through an intermediate medium; the use of the terms "suitable for" or "configured to" means open and inclusive language, which does not exclude devices that are suitable for or configured to perform additional tasks or steps; the terms "parallel", "vertical", "same", "consistent", "level" and other descriptions are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges generated in practice, and also include differences based on the same design concept but due to manufacturing reasons. In the absence of more restrictions, the elements defined by the sentence "including one..." do not exclude the existence of other identical elements in the circuit structure, article or device including the elements.

[0032] Optical communication technology establishes information transmission between information processing devices. Optical communication technology loads information onto light and uses the propagation of light to achieve information transmission. Light loaded with information is an optical signal. When optical signals propagate in information transmission equipment, they can reduce the loss of optical power and achieve high-speed, long-distance, and low-cost information transmission. Information that can be processed by information processing equipment exists in the form of electrical signals. Optical network terminals / gateways, routers, switches, mobile phones, computers, servers, tablets, and televisions are common information processing devices, and optical fibers and optical waveguides are common information transmission equipment.

[0033] The mutual conversion of optical signals and electrical signals between information processing equipment and information transmission equipment is realized through optical modules. For example, an optical fiber is connected to the optical signal input end and / or the optical signal output end of the optical module, and an optical network terminal is connected to the electrical signal input end and / or the electrical signal output end of the optical module; the first optical signal from the optical fiber is transmitted into the optical module, the optical module converts the first optical signal into a first electrical signal, and the optical module transmits the first electrical signal into the optical network terminal; the second electrical signal from the optical network terminal is transmitted into the optical module, the optical module converts the second electrical signal into a second optical signal, and the optical module transmits the second optical signal into the optical fiber. Since information processing devices can be connected to each other through an electrical signal network, at least one type of information processing device needs to be directly connected to the optical module, and it is not necessary for all types of information processing devices to be directly connected to the optical module. The information processing device directly connected to the optical module is called the host computer of the optical module.

[0034] Figure 1 FIG. 1 is a partial architecture diagram of an optical communication system provided according to some embodiments of the present disclosure. Figure 1 As shown, the optical communication system is partially presented as a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an optical fiber 101 and a network cable 103 .

[0035] One end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end is connected to the optical interface of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal is totally reflected multiple times in the optical fiber 101, and the optical signal from the direction of the remote information processing device 1000 is transmitted into the optical module 200, or the light from the optical module 200 is propagated toward the remote information processing device 1000, so as to realize long-distance and low-power-loss information transmission.

[0036] The number of optical fibers 101 may be one or more (two or more); the optical fiber 101 and the optical module 200 may be connected in a pluggable movable manner or in a fixed manner.

[0037] The host computer 100 has an optical module interface 102, which is configured to access the optical module 200, so that the host computer 100 establishes a unidirectional / bidirectional electrical signal connection with the optical module 200; the host computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor and control the working status of the optical module 200.

[0038] The host computer 100 has an external electrical interface, such as a Universal Serial Bus (USB) interface and a network cable interface 104, which can be connected to an electrical signal network. For example, the network cable interface 104 is configured to connect to the network cable 103, so that the host computer 100 and the network cable 103 establish a unidirectional / bidirectional electrical signal connection.

[0039] Optical Network Unit (ONU), Optical Line Terminal (OLT), Optical Network Equipment (ONT) and Data Center Server are common host computers.

[0040] One end of the network cable 103 is connected to the local information processing device 2000 , and the other end is connected to the host computer 100 . The network cable 103 establishes an electrical signal connection between the local information processing device 2000 and the host computer 100 .

[0041] For example, the third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal. The optical module 200 transmits the second optical signal into the optical fiber 101. The second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101.

[0042] For example, a first optical signal from the direction of a remote information processing device 1000 propagates through the optical fiber 101, the first optical signal from the optical fiber 101 is transmitted into the optical module 200, the optical module 200 converts the first optical signal into a first electrical signal, the optical module 200 transmits the first electrical signal into the host computer 100, the host computer 100 generates a fourth electrical signal based on the first electrical signal, and the host computer 100 transmits the fourth electrical signal to the local information processing device 2000.

[0043] The optical module is a tool for realizing the mutual conversion between optical signals and electrical signals. During the conversion process between optical signals and electrical signals, the information does not change, but the encoding and decoding method of the information can change.

