Cooling mechanism for metal stamping die

Abstract

The utility model relates to the technical field of metal stamping dies, in particular to a metal stamping die cooling mechanism which comprises a female die and a male die arranged above the female die, cooling cavities are arranged in the female die and the male die, rectangular holes communicated with the outside are formed in the cavity walls of the cooling cavities, and the rectangular holes are communicated with the outside. A rectangular frame is fixedly installed on the hole wall of the rectangular hole, a pressing plate is fixedly installed on the front side face of the rectangular frame, a plugging block is fixedly installed on the rear side face of the pressing plate and matched with the rectangular hole in an inserted mode, and a plurality of semiconductor chilling plates which are linearly arranged at equal intervals are fixedly installed on the pressing plate; the refrigeration end of the semiconductor refrigeration piece is located in the cooling cavity, the heat dissipation end of the semiconductor refrigeration piece is located on the front side of the pressing plate, and supplementing pipes communicating with the interior of the cooling cavity are fixedly installed on the female die and the male die correspondingly. Cooling operation can be carried out, and the performance of the male die and the performance of the female die can be kept stable.

Description

Technical Field

[0001] The utility model relates to the technical field of metal stamping dies, in particular to a metal stamping die cooling mechanism. Background Art

[0002] When preparing metal products, stamping operations are usually required. When stamping operations are performed, they are usually carried out in the corresponding stamping mold. This type of stamping mold usually consists of components such as a die, a punch, and a transmission part. During the metal stamping process, the mold heats up rapidly due to contact with the high-temperature molten metal. As the temperature on the mold rises, it will affect the service life of the mold and may also cause quality problems in the stamped products.

[0003] Common metal stamping dies are not equipped with cooling components inside, and timely cooling operations cannot be performed. As the temperature rises, the stability of the die will be affected. Some metal stamping dies use cooling water for cooling operations. Although the introduction of cooling water can achieve a cooling effect, the use of cooling water for cooling requires the arrangement of multiple pipelines. The number of water inlet and outlet pipelines is large, and the arrangement of pipelines will take up space, hinder other operations, affect the normal and stable progress of subsequent stamping operations, and bring inconvenience to users. In view of this, we propose a metal stamping die cooling mechanism. Utility Model Content

[0004] The utility model aims to provide a metal stamping die cooling mechanism to solve the defects mentioned in the above background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A metal stamping die cooling mechanism comprises a die and a punch arranged above the die, wherein the die and the punch are both provided with cooling chambers, the cavity wall of the cooling chamber is provided with rectangular holes connected to the outside, a rectangular frame is fixedly installed on the hole wall of the rectangular hole, a clamping plate is fixedly installed on the front side surface of the rectangular frame, a sealing block is fixedly installed on the rear side surface of the clamping plate, the sealing block is plugged into the rectangular hole, a plurality of semiconductor refrigeration plates arranged linearly and equidistantly are fixedly installed on the clamping plate, the cooling end of the semiconductor refrigeration plate is located in the cooling chamber, and the heat dissipation end of the semiconductor refrigeration plate is located on the front side of the clamping plate.

[0007] Preferably, a forming cavity is provided in the female die, and the male die is plug-fitted with the forming cavity for stamping operation.

[0008] Preferably, a convex mold plate is fixedly installed on the top of the convex mold, and a plurality of guide pillars arranged in a matrix are fixedly installed on the bottom surface of the convex mold plate. A plurality of guide holes arranged in a matrix are provided in the concave mold. The guide pillars are located in the guide holes and are plugged into and fitted with the guide holes, thereby guiding the movement of the convex mold plate.

[0009] Preferably, a sealing sleeve is sleeved on the blocking block, and the sealing sleeve is abutted between the rectangular frame and the pressing plate for sealing operation.

[0010] Preferably, a drain pipe connected to the interior of the cooling chamber is fixedly installed at the bottom of the die, and a valve is fixedly installed on the drain pipe to facilitate drainage operations before maintenance operations.

[0011] Preferably, a replenishing pipe connected to the interior of the cooling chamber is fixedly mounted on both the concave mold and the convex mold, and the replenishing pipe is used for water replenishment operation.

[0012] Preferably, a threaded tube arranged vertically upward is fixedly installed at the end of the supplementary tube, and a threaded cap is threadedly connected to the threaded tube. After the threaded cap is tightened, water can be prevented from overflowing from the threaded tube.

