Integrated circuit SIP packaging structure
By designing the integrated circuit SIP packaging structure, the circuit board is moved by the combination of ratchets and screws, and the chip is clamped and docked through the settings of the clamps and hydraulic rods, the problems of long docking time and low efficiency during the packaging of small chips are solved, and efficient chip-to-circuit board docking is achieved.
Patent Information
- Application Number
- CN202420860928.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-24
- Publication Date
- 2025-04-15
- Estimated Expiration
- 2034-04-24
AI Technical Summary
In the prior art, due to the small size of the small chip during the packaging process, the chip interface of the circuit board is long and the working efficiency is low. The existing packaging devices can only dock a single chip interface.
An integrated circuit SIP package structure is designed, including an operating table, a gantry, a clamping mechanism, a rotating mechanism, a restraining mechanism and a fixing mechanism. Through the cooperation of the ratchet and the screw, the circuit board can be moved, and the chip is clamped and docked through the arrangement of the clamp and the hydraulic rod.
It realizes efficient docking between chips and circuit boards, improves work efficiency, can adapt to the needs of different circuit boards, and enhances the flexibility and reliability of packaging.
Smart Images
Figure CN222762931U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of packaging structures, in particular to an integrated circuit SIP packaging structure. Background Art
[0002] SIP packaging device refers to a packaging form in integrated circuit packaging technology, also known as system-level packaging, which integrates multiple different chips, modules or devices in one package to form a complete functional module or system. SIP packaging device can integrate different types of functional modules, such as processors, memory, sensors, wireless communication modules, etc., and can realize integrated circuits with multiple different functions. It has the advantages of small size, low power consumption, high performance, good reliability, etc., and can meet the needs of modern electronic products for miniaturization, high performance and multi-functions. SIP packaging devices are widely used in electronic products, such as smart phones, tablets, smart watches, wireless communication devices, etc.
[0003] When some existing chips are packaged, due to their small size, it takes a lot of time to connect them to the chip interface on the circuit board, and some existing packaging devices can only connect to a single chip interface, resulting in low work efficiency. Therefore, this problem needs to be solved. Utility Model Content
[0004] The utility model aims to solve the shortcomings in the prior art and proposes an integrated circuit SIP packaging structure.
[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:
[0006] A SIP packaging structure for an integrated circuit comprises an operating table, a gantry is fixedly connected to the top of the operating table, a clamping mechanism for clamping the chip is provided at the bottom of the gantry, a slide groove is provided at the top of the operating table, a lead screw is rotatably connected to the inside of the operating table close to the slide groove, a slider is sleeved on the surface of the lead screw, a ratchet is sleeved on the surface of the lead screw close to the slider, a rotating mechanism for rotating the lead screw is provided on the surface of the ratchet, a turntable is fixedly connected to the end of the lead screw close to the ratchet, a receiving groove is provided on the top of the slider, a rotating shaft is slidably connected to the inside of the receiving groove, a placement plate is fixedly connected to the top of the rotating shaft, a restraining mechanism for restraining the placement plate is provided inside the storage groove, four sliding columns are symmetrically slidably connected to the top of the placement plate, and a fixing mechanism for fixing the circuit board is provided at the bottom of the four sliding columns, and the circuit board can be moved by setting the ratchet.
[0007] As a further solution of the utility model, the clamping mechanism includes two first hydraulic rods, the two first hydraulic rods are fixedly connected to the top of the gantry, the bottom of the two first hydraulic rods are fixedly connected to the same support plate, the bottom of the support plate is fixedly connected to a U-shaped plate, one side of the U-shaped plate is fixedly connected to a second hydraulic rod, one end of the second hydraulic rod is fixedly connected to a clamping plate, the clamping plate slides inside the U-shaped plate, and the chip can be clamped by the setting of the clamping plate.
[0008] As a further solution of the utility model, the rotating mechanism includes an L-plate, which is fixedly connected to one side of the support plate, and the surface of the L-plate close to the ratchet is rotatably connected to four pawls, and the four pawls cooperate with the ratchet. The surface of the four pawls close to the L-plate is fixedly connected to two first springs, and the other ends of the two first springs are fixedly connected to one side of the L-plate. The ratchet can be rotated by setting the pawls.
