Framework of side reading type sensor and sensor

Abstract

The utility model discloses a framework of a side reading type sensor, comprising a framework body which comprises an insertion sheet accommodating part and a chip accommodating part, the insertion sheet accommodating part comprises an injection molding contact surface, and the chip accommodating part is used for accommodating a chip main body; the insertion piece and the insertion piece containing part are formed in an injection molding mode, the insertion piece comprises a supporting part and a first connecting part which are connected, the supporting part is contained in the insertion piece containing part, the first connecting part is located outside the insertion piece containing part and arranged on the injection molding contact face in a protruding mode, and the first connecting part is used for being connected with a chip pin. According to the framework of the side reading type sensor, the welding effect between the insertion piece of the framework and the chip pin can be improved, and pseudo soldering is avoided. The utility model also provides a sensor.

Description

Technical Field

[0001] The utility model relates to the technical field of sensor frameworks, in particular to a framework of a side-reading sensor and a sensor. Background Art

[0002] Wheel speed sensors are sensors used in the anti-lock braking system (ABS) of automobiles. They are usually installed on wheels to monitor the vehicle speed during braking and feed the speed back to the braking system. Wheel speed sensors usually include a chip and a frame. The chip is used to process and support the working process. The frame is a support frame used to fix and protect the chip, which can improve the stability of the chip.

[0003] The frame includes a chip slot and an insert. The chip slot is used to install the chip, and the insert is used to weld the chip in the chip slot. The insert is generally molded as a whole with the frame. During the injection molding process, the injection plastic is likely to overflow onto the insert surface, affecting the subsequent welding of the insert and the chip, resulting in cold welding, thereby affecting the overall performance of the wheel speed sensor.

[0004] On the other hand, wheel speed sensors are usually divided into bottom-reading wheel speed sensors and side-reading wheel speed sensors. The reading surface of the bottom-reading wheel speed sensor is the bottom surface of the sensor, and the chip needs to be bent. It is generally large in size and difficult to apply to complex installation environments; while the reading surface of the side-reading wheel speed sensor is the side of the sensor, and the chip does not need to be bent, is small in size, and has a high degree of application flexibility. Depending on the different reading methods, the skeleton design used is also different, and there is currently no skeleton structure for the side-reading wheel speed sensor with this type of chip. Utility Model Content

[0005] The utility model aims to solve the technical problem that the inserts injected into the frame body may be attached with injection molding glue, which may cause a cold solder joint between the inserts and the chip pins. The utility model provides a frame and sensor of a side-reading sensor, which can improve the welding effect between the inserts of the frame and the chip pins and avoid the cold solder joint.

[0006] In order to solve the above technical problems, the embodiment of the utility model discloses a skeleton of a side-reading sensor, comprising:

[0007] The skeleton body comprises a sheet receiving portion and a chip receiving portion, wherein the sheet receiving portion comprises an injection-molded contact surface, and the chip receiving portion is used to receive the chip body;

[0008] The insert is injection molded with the insert accommodating portion, the insert includes a supporting portion and a first connecting portion connected to each other, the supporting portion is accommodated in the insert accommodating portion, the first connecting portion is located outside the insert accommodating portion and protrudes from the injection molding contact surface, and the first connecting portion is used to connect the chip pin.

[0009] By adopting the above-mentioned technical scheme, the embodiment of the present application provides a skeleton that can be used for a side-reading sensor, and the first connecting portion of the plug-in piece is protruded from the plug-in piece receiving portion of the skeleton body, that is, the first connecting portion is protruded relative to the injection molding contact surface of the plug-in piece receiving portion (exemplarily, the skeleton body and the plug-in piece are injection molded together in the mold, and the injection molding contact surface is the molding surface facing away from the inner wall of the mold after injection molding, which is used to contact the first connecting portion of the plug-in piece). In the process of injection molding of the plug-in piece and the plug-in piece receiving portion, the injection molding rubber will not overflow on the surface of the first connecting portion, thereby not affecting the welding of the first connecting portion and the chip pin, thereby avoiding the generation of cold solder joints.

