Package structure with separated-cavity shielding

Abstract

The utility model provides a packaging structure for cavity-divided shielding. According to the cavity-divided shielding packaging structure, a middle plastic packaging structure is installed on the front face of a second substrate, the middle plastic packaging structure comprises a first electronic element, a first plastic packaging layer and a first shielding layer, the first electronic element is wrapped by the first plastic packaging layer, and the outer surface of the first plastic packaging layer is covered by the first shielding layer; the second electronic element is mounted on the front surface of the second substrate; the second plastic package layer is formed on the front surface of the second substrate, covers the second electronic element and covers the side wall and part of the top surface of the first plastic package layer, and the second plastic package layer is provided with a via hole located in the top surface of the first plastic package layer; the second shielding layer covers the outer surface of the second plastic packaging layer and the inner surface of the via hole, and the second shielding layer is electrically connected with the first shielding layer. The packaging structure shielded by the separated cavities is small in packaging process difficulty, low in cost and high in reliability.

Description

Technical Field

[0001] The utility model relates to the technical field of packaging, in particular to a cavity-divided shielding packaging structure. Background Art

[0002] With the continuous upgrading of electronic products, emerging markets such as smartphones, 5G, and AI have put forward higher requirements for product packaging, making packaging technology develop in the direction of high dimension and high integration. System in Package (SIP) came into being. In the system-level packaging structure, the spacing between chips and passive components is getting closer and closer, and the problem of electromagnetic interference (EMI) between devices is more prominent. To solve this problem, the cavity shielding solution is widely used in system-level packaging. At present, the mainstream cavity shielding solution in the industry has the problems of difficult process, high cost and low reliability. Utility Model Content

[0003] The utility model provides a cavity-divided shielding packaging structure, which has low packaging process difficulty, low cost and high reliability.

[0004] In order to achieve the above-mentioned purpose, the utility model provides a cavity-shielded packaging structure including a second substrate, an intermediate plastic packaging structure, a second electronic component, a second plastic packaging layer and a second shielding layer. The intermediate plastic packaging structure is installed on the front of the second substrate, including a first electronic component, a first plastic packaging layer and a first shielding layer, the first plastic packaging layer wraps the first electronic component, the first shielding layer covers the side wall of the first plastic packaging layer and covers the top surface of the first plastic packaging layer facing away from the second substrate; the second electronic component is installed on the front of the second substrate; the second plastic packaging layer is formed on the front of the second substrate, covering the second electronic component and the side wall and part of the top surface of the first plastic packaging layer, the second plastic packaging layer has the via located on the top surface of the first plastic packaging layer; the second shielding layer covers the side wall of the second plastic packaging layer, covers the top surface of the second plastic packaging layer facing away from the second substrate, and covers the inner surface of the via, and the second shielding layer is electrically connected to the first shielding layer.

[0005] Optionally, the intermediate plastic packaging structure further includes a first substrate, the front side of the first substrate faces away from the front side of the second substrate, the first electronic component is mounted on the front side of the first substrate, and the first plastic packaging layer is formed on the front side of the first substrate.

[0006] Optionally, the back surface of the first substrate is welded to the front surface of the second substrate.

[0007] Optionally, the intermediate plastic packaging structure includes a plurality of first electronic components, and the first electronic components are chips or passive devices.

[0008] Optionally, the cavity-shielded packaging structure includes a plurality of intermediate plastic packaging structures, and the structures of the plurality of intermediate plastic packaging structures are different.

[0009] Optionally, the number of first electronic components in the plurality of intermediate plastic packaging structures is different or the same.

[0010] Optionally, in different intermediate plastic packaging structures, at least a portion of the first electronic components are different devices.

[0011] Optionally, the second electronic component is located between the plurality of intermediate plastic packaging structures.

[0012] Optionally, the second electronic component is a chip or a passive device.

[0013] Optionally, other electronic components are disposed on the back side of the second substrate.