[0013] Preferably, a limiting ring is fixedly installed on the bottom tube body of the threaded tube, a sealing gasket is arranged on the upper surface of the limiting ring, and the threaded cover abuts against the upper surface of the sealing gasket to improve the sealing effect.

[0014] Compared with the prior art, the beneficial effects of the utility model are:

[0015] 1. The utility model sets up a cooling chamber, and sets a semiconductor refrigeration sheet in the cooling chamber, so as to ensure that when in use, the semiconductor refrigeration sheet can be used to achieve refrigeration, and the cooling chamber has the effect of cooling down. After the cooling chamber is cooled down, the die and the punch are cooled down, and the semiconductor refrigeration sheet is directly used for cooling, without the need for pipeline arrangement, and is easy to use, so as to achieve the effect of cooling down.

[0016] 2. The utility model uses fastening screws to fix the clamping plate and the rectangular frame, which is convenient for loading and unloading and maintenance of the semiconductor refrigeration plate and is easy to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0018] Figure 2 It is a cross-sectional view of the concave die and the convex die of the utility model;

[0019] Figure 3It is a schematic diagram of the explosion structure of the utility model;

[0020] Figure 4 For this utility model Figure 3 The enlarged view of point A in the middle;

[0021] Figure 5 It is a partial structural schematic diagram of the utility model.

[0022] The meaning of each number in the figure is:

[0023] 1. Concave die; 10. Forming chamber; 11. Guide hole; 12. Drain pipe; 121. Valve;

[0024] 2. convex mold plate; 20. convex mold; 21. guide column;

[0025] 3. Cooling chamber;

[0026] 4. Rectangular hole; 40. Rectangular frame;

[0027] 5. Compression plate; 50. Sealing block; 51. Semiconductor cooling sheet; 52. Sealing sleeve;

[0028] 6. Supplementary pipe; 60. Threaded pipe; 61. Limiting ring; 611. Sealing gasket; 62. Threaded cap. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0030] See also Figure 1-Figure 5 The utility model provides a technical solution: a metal stamping die cooling mechanism, comprising a die 1 and a punch 20 arranged above the die 1, a cooling chamber 3 is arranged in the die 1 and the punch 20, a rectangular hole 4 connected to the outside is arranged on the cavity wall of the cooling chamber 3, a rectangular frame 40 is fixedly installed on the hole wall of the rectangular hole 4, a clamping plate 5 is fixedly installed on the front side of the rectangular frame 40 by a plurality of fastening screws, a blocking block 50 is fixedly installed on the rear side of the clamping plate 5, the blocking block 50 is plugged into the rectangular hole 4, a plurality of semiconductor cooling sheets 51 arranged linearly and equidistantly are fixedly installed on the clamping plate 5, a cooling end of the semiconductor cooling sheet 51 is located in the cooling chamber 3, and a heat dissipation end of the semiconductor cooling sheet 51 is located on the front side of the clamping plate 5, so as to facilitate the use of the semiconductor cooling sheet 51 for cooling and realizing the temperature reduction operation.

[0031] In this embodiment, a molding chamber 10 is provided in the die 1, and the punch 20 is plugged into the molding chamber 10 for stamping operation; a punch plate 2 is fixedly installed on the top of the punch 20, and a plurality of guide pillars 21 arranged in a matrix are fixedly installed on the bottom surface of the punch plate 2, and a plurality of guide holes 11 arranged in a matrix are provided in the die 1, and the guide pillars 21 are located in the guide holes 11 and plugged into the guide holes 11, thereby guiding the movement of the punch plate 2.

[0032] Specifically, a sealing sleeve 52 is sleeved on the blocking block 50 , and the sealing sleeve 52 is pressed between the rectangular frame 40 and the pressing plate 5 for sealing operation.

[0033] Furthermore, a drain pipe 12 connected to the interior of the cooling chamber 3 is fixedly installed at the bottom of the die 1, and a valve 121 is fixedly installed on the drain pipe 12 to facilitate drainage operations before maintenance operations.

[0034] In addition, a replenishing pipe 6 connected to the interior of the cooling chamber 3 is fixedly installed on the concave mold 1 and the convex mold 20, and the replenishing pipe 6 is used for water replenishment operation.