[0010] According to another specific embodiment of the utility model, along the first direction, one side of the chip accommodating portion has a first opening, the first opening and the first connecting portion are located on the same side of the skeleton body, and the reading surface of the chip body is located at the first opening; along the second direction, one side of the chip accommodating portion has a second opening, and the second opening is used for inserting the chip body.

[0011] Currently, there are only skeletons adapted for bottom-reading sensors. Using the above-mentioned technical solution, an embodiment of the present application provides a skeleton for a side-reading sensor, thereby providing support and protection for the side-reading sensor chip. For example, the skeleton of the embodiment of the present application can be adapted to a certain universal series of chips, but is not limited to this.

[0012] According to another specific embodiment of the present utility model, the chip accommodating portion includes a first side wall, a second side wall and a bottom wall, and along a third direction, the first side wall and the second side wall are arranged opposite to each other, and the first side wall, the second side wall and the bottom wall form a accommodating cavity, and the chip body is accommodated in the accommodating cavity and abuts against the bottom wall; along the first direction, the first opening is formed between the top end of the first side wall and the top end of the second side wall; along the second direction, the side end of the first side wall, the side end of the second side wall and the side end of the bottom wall form the second opening; the first direction, the second direction and the third direction intersect with each other respectively.

[0013] According to another specific embodiment of the utility model, the skeleton body also includes a positioning protrusion, which is arranged on the side of the chip accommodating portion facing away from the injection molding contact surface along the first direction, and the positioning protrusion is provided with a positioning hole for fixing to an external mold.

[0014] Using the above technical solution, the skeleton is placed inside a mold (such as a sensor housing) and is injection molded together with the mold. A large pressure may be generated during the injection molding. The positioning bumps of the embodiment of the present application can limit the displacement of the skeleton in a first direction (i.e., the thickness direction of the skeleton) to reduce the impact strength of the injection molding compound on the skeleton and the chip in the skeleton.

[0015] According to another specific embodiment of the utility model, the skeleton body further includes at least one glue hole, along the first direction, the thickness of the insert sheet accommodating portion is greater than the thickness of the chip accommodating portion, and the glue hole is arranged in the insert sheet accommodating portion.

[0016] By adopting the above technical solution, during the injection molding process, the injection molding rubber itself will produce decomposition gas and a small amount of water vapor, resulting in air pockets inside the injection molded part. The glue holes on the skeleton body of the embodiment of the present application can adjust the wall thickness of the insert accommodating portion, thereby preventing air pockets from forming inside the insert accommodating portion.

[0017] According to another specific embodiment of the utility model, the first side wall and the second side wall are respectively provided with at least one connecting rib, a plurality of the connecting ribs are located in the accommodating cavity, and the plurality of the connecting ribs are used for interference fit with the chip body.

[0018] By adopting the above technical solution, the connecting ribs arranged on the first side wall and the second side wall can be interference-fitted with the chip body inserted into the accommodating cavity, thereby enhancing the connection strength between the chip body and the frame.

[0019] According to another specific embodiment of the utility model, the plug also includes a second connecting portion, which extends in a direction away from the plug accommodating portion and is used to connect a wiring harness or a pin, and one end of the second connecting portion is connected to the first connecting portion through the supporting portion, and the connected second connecting portion, the supporting portion, the first connecting portion and the plug accommodating portion are injection molded.

[0020] According to another specific implementation of the present invention, the chip pin is connected to the first connecting portion by spot welding.

[0021] According to another specific embodiment of the utility model, the skeleton body also includes a first positioning block and a second positioning block. Along the third direction, the first positioning block and the second positioning block are respectively arranged on both sides of the insert accommodating portion, and the first positioning block and the second positioning block are respectively used to abut against the external mold.