[0014] In the cavity-shielded packaging structure of the utility model, a first shielding layer is formed on the surface of an intermediate packaging structure, a second plastic sealing layer formed by secondary plastic sealing is used to seal the intermediate packaging structure, and a second shielding layer is provided to cover the side walls of the second plastic sealing layer, the top surface of the second plastic sealing layer facing away from the second substrate, and the inner surface of the conductive hole. Thus, cavity shielding between the intermediate plastic sealing structure and the second electronic component is achieved; compared with the technical solution of exposing the first shielding layer by grinding after secondary plastic sealing, the technical solution of the present application can effectively avoid the stress concentration risk and delamination risk caused by grinding, and can improve the reliability of the packaging structure; compared with the technical solution of sealing all electronic components on the front side of the substrate by a primary plastic sealing layer and directly punching holes in the primary plastic sealing layer, in the present application, the distance between the top surface of the second plastic sealing layer and the top surface of the intermediate plastic sealing structure is small, and the depth of the conductive hole formed by the laser grooving process is small, so that a low-energy laser machine or a marking machine can be used to achieve grooving, which effectively reduces the packaging cost and the difficulty of the packaging process. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic cross-sectional view of a cavity-shielded packaging structure provided in one embodiment of the utility model.

[0016] Figures 2 to 9 A schematic diagram of the manufacturing process of a cavity-shielded packaging structure provided in one embodiment of the utility model.

[0017] Explanation of the reference numerals: 10 - intermediate plastic packaging structure; 101 - first substrate; 102 - first electronic component; 103 - first plastic packaging layer; 104 - first shielding layer; 201 - second substrate; 202 - second electronic component; 203 - second plastic packaging layer; 204 - via hole; 205 - second shielding layer. DETAILED DESCRIPTION

[0018] The following is a further detailed description of the cavity shielding packaging structure proposed by the utility model in combination with the accompanying drawings and specific embodiments. According to the following description, the advantages and features of the utility model will be clearer. It should be noted that the accompanying drawings are all in a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the utility model.

[0019] As used in the present invention, the singular forms "one", "an", and "the" include plural objects, unless the content clearly indicates otherwise. As used in the present invention, the term "or" is generally used in a sense that includes "and / or", unless the content clearly indicates otherwise. As used in the present invention, the term "several" is generally used in a sense that includes "at least one", unless the content clearly indicates otherwise. As used in the present invention, the term "at least two" is generally used in a sense that includes "two or more", unless the content clearly indicates otherwise. In addition, the terms "first", "second", and "third" are used only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second", and "third" may explicitly or implicitly include one or at least two of the features.

[0020] Figure 1 A schematic cross-sectional view of a cavity-shielded packaging structure provided by an embodiment of the present invention. Figure 1 As shown, the cavity-shielded packaging structure provided in the present application includes a second substrate 201, an intermediate plastic packaging structure 10, a second electronic component 202, a second plastic packaging layer 203 and a second shielding layer 205. The intermediate plastic packaging structure 10 is installed on the front of the second substrate 201, and the intermediate plastic packaging structure 10 includes a first electronic component 102, a first plastic packaging layer 103 and a first shielding layer 104. The first plastic packaging layer 103 wraps the first electronic component 102, and the first shielding layer 104 covers the side wall of the first plastic packaging layer 103 and covers the top surface of the first plastic packaging layer 103 facing away from the second substrate 201. The second electronic component 202 is installed on the front of the second substrate 201. The second plastic packaging layer 203 is formed on the front of the second substrate 201, covering the second electronic component 202 and covering part of the top surface of the first plastic packaging layer 103, and the second plastic packaging layer 203 has the through hole 204 located on the top surface of the first plastic packaging layer 103. The second shielding layer 205 covers the side walls of the second plastic packaging layer 203 , covers the top surface of the second plastic packaging layer 203 facing away from the second substrate 201 , and covers the inner surface of the via 204 . The second shielding layer 205 is electrically connected to the first shielding layer 104 .

