Loading machine for manufacturing single-line NTC temperature sensor
By designing a chip-loading machine that includes vibrating devices, vibrating disk conveying tracks, rotating shafts and chip adsorption blocks, the problem of inefficient working efficiency of the existing chip loading mechanism is solved, and the automation and production efficiency of chip-loading is improved.
Patent Information
- Application Number
- CN202421361576.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-14
- Publication Date
- 2025-04-15
- Estimated Expiration
- 2034-06-14
AI Technical Summary
The existing chip loading mechanism is inefficient and has cumbersome steps, which cannot effectively improve the production efficiency of single-line NTC temperature sensors.
A chip-up machine including a vibrating device, a vibrating disk conveying track, a rotating shaft, a chip adsorption block and a lifting push plate is designed. The chip is automatically transmitted through the vibrating disk conveying track, and the automatic adsorption and chip-up operation of the chip is realized using the rotating shaft and the chip adsorption block.
It improves chip absorption efficiency, simplifies operation steps, realizes chip-on-chip automation, and significantly improves the production efficiency of single-line NTC temperature sensors.
Smart Images

Figure CN222757310U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of manufacturing single-line NTC temperature sensors by automated equipment, in particular to a chip loading machine used for manufacturing single-line NTC temperature sensors. Background Art
[0002] NTC temperature sensor is a thermistor whose resistance value decreases rapidly as the temperature rises. By using this characteristic, the NTC thermistor can be used to determine the corresponding temperature by measuring its resistance value, thereby achieving the purpose of detecting and controlling temperature.
[0003] In the process steps of making a single-wire NTC temperature sensor, it is necessary to clamp the chip between two cables. In the prior art, for example, a Chinese utility model patent with authorization announcement number: CN219520785U discloses a chip welding machine, in which a chip loading mechanism and a chip loading mechanism are used. The chip is placed on the loading mechanism through the chip loading mechanism, and the loading mechanism clamps the chip to complete the chip loading operation. The device realizes the automatic operation of chip loading, and solves the problem that the traditional chip loading operation requires pure manual operation. However, the chip suction component of the chip loading mechanism can only absorb two chips at a time and needs to absorb ten times continuously to fill the chip points of the chip flip component. At the same time, after the chip flip component is full of chips, the chip pushing component still needs to push the chip into the chip flip component to continue the next step of chip loading operation, so the device is in urgent need of improvement to make it more reasonable. Utility Model Content
[0004] In view of the above problems: the chip loading mechanism has low working efficiency and complicated working steps.
[0005] The utility model provides a chip loading machine for the production of a single-line NTC temperature sensor, characterized in that it includes a work surface, a vibration device and a vibration disk conveying track, the vibration device is fixed to the work surface, the vibration device is connected to the vibration disk conveying track, and the vibration disk conveying track is divided into a conveying end and a loading end; it also includes a rotating shaft, a chip adsorption block and a lifting and pushing plate, the lifting and pushing plate is provided with two raised vertical plates, the vertical plates are connected to the two ends of the rotating shaft, the rotating shaft coaxially fixes the chip adsorption block, and a chip suction nozzle is provided on a side of the chip adsorption block away from the rotating shaft, and the chip suction nozzle adsorbs the chip at the loading end.
[0006] As an improvement of the utility model, the vibration device includes a direct vibration controller, a direct vibration block and a vibration disk connecting plate, and the direct vibration controller is electrically connected to the direct vibration block.
[0007] As an improvement of the utility model, the vibration plate conveying track includes a chip baffle and a straight vibration rear baffle, the chip baffle is installed in the middle part of the surface of the vibration plate conveying track and divides the vibration plate conveying track into a conveying end and a loading end, a groove track is arranged on the surface of the conveying end, the straight vibration rear baffle is installed at one end of the conveying end away from the chip baffle, and the loading end is also provided with a groove track and connected to the groove track of the conveying end.
[0008] As an improvement of the utility model, it also includes a direct vibration damping base plate and a direct vibration connecting plate. The direct vibration damping base plate is fixed to the work surface, and the direct vibration connecting plates are arranged at both ends of the direct vibration damping base plate, and the direct vibration connecting plates connect the two ends of the direct vibration block.
[0009] As an improvement of the utility model, it also includes a rotating motor, and the rotating motor is connected to the rotating shaft.
