Audio separation input / output circuit and input / output matrix

Abstract

The utility model discloses an audio separation input and output circuit and an input and output matrix, the circuit comprises a video matrix processing module, a video output module and an audio output module, the video matrix processing module is used for receiving video signals input by a video input module and executing target processing operation on the video signals, and the audio output module is used for outputting audio signals; the target output signal is obtained and transmitted to the video output module and the audio output module, the video output module is used for transmitting the video output signal to the target display device, and the audio output module is used for transmitting the audio output signal to the target audio device. Visibly, according to the utility model, the video and the audio can be de-embedded and separated intelligently so as to adapt to different video display or audio output requirements, meanwhile, a plurality of signals can be switched and distributed to a plurality of devices, 8K video signal output is realized, the video output definition is improved, and the use convenience of a user is further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of input-output matrices, in particular to an input-output circuit and an input-output matrix for audio separation. Background Art

[0002] With the continuous development of science and technology, digital electronic devices have become an indispensable part of people's daily life. More and more multimedia devices, such as game consoles, computers, Blu-ray disc players, set-top boxes, video playback boxes, TVs, monitors, etc., use HDMI interfaces as the main audio and video signal transmission interface. Various signal source output devices and display devices need to be connected through HDMI cables to transmit high-quality and stable audio and video signals.

[0003] HDMI video matrix is ​​an electronic device that can switch and distribute high-definition signals generated by multiple HDMI high-definition signal sources to multiple HDMI output display devices that support high-definition signals. At present, most HDMI video matrices on the market do not process the output signals. If the HDMI versions and resolutions of different display devices used by the user end are inconsistent, only the lowest resolution can be output. In addition, most HDMI video matrices only support a maximum output of 4K resolution, which cannot provide users with a high-definition, high-quality visual experience. In addition, most HDMI video matrices on the market do not have an audio separation function, resulting in low convenience for users. It can be seen that it is particularly important to provide a new input and output circuit to achieve audio de-embedding, improve video output clarity, and thus improve user convenience. Utility Model Content

[0004] The utility model provides an audio separation input and output circuit and an input and output matrix, which can realize audio de-embedding, improve the clarity of video output, and thus improve the convenience of user use.

[0005] In order to solve the above technical problems, the utility model discloses an audio separation input and output circuit in the first aspect, characterized in that the circuit includes a video matrix processing module, a video output module and an audio output module, wherein:

[0006] The first end of the video matrix processing module is used to electrically connect to the video input module, the second end of the video matrix processing module is electrically connected to the first end of the video output module and the first end of the audio output module respectively, the second end of the video output module is used to electrically connect to the target display device, and the second end of the audio output module is used to electrically connect to the target audio device;

[0007] The video matrix processing module is used to receive the video signal input by the video input module, and perform a target processing operation on the video signal to obtain a target output signal and transmit the target output signal to the video output module and the audio output module, wherein the target output signal includes a video output signal and an audio output signal;

[0008] The video output module is used to transmit the video output signal to the target display device;

[0009] The audio output module is used to transmit the audio output signal to the target audio device.

[0010] As an optional implementation, in the first aspect of the utility model, the circuit further includes a control module, wherein:

[0011] The first end of the control module is electrically connected to the third end of the video matrix processing module;

[0012] The control module is used to determine the output audio signal format corresponding to the video signal, so that the video matrix processing module performs the target processing operation on the video signal to obtain an audio output signal matching the output audio signal format.

[0013] As an optional implementation, in the first aspect of the utility model, the circuit further includes a signal conversion module and a signal amplification module, wherein:

[0014] The first end of the signal conversion module is electrically connected to the second end of the video matrix processing module, the second end of the signal conversion module is electrically connected to the first end of the signal amplification module, and the second end of the signal amplification module is electrically connected to the first end of the audio output module;

[0015] The signal conversion module is used to receive the first sub audio output signal transmitted by the video matrix processing module, perform a signal type conversion operation on the first sub audio output signal to obtain a first target audio output signal, and transmit the first target audio output signal to the signal amplification module, wherein the audio output signal includes the first sub audio output signal;

[0016] The signal amplification module is used to receive the first target audio output signal transmitted by the signal conversion module, perform a first signal amplification operation on the first target audio output signal, obtain the first target audio output signal after signal amplification, and transmit the first target audio output signal after signal amplification to the audio output module.

