Display module and display device

Abstract

The utility model provides a display module and a display device. The display module comprises a panel and a chip on film arranged on one side of the panel, a first pin is arranged on the side, close to the chip on film, of the panel, a second pin is arranged on the side, close to the panel, of the chip on film, the first pin and the second pin are electrically connected, a cutting edge is formed on the side face of the panel, and the second pin comprises an exposed area extending out of the first pin; the cutting edge is provided with a first insulation protection layer, and the first insulation protection layer wraps the whole cutting edge. And / or, the surface, facing the panel, of the exposed area is provided with a second insulation protection layer, and the orthographic projection of the second insulation protection layer on the panel at least covers the surface, facing the chip on film, of the cutting edge. According to the display module, through the arrangement of the insulating protection layer, the problem of short circuit caused by lap joint of carbonized foreign matter chippings generated after panel cutting and the chip-on-film is reliably avoided, and then the quality and the yield of the display module are improved.

Description

Technical Field

[0001] The utility model generally relates to the field of display technology, and specifically relates to a display module and a display device. Background Art

[0002] In the production process of display devices, the chip-on-film (COF) bonding process is an important link in the display module stage production. In the COF bonding process, the COF needs to be contacted with the binding contact pattern of the display panel. However, in order to achieve high resolution, medium and large size and high-quality image for vehicles, the line width (pitch) of the COF needs to be continuously reduced. However, due to the overlap between the carbonized debris in the heat-affected zone (carbonized zone) and the COF Pin after the Pad Cut (terminal area cutting) process, a short circuit problem occurs, resulting in a high defect loss rate such as dark lines. Utility Model Content

[0003] In view of the above-mentioned defects or deficiencies in the prior art, it is desired to provide a display module and a display device, which avoids the short circuit problem caused by the overlapping of the cutting edge and the pins of the cover chip film by setting a first insulating protective layer and / or a second insulating protective layer, thereby improving the quality and yield of the display module.

[0004] In a first aspect, the utility model provides a display module, comprising a panel and a chip-on-chip film disposed on one side of the panel, a first pin is disposed on a side of the panel close to the chip-on-chip film, a second pin is disposed on a side of the chip-on-chip film close to the panel, the first pin is electrically connected to the second pin, a cutting edge is formed on a side of the panel, and the second pin includes an exposed area extending out of the first pin;

[0005] The cutting edge is provided with a first insulating protective layer, and the first insulating protective layer covers the entire cutting edge;

[0006] And / or, a second insulating protective layer is provided on the surface of the exposed area facing the panel, and the orthographic projection of the second insulating protective layer on the panel at least covers the surface of the cutting edge facing the chip-on-film.

[0007] As an optional solution, the thickness of the first insulating protection layer is greater than or equal to 10 μm and less than or equal to 20 μm.

[0008] As an optional solution, the thickness of each part of the first insulating protection layer is uneven, and the deviation range of the thickness of each part is ±10 μm.

[0009] As an optional solution, the display module also includes a protective film, which is located on the side of the panel away from the flip chip film. The first insulating protective layer includes a first extension portion, which covers the side of the protective film away from the panel, and the first extension portion is located in the area of ​​the surface of one side of the protective film close to the cutting edge.

[0010] As an optional solution, the length of the first extension portion is less than or equal to 50 μm.

[0011] As an optional solution, a third insulating protective layer is provided on the surface of the panel facing the chip-on-film, the third insulating protective layer is located between the side surface of the first pin and the cutting edge, and the third insulating protective layer does not cover the first pin.

[0012] As an optional solution, the thickness of the third insulating protection layer is smaller than the thickness of the first insulating protection layer, and the thickness of the third insulating protection layer is smaller than the height of the first pin exposed outside the panel.

[0013] As an optional solution, the thickness of the third insulating protection layer is greater than 0 and less than or equal to 3 μm.

[0014] As an optional solution, the roughness of the third insulating protection layer is less than or equal to 0.7 μm.

[0015] As an optional solution, the thickness of the second insulating protection layer is greater than 0 and less than or equal to 3 μm.

[0016] As an optional solution, the second insulating protection layer includes a second extension portion, and the second extension portion is arranged to cover the side surface of the exposed area.

[0017] As an optional solution, the distance between the first position and the second position is greater than or equal to 100 μm, wherein the first position is the side of the second insulating protection layer close to the positive projection of the first pin on the second pin, and the second position is the side of the first pin close to the cutting edge.