[0021] Specifically, refer to Figure 1 As shown, the second substrate 201 has a relative front and back side. The second substrate 201 may be a printed circuit board (PCB) or a ceramic substrate, etc., but is not limited thereto. The front side of the second substrate 201 may have a plurality of pads, which may be used to install electronic components and to achieve electrical connection between the electronic components and the second substrate 201. The interior of the second substrate 201 may have a plurality of interconnected metal circuit layers, and the plurality of pads on the front side of the second substrate 201 may be electrically connected to the metal circuit layers inside the second substrate 201, and the plurality of metal circuit layers may be separated by insulating materials such as resin layers. The back side of the second substrate 201 may also have a plurality of pads, which are used to establish electrical connection between the cavity-shielded packaging structure and the outside, or to install electronic components.

[0022] The intermediate plastic packaging structure 10 is mounted on the front side of the second substrate 201 , and includes a first substrate 101 , a first electronic component 102 , a first plastic packaging layer 103 and a first shielding layer 104 .

[0023] The front side of the first substrate 101 faces away from the second substrate 201, and the back side of the first substrate 101 faces toward the second substrate 201. Figure 1 As shown, the front side of the first substrate 101 and the front side of the second substrate 201 are Figure 1 The upper surfaces of the first substrate 101 and the second substrate 201 are welded. The back surface of the first substrate 101 and the front surface of the second substrate 201 are welded, but the present invention is not limited thereto.

[0024] The first electronic component 102 is mounted on the front surface of the first substrate 201. For example, the first electronic component 102 can be soldered on the front surface of the first substrate 101, but is not limited thereto. The first electronic component 102 can be a chip or a passive device, and the passive device can be a capacitor, an inductor, or a resistor.

[0025] refer to Figure 1 As shown, the intermediate plastic packaging structure may include a plurality of first electronic components 102, where "plurality" means more than two, and the first electronic components 102 in the same intermediate plastic packaging structure may be different devices. Exemplarily, in the same intermediate plastic packaging structure, some of the first electronic components 102 may be chips, which may be flip chips or wire-bonded chips, and some of the first electronic components 102 may be passive devices, but the present invention is not limited thereto.

[0026] The first plastic encapsulation layer 103 is formed on the front side of the first substrate 101, and the first plastic encapsulation layer 103 at least covers the side surface of the first electronic component 102; illustratively, the first plastic encapsulation layer 103 also covers the surface of the first electronic component 102 away from the first substrate 101. The material of the first plastic encapsulation layer 103 includes but is not limited to epoxy molding compound (EMC). The top surface of the first plastic encapsulation layer 103 faces away from the first substrate 101 and the second substrate 201.

[0027] The first shielding layer 104 covers the sidewalls of the first plastic packaging layer 103 and the top surface of the first plastic packaging layer 103. The first shielding layer 104 self-shields the first electronic component 102 in the middle plastic packaging structure. The first shielding layer 104 can be a metal material layer, and the material of the first shielding layer 104 includes but is not limited to copper.

[0028] refer to Figure 1 As shown, the second electronic component 202 is mounted on the front surface of the second substrate 201 and is located on the side of the middle plastic packaging structure 10 .

[0029] The second electronic component 202 may be a chip or a passive device. Figure 1 As shown, the second electronic component 202 may be a flip chip, and the second electronic component 202 may be soldered on the front side of the second substrate 201. In other embodiments, the second electronic component 202 may also be a wire-bonded chip, and the back side of the second electronic component 202 may be attached to the front side of the second substrate 201, and the front side of the second electronic component 202 may be electrically connected to the front side of the second substrate 201 through a metal wire.

[0030] The cavity-divided shielding packaging structure may include a single second electronic component 202 or a plurality of second electronic components 202 .

[0031] refer to Figure 1 As shown, the cavity-shielded packaging structure includes a plurality of intermediate plastic packaging structures 10, and the structures of the plurality of intermediate plastic packaging structures 10 may be different. It should be noted that, in some embodiments, the structures of the plurality of intermediate plastic packaging structures 10 in the cavity-shielded packaging structure may also be the same.