[0017] As an optional implementation, in the first aspect of the utility model, the circuit further includes a driving module, wherein:

[0018] The first end of the driving module is electrically connected to the second end of the video matrix processing module, and the second end of the driving module is used to electrically connect to the optical fiber transmitting seat;

[0019] The driving module is used to receive the second sub-audio output signal transmitted by the video matrix processing module, perform a second signal amplification operation on the second sub-audio output signal, obtain a second target audio output signal, and transmit the second target audio output signal to the optical fiber transmitting seat. The audio output signal includes the second sub-audio output signal.

[0020] As an optional implementation, in the first aspect of the utility model, the control module includes a control chip, an EDID dial circuit and a CEC circuit, wherein:

[0021] The first end of the control chip is electrically connected to the third end of the video matrix processing module, the second end of the control chip is electrically connected to the first end of the EDID dialing circuit, and the third end of the control chip is electrically connected to the first end of the CEC circuit;

[0022] The EDID dial code circuit is used to manage the video signal format of the video output signal output by the video output module, and to manage the audio signal format of the audio output signal output by the audio output module.

[0023] As an optional implementation, in the first aspect of the utility model, the circuit further includes the video input module, the video input module includes a video input chip, an input DDC processing circuit, an input HPD conversion circuit and an input ESD protection circuit, wherein:

[0024] The first end of the video input chip is electrically connected to the first end of the video matrix processing module, the second end of the video input chip is electrically connected to the first end of the input DDC processing circuit, the third end of the video input chip is electrically connected to the first end of the input HPD conversion circuit, and the fourth end of the video input chip is electrically connected to the first end of the input ESD protection circuit.

[0025] As an optional implementation, in the first aspect of the utility model, the video output module includes a video output chip, an output DDC processing circuit, an output HPD conversion circuit, an output ESD protection circuit and a current limiting protection circuit, wherein:

[0026] The first end of the video output chip is electrically connected to the second end of the video matrix processing module, the second end of the video output chip is used to electrically connect to the target display device, the third end of the video output chip is electrically connected to the first end of the output DDC processing circuit, the fourth end of the video output chip is electrically connected to the first end of the output HPD conversion circuit, the fifth end of the video output chip is electrically connected to the first end of the output ESD protection circuit, and the sixth end of the video output chip is electrically connected to the first end of the current limiting protection circuit.

[0027] As an optional implementation, in the first aspect of the utility model, the circuit further includes a video signal processing module, wherein:

[0028] The first end of the video signal processing module is used to electrically connect to the video input module, and the second end of the video signal processing module is electrically connected to the first end of the video matrix processing module;

[0029] The video signal processing module is used to receive the video signal input by the video input module, perform signal processing operations on the video signal, obtain the video signal after signal processing, and transmit the video signal after signal processing to the video matrix processing module.

[0030] As an optional implementation, in the first aspect of the utility model, the video signal input by the video input module includes four HDMI video input signals, wherein, after the video matrix processing module performs the target processing operation on the four HDMI video input signals input by the video input module, the output video output signal includes two HDMI video output signals.

[0031] The second aspect of the utility model discloses an input-output matrix, which includes an input port for receiving an HDMI video input signal, and includes an audio separation input-output circuit as described in any one of the items disclosed in the first aspect of the utility model, the HDMI video input signal is processed by the audio separation input-output circuit as described in any one of the items disclosed in the first aspect of the utility model to obtain a target output signal, and includes an output port for outputting the target output signal.

[0032] The implementation of this utility model has the following beneficial effects:

[0033] The utility model provides an input-output circuit and an input-output matrix for audio separation, the circuit includes a video matrix processing module, a video output module and an audio output module, wherein: the video matrix processing module is used to receive the video signal input by the video input module, and perform a target processing operation on the video signal, obtain a target output signal and transmit the target output signal to the video output module and the audio output module, the video output module is used to transmit the video output signal to the target display device, and the audio output module is used to transmit the audio output signal to the target audio device. It can be seen that the utility model can intelligently de-embed and separate the video and audio to adapt to different video display or audio output requirements, and can also switch and distribute multiple signals to multiple devices, realize 8K video signal output, improve video output clarity, and thus improve user convenience. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0035] Figure 1 It is a structural schematic diagram of an audio separation input and output circuit disclosed in an embodiment of the utility model;