[0018] As an optional solution, a conductive adhesive layer is further provided between the first pin and the second pin, and the thickness of the conductive adhesive layer is 2 μm-4 μm.

[0019] As an optional solution, at least one of the first insulating protective layer, the second insulating protective layer and the third insulating protective layer is formed by electrohydrodynamic printing, painting or pad printing technology.

[0020] In a second aspect, the utility model provides a display device, comprising the display module of the first aspect.

[0021] The display module of the utility model is provided with a first insulating protective layer on the cutting edge of the panel, the first insulating protective layer covers the cutting edge; and / or, a second insulating protective layer is provided on the surface of the exposed area facing the panel, the orthographic projection of the second insulating protective layer on the panel at least covers the surface of the cutting edge facing the chip-on-chip film. The provision of the insulating protective layer in the utility model is conducive to avoiding the short circuit problem caused by the direct overlap of the carbide debris on the cutting edge of the panel with the pins of the chip-on-chip film under the process requirement of the continuous reduction of the line width of the chip-on-chip film, thereby reliably avoiding the generation of dark lines and other undesirable problems, and improving the quality and yield rate of the display module; and the display module of the present application is simple to operate, easy to implement, and highly feasible. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Other features, objects and advantages of the present application will become more apparent by reading the detailed description of non-limiting embodiments made with reference to the following drawings:

[0023] Figure 1 This is a schematic diagram of the structure of the display module after the panel is cut;

[0024] Figure 2 This is a structural schematic diagram of a display module of the utility model;

[0025] Figure 3 It is a structural schematic diagram of another display module of the utility model;

[0026] Figure 4 This is a structural schematic diagram of another display module of the present utility model;

[0027] Figure 5 This is a structural schematic diagram of another display module of the present utility model;

[0028] Figure 6 This is a schematic structural diagram of another display module of the present invention.

[0029] In the figure,

[0030] 100. Display module;

[0031] 10. panel, 11. first pin, 12. cutting edge, 13. first protective film, 14. second protective film;

[0032] 20. Chip-on-film, 21. Second pin;

[0033] 30, first insulating protective layer, 301, first extending portion, 31, second insulating protective layer, 311, second extending portion, 32, third insulating protective layer;

[0034] 40. Conductive adhesive layer;

[0035] 50. Integrated circuit. DETAILED DESCRIPTION

[0036] The present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the relevant utility model, rather than to limit the utility model. It is also necessary to explain that, for ease of description, only the parts related to the utility model are shown in the accompanying drawings.

[0037] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0038] The embodiment of the present application provides a display module 100, such as Figure 1-3 As shown, it includes a panel 10 and a COF 20 disposed on one side of the panel 10, a first pin 11 is disposed on the side of the panel 10 close to the COF 20, a second pin 21 is disposed on the side of the COF 20 close to the panel 10, the first pin 11 and the second pin 21 are electrically connected, a cutting edge 12 is formed on the side of the panel 10, and the second pin 21 includes an exposed area extending out of the first pin 11;

[0039] The cutting edge 12 is provided with a first insulating protective layer 30, and the first insulating protective layer 30 covers the cutting edge 12;

[0040] And / or, a second insulating protective layer 31 is disposed on the surface of the exposed area facing the panel 10 , and the orthographic projection of the second insulating protective layer 31 on the panel 10 at least covers the surface of the cutting edge 12 facing the COF 20 .

[0041] It should be noted that the first pin 11 and the second pin 21 are electrically connected, and are used for the binding contact pattern contact between the COF 20 and the panel 10, so as to enable the display panel 10 to display a clear image; in order to improve the resolution of the display panel 10, it is necessary to reduce the line width of the COF, and increase the contact area between the first pin 11 and the second pin 21 as much as possible while ensuring reliable contact between the first pin 11 and the second pin 21. Therefore, the second pin 21 of the COF 20 is generally larger in size. After being electrically connected to the first pin 11, the second pin 21 has an exposed area extending out from the edge of the first pin 11, and the specific size of the exposed area is determined according to the actual binding process; for example, the length of the exposed area is 100μm-200μm, and specifically, the length of the exposed area can be but is not limited to 100μm, 120μm, 140μm, 160μm, 180μm or 200μm.