[0010] As an improvement of the utility model, it also includes a lifting electric cylinder and a lifting slide, the lifting electric cylinder is connected to the lifting slide, and the lifting slide fixes the rotating motor at one end close to the rotating shaft.
[0011] As an improvement of the utility model, it also includes a screw rod, a screw rod nut, a screw rod fixing seat and a screw rod supporting seat. The screw rod nut is movably sleeved on the screw rod, and the two ends of the screw rod are respectively fixed to the screw rod fixing seat and the screw rod supporting seat. The screw rod fixing seat and the screw rod supporting seat are fixed to the work table, and the screw rod nut fixes the lifting electric cylinder.
[0012] As an improvement of the utility model, it further comprises a working machine top plate, wherein a cavity for placing the insert is arranged in the middle of the working machine top plate, and the working machine top plate is fixed to the working table surface through a vertical plate.
[0013] As an improvement of the utility model, it also includes a driving electric cylinder, a slide and an insert clamp, which exist in pairs and are installed in a mirror-symmetrical position relationship. One side of the driving electric cylinder is fixed to the top plate of the working machine, and the other side is connected to the slide. One end of the slide is fixed with the insert clamp distributed in a clamping tendency.
[0014] The beneficial effect of the utility model is that compared with the prior art, the chip loading machine provided by the utility model for the production of single-line NTC temperature sensors can transmit the chips to be assembled through the vibration plate conveying track and be adsorbed by the suction nozzle of the chip adsorption block. The suction nozzle of the chip adsorption block can adsorb a large number of chips at one time, and then drive the chip adsorption block through the rotating shaft to rotate the chip to the position where the chip clamp is clamped to complete the chip loading operation. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is an overall diagram of the utility model.
[0016] Figure 2 It is a three-dimensional diagram of the film loading machine of the present utility model.
[0017] Figure 3 It is a three-dimensional diagram of the linear movable module of the utility model.
[0018] Figure 4 It is a three-dimensional diagram of the lifting module of the utility model.
[0019] Figure 5 It is a three-dimensional diagram of the rotating module of the utility model.
[0020] Figure 6 It is a three-dimensional diagram of the clamp module of the present utility model.
[0021] Figure 7 It is a three-dimensional diagram of the feeding mechanism of the present utility model.
[0022] Figure 8 It is an exploded view of the feeding mechanism of the utility model. DETAILED DESCRIPTION
[0023] In order to more clearly illustrate the present invention, the present invention is further described below in conjunction with the accompanying drawings.
[0024] See also Figures 1 to 8 The utility model is a chip loading machine for the production of single-line NTC temperature sensors, including a work surface 7, a vibration device and a vibration plate conveying track 56, wherein the vibration device 5 is fixed to the work surface 7, the vibration device is connected to the vibration plate conveying track 56, and the vibration plate conveying track 56 is divided into a conveying end and a loading end; it also includes a rotating shaft 33, a chip adsorption block 34 and a lifting push plate 24, wherein the lifting push plate 24 is provided with two raised vertical plates 35, wherein the vertical plates 35 are connected to the two ends of the rotating shaft 33, the rotating shaft 33 is coaxially fixed with the chip adsorption block 34, and a chip suction nozzle is provided on a side of the chip adsorption block 34 away from the rotating shaft 33, and the chip suction nozzle adsorbs the chip at the loading end.
[0025] See also Figure 5 In order to automatically absorb the chip and rotate the chip to the fixture position, in this embodiment, a rotating module 3 is included, which is composed of a rotating motor 31, a motor mounting plate 32, a rotating shaft 33, a column 35, a bearing 36, a receiving tray 37 and a rotating motor sensor 38;
[0026] The chip adsorption block 34 is coaxially fixed to the rotating shaft 33, and the rotating shaft 33 is connected to the rotating motor 31. The rotating motor 31 controls the rotation of the rotating shaft 33 to drive the chip adsorption block 34, so that the chip adsorption block 34 can perform chip adsorption and chip loading operations at different angles. The rotating motor 31 is fixed to the motor mounting plate 32, and the motor mounting plate 32 is fixed to one end of the lifting and pushing plate 24. The other end of the lifting and pushing plate 24 is provided with a rotating motor sensor 38 for sensing the rotation angle of the rotating shaft 33; at the same time, both ends of the rotating shaft 33 are fixed with bearings 36, and the bearings 36 are installed on the column 35, and the column 35 is fixed to the side of the lifting and pushing plate 24 close to the rotating shaft 33;
[0027] The receiving tray 37 is installed on the surface of the lifting push plate 24 close to the rotating shaft 33 to catch the chips dropped from the chip adsorption block 34 to prevent the dropped chips from affecting the operation of the working device.