[0036] Figure 2 It is a structural schematic diagram of a video matrix processing chip disclosed in an embodiment of the utility model;

[0037] Figure 3 This is a schematic diagram of the structure of a 3.5mm audio output module disclosed in an embodiment of the utility model;

[0038] Figure 4 It is a structural schematic diagram of another audio separation input and output circuit disclosed in an embodiment of the utility model;

[0039] Figure 5 It is a structural schematic diagram of a signal conversion module disclosed in an embodiment of the utility model;

[0040] Figure 6 It is a structural schematic diagram of a signal amplification module disclosed in an embodiment of the utility model;

[0041] Figure 7 It is a structural schematic diagram of a driving module disclosed in an embodiment of the utility model;

[0042] Figure 8 It is a structural schematic diagram of an SPDIF audio output module disclosed in an embodiment of the utility model;

[0043] Fig. 9 It is a structural schematic diagram of a control chip disclosed in an embodiment of the utility model;

[0044] Fig.10 It is a structural schematic diagram of an EDID dial code circuit disclosed in an embodiment of the utility model;

[0045] Fig.11 It is a structural schematic diagram of a CEC circuit disclosed in an embodiment of the utility model;

[0046] Fig.12 It is a structural schematic diagram of an LED selection circuit disclosed in an embodiment of the utility model;

[0047] Fig.13 It is a structural schematic diagram of another audio separation input and output circuit disclosed in an embodiment of the utility model;

[0048] Fig.14 It is a structural schematic diagram of a video input chip disclosed in an embodiment of the utility model;

[0049] Fig.15 It is a structural schematic diagram of an input DDC processing circuit disclosed in an embodiment of the utility model;

[0050] Fig.16 It is a structural schematic diagram of an input HPD conversion circuit disclosed in an embodiment of the utility model;

[0051] Fig.17 It is a structural schematic diagram of an input ESD protection circuit disclosed in an embodiment of the utility model;

[0052] Fig.18 It is a structural schematic diagram of a video output chip disclosed in an embodiment of the utility model;

[0053] Fig.19 It is a structural schematic diagram of an output DDC processing circuit disclosed in an embodiment of the utility model;

[0054] Fig. 20 It is a structural schematic diagram of an output HPD conversion circuit disclosed in an embodiment of the utility model;

[0055] Fig.21 It is a structural schematic diagram of an output ESD protection circuit disclosed in an embodiment of the utility model;

[0056] Fig. 22 It is a structural schematic diagram of a current limiting protection circuit disclosed in an embodiment of the utility model;

[0057] Fig.23It is a structural schematic diagram of a video signal processing chip disclosed in an embodiment of the utility model;

[0058] Fig.24 It is a structural diagram of an input-output matrix disclosed in an embodiment of the utility model. DETAILED DESCRIPTION

[0059] For better understanding and implementation, the technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0060] It should be noted that, unless otherwise clearly specified and limited, the term "electrical connection" in the specification and claims of the utility model and the above-mentioned drawings should be understood in a broad sense. For example, it can be a fixed electrical connection, a detachable electrical connection, or an integral electrical connection; it can be a mechanical electrical connection, an electrical electrical connection, or can communicate with each other; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. In addition, the terms "first", "second", etc. in the specification and claims of the utility model and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. The terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For those of ordinary skill in the art, the specific meanings of the above terms in the utility model can be understood according to specific circumstances.

[0061] The utility model discloses an audio separation input and output circuit and an input and output matrix, which can intelligently de-embed and separate video and audio to meet different video display or audio output requirements, and can switch and distribute multiple signals to multiple devices to achieve 8K video signal output, improve video output clarity, and thus improve user convenience. The following is a detailed description of each.