[0042] It is understandable that if Figure 1As shown, the terminal area of ​​the panel 10 is cut by the PAD cut process to form a cutting edge 12. The cutting edge 12 generates carbonized debris due to the cutting process. During the assembly process of the panel 10, the carbonized debris overlaps with the exposed area of ​​the second pin 21, thereby causing short circuits and resulting in dark lines and other defects. The embodiments of the present application effectively insulate and isolate the exposed area of ​​the second pin 21 from the cutting edge 12 of the panel 10 by setting a first insulating protective layer 30 on the cutting edge 12 of the panel 10 and / or setting a second insulating protective layer 31 on the exposed area of ​​the second pin 21, thereby avoiding problems such as dark lines caused by short circuits and improving the quality and yield of the display module.

[0043] Among them, the first insulating protective layer 30 and the second insulating protective layer 31 can adopt any insulating glue with lower viscosity, such as Dow Corning 1200. The first insulating protective layer 30 and the second insulating protective layer 31 of the embodiment of the present application have low viscosity. On the one hand, the first insulating protective layer 30 and the second insulating protective layer 31 are easier to be coated on the exposed area of ​​the cutting edge 12 and / or the second pin 21, and can cover the exposed area of ​​the cutting edge 12 and the second pin 21. On the other hand, the lower viscosity can make the surface of the first insulating protective layer 30 and the second insulating protective layer 31 smooth, which is conducive to the overflow of the ACF (anisotropic conductive film) between the first pin 11 and the second pin 21 during the crimping process, avoiding the accumulation of conductive particles and causing adverse problems such as short circuit between the first pin 11 and the second pin 21, thereby improving the packaging quality and yield rate of the display module.

[0044] It can also be understood that in actual production and processing, the first insulating protective layer 30 can be set only on the cutting edge 12 of the panel 10 to ensure that the first insulating protective layer 30 covers the entire cutting edge 12 to avoid exposure of carbonized foreign matter debris generated by the cutting edge 12; of course, the second insulating protective layer 31 can also be set only on the exposed area of ​​the second pin 21 to ensure that the positive projection of the second insulating protective layer 31 on the panel 10 covers the surface of the cutting edge 12 facing the COF, thereby insulating and isolating the exposed area of ​​the second pin 21; in some other embodiments, the first insulating protective layer 30 and the second insulating protective layer 31 can also be respectively set on the cutting edge 12 of the panel 10 and the exposed area of ​​the second pin 21, so as to avoid that when one of the first insulating protective layer 30 or the second insulating protective layer 31 fails, the other can also play the role of insulating isolation, further ensuring that the cutting edge 12 of the panel 10 and the exposed area of ​​the second pin 21 are reliably insulated and isolated.

[0045] Among them, the first insulating protective layer 30 needs to cover the entire cutting edge 12 (that is, the side of the panel 10 and when the cutting edge 12 has a certain thickness, it also needs to cover the surface of the cutting edge 12 facing the COF); the second insulating protective layer 31 can be only arranged in the area where the positive projection of the exposed area on the panel 10 overlaps with the cutting edge 12, and of course it can also be arranged in the entire exposed area (including the side of the exposed area and the surface facing the panel 10).

[0046] The display module of the embodiment of the present application solves the problem in the prior art that short circuit occurs due to the overlap between carbonized debris in the heat-affected zone (carbonized zone) and COF Pin after the Pad Cut process, thereby causing a high rate of defective losses such as dark lines. The display module of the embodiment of the present application is advantageous in avoiding the short circuit problem caused by the direct overlap between the carbide debris at the cutting edge 12 of the panel 10 and the pin (Pin) of the cover chip film 20 under the process requirement of continuously reducing the line width of the cover chip film 20 through the provision of the first insulating protective layer 30 and / or the second insulating protective layer 31, thereby avoiding the generation of dark lines and other defective problems and improving the quality and yield rate of the display module; and the display module of the present application is simple to operate, easy to implement, and highly feasible.

[0047] As an achievable manner, the thickness of the first insulating protection layer 30 is greater than or equal to 10 μm and less than or equal to 20 μm.

[0048] It should be noted that the thickness of the first insulating layer 30 refers to the thickness from the cutting edge 12 to the direction away from the cutting edge 12 ( Figure 1 The size of the first insulating layer 30 in the X direction (in FIG. 1 ).

