Ball mounting and laminating equipment for BGA (Ball Grid Array) chip

Abstract

The utility model discloses ball mounting and laminating equipment for a BGA chip, which comprises a first portal frame, a ball mounting device is mounted on one side of the first portal frame, and a laminating device is further mounted on the other side of the first portal frame; the jig inflow track is arranged below the first portal frame, and a first push-pull mechanism is mounted on the jig inflow track; a jig outflow track is further arranged on one side of the jig inflow track, and a second push-pull mechanism is further installed on the jig outflow track. And the ball shaking platform device is mounted below the ball mounting device and is arranged close to one end of the jig inflow track and one end of the jig outflow track. According to the utility model, the ball mounting process of the BGA chip and the bonding process of the BGA chip are integrated, one-stop ball mounting and bonding work of the BGA chip can be realized, the automation degree is high, and the working efficiency is high.

Description

Technical Field

[0001] The utility model relates to the technical field of BGA chip ball planting, in particular to a BGA chip ball planting and bonding device. Background Art

[0002] In recent years, the electronic information industry has developed rapidly around the world, and electronic information products have become necessities of people's lives. The development of the electronic information industry has brought a lot of convenience to human life. At the same time, with the increasingly accelerated process of intelligence in all walks of life, the demand for chip BGA is also increasing. Due to the complex manufacturing process of the chip itself, different production links of high-end chips are completed by different manufacturers around the world. As long as one of the links is affected, it will not be able to operate normally, and the entire chip manufacturing process will stagnate, resulting in a decline in overall production capacity and a reduction in the supply of chips. However, market demand is still increasing, and this naturally leads to a shortage of chips in the global electronics industry. Therefore, the current market gap for automated intelligent equipment required for each production link is huge, and the technical requirements for equipment in the BGA ball planting process production are also increasing. However, the current BGA ball planting equipment and bonding equipment (bonding the BGA chip with ball planting to the PCB) are separate. After the BGA is planted, it needs to be transferred to the bonding machine manually or by an assembly line. The operation is cumbersome and the work efficiency is low. Therefore, a ball planting and bonding machine integrating ball planting and bonding functions has been developed. Utility Model Content

[0003] The purpose of the utility model is to provide a ball planting and bonding equipment for BGA chips, which integrates the ball planting process of the BGA chip with the bonding process of the BGA chip, and can realize one-stop BGA chip ball planting and bonding work, with high automation and high work efficiency. At the same time, the ball-planted BGA chips and bonded products can be automatically visually inspected, and automatic sorting of good and bad products can be realized, thereby ensuring the accuracy of ball planting and bonding.

[0004] In order to achieve the above purpose, the following technical solutions are adopted:

[0005] A ball-planting and bonding device for a BGA chip, comprising:

[0006] A first gantry, wherein a ball planting device is installed on one side of the first gantry, and a bonding device is also installed on the other side of the first gantry;

[0007] A jig inflow track, the jig inflow track is arranged below the first gantry, and a first push-pull mechanism is installed on the jig inflow track; a jig outflow track is also arranged on one side of the jig inflow track, and a second push-pull mechanism is also installed on the jig outflow track;

[0008] A ball shaking platform device, which is installed below the ball planting device and arranged near one end of the fixture inflow track and the fixture outflow track;

[0009] The first conveying mechanism is installed below the bonding device and arranged close to one side of the fixture outflow track; the first conveying mechanism is at least used to convey the product to be bonded.

[0010] Furthermore, the bonding device includes a bonding Y-axis translation mechanism installed on the first gantry, a bonding X-axis translation mechanism connected to the bonding Y-axis translation mechanism, a bonding Z-axis lifting mechanism connected to the bonding X-axis translation mechanism, a bonding lifting seat connected to the bonding Z-axis lifting mechanism, a bonding R-axis rotation mechanism installed on the bonding lifting seat, and a bonding rotating seat connected to the bonding R-axis rotation mechanism; an electric clamp is also installed at the bottom of the bonding rotating seat, and the electric clamp also drives and connects two bonding claws.

[0011] Furthermore, a laminating upper visual module is installed on the laminating lifting seat; and a plurality of ion fans are installed at the bottom of the first gantry.

