Shielding plate lifting device and vertical continuous electroplating system

Abstract

The utility model relates to the technical field of vertical continuous electroplating, and discloses a curtain board lifting device and a vertical continuous electroplating system. The shielding plate lifting device comprises shielding plates, connecting pieces and driving pieces, the shielding plates are suitable for being installed on the two opposite sides in the electroplating bath, a circuit board is suitable for being placed between the shielding plates, one ends of the connecting pieces are connected with the shielding plates in a one-to-one correspondence mode, and the driving pieces are connected with the other ends of the connecting pieces and used for driving the shielding plates to move in the height direction of the electroplating bath. The connecting piece is driven by the driving piece to adjust the height position of the shielding plate in the electroplating bath so as to adapt to circuit boards with different sizes, so that the two sides of the bottom of the circuit board are respectively shielded by the shielding plate, and a current line at the bottom of the circuit board is prevented from passing through; and the shielding effect in the electroplating process is ensured, and the electroplating uniformity of the bottom of the circuit board is accurately adjusted, so that the electroplating quality is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of vertical continuous electroplating, in particular to a shield lifting device and a vertical continuous electroplating system. Background Art

[0002] Vertical continuous plating is a metal surface treatment technology that is mainly used to deposit a uniform and precise layer of metal, such as copper, nickel, gold, etc., on a specific area of ​​a circuit board. In the VCP process, the circuit board is not stationary in a tank like traditional electroplating, but is continuously moved in multiple plating tanks through a vertical continuous conveyor system.

[0003] In the prior art, the shielding plate is usually fixed on the floating plate, and then the floating plate is placed in the electroplating tank at the bottom of the circuit board. The floating plate can usually be fine-tuned in the height direction of the electroplating tank. However, after the electroplating at the bottom of the circuit board is completed, unevenness often occurs. In particular, when the height of the circuit board is small, the distance from the bottom to the floating plate is relatively large. At this time, it is impossible to adjust the height of the floating plate to block the current line at the bottom of the circuit board, resulting in uneven electroplating at the bottom of the circuit board. Utility Model Content

[0004] In view of this, the utility model provides a shield lifting device and a vertical continuous electroplating system to solve the problem of uneven electroplating at the bottom of a circuit board in the prior art.

[0005] In a first aspect, the utility model provides a shield lifting device, comprising:

[0006] Shields are suitable for being installed on two opposite sides of the electroplating tank, and circuit boards are suitable for being placed between the shields;

[0007] A connecting piece, one end of which is connected to the shield in a one-to-one correspondence;

[0008] A driving member is connected to the other end of the connecting member and is used to drive the shield plate to move along the height direction of the electroplating tank.

[0009] Beneficial effect: This shield lifting device places the circuit board between relatively arranged shields. Since the driving member is connected to one end of the connecting member, and the other end of the connecting member is connected to the corresponding shield, the driving member drives the connecting member to adjust the height position of the shield in the electroplating tank to adapt to circuit boards of different sizes, so that the two sides of the bottom of the circuit board are respectively shielded by the shield, thereby blocking the current lines at the bottom of the circuit board, ensuring the shielding effect during the electroplating process and realizing precise adjustment of the uniformity of electroplating on the bottom of the circuit board, thereby improving the electroplating quality.

[0010] Compared with the existing technology, the shield lifting device can quickly adapt to the needs of circuit boards of different sizes, reducing the time spent on replacing shields or adjusting equipment, thereby improving the overall efficiency of the electroplating production line.

[0011] In an optional embodiment, a reinforcing plate is provided on the top of the shielding plate, the reinforcing plate is arranged at an angle with the corresponding shielding plate, and opposite sides of the reinforcing plate are arranged between the shielding plates.

[0012] Beneficial effect: By setting a reinforcing plate on the top of the shield, the overall rigidity and stability of the shield are improved, especially when the shield is raised and lowered, the shield can be effectively prevented from being deformed due to force, thereby ensuring the stability and accuracy of the shielding during the electroplating process.

[0013] In an optional embodiment, a plurality of avoidance grooves are formed on the reinforcing plate, and the plurality of avoidance grooves are arranged at intervals along the extension direction of the reinforcing plate, and each of the avoidance grooves is suitable for the nozzle to pass through.