[0049] Specifically, the thickness of the first insulating protection layer 30 may be, but is not limited to, 10 μm, 12 μm, 15 μm, 17 μm, or 20 μm.

[0050] In this embodiment, the thickness of the first insulating protective layer 30 is conducive to filling the edge burrs or carbonized foreign matter generated by laser cutting, making the cutting edge 12 smoother and flatter, which is conducive to the subsequent assembly of the panel 10 and reliably avoids adverse problems such as short circuits caused by carbonized foreign matter such as burrs.

[0051] In an optional embodiment, if Figure 2 As shown, the first insulating protective layer 30 is coated with a uniform thickness everywhere to ensure that the surface of the first insulating protective layer 30 is smooth, without affecting the adhesive coating of the COF, which is beneficial to improving the assembly effect of the panel 10.

[0052] The uniform coating thickness of the first insulating protective layer 30 at all locations refers to the coating process being such that the first insulating layer 30 is uniformly coated at all locations within a certain tolerance range.

[0053] In some embodiments, Figure 5 As shown, the thickness of each portion of the first insulating protection layer 30 is not uniform, and the deviation range of the thickness of each portion is ±10 μm.

[0054] The thickness deviation range of this embodiment avoids the impact on the COF adhesive coating, while being able to reliably fill the burrs or carbonized foreign debris on the cutting edge 12 and avoiding being too thick to affect the assembly of other structures on the panel 10 .

[0055] As an achievable method, Figure 5 As shown, the display module 100 further includes a protective film, and the first insulating protective layer 30 includes a first extension portion 301 , which covers a side of the protective film away from the COF 20 , and is located on a surface of one side of the protective film near the cutting edge 12 .

[0056] It can be understood that the first insulating protective layer 30 is generally a colloid with low viscosity and has a certain fluidity. Therefore, in the process of coating the first insulating protective layer 30 on the cutting edge 12 of the panel 10, glue will overflow on the side of the protective film away from the panel 10, thereby forming a first extension portion 301. The existence of the first extension portion 301 is conducive to the setting of the first insulating protective layer 30 and reduces the operating process requirements.

[0057] In this embodiment, the first extension portion 301 is located in the area of ​​the protective film close to the cutting edge 12. While facilitating processing, it does not affect the binding and crimping of the panel 10, and avoids the first extension portion 301 being too long, causing uneven force on the panel 10 during the binding and crimping process, which is beneficial to improving the packaging quality of the display module.

[0058] It can be understood that the first extension portion 301 extends from the cutting edge 12 toward the surface of the protective film, and the length of the first extension portion 301 refers to the length in the extension direction ( Figure 5 The size of the X direction in the image.

[0059] In some embodiments, the length of the first extension portion 301 is less than or equal to 50 μm.

[0060] Specifically, the length of the first extension portion 301 may be, but is not limited to, 0, 10 μm, 20 μm, 30 μm, 40 μm or 50 μm, etc.;

[0061] In this embodiment, the length of the first extension portion 301 is less than or equal to 50 μm, which helps to avoid affecting the binding and crimping position of the panel 10. While reducing the processing technology of the first insulating protection layer 30, it ensures that the panel 10 is evenly stressed during the binding and crimping process, thereby ensuring the packaging quality of the display module 100.

[0062] Of course, as an optional implementation, in order to ensure that the panel 10 is subjected to uniform force during the binding and crimping process, the length of the first extension portion 301 is as close to 0 as possible.

[0063] As an achievable method, Figure 4 As shown, a third insulating protective layer 32 is disposed on the surface of the panel 10 facing the COF 20 . The third insulating protective layer 32 is located between the side of the first pin 11 and the cutting edge 12 , and the third insulating protective layer 32 does not cover the first pin 11 .

[0064] Among them, the third insulating protective layer 32 can be extended from the cutting edge 12 in the direction close to the first pin 11, and the edge of the third insulating protective layer 32 can just contact the edge of the first pin 11, but the third insulating protective layer 32 cannot cover the first pin 11, thereby reliably achieving insulation and isolation of carbonized foreign matter debris on the cutting edge 12 while ensuring the contact area between the first pin 11 and the second pin 21.