[0035] It is worth noting that a vertically upwardly arranged threaded tube 60 is fixedly installed at the end of the supplementary tube 6, and a threaded cap 62 is threadedly connected to the threaded tube 60. After the threaded cap 62 is tightened, water can be prevented from overflowing from the threaded tube 60.

[0036] It is worth noting that a limiting ring 61 is fixedly installed on the bottom tube body of the threaded tube 60, a sealing gasket 611 is provided on the upper surface of the limiting ring 61, and the threaded cover 62 is against the upper surface of the sealing gasket 611 to improve the sealing effect.

[0037] When the metal stamping die cooling mechanism of the utility model is in use, the threaded cover 62 is opened, and a proper amount of water is introduced into the cooling chamber 3 using the threaded tube 60 and the replenishing tube 6. After the water is added, the threaded cover 62 is tightened, and then the semiconductor refrigeration sheet 51 is connected to an external power source and made to work. The semiconductor refrigeration sheet 51 starts to work and starts cooling, thereby cooling the water in the cooling chamber 3. After the water temperature in the cooling chamber 3 is reduced, the temperature on the punch 20 and the die 1 can be reduced, thereby achieving a cooling operation.

[0038] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the utility model and are not used to limit the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection of the utility model is defined by the attached claims and their equivalents.

Claims

1. A metal stamping die cooling mechanism, comprising a die (1) and a punch (20) arranged above the die (1), characterized in that: The concave mold (1) and the convex mold (20) are both provided with a cooling chamber (3), the cavity wall of the cooling chamber (3) is provided with a rectangular hole (4) connected to the outside, a rectangular frame (40) is fixedly installed on the hole wall of the rectangular hole (4), a clamping plate (5) is fixedly installed on the front side of the rectangular frame (40), a sealing block (50) is fixedly installed on the rear side of the clamping plate (5), the sealing block (50) is plugged into and matched with the rectangular hole (4), a plurality of semiconductor cooling plates (51) arranged linearly and equidistantly are fixedly installed on the clamping plate (5), the cooling end of the semiconductor cooling plate (51) is located in the cooling chamber (3), and the heat dissipation end of the semiconductor cooling plate (51) is located on the front side of the clamping plate (5).

2. The metal stamping die cooling mechanism according to claim 1, characterized in that: A forming chamber (10) is provided in the female die (1), and the male die (20) is plug-fitted with the forming chamber (10) for stamping operations.

3. The metal stamping die cooling mechanism according to claim 1, characterized in that: A convex mold plate (2) is fixedly mounted on the top of the convex mold (20), a plurality of guide pillars (21) arranged in a matrix are fixedly mounted on the bottom surface of the convex mold plate (2), a plurality of guide holes (11) arranged in a matrix are provided in the concave mold (1), and the guide pillars (21) are located in the guide holes (11) and are plugged into and fitted with the guide holes (11).

4. The metal stamping die cooling mechanism according to claim 1, characterized in that: The blocking block (50) is sleeved with a sealing sleeve (52), and the sealing sleeve (52) is pressed between the rectangular frame (40) and the pressing plate (5) for sealing operation.

5. The metal stamping die cooling mechanism according to claim 1, characterized in that: A drainage pipe (12) connected to the interior of the cooling chamber (3) is fixedly installed at the bottom of the concave mold (1), and a valve (121) is fixedly installed on the drainage pipe (12).

6. The metal stamping die cooling mechanism according to claim 1, characterized in that: A replenishing pipe (6) connected to the interior of the cooling chamber (3) is fixedly mounted on both the concave mold (1) and the convex mold (20), and the replenishing pipe (6) is used for water replenishment operations.

7. The metal stamping die cooling mechanism according to claim 6, characterized in that: A threaded tube (60) arranged vertically upward is fixedly mounted at the end of the supplementary tube (6), and a threaded cap (62) is threadedly connected to the threaded tube (60).

8. The metal stamping die cooling mechanism according to claim 7, characterized in that: A limiting ring (61) is fixedly mounted on the bottom tube body of the threaded tube (60), a sealing gasket (611) is provided on the upper surface of the limiting ring (61), and the threaded cover (62) abuts against the upper surface of the sealing gasket (611).

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