[0032] refer to Figure 1 As shown, in this embodiment, the number of first electronic components 102 in the plurality of intermediate plastic packaging structures 10 is the same, for example, two. In other embodiments, the number of first electronic components 102 in the plurality of intermediate plastic packaging structures 10 may be different.

[0033] Exemplary, reference Figure 1As shown, in different intermediate plastic packaging structures 10 , the number of chips in the first electronic component is different, the number of passive components in the first electronic component is different, and / or the type of passive components in the first electronic component is different, but not limited thereto.

[0034] In this embodiment, the second electronic component 202 is located between a plurality of intermediate plastic packaging structures 10 , but is not limited thereto.

[0035] refer to Figure 1 As shown, the second plastic sealing layer 203 is formed on the front side of the second substrate 201, covering the second electronic component 202, and covering the side walls and part of the top surface of the first plastic sealing layer 103 of the intermediate plastic sealing structure 10. In fact, the second plastic sealing layer 203 covers the first shielding layer 104 on the side walls of the first plastic sealing layer 103 and part of the first shielding layer 104 on the top surface of the first plastic sealing layer 103.

[0036] The second plastic encapsulation layer 203 has the via hole 204 located on the top surface of the first plastic encapsulation layer 103 , and the bottom surface of the via hole 204 is located on the first shielding layer 104 so that the first shielding layer 104 is led out through the via hole 204 .

[0037] The material of the second plastic encapsulation layer 203 may be the same as that of the first plastic encapsulation layer 103 , but is not limited thereto.

[0038] refer to Figure 1 As shown, the second shielding layer 205 covers the side walls of the second plastic sealing layer 203, covers the top surface of the second plastic sealing layer 203 facing away from the second substrate 201, and covers the inner surface of the via 204. The second shielding layer 205 is electrically connected to the first shielding layer 104 through the second shielding layer 205 on the inner surface of the via 204.

[0039] There may be a plurality of via holes 204 on the top surface of each first plastic encapsulation layer 103 to increase the reliability of the electrical connection between the first shielding layer 104 and the second shielding layer 205 .

[0040] refer to Figure 1 As shown, the second shielding layer 205 may also cover the sidewalls of the second substrate 201 .

[0041] The second shielding layer 205 may be a metal layer. The material of the second shielding layer 205 may be the same as that of the first shielding layer 205 .

[0042] Illustratively, the cavity-shielded packaging structure of the present application may be a system-level packaging structure, but is not limited thereto.

[0043] The cavity-shielded packaging structure may be a double-sided packaging (DSM) structure, and other electronic components may be disposed on the back side of the second substrate 201 .

[0044] The cavity-shielded packaging structure may also be a filter module or other functional modules.

[0045] The present application also provides a method for manufacturing the above-mentioned cavity-shielded packaging structure. Figures 2 to 9 This is a schematic diagram of the manufacturing process of the cavity shielding packaging structure provided by an embodiment of the utility model. Figure 1 , Figures 2 to 9 The manufacturing method of the above-mentioned cavity-shielded packaging structure is described.

[0046] like Figure 2 As shown, a first substrate 101 is provided. The first substrate 101 has a front surface and a back surface opposite to each other. The first substrate 101 may be a printed circuit board, but is not limited thereto.

[0047] like Figure 3 As shown, the first electronic component 102 is mounted on the front surface of the first substrate 101 .

[0048] Illustratively, solder paste may be printed on the front surface of the first substrate 101 , and then the first electronic component 102 may be mounted on the front surface of the first substrate 101 . Then, a reflow process may be performed to solder the first electronic component 102 on the front surface of the first substrate 101 .

[0049] like Figure 3 As shown, a plurality of first electronic components 102 may be mounted on the front surface of the first substrate 101. Among the plurality of first electronic components 102, some of the first electronic components 102 and the remaining first electronic components 102 may be different devices; or, the plurality of first electronic components 102 may also be the same device.