[0009] As a further scheme of the utility model, the constraint mechanism includes a limit groove, which is opened on the inner surface of the storage groove, the inner surface of the limit groove is rotatably connected to a limit plate, the top of the limit plate is fixedly connected to a limit rod, the limit rod is slidably connected to the bottom of the rotating shaft, the surface of the limit rod is sleeved with a second tension spring, the top of the second tension spring is fixedly connected to the bottom of the rotating shaft, and the bottom of the second tension spring is fixedly connected to the top of the limit plate, four constraint grooves are opened on the top of the sliding block close to the storage groove, and the four constraint grooves are arranged in groups of two, and two constraint rods are symmetrically fixedly connected to the surface of the placement plate close to the constraint groove, each group of the constraint grooves cooperates with the constraint rod, and the placement plate can be constrained by the setting of the limit plate.
[0010] As a further solution of the utility model, the fixing mechanism includes a pressure plate, which is fixedly connected to the bottom of the sliding column, and the top of the sliding column is fixedly connected to the top plate. The surface of the sliding column close to the top plate is sleeved with a first tension spring, the bottom end of the first tension spring is fixedly connected to the top of the placement plate, and the top end of the first tension spring is fixedly connected to the bottom of the top plate. The circuit board can be fixed by setting the pressure plate.
[0011] The beneficial effects of the utility model are:
[0012] 1. The circuit board can be moved by setting the pawl. A pawl is installed on one side of the U-shaped plate, and the pawl cooperates with the ratchet on the surface of the screw rod. Due to the shape of the ratchet, when the pawl follows the U-shaped plate to reset, the ratchet will rotate. A screw is installed on one side of the ratchet. When the ratchet screw rod rotates, the placement plate can be moved, thereby moving the next chip docking interface to the bottom of the U-shaped plate so that the chip can be accurately docked with it.
[0013] 2. The placement plate can be rotated by setting the constraint rod. Two constraint rods are installed at the bottom of the placement plate, and both constraint rods slide inside the slider. Therefore, when the current state of the placement plate cannot meet the chip docking requirements, the constraint rods can be pulled out from the slider to allow the placement plate to rotate to cope with different circuit boards. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 This is a schematic diagram of the overall structure of an integrated circuit SIP packaging structure proposed by the utility model;
[0015] Figure 2 A schematic diagram of a clamping mechanism for an integrated circuit SIP packaging structure proposed by the utility model;
[0016] Figure 3 for Figure 2 A schematic diagram of the structure of part A;
[0017] Figure 4 A schematic diagram of a rotating mechanism of an integrated circuit SIP packaging structure proposed by the utility model;
[0018] Figure 5 A schematic diagram of a fixing mechanism of an integrated circuit SIP packaging structure proposed by the utility model;
[0019] Figure 6 The present invention is a schematic diagram of a constraint mechanism of an integrated circuit SIP packaging structure.
[0020] In the figure: 1, operating table; 2, gantry; 3, turntable; 4, placement plate; 101, slide; 201, first hydraulic rod; 202, support plate; 203, U-shaped plate; 204, second hydraulic rod; 205, clamping plate; 206, L-plate; 207, pawl; 208, first spring; 301, screw rod; 302, ratchet; 303, slider; 304, storage slot; 305, limit slot; 306, constraint slot; 401, slide column; 402, pressure plate; 403, top plate; 404, first tension spring; 405, rotating shaft; 406, limit rod; 407, limit plate; 408, constraint rod; 409, second tension spring. DETAILED DESCRIPTION
[0021] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.
[0022] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present utility model will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.
[0023] Reference Figure 1-Figure 6 , an integrated circuit SIP packaging structure, including an operating table 1, a gantry 2 is fixedly connected to the top of the operating table 1, a clamping mechanism for clamping a chip is provided at the bottom of the gantry 2, a slide groove 101 is provided on the top of the operating table 1, a screw rod 301 is rotatably connected to the inner side of the operating table 1 close to the slide groove 101, a slider 303 is sleeved on the surface of the screw rod 301, a ratchet 302 is sleeved on the surface of the screw rod 301 close to the slider 303, a rotating mechanism for rotating the screw rod 301 is provided on the surface of the ratchet 302, and the screw rod 301 is provided with a rotating mechanism. 01 A turntable 3 is fixedly connected to the end portion on one side close to the ratchet 302, a receiving groove 304 is opened on the top of the slider 303, a rotating shaft 405 is slidably connected inside the receiving groove 304, a placing plate 4 is fixedly connected to the top of the rotating shaft 405, a restraining mechanism for restraining the placing plate 4 is provided inside the receiving groove 304, four sliding columns 401 are symmetrically slidably connected to the top of the placing plate 4, and a fixing mechanism for fixing the circuit board is provided at the bottom of the four sliding columns 401, and the circuit board can be moved by the setting of the ratchet 302.