[0062] Embodiment 1

[0063] See also Figure 1 , Figure 1 This is a schematic diagram of the structure of an audio separation input and output circuit disclosed in an embodiment of the utility model. The audio separation input and output circuit can separate and de-embed the audio from the video, which is beneficial to improving the intelligence of audio de-embedding. It can also switch and distribute multiple signals to multiple devices to achieve 8K video signal output, improve the clarity of video output, and thus improve the convenience of user use. This utility model embodiment does not limit this. Figure 1 As shown, the audio separation input and output circuit includes: a video matrix processing module 101, a video output module 102 and an audio output module 103, wherein:

[0064] The first end of the video matrix processing module 101 is used to electrically connect to the video input module 104, the second end of the video matrix processing module 101 is electrically connected to the first end of the video output module 102 and the first end of the audio output module 103, the second end of the video output module 102 is used to electrically connect to the target display device 105, and the second end of the audio output module 103 is used to electrically connect to the target audio device 106;

[0065] The video matrix processing module 101 is used to receive the video signal input by the video input module 104, and perform a target processing operation on the video signal to obtain a target output signal and transmit the target output signal to the video output module 102 and the audio output module 103, wherein the target output signal includes a video output signal and an audio output signal;

[0066] The video output module 102 is used to transmit the video output signal to the target display device 105;

[0067] The audio output module 103 is used to transmit the audio output signal to the target audio device 106 .

[0068] In an embodiment of the utility model, optionally, the video input module 104 may include four HDMI video input modules, wherein the four HDMI video input modules may include a first HDMI video input module, a second HDMI video input module, a third HDMI video input module, and a fourth HDMI video input module. Further, the video input module may collect four HDMI video signals.

[0069] In the embodiment of the utility model, the video matrix processing module 101 may optionally include a four-input and two-output video matrix processing module, wherein the four-input and two-output video matrix processing module can connect four HDMI video input signals, perform target processing operations on the four HDMI video input signals, and output two HDMI video output signals; the four-input and two-output video matrix processing module may include a video matrix processing chip, such as Figure 2 As shown, Figure 2 : is a schematic diagram of the structure of a video matrix processing chip disclosed in an embodiment of the utility model, wherein the components included in the video matrix processing chip and the connection method between the components can be as follows Figure 2 As shown, the four-input and two-output video matrix processing module can be composed of at least one KM864807 chip with equalizer gain control and peripheral circuits, that is, the video matrix processing chip is a KM864807 chip.

[0070] Furthermore, the four-input and two-output video matrix processing module can be used to perform audio and video separation operations on four HDMI video input signals to obtain target output signals including video output signals and audio output signals; further, the output two HDMI video output signals include 8K video signals.

[0071] In the embodiment of the utility model, optionally, the audio output module 103 may include a 3.5mm audio output module, such as Figure 3 As shown, Figure 3 : is a schematic diagram of the structure of a 3.5mm audio output module disclosed in an embodiment of the utility model, wherein the components included in the 3.5mm audio output module and the connection method between the components can be as follows Figure 3 As shown, the 3.5mm audio output module may include a 3.5mm audio socket interface. Further, the target audio device connected to the 3.5mm audio socket interface may include one or more of a smart headphone device, a smart playback device, etc., which is not specifically limited in the embodiment of the utility model.

[0072] In the embodiments of the utility model, optionally, the target display device may include a smart phone, a smart computer, a smart tablet, an LED screen, or the like that can be used to display video information; the target audio device may include a smart headset, a smart phone, a smart computer, a smart tablet, a smart radio, a smart player, or the like that can be used to play audio information, and the embodiments of the utility model do not make specific limitations.

[0073] It can be seen that implementation Figure 1 The described audio separation input and output circuit can perform target processing operations on the video signal input by the received video input module through the video matrix processing module, and transmit the obtained video output signal to the video output module, and transmit the obtained audio output signal to the audio output module, and transmit the video output signal and the audio output signal to the target display device and the target audio device through the video output module and the audio output module respectively, and can intelligently de-embed and separate the video and audio to adapt to different video display or audio output requirements, and can also switch and distribute multiple signals to multiple devices to achieve 8K video signal output, improve video output clarity, and thereby improve user convenience.

[0074] In an optional embodiment, if Figure 4 As shown, Figure 4 1 is a schematic diagram of the structure of another audio separation input and output circuit disclosed in an embodiment of the utility model. The audio separation input and output circuit also includes: a control module 107, wherein:

[0075] A first terminal of the control module 107 is electrically connected to a third terminal of the video matrix processing module 101;

[0076] The control module 107 is used to determine the output audio signal format corresponding to the video signal, so that the video matrix processing module 101 performs a target processing operation on the video signal to obtain an audio output signal matching the output audio signal format.