[0050] like Figure 4 As shown, a first plastic encapsulation layer 103 is formed on the front surface of the first substrate 101, and the first plastic encapsulation layer 103 fully wraps the first electronic component 102. In order to reduce the thickness of the packaging structure, after the first plastic encapsulation layer 103 is formed, part of the thickness of the first plastic encapsulation layer 103 can be ground away.

[0051] refer to Figure 4 and Figure 5 As shown, the first substrate 101 may have multiple regions, and the multiple regions are separated by cutting lines. After the first plastic encapsulation layer 103 is formed, the first substrate 101 and the first plastic encapsulation layer 103 are cut along the cutting lines to obtain multiple plastic encapsulation particles.

[0052] like Figure 6 As shown, the bottom surface of the plastic encapsulated particles is placed on the carrier 105, and the first shielding layer 104 is deposited on the top surface and sidewalls of the plastic encapsulated particles to form an intermediate plastic encapsulated structure 10, and then the carrier 105 is removed. Exemplarily, multiple plastic encapsulated particles can be placed on the same carrier 105 to form the first shielding layer 104 at the same time to improve the packaging efficiency. The first shielding layer 104 can be formed on the encapsulated particles by a sputtering process.

[0053] It should be noted that the structures of the multiple plastic encapsulation particles obtained by cutting the first substrate 101 can be the same; different intermediate plastic encapsulation structures 10 in the cavity shielding packaging structure can be made separately. The structures of the multiple plastic encapsulation particles obtained by cutting the first substrate 101 can be different; different intermediate plastic encapsulation structures 10 in the cavity shielding packaging structure can be formed at the same time.

[0054] like Figure 7 As shown, the intermediate plastic package structure 10 and the second electronic component 202 are mounted on the front side of the second substrate 201. The intermediate plastic package structure 10 and the second electronic component 202 can be soldered on the front side of the second substrate 201 by solder paste.

[0055] like Figure 8 As shown, a second plastic encapsulation layer 203 is formed on the front side of the second substrate 201, and the second plastic encapsulation layer 203 covers the intermediate plastic encapsulation structure 10 and the second electronic component 202. If necessary, part of the thickness of the second plastic encapsulation layer 203 can be removed, but it is necessary to ensure that the second plastic encapsulation layer 203 covers the intermediate plastic encapsulation structure 10 to avoid damaging the first shielding layer on the surface of the intermediate plastic encapsulation structure 10.

[0056] like Fig. 9 As shown, a via hole 204 is formed in the second plastic packaging layer 203 . The via hole 204 is located on the top surface of the middle plastic packaging structure 10 and exposes the first shielding layer 104 on the surface of the middle plastic packaging structure.

[0057] In the present application, the via 204 can be formed by laser or other processes. Since the second plastic layer 203 on the top surface of the intermediate plastic packaging structure 10 is relatively thin, the laser process is relatively easy, and a low-energy laser machine or marking machine can be used to perform the slotting, which can reduce the packaging cost.

[0058] like Figure 1 As shown, a second shielding layer 205 is formed on the surface of the second plastic encapsulation layer 203, the second shielding layer 205 covers the side walls of the second plastic encapsulation layer 203, covers the top surface of the second plastic encapsulation layer 203 facing away from the second substrate 201, and covers the inner surface of the via 204, and the second shielding layer 205 is electrically connected to the first shielding layer 104. Exemplarily, the second shielding layer 205 is formed on the surface of the second plastic encapsulation layer 203 by a sputtering process, but is not limited thereto.