[0028] See also Figure 4 In order to enable the above-mentioned rotating module 3 to complete the chip suction and chip loading operations at different heights, in this embodiment, it includes a lifting module 2 composed of a chip inserting plate 21, a lifting electric cylinder 23, a lifting slide 22, an upper limit block 252, a limit block 253 and a lower limit block 251;
[0029] A lifting push plate 24 is fixed to one end of the lifting slide 23 close to the rotating module 2. The lifting slide 23 is connected to one side of the lifting electric cylinder 22. The other side of the lifting electric cylinder 22 is fixed to the inserting plate 21. The lifting slide 23 is driven by the lifting electric cylinder 22 to drive the lifting movement of the rotating module 3, so as to complete the chip absorption at a certain height, and rotate the chip into the fixture at another height to complete the chip loading operation.
[0030] At the same time, an upper limit block 252 is installed on the side parallel to the sliding direction of the lifting cylinder 22 and the lifting slide 23, and a limit block 253 is installed on the side of the lifting slide 23 on the same side as the upper limit block 252. When the lifting slide 23 rises, the limit block 253 touches the upper limit block 252, thereby limiting the upward movement of the lifting slide 23 and preventing the lifting slide 23 from separating from the lifting cylinder 22. Similarly, a lower limit block 251 is installed on the side perpendicular to the sliding direction of the lifting cylinder 22 and the lifting slide 23. When the lifting slide 23 descends, one end of the lifting slide 23 touches the lower limit block 251, thereby limiting the downward movement of the lifting slide 23 and preventing the lifting slide 23 from separating from the lifting cylinder 22.
[0031] See also Figure 3In order to achieve the above-mentioned lifting module 2 and rotating module 3 cooperating with each other at different horizontal distances and completing the chip suction and chip loading operations, in this embodiment, a linear sliding module 1 is included, which is composed of a screw, a screw fixing seat, a screw support seat, a screw nut, a screw transmission plate, a insert bottom plate, a first linear slider, a second linear slider, a first guide rail, a second guide rail, a stepping motor, an origin sensor sheet and an origin sensor;
[0032] One side of the insert bottom plate 18 is fixed to one end of the insert vertical plate 21 away from the rotating module 3, and the other side is fixed with a screw transmission plate 17, which is fixed to a screw nut 16, which is movably sleeved on a screw 13, which is connected to a stepper motor 11, and a screw fixing seat 12 is installed at one end of the screw 13 connected to the stepper motor 11 to fix the position of the screw 13, and a screw support seat 14 is installed at the other end to keep the screw 13 parallel to the work table 7, and the screw fixing seat 12 and the screw support seat 14 are both fixed to the work table 7, and the stepper motor 11 rotates the screw 13 to make the screw nut 16 reciprocate on the screw 13, thereby driving the lifting module 2 and the rotating module 3 to achieve linear sliding;
[0033] The first linear slider 191 and the second linear slider 192 are respectively fixed to the two ends of the side of the insert plate 18 away from the insert plate vertical plate 21. The first linear slider 191 is connected to the first guide rail 151, and the second linear slider 192 is connected to the second guide rail 152. The first guide rail 151 and the second guide rail 152 are both fixed on the work surface 7.
[0034] An origin sensing sheet 101 is also installed on the side of the insert base plate 18 parallel to its sliding direction. The origin sensing sheet 101 moves along with the movement of the insert base plate 18. The origin sensor 102 is installed on the work table 7. The origin sensing sheet 101 stops sliding when it moves to the origin sensor 102. An upper limit block 10 is installed on the side of the insert base plate 18 close to the screw fixing seat 12. When the screw nut 16 drives the insert base plate 18 to slide toward the screw fixing seat 12, the upper limit block 10 contacts the screw fixing seat 12, thereby limiting the sliding of the insert base plate 18 in this direction.