[0077] In this optional embodiment, optionally, the control module 107 may include an MCU control module, and the MCU control module 105 is an electronic control module 105 based on a microcontroller (MCU), which is widely used in various electronic devices and systems. It is usually composed of an MCU and other auxiliary circuits, and can realize various control, calculation and data processing functions. The MCU controller usually includes modules such as a CPU, a memory, an input and output interface, a timer, an ADC, and a DAC. Through these modules, the MCU control module 105 can realize automatic control, such as controlling the operation of equipment such as motors, switches, and lights, and meeting various automatic control requirements. In addition, it can also process various data, such as collecting sensor data, processing sound image data, etc. In terms of communication, the MCU control module 105 can communicate and control with other devices, such as exchanging data and communicating through serial ports, Ethernet, wireless networks, etc. Specifically, the MCU control module may be composed of a GD32F330CBT6 chip with an ARM-M4 CPU core and a storage capacity of 64KB and peripheral circuits. The electrical connection between the control module 107 and the video matrix processing module 101 may include connection through an IIC bus connection, wherein IIC, also known as Inter-Integrated Circuit, is a two-wire serial bus developed by Philips for connecting a microcontroller and its peripheral devices. It is a synchronous, half-duplex, bidirectional two-wire serial bus consisting of two buses: a serial clock line SCL and a serial data line SDA. The SCL line is responsible for generating a synchronous clock pulse, while the SDA line is responsible for transmitting serial data between devices.

[0078] In this optional embodiment, the control module 107 is optionally used to determine the output audio signal format corresponding to the video signal, so that the video matrix processing module 101 performs a target processing operation on the video signal to obtain an audio output signal that matches the output audio signal format.

[0079] It can be seen that the implementation of this optional embodiment can connect the control module with the video matrix processing module and determine the output audio signal format corresponding to the video signal, so that the video matrix processing module performs the target processing operation on the video signal to obtain an audio output signal that matches the output audio signal format, which can ensure the format matching of the video signal and the audio signal when they are output. By ensuring the format matching of the two, the accuracy and smoothness of the synchronous playback of audio and video can be significantly improved.

[0080] In another optional embodiment, Figure 4 As shown, the audio separation input and output circuit also includes: a signal conversion module 108 and a signal amplification module 109, wherein:

[0081] A first end of the signal conversion module 108 is electrically connected to a second end of the video matrix processing module 101, a second end of the signal conversion module 108 is electrically connected to a first end of the signal amplification module 109, and a second end of the signal amplification module 109 is electrically connected to a first end of the audio output module 103;

[0082] The signal conversion module 108 is used to receive the first sub audio output signal transmitted by the video matrix processing module 101, perform a signal type conversion operation on the first sub audio output signal, obtain a first target audio output signal, and transmit the first target audio output signal to the signal amplification module 109, wherein the audio output signal includes the first sub audio output signal;

[0083] The signal amplification module 109 is used to receive the first target audio output signal transmitted by the signal conversion module 108, perform a first signal amplification operation on the first target audio output signal, obtain the first target audio output signal after signal amplification, and transmit the first target audio output signal after signal amplification to the audio output module 103.

[0084] In this optional embodiment, optionally, as Figure 5 As shown, Figure 5 is a schematic diagram of a structure of a signal conversion module disclosed in an embodiment of the utility model, wherein the components included in the signal conversion module and the connection method between the components can be as follows Figure 5As shown. Among them, the signal conversion module 108 includes a D / A conversion module, wherein the D / A conversion module, also known as a digital-to-analog conversion module, mainly functions to convert digital signals into analog signals. For example, in the field of industrial automation, the D / A conversion module can be used to convert control signals generated by a computer into analog signals to drive actuators, such as motors, valves, etc. In the field of instrumentation, it can convert digital display values ​​into analog outputs for more accurate measurement and calibration. Further, the D / A conversion module can be composed of a CS4344 chip and peripheral circuits, or a HT5010 chip and peripheral circuits, wherein the CS4344 chip includes a 10-pin, 24-bit, 192kHz stereo digital-to-analog converter (DAC). It is a complete stereo digital-to-analog output system, including functions such as interpolation, multi-bit D / A conversion, and output analog filtering. CS:4344 supports major audio data interface formats, such as I2 S, etc., and has the ability to automatically detect sampling rates up to 192kHz.

[0085] In this optional embodiment, optionally, the first sub-audio output signal may include an IIS digital signal de-embedded from the KM864807 chip in the video matrix processing module 101, and the D / A conversion module converts the IIS digital signal into an analog signal and outputs the analog signal to the signal amplification module.