[0014] Beneficial effect: By opening a plurality of avoidance grooves on the reinforcing plate, the nozzle in the electroplating tank can pass through the reinforcing plate, avoiding interference between the reinforcing plate and the nozzle during the lifting and lowering of the shield plate, ensuring that the electroplating liquid sprayed by the nozzle can be evenly sprayed to the area of ​​the circuit board that needs to be electroplated, thereby improving the electroplating uniformity of the circuit board. At the same time, by setting the avoidance grooves, the nozzle can be reasonably arranged, the space can be fully utilized, and the layout in the electroplating tank can be more compact.

[0015] In an optional embodiment, the shield plate is arranged vertically and the reinforcing plate is arranged horizontally.

[0016] Beneficial effects: The vertical shield directly bears the vertical force, which is conducive to maintaining the stability of the shielding effect in the electroplating tank. The horizontal reinforcement plate can enhance the horizontal rigidity and anti-deformation ability of the shield, prevent the shield from twisting or shaking due to force during the electroplating process, thereby improving the accuracy and quality of electroplating.

[0017] In an optional embodiment, a guide member is further included, and the guide member is arranged along the height direction of the electroplating tank. A first guide hole for the guide member to pass through is opened on the reinforcing plate.

[0018] Beneficial effect: Through the cooperation between the guide member and the first guide hole on the reinforcing plate, the guide member can accurately guide the lifting process of the baffle, improve the stability of the baffle during the lifting process, avoid problems such as uneven electroplating caused by shaking or deviation during the lifting process, thereby improving the accuracy and quality of the electroplating process.

[0019] In an optional embodiment, a protrusion is provided on the reinforcing plate, a second guide hole corresponding to the position of the first guide hole is opened on the protrusion, and the guide member passes through the first guide hole and the second guide hole in sequence.

[0020] Beneficial effect: By setting a protrusion on the reinforcing plate, it is convenient to open a second guide hole on the reinforcing plate corresponding to the position of the first guide hole, so that the guide member passes through the first guide hole and the second guide hole at the same time. The first guide hole and the second guide hole cooperate with the guide member to prevent the baffle from shaking, ensure that the baffle is always in a vertical state, and reduce the problem of uneven electroplating caused by the shaking of the baffle.

[0021] In an optional embodiment, it also includes a transmission shaft and a driving wheel arranged on the transmission shaft, the transmission shaft is connected to the driving member, the connecting member is a flexible cable, one end of the connecting member is connected to the raised portion on the shield plate in a one-to-one correspondence, and the other end is connected to the driving wheel.

[0022] Beneficial effect: Since the connecting member is a flexible rope, one end of the flexible rope is connected to the raised part on the shield plate one by one, and the other end is connected to the driving wheel. The driving member drives the transmission shaft to rotate and then drives the driving wheel on the transmission shaft to rotate. The forward or reverse rotation of the driving wheel is controlled to control the winding and releasing of the flexible rope, which can easily achieve precise control of the lifting and lowering of the shield plate.

[0023] In an optional embodiment, it further includes a rotating shaft and a guide wheel arranged on the rotating shaft, and the connecting member bypasses the guide wheel and is connected to the driving wheel.

[0024] Beneficial effect: By setting a guide wheel on the rotating shaft, the flexible cable bypasses the guide wheel and is connected to the driving wheel, which can change the movement trajectory and force direction of the flexible cable, thereby adapting to different equipment layouts and shield lifting paths, so that the shield can be lifted and lowered more smoothly in the electroplating tank.

[0025] In an optional embodiment, the connecting member includes a plurality of connecting members spaced apart along the length direction of the shield.

[0026] Beneficial effect: By arranging multiple connectors on the connecting member, the multiple connectors can disperse the force during the lifting and lowering process of the shield, avoiding excessive stress concentration at a single connection point, thereby improving the stability of the shield lifting and lowering, and enhancing the safety of the overall device.

[0027] In a second aspect, the utility model also provides a vertical continuous electroplating system, comprising:

[0028] A plurality of electroplating tanks are arranged along the length direction of the electroplating tanks;

[0029] A shield lifting device, wherein the shield is arranged in each of the electroplating tanks.