[0044] Figure 21 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structures related to the host computer 100 and the optical module 200 are shown. Figure 2 As shown, the host computer 100 also includes a PCB circuit board 105 arranged in the shell, a cage 106 arranged on the surface of the PCB circuit board 105, a heat sink 107 arranged on the cage 106, and an electrical connector (not shown in the figure) arranged inside the cage 106. The heat sink 107 has a protruding structure that increases the heat dissipation area, and the fin-shaped structure is a common protruding structure.

[0045] The optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical interface of the optical module 200 is connected to the electrical connector inside the cage 106.

[0046] Figure 3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure, Figure 4 FIG. 1 is an exploded view of an optical module provided according to some embodiments of the present disclosure. Figure 3 and Figure 4 As shown, the optical module 200 includes a shell, a circuit board 300 disposed in the shell, a light emitting component 400 and a light receiving component 500. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes one of the light emitting component 400 and the light receiving component 500.

[0047] The housing comprises an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square body.

[0048] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and arranged perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0049] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and vertically arranged with the bottom plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and vertically arranged with the cover plate 2011, and the two upper side plates are combined with the two lower side plates 2022 to realize that the upper shell 201 covers the lower shell 202.

[0050] The direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 ( Figure 3 The opening 205 is also located at the end of the optical module 200 ( Figure 3 Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located at the side of the optical module 200. The opening 204 is an electrical interface, and the gold finger 301 of the circuit board 300 extends from the electrical interface and is inserted into the electrical connector of the host computer; the opening 205 is an optical port, which is configured to access the optical fiber 101 so that the optical fiber 101 is connected to the optical emitting component 400 and / or the optical receiving component 500 in the optical module 200.

[0051] The assembly method of combining the upper shell 201 and the lower shell 202 is adopted, which facilitates the installation of components such as the circuit board 300, the light emitting component 400, and the light receiving component 500 into the above-mentioned shell, and the upper shell 201 and the lower shell 202 can encapsulate and protect the shapes of these components. In addition, when assembling components such as the circuit board 300, the light emitting component 400 and the light receiving component 500, it is convenient to deploy the positioning components, heat dissipation components, and electromagnetic shielding components of these devices, which is conducive to the automated implementation of production.

[0052] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials to facilitate electromagnetic shielding and heat dissipation.

[0053] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0054] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a snap-fit ​​component that matches the cage 106 of the host computer. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the snap-fit ​​component and the host computer, so as to release the snap-fit ​​fixed connection between the optical module 200 and the host computer, so that the optical module 200 can be pulled out of the cage 106.

[0055] The circuit board 300 includes circuit traces, electronic components and chips, etc. The electronic components and chips are connected together according to the circuit design through the circuit traces to realize the functions of power supply, electrical signal transmission and grounding. The electronic components may include capacitors, resistors, triodes, metal-oxide-semiconductor field-effect transistors (MOSFET), etc. The chips may include microcontroller units (MCU), laser driver chips, transimpedance amplifiers (TIA), limiting amplifiers, clock and data recovery chips (CDR), power management chips, and digital signal processing (DSP) chips.

[0056] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board is also easy to insert into the electrical connector in the upper computer cage.

[0057] The circuit board 300 further includes a gold finger 301 formed on the end surface thereof, and the gold finger 301 is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger 301 is connected to the electrical connector in the cage 106. The gold finger 301 can be provided on only one side of the circuit board 300 (e.g. Figure 4 The gold finger 301 is configured to establish an electrical connection with the host computer to achieve power supply, grounding, I2C signal transmission, data signal transmission, etc.

[0058] Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0059] The light emitting component 400 and / or the light receiving component 500 are located on a side of the circuit board 300 away from the gold finger 301; in some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors; in some embodiments, the light emitting component and / or the light receiving component can be directly set on the circuit board 300, can be set on the surface of the circuit board, and can also be set on the side of the circuit board.

[0060] Figure 5A schematic diagram of a light emitting component and a circuit board structure provided according to some embodiments of the present disclosure. Figure 6 A partial schematic diagram of a circuit board of a light emitting component provided according to some embodiments of the present disclosure. Figure 6 FIG. 1 is a schematic diagram of an exploded view of a circuit board of a light emitting component provided according to some embodiments of the present disclosure. Figure 5 , Figure 6 and Figure 7 As shown, the circuit board 300 is provided with a first avoidance opening 302 , and the light emitting component is located in the first avoidance opening 302 .

[0061] In some embodiments, the first avoidance opening 302 is located on one side of the circuit board, and its opening is connected to the outside. A signal pin area is provided on the circuit board, and the light emitting component is connected to the signal pin area by wire bonding.