[0024] Reference Figure 1 and Figure 2 In a preferred embodiment, the clamping mechanism includes two first hydraulic rods 201, the two first hydraulic rods 201 are fixedly connected to the top of the gantry 2, the bottom of the two first hydraulic rods 201 is fixedly connected to the same support plate 202, the bottom of the support plate 202 is fixedly connected to a U-shaped plate 203, one side of the U-shaped plate 203 is fixedly connected to a second hydraulic rod 204, one end of the second hydraulic rod 204 is fixedly connected to a clamping plate 205, the clamping plate 205 slides inside the U-shaped plate 203, and the chip can be clamped by the setting of the clamping plate 205.
[0025] Reference Figure 2-Figure 4 In a preferred embodiment, the rotating mechanism includes an L-plate 206, which is fixedly connected to one side of the support plate 202. Four pawls 207 are rotatably connected to the surface of the L-plate 206 close to the ratchet 302. The four pawls 207 cooperate with the ratchet 302. The four pawls 207 are fixedly connected to the surface of the L-plate 206 close to the one side of the L-plate 206 with two first springs 208. The other ends of the two first springs 208 are fixedly connected to one side of the L-plate 206. The ratchet 302 can be rotated by setting the pawls 207.
[0026] Reference Figure 4 and Figure 6In a preferred embodiment, the constraint mechanism includes a limit groove 305, which is provided on the inner surface of the storage groove 304. The inner surface of the limit groove 305 is rotatably connected to a limit plate 407. The top of the limit plate 407 is fixedly connected to a limit rod 406. The limit rod 406 is slidably connected to the bottom of the rotating shaft 405. A second tension spring 409 is sleeved on the surface of the limit rod 406. The top of the second tension spring 409 is fixedly connected to the bottom of the rotating shaft 405, and the bottom of the second tension spring 409 is fixedly connected to the top of the limit plate 407. Four constraint grooves 306 are provided on the top of the slider 303 near the storage groove 304. The four constraint grooves 306 are arranged in groups of two. Two constraint rods 408 are symmetrically fixedly connected to the surface of the placement plate 4 near the constraint grooves 306. Each group of constraint grooves 306 cooperates with the constraint rod 408. The placement plate 4 can be constrained by the setting of the limit plate 407.
[0027] Reference Figure 1 and Figure 5 In a preferred embodiment, the fixing mechanism includes a pressure plate 402, which is fixedly connected to the bottom of the sliding column 401, and a top plate 403 is fixedly connected to the top of the sliding column 401. A first tension spring 404 is sleeved on the surface of the sliding column 401 close to the top plate 403. The bottom end of the first tension spring 404 is fixedly connected to the top of the placement plate 4, and the top end of the first tension spring 404 is fixedly connected to the bottom of the top plate 403. The circuit board can be fixed by setting the pressure plate 402.
[0028] From the above description, it can be seen that the above-mentioned embodiment of the utility model achieves the following technical effects: when in use, the circuit board is placed on the top of the placement plate 4, and a pressure plate 402 is installed inside the placement plate 4, and the pressure plate 402 is connected to the placement plate 4 through the first tension spring 404, so that when the circuit board enters the inside of the placement plate 4, the pressure plate 402 can press the circuit board, and when the circuit board is placed, the chip to be docked is placed inside the U-shaped plate 203, and a first hydraulic rod 201 is installed on the top of the U-shaped plate 203. After the chip is placed, the chip and the circuit board can be docked with the help of the first hydraulic rod 201, and a pawl 207 is installed on one side of the U-shaped plate 203, and the pawl 207 cooperates with the ratchet 302 on the surface of the screw rod 301. Due to the shape of the ratchet 302, when the pawl 207 moves downward with the U-shaped plate 203, the ratchet 302 will not be caused. 02 rotates, but when the pawl 207 follows the U-shaped plate 203 to reset, the ratchet 302 will rotate. A screw rod 301 is installed on one side of the ratchet 302, so that when the ratchet 302 rotates, the screw rod 301 will also rotate synchronously. A slider 303 is sleeved on the surface of the screw rod 301, and the placement plate 4 cooperates with the slider 303 through the rotating shaft 405, so that when the screw rod 301 drives the slider 303 to move, the placement plate 4 will also move synchronously, so as to move the next chip docking interface to the bottom of the U-shaped plate 203, so that the chip can be accurately docked with it. Two constraint rods 408 are also installed at the bottom of the placement plate 4, and the two constraint rods 408 are both slid inside the slider 303, so that when the current state of the placement plate 4 cannot meet the chip docking, the constraint rod 408 can be pulled out from the slider 303, so that the placement plate 4 can rotate to cope with different circuit boards.