[0022] An embodiment of the utility model also discloses a sensor, comprising a chip, a shell and the skeleton described in any of the above embodiments, wherein the chip comprises a chip body and a chip pin, the chip body is accommodated in the chip accommodating portion of the skeleton, and the chip pin is connected to the first connecting portion of the skeleton; the chip and the skeleton are located inside the shell and are injection molded together with the shell. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A three-dimensional diagram showing the skeleton of the utility model embodiment Figure 1 ; Among them, the figure shows a chip installed on a skeleton.

[0024] Figure 2 A three-dimensional diagram showing the skeleton of the utility model embodiment Figure 2 ; Among them, the chip is not shown in the figure.

[0025] Figure 3 A cross-sectional view of the skeleton of an embodiment of the utility model is shown.

[0026] Figure 4 A three-dimensional diagram showing the skeleton of the utility model embodiment Figure 3 ; Among them, the picture shows the top view of the skeleton. DETAILED DESCRIPTION

[0027] The following is an explanation of the implementation of the present invention by specific specific embodiments. Those skilled in the art can easily understand other advantages and functions of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this utility model are limited to this implementation. On the contrary, the purpose of introducing the utility model in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description will include many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description. It should be noted that, in the absence of conflict, the embodiments in the present invention and the features in the embodiments can be combined with each other.

[0028] It should be noted that in this specification, similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0029] In the description of this embodiment, it should be noted that the terms "upper", "lower", "inner", "bottom", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the utility model product is usually placed when in use. They are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the utility model.

[0030] The terms “first”, “second”, etc. are only used for distinguishing descriptions and should not be understood as indicating or implying relative importance.

[0031] In the description of this embodiment, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this embodiment can be understood according to specific circumstances.

[0032] In order to make the purpose, technical solution and advantages of the present invention more clear, the implementation mode of the present invention will be further described in detail below with reference to the accompanying drawings.

[0033] See also Figure 1 An embodiment of the present application provides a skeleton of a side-reading sensor, including a skeleton body 1 and an insert 2, wherein the insert 2 and the skeleton body 1 are injection molded (for example, a portion of the insert 2 is embedded in the skeleton body 1).

[0034] The skeleton is used to mount the chip 3 , which includes a chip body 31 and chip pins 32 . Figure 1 Two chip pins 32 are shown by way of example, but this is not limited in the embodiment of the present application.

[0035] Based on this, the embodiment of the present application further provides a sensor, the sensor (such as a wheel speed sensor, and another example is a side-reading wheel speed sensor) comprising a chip 3, a housing (not shown in the figure) and the above-mentioned skeleton, Figure 1 The skeleton with the chip 3 mounted thereon is placed as a whole inside the mold of the shell, and then the shell is injection molded by an injection molding process. Meanwhile, the skeleton with the chip 3 mounted thereon is also correspondingly injection molded inside the shell.

[0036] See also Figure 1 and Figure 2 The skeleton body 1 includes a plug-in sheet accommodating portion 11 and a chip accommodating portion 12. The plug-in sheet accommodating portion 11 accommodates the above-mentioned plug-in sheet 2, and the chip accommodating portion 12 accommodates the above-mentioned chip 3.

[0037] For example, Figure 1 and Figure 2 As shown, the insert receiving portion 11 is a rectangular block structure, and the chip receiving portion 12 is a receiving slot structure with openings on both sides (i.e., the first opening and the second opening described later). For example, the insert receiving portion 11 and the chip receiving portion 12 can be injection molded into one piece by an injection molding process, but the embodiment of the present application is not limited thereto, that is, the insert receiving portion 11 and the chip receiving portion 12 can also be a non-integrated structure.

[0038] See also Figure 1 Combined with Figure 2 It can be seen that the chip body 31 is accommodated in the chip accommodation portion 12, and the chip pins 32 are arranged along the second direction (for example, along the length direction of the frame, such as Figure 1 The Y direction shown in FIG. 1 extends, and one end of the chip lead 32 (i.e. Figure 1 The end indicated by the Y1 direction in the figure is connected to the chip body 31, and the end is not connected to the chip body 31 in a bent structure.