[0030] Beneficial effects: This vertical continuous electroplating system drives the connecting parts through the driving parts to adjust the height position of the shield in the electroplating tank to adapt to circuit boards of different sizes, so that the two sides of the bottom of the circuit board are respectively shielded by the shield, thereby blocking the current lines at the bottom of the circuit board, ensuring the shielding effect during the electroplating process and realizing precise adjustment of the uniformity of electroplating on the bottom of the circuit board, thereby improving the electroplating quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0032] Figure 1 A front view of a shield lifting device according to an embodiment of the utility model installed in an electroplating tank;

[0033] Figure 2 A side view of a shield lifting device according to an embodiment of the utility model installed in an electroplating tank;

[0034] Figure 3 A top view of a shield lifting device according to an embodiment of the utility model installed in an electroplating tank;

[0035] Figure 4 It is a front view of a shield lifting device according to an embodiment of the utility model;

[0036] Figure 5 A side view of a shutter lifting device according to an embodiment of the utility model;

[0037] Figure 6 A top view of a shield lifting device according to an embodiment of the utility model;

[0038] Figure 7 A side view of a shield lifting device according to an embodiment of the utility model installed in an electroplating tank with the shield raised.

[0039] Description of reference numerals:

[0040] 1. Shield; 2. Plating tank; 3. Circuit board; 4. Connector; 5. Driving member; 6. Reinforcing plate; 601. Avoidance groove; 602. Raised portion; 603. Second guide hole; 7. Guide member; 8. Transmission shaft; 9. Driving wheel; 10. Rotating shaft; 11. Guide wheel. DETAILED DESCRIPTION

[0041] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model.

[0042] In the related art, the shielding plate is usually fixed on the floating plate, and then the floating plate is placed in the electroplating tank at the bottom of the circuit board. The floating plate can usually be fine-tuned in the height direction of the electroplating tank. However, after the electroplating at the bottom of the circuit board is completed, unevenness often occurs. In particular, when the height of the circuit board is small, the distance from the bottom to the floating plate is relatively large. At this time, it is impossible to adjust the height of the floating plate to block the current line at the bottom of the circuit board, resulting in uneven electroplating at the bottom of the circuit board.

[0043] In order to solve the above technical problems, the following Figures 1 to 7 , describing an embodiment of the utility model.

[0044] According to an embodiment of the present utility model, on the one hand, as Figures 1 to 7 As shown, a shield lifting device is provided, including a shield 1, a connecting member 4 and a driving member 5.

[0045] Specifically, Figure 2 As shown, the shielding plates 1 are suitable for being installed on two opposite sides of the electroplating tank 2, and the circuit board 3 is suitable for being placed between the shielding plates 1 on the two opposite sides.

[0046] Specifically, Figure 2 As shown, one end of the connecting member 4 is connected to the shielding plate 1 in a one-to-one correspondence.

[0047] Specifically, Figure 2 As shown, the driving member 5 is connected to the other end of the connecting member 4 , and the driving member 5 is used to drive the shield plate 1 to move along the height direction of the electroplating tank 2 .

[0048] This shield lifting device places the circuit board 3 between the relatively arranged shields 1. Since the driving member 5 is connected to one end of the connecting member 4, and the other end of the connecting member 4 is connected to the corresponding shield 1, the driving member 5 drives the connecting member 4 to adjust the height position of the shield 1 in the electroplating tank 2 to adapt to circuit boards 3 of different sizes, so that the two sides of the bottom of the circuit board 3 are respectively shielded by the shield 1, thereby blocking the current line at the bottom of the circuit board 3, ensuring the shielding effect during the electroplating process and realizing precise adjustment of the electroplating uniformity at the bottom of the circuit board 3, thereby improving the electroplating quality.

[0049] Compared with the prior art, the shield lifting device can quickly adapt to the needs of circuit boards 3 of different sizes, reduce the time consumed by replacing the shield 1 or adjusting the equipment, and thus improve the overall efficiency of the electroplating production line.