[0065] It should be noted that while the third insulating protection layer 32 achieves insulation isolation, its thickness cannot be too thick (for example, it can be less than or equal to 3μm) to avoid affecting the setting of the anisotropic conductive film (ACF) between the first pin 11 and the second pin 21, ensuring that the ACF can overflow the glue, thereby preventing the accumulation of conductive particles and avoiding poor contact problems such as short circuits between the first pin 11 and the second pin 21.

[0066] In an optional embodiment, the thickness of the third insulating protection layer 32 is smaller than the thickness of the first insulating protection layer 30 , and the thickness of the third insulating protection layer 32 is smaller than the height of the first pin 11 exposed outside the panel 10 .

[0067] It should be noted that the thickness of the third insulating layer 32 refers to the thickness of the third insulating layer 32 in the light emitting direction of the panel 10 ( Figure 4 The thickness of the first insulating protective layer 30 is from the cutting edge 12 toward the direction away from the cutting edge 12 ( Figure 4 The height of the first lead 11 exposed outside the panel 10 refers to the height of the first lead 11 exposed outside the panel 10 in the light emitting direction of the panel 10 ( Figure 4 The dimension of the first pin 11 exposed outside the panel 10 (in the Y direction).

[0068] In this embodiment, the thickness of the third insulating protective layer 32 is less than the height of the first pin 11 exposed outside the panel 10, which is beneficial to ensure that the third insulating protective layer 32 can achieve insulation and isolation of the carbonized foreign matter debris generated by the cutting edge 12 while not being higher than the edge of the first pin 11, thereby ensuring that the ACF can reliably overflow without causing local accumulation of conductive particles.

[0069] In an optional embodiment, the thickness of the third insulating protection layer 32 is greater than 0 and less than or equal to 3 μm.

[0070] The thickness of the third insulating protection layer 32 of the present embodiment can, on the one hand, ensure good contact between the first pin 11 and the second pin 21, and on the other hand, cover the cutting edge 12 of the panel 10 to avoid problems such as short circuit caused by contact between carbonized foreign matter debris on the cutting edge 12 and the exposed area of ​​the second pin 21.

[0071] Specifically, the thickness of the third insulating protection layer 32 may be 0.5 μm, 1 μm, 1.5 μm, 2 μm, 2.5 μm or 3 μm. When the thickness of the third insulating protection layer 32 is greater than 3 μm, the excessive thickness may affect the overflow of the ACF and cause accumulation of conductive particles.

[0072] In some embodiments, the roughness of the third insulating protection layer 32 is less than or equal to 0.7 μm.

[0073] It can be understood that roughness refers to roughness in the conventional sense, which can be broadly interpreted as the unevenness of the processed surface with small spacing and tiny peaks and valleys; the roughness of the third insulating protective layer 32 will affect the overflow of the ACF between the first pin 11 and the second pin 21, so the surface of the first insulating protective layer 30 should be as smooth as possible to facilitate the reliable flow of the ACF, thereby avoiding the accumulation of conductive particles.

[0074] The roughness of the third insulating protection layer 32 in this embodiment is conducive to glue overflow after ACF pressing, and can avoid accumulation of conductive particles during the binding process, thereby ensuring good contact between the first pin 11 and the second pin 21.

[0075] The roughness of the third insulating protection layer 32 may be, but is not limited to, 0.1 μm, 0.2 μm, 0.3 μm, 0.4 μm, 0.5 μm, 0.6 μm or 0.7 μm.

[0076] For example, Figure 4 As shown, the display module includes a panel 10 and a chip-on-chip film 20 disposed on one side of the panel 10, a protective film is disposed on the side of the panel 10 away from the chip-on-chip film 20, and the protective film includes a first protective film 13 and a second protective film 14 stacked in sequence along the direction of the panel 10 away from the chip-on-chip film 20, an integrated circuit 50 (IC) is disposed on the side of the chip-on-chip film 20 away from the panel 10, a first pin 11 is disposed on the side of the panel 10 close to the chip-on-chip film 20, a second pin 21 is disposed on the side of the chip-on-chip film 20 close to the panel 10, and a side of the panel 10 perpendicular to the light emitting direction (i.e. Figure 4A cutting edge 12 is formed on the side of the middle panel 10 in the X direction, wherein the cutting edge 12 refers to the edge formed by simultaneously cutting the terminal area and the protective film of the panel 10, and a first insulating protective layer 30 is arranged on the cutting edge 12, and the first insulating protective layer 30 covers the entire cutting edge 12, and the thickness of the first insulating protective layer 30 is uneven at various locations, and the average thickness of the first insulating protective layer 30 is greater than or equal to 10μm and less than or equal to 20μm, and the deviation range of the thickness at various locations is approximately ±10μm, so that the first insulating protective layer 30 can fill and cover the burrs and / or carbonized foreign matter debris on the cutting edge 12 to achieve the effect of insulating isolation. During the coating process of the first insulating protective layer 30, since it has a certain fluidity, a first extension portion 301 is formed on the back side of the panel 10 away from the flip chip film 20, and the length of the first extension portion 301 is less than or equal to 50μm, while reducing the processing requirements of the first insulating protective layer 30, it does not affect the assembly of the panel 10, so that the panel 10 is evenly stressed.