[0086] In this optional embodiment, optionally, as Figure 6 As shown, Figure 6 is a schematic diagram of a structure of a signal amplification module disclosed in an embodiment of the utility model, wherein the components included in the signal amplification module and the connection method between the components can be as follows Figure 6As shown. Among them, the signal amplification module 109 includes an amplification circuit module, which is an electronic circuit system mainly used to increase the amplitude of the input signal and keep the relative amplitude of the output signal and the input signal unchanged. The amplification circuit module is usually composed of an amplifier, a power supply, and an input and output interface. Its core part is the amplifier, which provides a signal with a corresponding amplitude change at the output end according to the amplitude change of the input signal. Further optionally, the signal amplification module 109 may include an OPAMP circuit, wherein the OPAMP circuit is also an operational amplifier circuit, and the operational amplifier circuit is a common integrated circuit device in electronic circuits. The OPAMP circuit is mainly composed of an input stage, a differential amplifier stage, and an output stage. The input stage provides a high input impedance and differential input function for the differential amplifier. The differential amplifier stage amplifies the input signal, and the output stage converts the voltage after the signal is amplified into a current output; further, the differential input of the operational amplifier can accept two input signals, namely, a positive phase input and a negative phase input. Through the difference between the two input signals, the operational amplifier can amplify the differential signal. This differential input design enables the operational amplifier to offset some noise and interference in practical applications, thereby improving the quality of the signal. Furthermore, the operational amplifier has a very high amplification factor, which can reach several thousand or even tens of thousands of times. This enables the operational amplifier to amplify weak input signals to a large enough amplitude for subsequent circuit processing, and the high amplification factor also enables the operational amplifier to provide stable gain in the negative feedback circuit.

[0087] In this optional embodiment, the amplifier circuit module optionally includes an operational amplifier TL082 subcircuit with dual power supply function and peripheral subcircuits, wherein the TL082 subcircuit is a dual operational amplifier integrated circuit with a gain bandwidth product (Typ) of 3MHz, which means that it can maintain stable amplification performance over a wide frequency range. In addition, the TL082 also has characteristics such as low offset current and low input bias current, which helps to reduce noise and distortion in the circuit.

[0088] In this optional embodiment, optionally, the analog signal output by the D / A conversion module is amplified by the operational amplifier TL082 to obtain an amplified first target audio output signal, and the amplified first target audio output signal is transmitted to the audio output module 103 for output.

[0089] It can be seen that the implementation of this optional embodiment can perform a signal type conversion operation on the first sub-audio output signal through the signal conversion module to obtain a first target audio output signal, and transmit the first target audio output signal to the signal amplification module, which can enhance the signal compatibility of the system, so that the system can process input signals of various formats, and effectively remove noise and interference in the original signal to improve the signal-to-noise ratio and clarity of the audio signal, and is also beneficial to improving the accuracy and integrity of the audio signal and thus improving the quality of the obtained output audio signal; performing a first signal amplification operation on the first target audio output signal through the signal amplification module, and transmitting the obtained first target audio output signal after signal amplification to the audio output module, can significantly enhance the strength of the output audio signal, and make the output audio signal reach a level suitable for driving the audio output device, improve the signal compatibility and the quality of the audio signal, enhance the flexibility and adaptability of the system, and is also beneficial to improving the user experience.

[0090] In yet another optional embodiment, Figure 4 As shown, the audio separation input and output circuit also includes: a driving module 110, wherein:

[0091] The first end of the driving module 110 is electrically connected to the second end of the video matrix processing module 101, and the second end of the driving module 110 is used to electrically connect to the optical fiber transmitting seat 111;

[0092] The driving module 110 is used to receive the second sub-audio output signal transmitted by the video matrix processing module 101, perform a second signal amplification operation on the second sub-audio output signal, obtain a second target audio output signal, and transmit the second target audio output signal to the optical fiber transmitting seat 111. The audio output signal includes the second sub-audio output signal.