[0012] Furthermore, the jig inflow track and the jig outflow track both include two jig transfer racks arranged in parallel and spaced apart, a jig conveyor belt module installed on the two jig transfer racks, and a jig transfer motor for driving the jig conveyor belt module to operate; the first push-pull mechanism and the second push-pull mechanism both include a push-pull translation mechanism arranged between the two jig transfer racks, a push-pull slide plate connected to the push-pull translation mechanism, and a push-pull hook installed on the push-pull slide plate.

[0013] Furthermore, the first transmission mechanism includes two first transmission frames arranged in parallel and spaced apart, a first transmission belt module installed on the two first transmission frames, a spacing adjustment mechanism connected to one of the first transmission frames, and a first transmission motor for driving the first transmission belt module to operate; a first clamping mechanism is also installed on each of the first transmission frames.

[0014] Furthermore, the first clamping mechanism includes a clamping lifting cylinder installed on one side of the first transmission frame, a clamping lifting plate connected to the clamping lifting cylinder, a clamping translation cylinder installed on the other side of the first transmission frame, and a clamping translation plate connected to the clamping translation cylinder; one side of the clamping translation plate extends to the top of the clamping lifting plate.

[0015] Furthermore, a first jig recovery mechanism is arranged between the jig inflow track and the jig outflow track, and a lower bonding vision module is arranged between the jig outflow track and the first transmission mechanism; and an upper ball planting vision module is arranged on the side of the first gantry where the ball planting device is installed.

[0016] Furthermore, a transfer translation mechanism is arranged at one end of the first transmission mechanism, and the transfer translation mechanism is also drivingly connected to a second transmission mechanism; a third transmission mechanism is arranged at one end of the transfer translation mechanism away from the first transmission mechanism.

[0017] Furthermore, the first gantry is provided with a first fixing frame connected to one side of the ball planting device; the first fixing frame is arranged above the transfer translation mechanism; and the patch visual module is also installed on the first fixing frame.

[0018] Furthermore, a defective chip recovery box is arranged on one side of the rocking ball platform device, and a defective chip transfer mechanism is arranged above the defective chip recovery box.

[0019] By adopting the above scheme, the beneficial effects of the utility model are:

[0020] The equipment integrates the BGA chip ball planting process and the BGA chip bonding process into one, which can realize one-stop BGA chip ball planting and bonding work with high automation and high work efficiency. At the same time, it can perform automatic visual inspection on the ball-planted BGA chips and bonded products, realize automatic sorting of good and defective products, and ensure the accuracy of ball planting and bonding. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the structure of the utility model;

[0022] Figure 2 for Figure 1 A schematic diagram of the structure from another perspective;

[0023] Figure 3 It is a structural schematic diagram of the fixture inflow track of the utility model;

[0024] Figure 4 It is a structural schematic diagram of the laminating device of the utility model;

[0025] Figure 5 It is a structural schematic diagram of the first transmission mechanism of the utility model;

[0026] The accompanying drawings illustrate:

[0027] 1. First gantry; 2. Ball planting device; 3. Laminating device; 4. Fixture inflow track; 5. First push-pull mechanism; 6. Fixture outflow track; 7. Second push-pull mechanism; 8. Shaking ball platform device; 9. First transmission mechanism; 11. First fixture recovery mechanism; 12. Laminating lower visual module; 13. Ball planting upper visual module; 14. Transfer translation mechanism; 15. Second transmission mechanism; 16. Third transmission mechanism; 17. SMD upper visual module; 18. Bad chip recovery box ; 19. Defective chip transfer mechanism; 31. Laminating Y-axis translation mechanism; 32. Laminating X-axis translation mechanism; 33. Laminating Z-axis lifting mechanism; 34. Laminating lifting seat; 35. Laminating R-axis rotation mechanism; 36. Electric clamp; 37. Laminating upper visual module; 38. Ion fan; 51. Push-pull translation mechanism; 52. Push-pull slide plate; 53. Push-pull hook; 91. Clamping and lifting cylinder; 92. Clamping and lifting plate; 93. Clamping translation cylinder; 94. Clamping translation plate. DETAILED DESCRIPTION

[0028] The present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0029] Reference Figures 1 to 5 As shown, the utility model provides a BGA chip ball bonding device, in one embodiment, including