[0077] As an achievable manner, the thickness of the second insulating protection layer 31 is greater than 0 and less than or equal to 3 μm.

[0078] The thickness of the second insulating layer 31 refers to the thickness from the surface of the second lead 21 to the direction away from the second lead 21 ( Figure 3 (in the Y direction) the size of the second insulating layer 31.

[0079] The thickness of the second insulating protective layer 31 of the present embodiment can, on the one hand, ensure good contact between the first pin 11 and the second pin 21, and on the other hand, cover the exposed area of ​​the second pin 21 to avoid the problem of short circuit caused by overlapping of the exposed area of ​​the second pin 21 and carbonized foreign matter debris on the cutting edge 12.

[0080] Specifically, the thickness of the second insulating protective layer 31 can be 0.5μm, 1μm, 1.5μm, 2μm, 2.5μm or 3μm, etc. When the thickness of the second insulating protective layer is greater than 3μm, the excessive thickness of the second insulating protective layer 31 will affect the overflow of the ACF, thereby causing accumulation of conductive particles.

[0081] In some embodiments, Figure 6 As shown, the second insulating protection layer 31 includes a second extension portion 311 , and the second extension portion 311 is disposed to cover the side surface of the exposed area.

[0082] The side surface of the exposed area refers to the surface of the exposed area in the Y direction. The first extension portion 311 extends from the edge of the exposed area along the Y direction close to the COF 20 to cover the side surface of the exposed area.

[0083] It is understandable that the second insulating protective layer 31 is also generally a colloid with low viscosity and has a certain fluidity. Therefore, in the process of coating the second insulating protective layer 31 on the exposed area of ​​the second pin 21 of the chip-on-chip film 20, the glue will overflow on the side of the chip-on-chip film 20, thereby forming a second extension portion 311. The existence of the second extension portion 311 is conducive to facilitating the setting of the second insulating protective layer 31 and reducing the operating process requirements.

[0084] Since the area of ​​the COF 20 away from the second pins 21 is generally provided with insulating devices, the length and thickness of the second extension portion 311 are not limited in this embodiment.

[0085] In an optional embodiment, the distance between the first position and the second position is greater than or equal to 100 μm, wherein the first position is the side of the second insulating protection layer 31 close to the positive projection of the first pin 11 on the second pin 21 , and the second position is the side of the first pin 11 close to the cutting edge 12 .

[0086] It should be noted that the distance between the first position and the second position refers to the vertical distance between the first position and the second position.

[0087] Specifically, the distance between the first position and the second position may be, but is not limited to, 100 μm, 110 μm, 120 μm, 150 μm or 200 μm.

[0088] It can be understood that the second insulating protective layer 31 is arranged on the surface of the second pin 21 facing the panel 10. Since an ACF is arranged between the first pin 11 and the second pin 21, in order to ensure that the ACF overflows sufficiently and avoids the accumulation of conductive particles, a gap is formed between the side of the second insulating protective layer 31 close to the first pin 11 and the side of the first pin 11 close to the cutting edge 12.

[0089] In this embodiment, the distance between the first position and the second position is greater than or equal to 100 μm, which is conducive to ensuring good contact between the first pin 11 and the second pin 21 .

[0090] For example, in actual processing, a conductive adhesive layer 40 is further provided between the first pin 11 and the second pin 21 , and the thickness of the conductive adhesive layer 40 is 2 μm-4 μm.

[0091] The conductive adhesive layer 40 is ACF, and the thickness of the ACF after crimping is 2 μm-4 μm.