[0093] In this optional embodiment, optionally, as Figure 7 As shown, Figure 7 is a schematic diagram of a structure of a driving module disclosed in an embodiment of the utility model, wherein the components included in the driving module and the connection method between the components can be as follows Figure 7As shown. Among them, the driving module includes an SPDIF driving circuit module, wherein the SPDIF driving circuit module is a circuit module specifically used to drive the SPDIF signal. SPDIF is a digital audio transmission interface standard, which is usually used to transmit compressed audio signals, such as AC3 signals, or to transmit original audio signals from a CD player to an audio receiving end. Further, the SPDIF driving circuit module can amplify and drive the signal, that is, the SPDIF driving circuit module can receive the SPDIF signal and amplify it to an appropriate level through an internal amplifier circuit to drive subsequent audio devices or interfaces; and the SPDIF driving circuit module can shape and stabilize the signal, that is, in order to ensure the accuracy and stability of the SPDIF signal, the driving circuit module usually shapes the signal to eliminate possible noise or distortion and ensure the quality of the signal; and the SPDIF driving circuit module can match and convert the interface: the SPDIF driving circuit module may also have the function of interface matching and conversion to meet the connection requirements between different devices or systems. In this way, the accuracy and reliability of SPDIF signal transmission can be ensured through the SPDIF driving circuit module included in the driving module 108, and the stability of SPDIF signal transmission by the SPDIF driving circuit module can be ensured, which is conducive to providing a strong guarantee for high-quality output audio signals and audio experience.

[0094] In this optional embodiment, optionally, as Figure 8 As shown, Figure 8 : is a schematic diagram of the structure of an SPDIF audio output module disclosed in an embodiment of the utility model, wherein the components included in the SPDIF audio output module and the connection method between the components can be as follows Figure 8 As shown. The SPDIF audio output module may include an optical fiber transmitter 111, which is also called an optical fiber transmitter. It is an electronic device used for signal transmission, and its main function is to convert electrical signals into optical signals and transmit them to optical fibers; further, the optical fiber transmitter can achieve a higher data transmission speed, which is conducive to improving the efficiency and quality of data transmission; and, by transmitting data through the optical fiber transmitter, long-distance data transmission can be achieved, and the data transmission quality can be improved during the long-distance transmission process. The optical fiber transmitter can be connected to a power amplifier and other devices that support audio formats of more than two channels or Dolby format.

[0095] In this optional embodiment, optionally, the second sub-audio output signal may include a digital signal SPDIF de-embedded from the KM864807 chip in the video matrix processing module 101, and a second amplification operation is performed on the second sub-audio output signal through an amplifier circuit composed of two transistors in the driving module 110 to obtain a second target audio output signal, and the second target audio output signal is transmitted to the optical fiber transmitting seat 111.

[0096] It can be seen that the implementation of this optional embodiment can perform a second signal amplification operation on the second sub-audio output signal transmitted by the video matrix processing module through the driving module to obtain a second target audio output signal, and transmit the second target audio output signal to the optical fiber transmitting seat, thereby realizing further processing and efficient transmission of the audio signal, and can output not only two-channel audio signals, but also multi-channel audio signals or Dolby format audio signals, which is beneficial to improving the signal compatibility and the quality of the audio signal, enhancing the flexibility and adaptability of the system, and is also beneficial to improving the user experience.

[0097] In yet another optional embodiment, the control module 107 includes a control chip, an EDID dialing circuit and a CEC circuit, wherein:

[0098] The first end of the control chip is electrically connected to the third end of the video matrix processing module 101, the second end of the control chip is electrically connected to the first end of the EDID dialing circuit, and the third end of the control chip is electrically connected to the first end of the CEC circuit;

[0099] The EDID dial code circuit is used to manage the video signal format of the video output signal output by the video output module 102 , and to manage the audio signal format of the audio output signal output by the audio output module 103 .

[0100] In this optional embodiment, optionally, as Fig. 9 As shown, Fig. 9 is a schematic diagram of the structure of a control chip disclosed in an embodiment of the utility model, wherein the components included in the control chip and the connection method between the components can be as follows Fig. 9 As shown;

[0101] Further, such as Fig.10 As shown, Fig.10 1 is a schematic diagram of the structure of an EDID dial code circuit disclosed in an embodiment of the utility model, wherein the components included in the EDID dial code circuit and the connection method between the components can be as follows Fig.10 As shown;

[0102] Further, such as Fig.11 As shown, Fig.11: is a schematic diagram of a CEC circuit disclosed in an embodiment of the utility model, wherein the components included in the CEC circuit and the connection method between the components can be as follows: Fig.11 shown.