[0029] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.
[0030] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.
[0031] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein, for example. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.
[0032] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.
Claims
1. An integrated circuit SIP packaging structure, comprising an operating table (1), characterized in that: The top of the operating table (1) is fixedly connected to a gantry (2), the bottom of the gantry (2) is provided with a clamping mechanism for clamping a chip, the top of the operating table (1) is provided with a slide groove (101), the side of the operating table (1) close to the slide groove (101) is internally rotatably connected to a lead screw (301), the surface of the lead screw (301) is sleeved with a slider (303), the surface of the lead screw (301) close to the slider (303) is sleeved with a ratchet (302), the surface of the ratchet (302) is provided with a rotating mechanism for rotating the lead screw (301), the A rotating disk (3) is fixedly connected to the end of the screw rod (301) near one side of the ratchet wheel (302); a receiving groove (304) is provided on the top of the slider (303); a rotating shaft (405) is slidably connected inside the receiving groove (304); a placement plate (4) is fixedly connected to the top of the rotating shaft (405); a restraining mechanism for restraining the placement plate (4) is provided inside the receiving groove (304); four sliding columns (401) are symmetrically slidably connected to the top of the placement plate (4); and a fixing mechanism for fixing a circuit board is provided at the bottom of each of the four sliding columns (401).
2. The integrated circuit SIP packaging structure according to claim 1, characterized in that: The clamping mechanism comprises two first hydraulic rods (201), the two first hydraulic rods (201) are fixedly connected to the top of the gantry (2), the bottoms of the two first hydraulic rods (201) are fixedly connected to the same support plate (202), the bottom of the support plate (202) is fixedly connected to a U-shaped plate (203), one side of the U-shaped plate (203) is fixedly connected to a second hydraulic rod (204), one end of the second hydraulic rod (204) is fixedly connected to a clamping plate (205), and the clamping plate (205) slides inside the U-shaped plate (203).
3. The integrated circuit SIP packaging structure according to claim 2, characterized in that: The rotating mechanism comprises an L-plate (206), wherein the L-plate (206) is fixedly connected to one side of the support plate (202), and the surface of the L-plate (206) close to the ratchet (302) is rotatably connected to four ratchet pawls (207), and the four ratchet pawls (207) cooperate with the ratchet (302), and the surface of the four ratchet pawls (207) close to the L-plate (206) is fixedly connected to two first springs (208), and the other ends of the two first springs (208) are fixedly connected to one side of the L-plate (206).
4. The integrated circuit SIP packaging structure according to claim 3, characterized in that: The restraining mechanism comprises a limit groove (305), wherein the limit groove (305) is arranged on the inner surface of the receiving groove (304), the inner surface of the limit groove (305) is rotatably connected to a limit plate (407), the top of the limit plate (407) is fixedly connected to a limit rod (406), the limit rod (406) is slidably connected to the bottom of the rotating shaft (405), a second tension spring (409) is sleeved on the surface of the limit rod (406), and the top of the second tension spring (409) is fixedly connected to the bottom of the rotating shaft (405).
5. The integrated circuit SIP packaging structure according to claim 4, characterized in that: The bottom end of the second tension spring (409) is fixedly connected to the top of the limit plate (407); four constraint grooves (306) are provided on the top of the slider (303) near the storage groove (304); the four constraint grooves (306) are arranged in groups of two; two constraint rods (408) are symmetrically fixedly connected to the surface of the placement plate (4) near the constraint grooves (306); each group of the constraint grooves (306) cooperates with the constraint rods (408).
6. The integrated circuit SIP packaging structure according to claim 5, characterized in that: The fixing mechanism comprises a pressure plate (402), wherein the pressure plate (402) is fixedly connected to the bottom of the sliding column (401), and the top of the sliding column (401) is fixedly connected to a top plate (403), and a first tension spring (404) is sleeved on the surface of the sliding column (401) on one side close to the top plate (403), and the bottom end of the first tension spring (404) is fixedly connected to the top of the placement plate (4), and the top end of the first tension spring (404) is fixedly connected to the bottom of the top plate (403).