[0092] Specifically, the thickness of the conductive adhesive layer 40 may be, but is not limited to, 2 μm, 2.5 μm, 3 μm, 3.5 μm or 4 μm.

[0093] The thickness of the conductive adhesive layer 40 in the embodiment of the present application is conducive to ensuring good contact between the first pin 11 and the second pin 21 .

[0094] For example, Figure 6 As shown, the display module 100 includes a panel 10 and a chip-on-film 20 disposed on a side of a conductive adhesive layer 40 away from the panel 10, a protective film is disposed on the side of the panel 10 away from the chip-on-film 20, and the protective film includes a first protective film 13 and a second protective film 14 stacked in sequence along a direction away from the panel 10, an integrated circuit 50 (IC) is disposed on the side of the chip-on-film 20 away from the panel 10, a first pin 11 is disposed on the side of the panel 10 close to the chip-on-film 20, and a side of the panel 10 perpendicular to the light emitting direction (i.e. Figure 6 A cutting edge 12 is formed on the side of the middle panel in the X direction, wherein the cutting edge 12 refers to an edge formed by simultaneously cutting the terminal area and the protective film of the panel 10, a second pin 21 is provided on the side of the chip-on-cover film 20 close to the panel 10, the second pin 21 includes an exposed area extending from the edge of the first pin 11, a second insulating protective layer 31 is provided on the exposed area, the projection of the second insulating protective layer 31 on the panel 10 covers the surface of the chip-on-cover film 20 facing the cutting edge 12, the thickness of the second insulating protective layer 31 is greater than 0 and less than or equal to 3μm, and a gap is formed between the side of the second insulating protective layer 31 close to the first pin 11 on the second pin 21 and the edge of the first pin 11 on the second pin 21 close to the second insulating protective layer 31, the gap can be used for ACF overflow between the first pin 11 and the second pin 21, and will not block the ACF, thereby avoiding the accumulation of conductive particles.

[0095] The second insulating protective layer 31 also includes a second extension portion 311 surrounding the side of the exposed area of ​​the second pin 21, so that the exposed area on the side of the second pin 21 is completely covered, so that the second insulating protective layer 31 insulates the exposed area of ​​the second pin 21 to achieve an insulating isolation effect, thereby avoiding a short circuit between the carbonized foreign matter debris on the cutting edge 12 and the second pin 21, causing problems such as dark lines on the display module.

[0096] As an implementable manner, at least one of the first insulating protection layer 30 , the second insulating protection layer 31 and the third insulating protection layer 32 may be formed by electrohydrodynamic printing, painting or pad printing technology.

[0097] In actual processing, the first insulating protective layer 30 , the second insulating protective layer 31 and the third insulating protective layer 32 can be formed by any one of EHD electric field printing technology, sponge smearing technology or silicone pad printing technology.

[0098] Among them, the parameter settings of EHD electric field printing technology can be: dot diameter ≥ 0.5μm, line width ≥ 1μm, solution viscosity 0.5-10000cp, droplet position accuracy 1-3μm, printing accuracy ±5μm, which is conducive to achieving a larger viscosity range and a wider range of corresponding materials, and has high dot and line accuracy and high printing accuracy, and can achieve more complex (customized dot, line, and surface patterns) and more precise sealing, so that the display module of the embodiment of the present application has a higher yield rate and achieves a better sealing effect with low risk.

[0099] The application can be but is not limited to sponge application. Sponge application is similar to the glue dipping and scraping method. It reduces the roughness and fills the burrs caused by side cutting by scraping to achieve sealing, avoid short circuit caused by carbonized foreign matter, and achieve insulation effect. The operation is simple and convenient.

[0100] Silicone head pad printing technology usually prepares the target pattern to be processed on the silicone head in advance, and prints the target pattern at the target position by moving the silicone head.

[0101] To sum up, the display module 100 of the embodiment of the present application, through the setting of the first insulating protective layer 30 and / or the second insulating protective layer 31, is conducive to avoiding the short circuit problem caused by the carbide debris at the cutting edge 12 of the panel 10 directly overlapping the pins (Pin) of the chip-on-cover film after cutting, under the process requirement of continuously reducing the line width of the chip-on-cover film 20, thereby avoiding the generation of dark lines and other undesirable problems, thereby improving the quality and yield rate of the display module; and the display module of the present application is simple to operate, easy to implement, and highly feasible.