[0039] See also Figure 1 and Figure 3 The insert 2 includes a first connecting portion 21 , a second connecting portion 22 , and a supporting portion 23 .

[0040] The first connecting portion 21 is located outside the insert receiving portion 11 and extends along a second direction (eg, along the length direction of the frame, such as Figure 1 Extends in the Y direction shown in FIG.

[0041] For example, Figure 1 As shown, there are two first connection parts 21, but the embodiment of the present application does not limit the number of the first connection parts 21. As long as the first connection parts 21 can be used to connect with the chip pins 32 described later, they belong to the protection scope of the embodiment of the present application.

[0042] Exemplarily, the first connection part 21 is a rectangular strip of metal, but the embodiment of the present application is not limited to this. The first connection part 21 can be made of metal materials such as copper, aluminum, and alloy. The first connection part 21 can also be in a triangular, elliptical, trapezoidal, etc. shape. As long as the first connection part 21 can be used to connect to the chip pin 32 described later, it belongs to the protection scope of the embodiment of the present application.

[0043] The support portion 23 is accommodated in the interior of the insert receiving portion 11. As an example, it can be seen that the support portion 23 is a bent structure (for example Figure 3 L-type shown in FIG.

[0044] The second connecting portion 22 is in a direction away from the insert receiving portion 11 along the second direction (i.e. Figure 1The second connection portion 22 extends in the Y2 direction shown in the figure, and the second connection portion 22 is used to connect the wiring harness or the plug pin (not shown in the figure). For example, for the sensor plug 2 with a wiring harness, the second connection portion 22 is used to connect with the wiring harness; for example, for the direct-insertion sensor plug 2, the second connection portion 22 is used to connect with the plug pin. At the same time, the second connection portion 22 is connected to the first connection portion 21 through the support portion 23.

[0045] Exemplarily, the first connection portion 21 , the second connection portion 22 and the support portion 23 are integrally formed, but this is not limited in the embodiment of the present application.

[0046] See also Figures 1 to 3 , along a first direction (e.g., along the thickness direction of the skeleton, such as Figure 1 The insert accommodating portion 11 includes an injection molding contact surface 111. By way of example, the skeleton body 1 and the insert 2 of the embodiment of the present application are integrally molded in a mold (not shown in the figure), and the injection molding contact surface 111 is a molding surface facing away from the inner wall of the mold after injection molding, and is used to contact the first connecting portion 21 of the insert 2.

[0047] Continue reading Figures 1 to 3 It can be seen that the first connection portion 21 is convexly arranged on the injection molding contact surface 111, that is, during the embedding process of a part of the insert sheet 2 and the skeleton body 1, no injection molding glue will adhere to the surface of the first connection portion 21 of the insert sheet 2. After the injection molding of the insert sheet 2 and the skeleton body 1 is completed, the chip body 31 is accommodated in the above-mentioned chip accommodating portion 12, the chip pin 32 is overlapped on the first connection portion 21, and then the chip pin 32 and the first connection portion 21 are welded (for example, spot welding).

[0048] By adopting the above technical solution, the embodiment of the present application provides a skeleton that can be used for a side-reading sensor on the one hand, and on the other hand, since the first connecting portion 21 of the insert 2 is protruding from the injection molding contact surface 111 of the skeleton body 1, during the injection molding process, the injection molding glue will not overflow on the surface of the first connecting portion 21, thereby not affecting the welding effect between the first connecting portion 21 and the chip pin 32, thereby avoiding the generation of cold solder joints.

[0049] See also Figure 2 Combined with Figure 1 In a possible implementation, along a first direction (such as Figure 2 The Z direction shown in FIG. 1 ), one side of the chip receiving portion 12 (ie Figure 2 The side indicated by the Z2 direction in the middle) has a first opening 120, that is, the first opening 120 and the first connecting portion 21 are located on the same side of the skeleton body 1 along the first direction, and the side surface of the chip body 31 (that is, Figure 1 The side indicated by the Z2 direction in the figure is located at the first opening 120 and is used as a reading surface of the sensor.