[0062] In some embodiments, the first avoidance opening 302 is located in the middle of the width of the circuit board, and the circuit board is arranged around the first avoidance opening 302 .

[0063] Figure 8 FIG. 1 is a schematic diagram of an exploded view of a light emitting component provided according to some embodiments. Figure 8 As shown, the optical emission component may include: the optical emission component includes an emission housing 410 and an electrical connector 430. A first through hole 4103 is provided on one side wall of the emission housing 410, and an electrical connector 430 is provided on the side wall opposite to the first through hole 4103. An optical emission assembly is provided in the emission housing 410.

[0064] The other side wall of the launch housing 410 may be provided with a first opening 4101 . The electrical connector 430 may be disposed at the first opening 4101 .

[0065] The transmitting housing 410 is provided with a first through hole 4103 , which is in communication with the inner cavity of the transmitting housing 410 , and is connected to the optical fiber adapter 700 .

[0066] Exemplarily, the transmitting shell 410 is a transmitting tube shell, and an optical transmitting assembly is arranged inside, including: a laser array 411, a lens array 412, and an optical multiplexing assembly 413. The laser array 411 emits light of different wavelengths, and each light beam is sequentially processed by a converging lens in the lens array 412, and is converted from a divergent state to a convergent state, and then is combined by the optical multiplexing assembly 413 to combine the light of different wavelengths into one beam of light, which is converted into parallel light after being collimated by a collimating lens in the optical fiber adapter 700, and is emitted from the transmitting shell 410 in the form of parallel light.

[0067] In some embodiments, the housing bottom 4102 of the launch housing 410 is connected to the electrical connector 430 to support the electrical connector 430. In some embodiments, the lower surface of the electrical connector 430 may be higher than the housing bottom 4102.

[0068] Fig. 9 FIG. 1 is a schematic diagram of the structure of an electrical connector provided according to some embodiments. Fig. 9 As shown, the electrical connector 430 may be located at the first opening 4101 .

[0069] The launch shell 410 is provided with a first opening 4101 , and the first through hole 4103 and the first opening 4101 are respectively located on opposite sides of the launch shell.

[0070] In some embodiments, the electrical connector 430 is located at the first opening 4101, and one side of the electrical connector 430 is inserted into the launch shell 410, and the other side is exposed outside the launch shell 410, so that the launch shell 410 and the electrical connector are assembled to form a light emission cavity. The end of the electrical connector 430 located inside the launch shell is connected to the laser array 411 through a gold wire, and the end of the electrical connector 430 located outside the launch shell is connected to the circuit board through a flexible circuit board 320, and the electrical signals, working signals, etc. generated by the circuit board 300 are transferred to the laser array 411 to drive each laser to emit laser beams of different wavelengths. Or the end of the electrical connector 430 located outside the launch shell is connected to the circuit board through wire bonding.

[0071] Fig.10 A partial cross-sectional view of a light emitting component and a circuit board according to some embodiments Figure 1 . Fig.11 A schematic cross-sectional view of a light emitting component connected to a circuit board according to some embodiments Figure 2 .like Fig.10 and Fig.11 As shown, the electrical connector 430 may include: a first connection portion 431 and a second connection portion 432. The second connection portion 432 is located above the first connection portion 431.

[0072] One end of the first connection portion 431 protrudes from the second connection portion 432 . For the purpose of description, the end of the first connection portion 431 protruding from the second connection portion 432 is referred to as a supporting plane 4311 .

[0073] In some embodiments, the first end of the second connection portion 432 is flush with the first end of the first connection portion 431 , and the first end of the second connection portion 432 and the first end of the first connection portion 431 are located inside the launch shell 410 .

[0074] The second end of the second connection portion 432 protrudes from the second end of the first connection portion 431 , and the second end of the second connection portion 432 and the second end of the first connection portion 431 are located outside the launching shell 410 .

[0075] A ground layer 434 is disposed on the upper surface of the second connection portion 432 .

[0076] In some embodiments, a grounding layer 434 is disposed between the first connection portion 431 and the second connection portion 432 . The grounding layer 434 covers the surface of the second connection portion 432 .

[0077] The electrical connector 430 may include a third connection portion 433. The third connection portion 433 is located above the second connection portion 432, and the third connection portion 433 is connected to the first opening 4101. The width of the third connection portion 433 is smaller than the width of the second connection portion 432, so that a portion of the second connection portion 432 is located inside the launch shell 410, and another portion of the second connection portion 432 is located outside the launch shell 410.