[0102] In addition, a third insulating protective layer 32 is provided on the surface of the panel 10 facing the chip-covered film 20. The third insulating protective layer 32 is located between the side of the first pin 11 and the cutting edge 12, and does not cover the first pin 11. While achieving insulation isolation, it does not affect the overflow of glue between the first pin 11 and the second pin 21 to the conductive adhesive layer 40, thereby avoiding the accumulation of conductive particles, which is beneficial to ensuring good contact between the first pin 11 and the second pin 21.

[0103] In a second aspect, an embodiment of the present application provides a display device, comprising the display module of the first aspect. It is understandable that the display device has all the features and advantages of the above-mentioned display module, which will not be elaborated here. In short, the display device has high quality and yield, high display resolution, and can achieve an ultra-thin packaging structure.

[0104] It should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like used above to indicate positions or positional relationships are based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the panel or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, unless otherwise specified, "multiple" means two or more.

[0105] The above description is only a preferred embodiment of the present application and an explanation of the technical principles used. Those skilled in the art should understand that the scope of the utility model involved in the present application is not limited to the technical solution formed by a specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the concept of the utility model. For example, the above features are replaced with the technical features with similar functions disclosed in the present application (but not limited to) by each other to form a technical solution.

Claims

1. A display module, characterized in that: The invention comprises a panel and a chip-on-chip film disposed on one side of the panel, wherein a first pin is disposed on a side of the panel close to the chip-on-chip film, and a second pin is disposed on a side of the chip-on-chip film close to the panel, the first pin and the second pin are electrically connected, a cutting edge is formed on a side of the panel, and the second pin includes an exposed area extending out of the first pin; The cutting edge is provided with a first insulating protective layer, and the first insulating protective layer covers the cutting edge; And / or, a second insulating protective layer is provided on the surface of the exposed area facing the panel, and the orthographic projection of the second insulating protective layer on the panel at least covers the surface of the cutting edge facing the chip-on-film.

2. The display module according to claim 1, characterized in that: The thickness of the first insulating protection layer is greater than or equal to 10 μm and less than or equal to 20 μm.

3. The display module according to claim 1, characterized in that: The thickness of each part of the first insulating protection layer is uneven, and the deviation range of the thickness of each part is ±10 μm.

4. The display module according to claim 1, characterized in that: The display module also includes a protective film, which is located on the side of the panel away from the flip chip film. The first insulating protective layer includes a first extension portion, which covers the side of the protective film away from the panel, and the first extension portion is located in an area on the surface of one side of the protective film close to the cutting edge.

5. The display module according to claim 4, characterized in that: The length of the first extension portion is less than or equal to 50 μm.

6. The display module according to any one of claims 1 to 5, characterized in that: A third insulating protective layer is disposed on the surface of the panel facing the COF, the third insulating protective layer is located between the side surface of the first pin and the cutting edge, and the third insulating protective layer does not cover the first pin.

7. The display module according to claim 6, characterized in that: The thickness of the third insulating protection layer is smaller than the thickness of the first insulating protection layer, and the thickness of the third insulating protection layer is smaller than the height of the first pin exposed outside the panel.

8. The display module according to claim 7, characterized in that: The thickness of the third insulating protection layer is greater than 0 and less than or equal to 3 μm.

9. The display module according to claim 7, characterized in that: The roughness of the third insulating protection layer is less than or equal to 0.7 μm.

10. The display module according to claim 1, characterized in that: The thickness of the second insulating protection layer is greater than 0 and less than or equal to 3 μm.

11. The display module according to claim 1, characterized in that: The second insulating protection layer includes a second extending portion, and the second extending portion is disposed to cover the side surface of the exposed area.

12. The display module according to claim 1, characterized in that: The distance between the first position and the second position is greater than or equal to 100 μm, wherein the first position is a side of the second insulating protection layer close to the positive projection of the first pin on the second pin, and the second position is a side of the first pin close to the cutting edge.

13. The display module according to claim 1, characterized in that: A conductive adhesive layer is further provided between the first pin and the second pin, and the thickness of the conductive adhesive layer is 2 μm-4 μm.

14. The display module according to claim 6, characterized in that: At least one of the first insulating protective layer, the second insulating protective layer and the third insulating protective layer is formed by electrohydrodynamic printing, painting or pad printing technology.

15. A display device, characterized in that A display module comprising any one of claims 1-14.

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