[0050] Specifically, the shape of the baffle 1 can be selected from existing baffle shapes as needed. In the embodiment of the present application, the shape of the baffle 1 is not specifically limited.

[0051] Specifically, the connecting member 4 can be set as a steel wire rope, or can be set as a chain, a connecting rod mechanism, etc. In the embodiment of the present application, there is no specific limitation on the type of the connecting member 4.

[0052] Specifically, the driving component 5 can select an existing driving component 5 according to specific application requirements, such as: a motor, a cylinder, a linear motor, etc. In the embodiment of the present application, there is no specific restriction on the type of the driving component 5.

[0053] In one embodiment, in combination Figures 4 to 6 As shown, a reinforcing plate 6 is provided on the top of the shielding plate 1 , and the reinforcing plate 6 is arranged at an angle with the corresponding shielding plate 1 , and the reinforcing plate 6 is arranged between the shielding plates 1 on two opposite sides.

[0054] By providing a reinforcing plate 6 on the top of the shield 1, the overall rigidity and stability of the shield 1 are improved, especially when the shield 1 is lifted or lowered, the shield 1 can be effectively prevented from being deformed due to force, thereby ensuring the stability and accuracy of shielding during the electroplating process.

[0055] Specifically, the shielding plate 1 and the corresponding reinforcing plate 6 can be arranged vertically, or can be arranged at any other angle. In the embodiment of the present application, no specific limitation is imposed on the angle between the shielding plate 1 and the reinforcing plate 6.

[0056] In one embodiment, in combination Figures 4 to 6 As shown, a plurality of avoidance grooves 601 are provided on the reinforcing plate 6. The plurality of avoidance grooves 601 are arranged at intervals along the extending direction of the reinforcing plate 6. Each avoidance groove 601 is suitable for the nozzle to pass through.

[0057] By providing a plurality of avoidance grooves 601 on the reinforcing plate 6, the nozzle in the electroplating tank 2 can pass through the reinforcing plate 6, thereby avoiding interference between the reinforcing plate 6 and the nozzle during the lifting and lowering of the shielding plate 1, and ensuring that the electroplating liquid sprayed by the nozzle can be uniformly sprayed to the area of ​​the circuit board 3 that needs to be electroplated, thereby improving the electroplating uniformity of the circuit board 3. At the same time, by providing the avoidance grooves 601, the nozzles can be reasonably arranged, the space can be fully utilized, and the layout in the electroplating tank 2 can be more compact.

[0058] Specifically, in the embodiment of the present application, there is no specific limitation on the shape of the avoidance groove 601 , and the shape of the avoidance groove 601 can be adaptively set according to the structure of the nozzle.

[0059] In one embodiment, Figure 5 As shown, the shield plate 1 is arranged vertically and the reinforcing plate 6 is arranged horizontally.

[0060] The vertically arranged shielding plate 1 directly bears the vertical force, which is conducive to maintaining the stability of the shielding effect in the electroplating tank 2. The horizontally arranged reinforcing plate 6 can enhance the horizontal rigidity and anti-deformation ability of the shielding plate 1, and prevent the shielding plate 1 from twisting or shaking due to the force during the electroplating process, thereby improving the precision and quality of electroplating.

[0061] In one embodiment, in combination Figures 1 to 7 As shown, it also includes a guide member 7, which is arranged along the height direction of the electroplating tank 2, and a first guide hole (not shown in the figure) for the guide member 7 to pass through is opened on the reinforcing plate 6.

[0062] By cooperating with the first guide hole on the reinforcing plate 6, the guide member 7 can accurately guide the lifting process of the baffle 1, improve the stability of the baffle 1 during the lifting process, avoid problems such as uneven electroplating caused by shaking or deviation during the lifting process, thereby improving the accuracy and quality of the electroplating process.

[0063] Specifically, the guide member 7 can select an existing guide structure according to design requirements. For example, the guide member 7 can be a guide rod or a suspension rod for hoisting a floating plate, etc. In the embodiment of the present application, there is no specific restriction on the type and structure of the guide member 7.