[0050] Along the second direction (such as Figure 2 Y direction shown in FIG), one side of the chip receiving portion 12 (ie Figure 2 The second opening 1200 is provided on the side indicated by the Y1 direction, and the second opening 1200 is used for inserting the chip body 31.

[0051] See also Figure 2 Combined with Figure 1 In a possible implementation manner, the chip receiving portion 12 includes a first side wall 121 , a second side wall 122 and a bottom wall 123 .

[0052] Along a third direction (e.g., along the width direction of the skeleton, such as Figure 2 The first side wall 121 and the second side wall 122 are arranged opposite to each other (in the X direction shown in FIG). The first side wall 121, the second side wall 122 and the bottom wall 123 form a receiving cavity 124. The chip body 31 is received in the receiving cavity 124 and abuts against the inner wall of the bottom wall 123.

[0053] Along the first direction, the top of the first side wall 121 (ie Figure 2 The first opening 120 is formed between the end indicated by the Z2 direction in the middle) and the top of the second side wall 122; along the second direction (such as Figure 2 Y direction shown in FIG), the side end of the first side wall 121 (ie Figure 2 The end indicated by the Y1 direction in the middle) and the side end of the second side wall 122 and the side end of the bottom wall constitute the above-mentioned second opening 1200.

[0054] In a possible implementation manner, the chip receiving portion 12 further includes a plurality of connecting ribs 125, the connecting ribs 125 extending along the second direction (eg Figure 2 The connecting ribs 125 extend in the accommodating cavity 124 and are arranged on the first side wall 121 and the second side wall 122. The multiple connecting ribs 125 are used for interference fit with the chip body 31.

[0055] See also Figure 4 Combined with Figure 1 In a possible implementation manner, the skeleton body 1 further includes a positioning protrusion 13, along the first direction (such as Figure 1 The positioning bump 13 is arranged on the side of the chip receiving portion 12 facing away from the injection molding contact surface 111 (ie, Figure 1 The positioning protrusion 13 is provided with a positioning hole 131, and the positioning hole 131 is used to fix with an external mold (not shown in the figure, such as a housing of a sensor).

[0056] See also Figure 4 Combined with Figure 1In a possible implementation, along a first direction (such as Figure 1 The thickness of the insert sheet accommodating portion 11 is greater than the thickness of the chip accommodating portion 12 . On this basis, the insert sheet accommodating portion 11 is provided with three glue removal holes 14 .

[0057] By adopting the above technical solution, the thickness of the insert accommodating portion 11 of the embodiment of the present application is greater than that of the chip accommodating portion 12. During the injection molding process, the injection molding rubber itself will produce decomposition gas and a small amount of water vapor, resulting in the formation of air pockets inside the injection molded part (i.e., the insert accommodating portion 11). Therefore, the glue hole 14 can adjust the wall thickness of the insert accommodating portion 11, thereby preventing the formation of air pockets inside the insert accommodating portion 11.

[0058] Although Figure 4 Three glue holes 14 are shown as an example, and the size of one of the glue holes 14 is larger than the sizes of the other two glue holes 14, but the embodiment of the present application does not limit the number and size of the glue holes 14. As long as they can be used to avoid the formation of air pockets in the insert accommodating portion 11, they are within the protection scope of the embodiment of the present application.

[0059] See also Figure 1 , Figure 2 and Figure 4 In a possible implementation, the skeleton body 1 further includes a first positioning block 15 and a second positioning block 16, along a third direction (for example, along the width direction of the skeleton, such as Figure 1 to Figure 2 The first positioning block 15 and the second positioning block 16 are respectively arranged on both sides of the insert receiving portion 11, and the first positioning block 15 and the second positioning block 16 are respectively used to abut against an external mold (not shown in the figure, such as a housing of a sensor).