[0035] See also Figure 6 In order to complete the chip loading operation of the rotating module 3, in this embodiment, it also includes a fixture module 4 composed of a driving electric cylinder 41, a slide 42, a chip inserting fixture 43, an upper limit block 44, a limit block 45 and a lower limit block 46;
[0036] The fixture modules 4 are installed in pairs at mirror-symmetrical positions, and are divided into a left fixture module and a right fixture module. One side of the driving electric cylinder 41 is fixed to the top plate 8 of the working machine, and the other side is connected to the slide 42. The slide 421 of the left fixture module is close to the end of the slide 422 of the right fixture module. The insert fixture 431 is installed. Similarly, the slide 422 of the right fixture module is also installed with an insert fixture 432.
[0037] An upper limit block 44 is installed on the side of the driving electric cylinder 41 parallel to the sliding direction of the slide 42, and a limit block 45 is installed on the side of the slide 42 on the same side as the upper limit block 44. The limit block 45 abuts against the upper limit block 44 as the slide 42 slides, thereby limiting the slide 42 from sliding in this direction. A lower limit block 46 is installed on the side of the driving electric cylinder 41 perpendicular to the sliding direction of the slide 42. The slide 42 slides and touches the lower limit block 46, thereby limiting the slide 42 from sliding in this direction.
[0038] When performing chip loading operation, the inserting clamps 431 and 432 of the left clamp module and the right clamp module install the inserting clamps, and then the driving motors 411 and 412 drive the inserting clamps 431 and 432 to move in conjunction, and the chip is clamped with the inserting clamps to complete the chip loading operation.
[0039] See also Figure 7 and Figure 8 In order to enable the chip to be smoothly transferred to the position to be absorbed by the chip adsorption block 34, in this embodiment, it also includes a feeding mechanism 5 consisting of a direct vibration block 54, a vibration plate connecting plate 55, a vibration plate conveying track 56, a direct vibration controller 51, a direct vibration damping bottom plate 52, a direct vibration connecting piece 53, a chip stop bar 562 and a direct vibration rear stop bar 561;
[0040] The vibration plate conveying track 56 includes a chip baffle 562 and a straight vibration rear baffle 561. The chip baffle 562 is installed in the middle of the vibration plate conveying track 56, dividing the vibration plate conveying track 56 into a conveying end and a loading end. The straight vibration rear baffle 561 is installed at the end of the conveying end away from the chip baffle 562 to prevent chips from falling. At the same time, a groove track of the size of the chip is set on the surface of the conveying end, and a groove track of the same size connected to the conveying end is also set at the loading end.
[0041] The direct vibration controller 51 and the direct vibration damping base plate 52 are both fixed to the work surface 7, and direct vibration connecting plates 53 are installed at both ends of the direct vibration damping base plate 52, and the direct vibration connecting plates 53 connect the two ends of the direct vibration block 54;
[0042] When the chip is transmitted, the chip is placed on the conveying end of the vibration plate conveying track 56. Under the vibration of the straight vibration block 54, the chip falls into the groove track at the conveying end. The chip that does not fall into the groove track is blocked by the chip blocking bar 562 until it falls into the groove track after vibration. The chip that falls into the groove track is transmitted to the loading end, and the chip at the loading end is adsorbed by the chip suction nozzle 34, thereby completing the chip transmission work.
[0043] When in use, two pieces of inserts that have been formed by the forming machine are respectively placed in the insert clamps 431 and 432 of the left clamp module and the right clamp module, and the chip is placed in the vibration plate conveying track 56. Then, the device start button is pressed, and the linear sliding module 1 drives the chip adsorption block 34 of the rotating module 3 to move to the feeding end of the vibration plate conveying track 56 of the feeding mechanism 5. Then, the chip adsorption block 34 of the rotating module 3 uses vacuum negative pressure to adsorb the chip. After the chip is absorbed, the linear sliding module 1 drives the rotating module 3 to move to the position where the clamp module 4 is placed for chip loading, and the rotating motor 3 is rotated. 1 Rotate the rotating shaft 33 to drive the chip adsorption block 34 to rotate, rotate the chip to the position to be loaded, and then the lifting module 2 drives the rotating module 3 to move upward to lift the chip on the chip adsorption block 34 to the middle of the insert clamp, and then the left clamp module and the right clamp module perform a clamping movement to clamp the chip between the two wires to complete the mold closing. The chip adsorption block 34 is equipped with 32 suction nozzles, which can complete 32 sets of wire clamps at a time. After the loading is completed, all modules return to the initial position, and the loading action is completed. Then take out the fixture that has completed the loading, and then proceed to the next step of tinning.