[0078] The part of the second connection part 432 located inside the transmitting housing 410 forms an inner connection part 4321. The inner connection part 4321 is electrically connected to the laser array 411. The part of the second connection part 432 located outside the transmitting housing 410 forms an outer connection part 4322. The outer connection part 4322 is electrically connected to the circuit board.

[0079] In some embodiments, the internal connection portion 4321 is provided with a first ground pin, and the first ground pin is electrically connected to the laser array 411 .

[0080] In some embodiments, the first ground pin is wire-bonded to the laser array 411 .

[0081] The first ground pin and the second ground pin may be connected; or the first ground pin and the second ground pin may be a metal wire.

[0082] The external connection portion 4322 may be provided with a second ground pin, and the second ground pin is electrically connected to the circuit board. In some embodiments, the upper surface of the circuit board may be provided with a ground pad, and the second ground pin is connected to the ground pad.

[0083] In some embodiments, a ground pin may be provided on the upper surface of the second connection portion 432, wherein a first end of the ground pin is located inside the transmitting housing 410, and the first end of the ground pin may be electrically connected to the laser array 411. A second end of the ground pin is located outside the transmitting housing 410, and the second end of the ground pin may be electrically connected to a ground pad of a circuit board.

[0084] In some embodiments, the second connection portion 432 may be provided with a ground via 435 . One end of the ground via 435 is connected to the ground pin, and the other end is connected to the ground layer 434 .

[0085] In some embodiments, the ground via 435 may be located at the inner connection portion 4321 , or the ground via 435 may be located at the outer connection portion 4322 ; or the ground via 435 may be located at both the inner connection portion 4321 and the outer connection portion 4322 .

[0086] The second end of the first connection portion 431 protrudes from the second connection portion 432, and the lower surface of the circuit board 300 can be electrically connected to the first connection portion 431. In some embodiments, the second end of the first connection portion 431 is electrically connected to the lower surface of the circuit board 300. A conductive adhesive 330 is disposed between the second end of the first connection portion 431 and the lower surface of the circuit board 300.

[0087] In some embodiments, the thickness of the circuit board body 310 is greater than the thickness of the second connection portion 432 , so the circuit board 300 may include: a first extension portion 320 . The thickness of the first extension portion 320 is less than the thickness of the circuit board body 310 .

[0088] The second end of the first connection portion 431 is connected to the lower surface of the first extension portion 320. The lower surface of the first extension portion 320 is recessed upward so that the thickness of the first extension portion 320 is smaller than the thickness of the circuit board body 310. The second end of the first connection portion 431 is located below the first extension portion 320.

[0089] The second connection portion 432 may abut against a side wall of the first extending portion 320 .

[0090] The upper surface of the second connection portion 432 is flush with the upper surface of the first extension portion 320. A first ground pad may be disposed on the upper surface of the first extension portion 320, and the second end of the ground pin may be electrically connected to the first ground pad.

[0091] A grounding metal layer may be disposed on the lower surface of the first extension portion 320 , and the grounding metal layer may be connected to the grounding layer 434 via a conductive adhesive.

[0092] The first extension portion 320 may include a circuit via 340 , one end of the circuit via 340 may be connected to the first ground pad, and the other end of the circuit via 340 may be connected to the ground metal layer.

[0093] In some embodiments of the present application, the sum of the thickness of the first connection portion 431 and the thickness of the second connection portion 432 is greater than or equal to the thickness of the circuit board body 310 .

[0094] The thickness of the circuit board body may be 0.9 mm to 1.1 mm. The thickness of the second connection portion may be 0.45 mm to 0.55 mm. The thickness of the first connection portion 431 may be 0.6 mm to 1.1 mm.

[0095] The thickness of the first extension portion 320 may be 0.45 mm to 0.55 mm.

[0096] In some embodiments, the thickness of the circuit board body may be greater than or equal to twice the thickness of the second connection portion. The thickness of the circuit board body may be greater than or equal to twice the thickness of the first extension portion 320 .

[0097] In some embodiments of the present application, the ground wire of the laser array is connected to the ground pin of the second connection part by wire bonding, and the ground pin is connected to the ground layer 434 of the first connection part through the ground via 435. The ground layer 434 can be electrically connected to the ground metal layer on the lower surface of the circuit board through the conductive glue 320, and the ground metal layer is connected to the ground pad on the upper surface of the circuit board through the circuit through hole 340, and is connected to the gold finger through the internal wire of the circuit board.