[0064] In one embodiment, in combination Figures 4 to 6 As shown, a protrusion 602 is provided on the reinforcing plate 6, and a second guide hole 603 is opened on the protrusion 602. The second guide hole 603 is arranged corresponding to the position of the first guide hole, and the guide member 7 passes through the first guide hole and the second guide hole 603 in sequence.

[0065] By providing a protrusion 602 on the reinforcing plate 6, it is convenient to open a second guide hole 603 corresponding to the position of the first guide hole on the reinforcing plate 6, so that the guide member 7 passes through the first guide hole and the second guide hole 603 at the same time. The first guide hole and the second guide hole 603 cooperate with the guide member 7 to prevent the baffle 1 from shaking, ensure that the baffle 1 is always in a vertical state, and reduce the problem of uneven electroplating caused by the shaking of the baffle 1.

[0066] In one embodiment, Figure 4 As shown, it also includes a transmission shaft 8 and a driving wheel 9, the driving wheel 9 is arranged on the transmission shaft 8, and the transmission shaft 8 is connected to the driving member 5. The connecting member 4 is a flexible cable, one end of the connecting member 4 is connected to the protrusion 602 on the shield 1 in a one-to-one correspondence, and the other end of the connecting member 4 is connected to the driving wheel 9.

[0067] Since the connecting member 4 is a flexible rope, one end of the flexible rope is connected to the protrusion 602 on the baffle 1 in a one-to-one manner, and the other end is connected to the driving wheel 9. The driving member 5 drives the transmission shaft 8 to rotate, and then drives the driving wheel 9 on the transmission shaft 8 to rotate. The forward or reverse rotation of the driving wheel 9 is controlled to control the winding and release of the flexible rope, which can easily achieve precise control of the lifting and lowering of the baffle 1.

[0068] Specifically, the flexible rope can be selected from existing flexible ropes as needed. For example, the flexible rope can be a steel wire rope, a fiber rope, or a chain, etc. In the embodiment of the present application, the type of the flexible rope is not specifically limited.

[0069] In one embodiment, Figure 5 As shown, it also includes a rotating shaft 10 and a guide wheel 11 . The guide wheel 11 is arranged on the rotating shaft 10 , and the connecting member 4 bypasses the guide wheel 11 and is connected to the driving wheel 9 .

[0070] By setting a guide wheel 11 on the rotating shaft 10, the flexible cable passes around the guide wheel 11 and is connected to the driving wheel 9, which can change the movement trajectory and force direction of the flexible cable, thereby adapting to different equipment layouts and the lifting path of the baffle 1, so that the baffle 1 can be lifted and lowered more smoothly in the electroplating tank 2.

[0071] In one embodiment, Figure 4 As shown, the connecting member 4 includes a plurality of connecting members 4 arranged at intervals along the length direction of the shield 1 .

[0072] By arranging multiple connectors 4 on the connector 4, the multiple connectors 4 can disperse the force during the lifting and lowering process of the shield 1, avoiding excessive stress concentration at a single connection point, thereby improving the lifting and lowering stability of the shield 1 and enhancing the safety of the overall device.

[0073] Specifically, the plurality of connectors 4 may be arranged at uniform intervals along the length direction of the shield 1 , or may be arranged at non-uniform intervals. In the embodiment of the present application, no specific limitation is imposed on the arrangement of the plurality of connectors 4 .

[0074] The working principle of the shutter lifting device in this embodiment is described as follows:

[0075] The circuit board 3 is placed between the shield plates 1, and the height of the shield plates 1 in the electrolytic cell is adjusted according to the size of the circuit board 3, so that both sides of the bottom of the circuit board 3 are respectively shielded by the shield plates 1, thereby shielding the current lines at the bottom of the circuit board 3 from passing through, ensuring the shielding effect during the electroplating process and improving the uniformity of the electroplating.

[0076] The driving member 5 drives the transmission shaft 8 to rotate, so that the driving wheel 9 on the transmission shaft 8 rotates together, and the forward or reverse rotation of the driving wheel 9 is controlled to control the winding and releasing of the flexible cable, so as to realize the control of the lifting and lowering of the shield 1. Since the first guide hole and the second guide hole 603 on the reinforcing plate 6 cooperate with the guide member 7, the shield 1 can be prevented from shaking, ensuring that the shield 1 is always in a vertical state, and ensuring the uniformity of the electroplating of the circuit board 3.