[0060] Although the present invention has been illustrated and described with reference to certain preferred embodiments of the present invention, it should be understood by those skilled in the art that the above contents are further detailed descriptions of the present invention in combination with specific embodiments, and it cannot be determined that the specific implementation of the present invention is limited to these descriptions. Those skilled in the art may make various changes in form and details, including making several simple deductions or substitutions, without departing from the spirit and scope of the present invention.

Claims

1. A skeleton of a side-reading sensor, characterized in that: include: The skeleton body comprises a sheet receiving portion and a chip receiving portion, wherein the sheet receiving portion comprises an injection-molded contact surface, and the chip receiving portion is used to receive the chip body; The insert is injection molded with the insert accommodating portion, the insert includes a supporting portion and a first connecting portion connected to each other, the supporting portion is accommodated in the insert accommodating portion, the first connecting portion is located outside the insert accommodating portion and protrudes from the injection molding contact surface, and the first connecting portion is used to connect the chip pin.

2. The skeleton according to claim 1, characterized in that Along the first direction, one side of the chip receiving portion has a first opening, the first opening and the first connecting portion are located on the same side of the skeleton body, and the reading surface of the chip body is located at the first opening; Along the second direction, one side of the chip receiving portion has a second opening, and the second opening is used for the chip body to be inserted.

3. The skeleton according to claim 2, characterized in that: The chip receiving portion comprises a first side wall, a second side wall and a bottom wall. Along the third direction, the first side wall and the second side wall are arranged opposite to each other. The first side wall, the second side wall and the bottom wall form a receiving cavity. The chip body is received in the receiving cavity and abuts against the bottom wall. Along the first direction, the first opening is formed between the top end of the first side wall and the top end of the second side wall. Along the second direction, the side end of the first side wall, the side end of the second side wall and the side end of the bottom wall form the second opening; the first direction, the second direction and the third direction intersect with each other respectively.

4. The skeleton according to claim 1, characterized in that The skeleton body further comprises a positioning protrusion, which is arranged on a side of the chip accommodating portion facing away from the injection molding contact surface along a first direction, and a positioning hole is formed in the positioning protrusion, and the positioning hole is used for fixing with an external mold.

5. The skeleton according to claim 1, characterized in that: The skeleton body further comprises at least one glue hole. Along the first direction, the thickness of the insert sheet accommodating portion is greater than the thickness of the chip accommodating portion. The glue hole is arranged on the insert sheet accommodating portion.

6. The skeleton according to claim 3, characterized in that: The first side wall and the second side wall are respectively provided with at least one connecting rib, a plurality of the connecting ribs are located in the accommodating cavity, and the plurality of the connecting ribs are used for interference fit with the chip body.

7. The skeleton according to claim 1, characterized in that The plug-in piece also includes a second connecting portion, which extends in a direction away from the plug-in piece accommodating portion and is used to connect a wiring harness or a pin. One end of the second connecting portion is connected to the first connecting portion through the supporting portion, and the connected second connecting portion, the supporting portion, the first connecting portion and the plug-in piece accommodating portion are injection molded.

8. The skeleton according to claim 1, characterized in that The chip pin is connected to the first connection portion by spot welding.

9. The skeleton according to claim 1, characterized in that: The skeleton body further includes a first positioning block and a second positioning block. Along the third direction, the first positioning block and the second positioning block are respectively arranged on both sides of the insert receiving portion. The first positioning block and the second positioning block are respectively used to abut against an external mold.

10. A sensor, characterized in that: It comprises a chip, a shell and a skeleton as claimed in any one of claims 1 to 9, wherein the chip comprises a chip body and a chip pin, the chip body is accommodated in the chip accommodating portion of the skeleton, and the chip pin is connected to the first connecting portion of the skeleton; the chip and the skeleton are located inside the shell and are injection molded together with the shell.

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