[0030] A first gantry 1, wherein a ball planting device 2 is installed on one side of the first gantry 1, and a bonding device 3 is also installed on the other side of the first gantry 1;

[0031] A jig inflow track 4, which is arranged below the first gantry 1, and a first push-pull mechanism 5 is installed on the jig inflow track 4; a jig outflow track 6 is also arranged on one side of the jig inflow track 4, and a second push-pull mechanism 7 is also installed on the jig outflow track 6;

[0032] A ball shaking platform device 8, wherein the ball shaking platform device 8 is installed below the ball planting device 2 and is arranged near one end of the fixture inflow track 4 and the fixture outflow track 6;

[0033] The first conveying mechanism 9 is installed below the bonding device 3 and arranged close to one side of the fixture outflow track 6; the first conveying mechanism 9 is at least used to convey the product to be bonded.

[0034] Continue to refer to Figures 1 to 5As shown, in this embodiment, the jig inflow track 4 is used to connect the jig carrying the BGA chip (the BAG chip has been printed with solder paste), and the first transmission mechanism 9 is used to connect the product to be bonded, that is, the PCB board; then, the jig inflow track 4 will transfer the jig carrying the BGA chip to one end close to the shaking ball platform device 8, and the first push-pull mechanism 5 will push the jig onto the shaking ball platform device 8; then, the shaking ball platform device 8 will move the jig to the bottom of the ball planting device 2, and the ball planting device 2 will plant the BGA chip on the jig. After the ball planting is completed, the shaking ball platform device 8 will move the jig to the bottom of the ball planting device 2. The ball platform device 8 then moves the jig to one end of the jig outflow track 6; then, the second push-pull mechanism 7 pulls the jig from the rocking ball platform device 8 to the jig outflow track 6, and the jig outflow track 6 then moves the jig to the bottom of the bonding device 3 and clamps the jig. At this time, the first transmission mechanism 9 connects the PCB board to be bonded and clamps it; then, the bonding device 3 transfers the BGA chip in the jig and bonds it to the PCB board. After the bonding is completed, the first transmission mechanism 9 transfers the bonded PCB board to the next process.

[0035] In this embodiment, the ball planting device 2 and the ball shaking platform device 8 directly adopt existing devices. At the same time, a first jig recovery mechanism 11 is arranged between the jig inflow track 4 and the jig outflow track 6, and a lower fitting visual module 12 is arranged between the jig outflow track 6 and the first transmission mechanism 9; a ball planting upper visual module 13 is also arranged on the side of the first gantry 1 where the ball planting device 2 is installed. The upper ball planting visual module 13 includes a camera and a light source, which is used to identify BGA chip ball planting defects, such as multiple balls, fewer balls and ball deviation, as well as to identify the QR code information of the BGA chip and bind the information output. The first fixture recovery mechanism 11 adopts the structural structure of a palletizer, which is used to recover NG fixtures (fixtures for placing unqualified BGA chips after ball planting) and NG BGA chips (after ball planting, for BGA chips that fail to pass the test, the bonding device 3 can transfer them to the first fixture recovery mechanism 11 and bond the qualified BGA chips to the PCB board). The lower bonding visual module 12 includes a camera and a light source to realize the bonding guiding function of the bonding device 3.

[0036] In addition, a transfer translation mechanism 14 is also arranged at one end of the first transmission mechanism 9, and the transfer translation mechanism 14 is also driven and connected to a second transmission mechanism 15; a third transmission mechanism 16 is also arranged at one end of the transfer translation mechanism 14 away from the first transmission mechanism 9. The structure and principle of the second transmission mechanism 15 and the third transmission mechanism 16 are similar to those of the first transmission mechanism 9. The following description of the working principle of the first transmission mechanism 9 can be referred to, and no further description is given here. The transfer translation mechanism 14 can directly adopt a linear motor module; at the same time, the first gantry 1 is provided with a side of the ball planting device 2 and is also connected to a first fixed frame; the first fixed frame is arranged above the transfer translation mechanism 14; the first fixed frame is also installed with a patch visual module 17. The visual module 17 on the patch includes a 3D line scan camera and a patch detection camera. After the PCB board is bonded, the first transmission mechanism 9 can transfer the bonded PCB board to the second transmission mechanism 15. Then, the transfer translation mechanism 14 drives the second transmission mechanism 15 to move, so that the PCB board passes under the 3D line scan camera and the patch detection camera respectively, to perform 3D line scan identification of overlapping balls and large and small ball defects, and patch deviation defect detection. After the inspection is completed, the second transmission mechanism 15 moves to the third transmission mechanism 16 and docks with the third transmission mechanism 16. Subsequently, the second transmission mechanism 15 transfers the PCB board to the third transmission mechanism 16.