[0098] The signal return path of the laser array can be to return to the ground pin of the second connection part through the ground wire, be conducted to the ground layer 434 through the ground via 435, and then return to the ground pad on the upper surface of the circuit board through the conductive glue 320, the ground metal layer on the lower surface of the circuit board, and the circuit through hole 340.

[0099] In the embodiment of the present application, the electrical connector 430 has a whole-surface grounding layer 434, which increases the area of ​​signal return, is conducive to the ground return of high-speed signals, and improves the signal transmission quality. The vertical distance between the grounding layer 434 and the upper surface of the second connecting portion 432 is less than the thickness of the circuit board body, so that the return path of the high-speed signal is shortened, which is conducive to the ground return of high-speed signals and improves the signal transmission quality.

[0100] In some embodiments, the electrical connector 430 can be connected to a flexible circuit board, and the specific example can be set according to actual needs. For example, the first connecting portion is connected to the first flexible circuit board, the second connecting portion is connected to the second flexible circuit board, the first flexible circuit board is connected to the lower surface of the circuit board, and the second flexible circuit board is connected to the upper surface of the upper road class.

[0101] Since the above embodiments are all described by citing and combining with other embodiments, different embodiments have the same parts, and the same and similar parts between the embodiments in this specification can be referred to each other. No further detailed description is given here.

Claims

1. An optical module, characterized in that: include: A launching shell, a side wall of which one end is provided with a first opening, and an electrical connector is provided at the first opening; A laser is located inside the transmitting housing; Wherein, the electrical connector comprises: A first connecting portion, a first end of which is located inside the launching shell and a second end of which is located outside the launching shell; A second connection portion is located above the first connection portion, wherein the first end of the first connection portion is flush with the first end of the second connection portion; and the second end of the first connection portion protrudes from the first end of the second connection portion; A grounding layer is provided on the upper surface of the first connecting portion, and the grounding layer covers the first connecting portion; The second connecting portion comprises: A ground pin, located on an upper surface of the second connecting portion and electrically connected to the laser; A ground via, one end of which is connected to the ground pin, and the other end of which is connected to the ground layer.

2. The optical module according to claim 1, characterized in that: It comprises a circuit board: the upper surface of the first connecting portion is connected to the lower surface of the circuit board; The second connection portion is electrically connected to the upper surface of the circuit board.

3. The optical module according to claim 2, characterized in that: A ground pad is provided on the upper surface of the circuit board, and the ground pad is connected to the ground pin by wire bonding; A grounding metal layer is provided on the lower surface of the circuit board, and the grounding layer is electrically connected to the grounding metal layer.

4. The optical module according to claim 3, characterized in that: The circuit board comprises: a circuit through hole, one end of which is connected to the ground pad, and the other end of which is connected to the ground metal layer.

5. The optical module according to claim 1, characterized in that: Circuit Board include: Circuit board body; The first extension portion has a thickness smaller than that of the circuit board body; the first connection portion is located below the first extension portion, and one end of the second connection portion abuts against a side wall of the first extension portion.

6. The optical module according to claim 5, characterized in that: The sum of the thickness of the first connecting portion and the thickness of the second connecting portion is greater than or equal to the thickness of the circuit board body.

7. The optical module according to claim 5, characterized in that: The thickness of the circuit board body is greater than or equal to 0.9 mm, and the thickness of the circuit board body is less than or equal to 1.1 mm; the thickness of the second connecting portion is greater than or equal to 0.45 mm, and the thickness of the second connecting portion is less than or equal to 0.55 mm; the thickness of the first connecting portion is greater than or equal to 0.6 mm, and the thickness of the first connecting portion is less than or equal to 1.1 mm.

8. The optical module according to claim 5, characterized in that: include: Conductive adhesive, the conductive adhesive is located between the first connecting portion and the first extending portion; The circuit board comprises: A ground pad, located on the upper surface of the circuit board, the ground pad being connected to the ground pin by wire bonding; The grounding metal layer is located on the lower surface of the circuit board. The grounding layer and the grounding metal layer are electrically connected to the circuit through hole. One end of the circuit through hole is connected to the grounding pad, and the other end is connected to the grounding metal layer.

9. The optical module according to claim 5, characterized in that: The thickness of the circuit board body is greater than or equal to twice the thickness of the second connecting portion.

10. The optical module according to claim 5, characterized in that: The thickness of the circuit board body is greater than or equal to twice the thickness of the first extending portion.

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