[0077] According to an embodiment of the present utility model, on the other hand, Figures 1 to 7 As shown, a vertical continuous electroplating system is also provided, including an electroplating tank 2 and a shield lifting device.

[0078] Specifically, a plurality of electroplating tanks 2 are provided, and the plurality of electroplating tanks 2 are arranged along the length direction of the electroplating tanks. A shielding plate 1 is arranged in each electroplating tank 2.

[0079] This vertical continuous electroplating system drives the connecting member 4 through the driving member 5 and then adjusts the height position of the shield 1 in the electroplating tank 2 to adapt to circuit boards 3 of different sizes, so that the two sides of the bottom of the circuit board 3 are respectively shielded by the shield 1, thereby shielding the current line at the bottom of the circuit board 3, ensuring the shielding effect during the electroplating process and realizing precise adjustment of the electroplating uniformity at the bottom of the circuit board 3, thereby improving the electroplating quality.

[0080] It should be noted that, during the electroplating process, the height of the shielding plate 1 in each electroplating tank 2 can be set on the same horizontal plane or on different horizontal planes.

[0081] Although the embodiments of the present invention are described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations are all within the scope defined by the appended claims.

Claims

1. A shutter lifting device, characterized in that: include: A shield plate (1) is suitable for being installed on two opposite sides of the electroplating tank (2), and a circuit board (3) is suitable for being placed between the shield plates (1); A connecting member (4), one end of which is connected to the shield (1) in a one-to-one correspondence; A driving member (5) is connected to the other end of the connecting member (4) and is used to drive the shield plate (1) to move along the height direction of the electroplating tank (2).

2. The shutter lifting device according to claim 1, characterized in that: A reinforcing plate (6) is provided on the top of the shielding plate (1), the reinforcing plate (6) is arranged at an angle with the corresponding shielding plate (1), and the reinforcing plate (6) is arranged between the shielding plates (1) on two opposite sides.

3. The shutter lifting device according to claim 2, characterized in that: The reinforcing plate (6) is provided with a plurality of avoidance grooves (601), the plurality of avoidance grooves (601) being arranged at intervals along the extension direction of the reinforcing plate (6), and each avoidance groove (601) is suitable for allowing a nozzle to pass through.

4. The shutter lifting device according to claim 2, characterized in that: The shielding plate (1) is arranged vertically, and the reinforcing plate (6) is arranged horizontally.

5. The shutter lifting device according to claim 2, characterized in that: It also includes a guide member (7), which is arranged along the height direction of the electroplating tank (2), and a first guide hole for the guide member (7) to pass through is opened on the reinforcing plate (6).

6. The shield lifting device according to claim 5, characterized in that: The reinforcing plate (6) is provided with a protruding portion (602), the protruding portion (602) is provided with a second guide hole (603) corresponding to the position of the first guide hole, and the guide member (7) passes through the first guide hole and the second guide hole (603) in sequence.

7. The shield lifting device according to claim 6, characterized in that: It also comprises a transmission shaft (8) and a driving wheel (9) arranged on the transmission shaft (8), wherein the transmission shaft (8) is connected to the driving member (5), the connecting member (4) is a flexible cable, one end of the connecting member (4) is connected to the protruding portion (602) on the shield (1) in a one-to-one correspondence, and the other end is connected to the driving wheel (9).

8. The shield lifting device according to claim 7, characterized in that: It also comprises a rotating shaft (10) and a guide wheel (11) arranged on the rotating shaft (10), and the connecting member (4) bypasses the guide wheel (11) and is connected to the driving wheel (9).

9. The shield lifting device according to any one of claims 1 to 8, characterized in that: The connecting member (4) comprises a plurality of connecting members (4) arranged at intervals along the length direction of the shield (1).

10. A vertical continuous electroplating system, characterized in that: include: A plurality of electroplating tanks (2) are arranged along the length direction of the electroplating tanks (2); According to any one of claims 1 to 9, the baffle plate (1) is arranged in each of the electroplating tanks (2).

Images