[0037] Meanwhile, a bad chip recovery box 18 is arranged on one side of the ball shaking platform device 8, and a bad chip transfer mechanism 19 is arranged above the bad chip recovery box 18. The bad chip transfer mechanism 19 includes a manipulator, which can transfer the unqualified PCB board to the bad chip recovery box 18 for recycling, and at the same time, the third transmission mechanism 16 will transfer the qualified PCB board to the next process.

[0038] In one embodiment, the bonding device 3 includes a bonding Y-axis translation mechanism 31 installed on the first gantry 1, a bonding X-axis translation mechanism 32 connected to the bonding Y-axis translation mechanism 31, a bonding Z-axis lifting mechanism 33 connected to the bonding X-axis translation mechanism 32, a bonding lifting seat 34 connected to the bonding Z-axis lifting mechanism 33, a bonding R-axis rotation mechanism 35 installed on the bonding lifting seat 34, and a bonding rotating seat connected to the bonding R-axis rotation mechanism 35; an electric clamp 36 is also installed at the bottom of the bonding rotating seat, and the electric clamp 36 also drives and connects two bonding claws. In this embodiment, the Y-axis translation mechanism 31, the X-axis translation mechanism 32 and the Z-axis lifting mechanism 33 all directly use linear motor modules, and the R-axis rotation mechanism 35 includes a rotary motor. With the cooperation of the above devices, the laminating claws can be driven to perform translation, lifting and rotation movements, so that the electric clamping claws 36 drive the laminating claws to clamp or laminating the BGA chip. The laminating lifting seat 34 is also equipped with a laminating upper visual module 37; and the bottom of the first gantry 1 is also equipped with a number of ion fans 38. The laminating upper visual module 37 includes a camera and a light source, and can cooperate with the laminating lower visual module 12 to guide the laminating device 3 to laminating the BGA chip. At the same time, the ion fan 38 can remove static electricity.

[0039] In one embodiment, the jig inflow track 4 and the jig outflow track 6 both include two jig transmission racks arranged in parallel and spaced apart, a jig transmission belt module installed on the two jig transmission racks, and a jig transmission motor for driving the jig transmission belt module to operate; the first push-pull mechanism 5 and the second push-pull mechanism 7 both include a push-pull translation mechanism 51 arranged between the two jig transmission racks, a push-pull slide plate 52 connected to the push-pull translation mechanism 51, and a push-pull hook 53 installed on the push-pull slide plate 52. The push-pull translation mechanism 51 includes a linear motor module, which can drive the push-pull slide plate 52 to move, so that the push-pull hook 53 pushes and pulls the jig; meanwhile, the first transmission mechanism 9 includes two first transmission racks arranged in parallel and spaced apart, a first transmission belt module installed on the two first transmission racks, a spacing adjustment mechanism connected to one of the first transmission racks, and a first transmission motor for driving the first transmission belt module to operate; each of the first transmission racks is also equipped with a first clamping mechanism. The spacing adjustment mechanism adopts the transmission mode of the motor screw rod, which can drive the first transmission frame to move, and then adjust the spacing between the two first transmission frames to adapt to the transmission of PCB boards of different sizes and types.

[0040] In addition, the first clamping mechanism includes a clamping and lifting cylinder 91 installed on one side of the first transmission frame, a clamping and lifting plate 92 connected to the clamping and lifting cylinder 91, a clamping and translating cylinder 93 installed on the other side of the first transmission frame, and a clamping and translating plate 94 connected to the clamping and translating cylinder 93; one side of the clamping and translating plate 94 extends to the top of the clamping and lifting plate 92. After the PCB board is transferred to the right position, the clamping and lifting cylinder 91 drives the clamping and lifting plate 92 to rise to lift the PCB board, and at the same time, the clamping and translating cylinder 93 drives the clamping and translating plate 94 to move to the top of the PCB board, thereby clamping and fixing the PCB board so that the bonding device 3 can bond the BGA chip.