[0059] In the cavity-shielded packaging structure of the present application, a first shielding layer 104 is formed on the surface of an intermediate packaging structure 10, a second plastic sealing layer 203 formed by secondary plastic sealing seals the intermediate packaging structure 10, and a second shielding layer 205 is provided to cover the side walls of the second plastic sealing layer 203, the top surface of the second plastic sealing layer 203 facing away from the second substrate 201, and the inner surface of the via 204, so as to achieve cavity-shielding between the intermediate plastic sealing structure 10 and the second electronic component 202; this is similar to the technical solution of exposing the first shielding layer by grinding after secondary plastic sealing. In comparison, the technical solution of the present application can effectively avoid the stress concentration risk and delamination risk caused by grinding, and can improve the reliability of the packaging structure; compared with the technical solution of plasticizing all electronic components on the front side of the substrate with a primary plastic packaging layer and directly drilling holes in the primary plastic packaging layer, in the present application, the distance between the top surface of the second plastic packaging layer 203 and the top surface of the intermediate plastic packaging structure 10 is small, and the depth of the conductive hole 204 formed by the laser grooving process is small, so that a low-energy laser machine or marking machine can be used to achieve grooving, which effectively reduces the packaging cost and the difficulty of the packaging process.

[0060] The above description is only a description of the preferred embodiment of the utility model, and is not any limitation on the scope of rights of the utility model. Any technical personnel in this field can make possible changes and modifications to the technical solution of the utility model by using the methods and technical contents disclosed above without departing from the spirit and scope of the utility model. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the utility model without departing from the content of the technical solution of the utility model are within the protection scope of the technical solution of the utility model.

Claims

1. A cavity-shielded packaging structure, characterized in that: include: a second substrate; an intermediate plastic packaging structure, mounted on the front surface of the second substrate, comprising a first electronic component, a first plastic packaging layer and a first shielding layer, wherein the first plastic packaging layer wraps the first electronic component, and the first shielding layer covers the side walls of the first plastic packaging layer and covers the top surface of the first plastic packaging layer facing away from the second substrate; a second electronic component mounted on the front surface of the second substrate; a second plastic encapsulation layer, formed on the front surface of the second substrate, covering the second electronic component and covering the side wall and a part of the top surface of the first plastic encapsulation layer, wherein the second plastic encapsulation layer has a conducting hole located on the top surface of the first plastic encapsulation layer; as well as The second shielding layer covers the side walls of the second plastic sealing layer, covers the top surface of the second plastic sealing layer facing away from the second substrate, and covers the inner surface of the via hole, and the second shielding layer is electrically connected to the first shielding layer.

2. The cavity-shielded packaging structure according to claim 1, characterized in that: The intermediate plastic packaging structure further includes a first substrate, the front side of the first substrate faces away from the front side of the second substrate, the first electronic component is mounted on the front side of the first substrate, and the first plastic packaging layer is formed on the front side of the first substrate.

3. The cavity-shielded packaging structure according to claim 2, characterized in that: The back surface of the first substrate is welded to the front surface of the second substrate.

4. The cavity-shielded packaging structure according to claim 1, characterized in that: The intermediate plastic packaging structure includes a plurality of first electronic components, and the first electronic components are chips or passive devices.

5. The cavity-shielded packaging structure according to claim 1, characterized in that: The cavity-shielded packaging structure includes a plurality of intermediate plastic packaging structures, and the structures of the plurality of intermediate plastic packaging structures are different.

6. The cavity-shielded packaging structure according to claim 5, characterized in that: The number of first electronic components in the plurality of intermediate plastic packaging structures is different or the same.

7. The cavity-shielded packaging structure according to claim 5, characterized in that: In different intermediate plastic packaging structures, the number of chips in the first electronic component is different, the number of passive components in the first electronic component is different, and / or the type of passive components in the first electronic component is different.

8. The cavity-shielded packaging structure according to claim 5, characterized in that: The second electronic component is located between the plurality of intermediate plastic packaging structures.

9. The cavity-shielded packaging structure according to claim 1, characterized in that: The second electronic component is a chip or a passive device.

10. The cavity-shielded packaging structure according to claim 1, characterized in that: Other electronic components are arranged on the back side of the second substrate.

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