[0044] The advantages of the utility model are:
[0045] 1) The chip adsorption block is equipped with 32 chip adsorption ports, which can use vacuum negative pressure to adsorb chips and can adsorb 32 groups of chips at the same time, thus improving the chip absorption efficiency.
[0046] 2) The chip adsorption block is fixed on the rotating shaft, and the rotating shaft can drive the chip adsorption block to place the chip directly on the chip loading position. The steps are simple and the operation is efficient.
[0047] 3) A straight vibration block and a vibration plate conveying track are set in the feeding mechanism. The vibration plate conveying track can be used in conjunction with the chip adsorption block to automate the chip grabbing and improve the efficiency of chip picking.
[0048] The above disclosures are only several specific embodiments of the present invention, but the present invention is not limited thereto, and any changes that can be conceived by those skilled in the art should fall within the protection scope of the present invention.
Claims
1. A chip loading machine for manufacturing single-wire NTC temperature sensors, characterized in that: It includes a work surface, a vibration device and a vibration plate conveying track, wherein the vibration device is fixed to the work surface, the vibration device is connected to the vibration plate conveying track, and the vibration plate conveying track is formed into a conveying end and a loading end; it also includes a rotating shaft, a chip adsorption block and a lifting push plate, the lifting push plate is provided with two raised vertical plates, the two ends of the rotating shaft of the rotating shaft are respectively rotatably connected to the two raised vertical plates, the cylindrical surface of the rotating shaft is fixedly connected with the chip adsorption block, and the chip adsorption block is provided with a chip suction nozzle on a side away from the rotating shaft, and the chip suction nozzle is used to adsorb the chip at the loading end.
2. The chip loading machine for manufacturing a single-wire NTC temperature sensor according to claim 1, characterized in that: The vibration plate conveying track includes a chip baffle and a straight vibration rear baffle. The chip baffle is installed in the middle part of the surface of the vibration plate conveying track and divides the vibration plate conveying track into a conveying end and a loading end. A groove track is arranged on the surface of the conveying end. The straight vibration rear baffle is installed at the end of the conveying end away from the chip baffle. The loading end is also provided with a groove track and is connected to the groove track of the conveying end.
3. The chip loading machine for manufacturing a single-wire NTC temperature sensor according to claim 2, characterized in that: The vibration device comprises a direct vibration controller, a direct vibration block and a vibration disk connecting plate, and the direct vibration controller is electrically connected to the direct vibration block.
4. The chip loading machine for manufacturing a single-wire NTC temperature sensor according to claim 3, characterized in that: It also includes a direct vibration damping base plate and a direct vibration connecting piece. The direct vibration connecting pieces are installed at both ends of the direct vibration damping base plate. The direct vibration connecting pieces connect the two ends of the direct vibration block. The direct vibration damping base plate is fixed to the work surface.
5. The chip loading machine for manufacturing a single-wire NTC temperature sensor according to claim 1, characterized in that: It also includes a rotating motor, wherein the output end of the rotating motor is connected to the rotating shaft.
6. The chip loading machine for manufacturing a single-wire NTC temperature sensor according to claim 5, characterized in that: It also includes a lifting electric cylinder and a lifting slide, wherein the lifting slide is attached to the surface of the lifting electric cylinder, and the lifting slide fixes the rotating motor at one end close to the rotating shaft.
7. The chip loading machine for manufacturing a single-wire NTC temperature sensor according to claim 6, characterized in that: It also includes a screw rod and a screw rod nut. The screw rod nut is movably sleeved on the screw rod. The screw rod is installed on the work table through a fixing seat. The screw rod nut fixes one end of the lifting cylinder away from the rotating shaft.
8. The chip loading machine for manufacturing a single-wire NTC temperature sensor according to claim 1, characterized in that: It also includes a working machine top plate, a cavity for placing the insert is arranged in the middle of the working machine top plate, and the working machine top plate is fixed to the working table surface through a vertical plate.
9. The chip loading machine for manufacturing a single-wire NTC temperature sensor according to claim 8, characterized in that: It also includes a driving electric cylinder, a slide and an insert clamp, one side of the driving electric cylinder is fixed to the top plate of the working machine, and the other side is connected to the slide, one end of the slide is fixed to the insert clamp, the driving electric cylinder, slide and insert clamp exist in pairs, and the end of the insert clamp away from the slide is used as a mirror surface, and they are installed in a mirror-symmetrical position.
Citation Information
Patent Citations
Automatic chip welding machine
CN219520785U