[0041] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A ball-planting and bonding device for a BGA chip, characterized in that: include A first gantry, wherein a ball planting device is installed on one side of the first gantry, and a bonding device is also installed on the other side of the first gantry; A jig inflow track, the jig inflow track is arranged below the first gantry, and a first push-pull mechanism is installed on the jig inflow track; a jig outflow track is also arranged on one side of the jig inflow track, and a second push-pull mechanism is also installed on the jig outflow track; A ball shaking platform device, which is installed below the ball planting device and arranged near one end of the fixture inflow track and the fixture outflow track; The first conveying mechanism is installed below the bonding device and arranged close to one side of the fixture outflow track; the first conveying mechanism is at least used to convey the product to be bonded.

2. The BGA chip ball implanting and bonding equipment according to claim 1, characterized in that: The bonding device includes a bonding Y-axis translation mechanism installed on the first gantry, a bonding X-axis translation mechanism connected to the bonding Y-axis translation mechanism, a bonding Z-axis lifting mechanism connected to the bonding X-axis translation mechanism, a bonding lifting seat connected to the bonding Z-axis lifting mechanism, a bonding R-axis rotation mechanism installed on the bonding lifting seat, and a bonding rotating seat connected to the bonding R-axis rotation mechanism; an electric clamp is also installed at the bottom of the bonding rotating seat, and the electric clamp also drives and connects two bonding claws.

3. The BGA chip ball implanting and bonding equipment according to claim 2, characterized in that: A laminating upper visual module is also installed on the laminating lifting seat; and a plurality of ion fans are also installed at the bottom of the first gantry.

4. The BGA chip ball implantation and bonding equipment according to claim 1, characterized in that: The jig inflow track and the jig outflow track both include two jig transmission racks arranged in parallel and spaced apart, a jig transmission belt module installed on the two jig transmission racks, and a jig transmission motor for driving the jig transmission belt module to operate; the first push-pull mechanism and the second push-pull mechanism both include a push-pull translation mechanism arranged between the two jig transmission racks, a push-pull slide plate connected to the push-pull translation mechanism, and a push-pull hook installed on the push-pull slide plate.

5. The BGA chip ball implanting and bonding equipment according to claim 1, characterized in that: The first transmission mechanism includes two first transmission frames arranged in parallel and spaced apart, a first transmission belt module installed on the two first transmission frames, a spacing adjustment mechanism connected to one of the first transmission frames, and a first transmission motor for driving the first transmission belt module to operate; a first clamping mechanism is also installed on each of the first transmission frames.

6. The BGA chip ball implanting and bonding equipment according to claim 5, characterized in that: The first clamping mechanism includes a clamping lifting cylinder installed on one side of the first transmission frame, a clamping lifting plate connected to the clamping lifting cylinder, a clamping translation cylinder installed on the other side of the first transmission frame, and a clamping translation plate connected to the clamping translation cylinder; one side of the clamping translation plate extends to the top of the clamping lifting plate.

7. The BGA chip ball implanting and bonding equipment according to claim 1, characterized in that: A first jig recovery mechanism is arranged between the jig inflow track and the jig outflow track, and a lower bonding vision module is arranged between the jig outflow track and the first transmission mechanism; and an upper ball planting vision module is arranged on the side of the first gantry where the ball planting device is installed.

8. The BGA chip ball implantation and bonding equipment according to claim 1, characterized in that: A transfer translation mechanism is also arranged at one end of the first transmission mechanism, and the transfer translation mechanism is also drivingly connected to a second transmission mechanism; a third transmission mechanism is also arranged at one end of the transfer translation mechanism away from the first transmission mechanism.

9. The BGA chip ball implantation and bonding equipment according to claim 8, characterized in that: The first gantry frame is provided with a first fixing frame connected to one side of the ball planting device; the first fixing frame is arranged above the transfer translation mechanism; and the patch visual module is also installed on the first fixing frame.

10. The BGA chip ball implantation and bonding equipment according to claim 1, characterized in that: A bad chip recovery box is arranged on one side of the rocking ball platform device, and a bad chip transfer mechanism is arranged above the bad chip recovery box.

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