[0103] In this optional embodiment, optionally, the control chip may include a GD32F330CBT6 chip with an ARM-M4 CPU core and a storage capacity of 64KB.

[0104] In this optional embodiment, the EDID dial-up circuit can be used to control the signal format of the video output signal output by the video output module 102, and to control the signal format of the first target audio output signal output by the audio output module 103, and also to control the signal format of the second target audio output signal output by the driver module 110. Specifically, when the GPIO0 pin of the EDID dial-up circuit is 1 and the GPIO1 pin is 1, the input and output circuit of the audio separation is EDID. COPY mode, at this time, the EDID of the first external target device is copied, and the remaining seven outputs output signals according to the EDID of the first channel. When the GPIO0 pin of the EDID dial circuit is 0 and the GPIO1 pin is 0, the input and output circuit of this audio separation is in EDIDCompose mode. At this time, the EDID is compared, and the signal of the corresponding format is adaptively output according to the EDID of the target device. When the GPIO0 pin of the EDID dial circuit is 0 and the GPIO1 pin is 1, the signal distribution circuit of this adaptive gain adjustment fixedly outputs 4K or 2K signals. When the GPIO0 pin of the EDID dial circuit is 1 and the GPIO1 pin is 0, the signal distribution circuit of this adaptive gain adjustment fixedly outputs 8K signals.

[0105] In this optional embodiment, optionally, the CEC circuit is mainly related to the communication and control between HDMI interface devices. It is a bidirectional data signal with a high level of 3.3V. When the level of the HDMI source controller chip is inconsistent with this level, a level conversion is required, which can be achieved by a level conversion chip or using an NMOS level conversion circuit. At the same time, the CEC signal is usually an open-drain output in the HDMI source controller chip, so a pull-up resistor is required; further, the CEC bus can transmit addresses, commands, data, etc. on one cable, thereby realizing control of all devices connected to the HDMI interface.

[0106] In this optional embodiment, optionally, as Fig.12 As shown, Fig.12 is a schematic diagram of a structure of an LED selection circuit disclosed in an embodiment of the utility model, wherein the components included in the LED selection circuit and the connection method between the components can be as follows Fig.12As shown. Optionally, the fourth end of the control chip is electrically connected to the first end of the LED selection circuit, wherein the user can select the corresponding channel through the button in the LED selection circuit and transmit it to the control module 107 so that the control module 107 knows the output video or audio signal format corresponding to the video signal. For example, when the selected channel is LED1 channel, the level output by the LED selection circuit consists of a high level 1 and a low level 0, and the output level enters the IO port of the MCU to detect the current state, such as outputting 1111 when the four-speed dial switches are all turned to a high level, and determining that the output audio signal format corresponding to the video signal is PC Control Mode.

[0107] It can be seen that the implementation of this optional embodiment can connect the video matrix processing module through the control chip and determine the output audio signal format corresponding to the video signal, so that the video matrix processing module performs the target processing operation on the video signal to obtain an audio output signal that matches the output audio signal format, which can ensure the format matching of the video signal and the audio signal when they are output. By ensuring the format matching of the two, the accuracy and smoothness of the synchronous playback of audio and video can be significantly improved; the output audio signal format corresponding to the video signal can be determined through the EDID dip switch, which is conducive to improving the accuracy and reliability of determining the output audio signal format corresponding to the video signal; the CEC circuit can achieve rapid response and precise control of HDMI devices, improve the response speed and control accuracy of the system, and also enhance the flexibility and scalability of the system, improve the reliability of the system, make the entire system more efficient, stable, reliable and flexible, and can meet various complex application requirements.

[0108] In yet another optional embodiment, Fig.13 As shown, Fig.13 It is a structural diagram of another audio separation input and output circuit disclosed in an embodiment of the utility model. The audio separation input and output circuit also includes: a video input module 104, the video input module 104 includes a video input chip, an input DDC processing circuit, an input HPD conversion circuit and an input ESD protection circuit, wherein:

[0109] A first end of the video input chip is electrically connected to a first end of the video matrix processing module 101, a second end of the video input chip is electrically connected to a first end of the input DDC processing circuit, a third end of the video input chip is electrically connected to a first end of the input HPD conversion circuit, and a fourth end of the video input chip is electrically connected to a first end of the input ESD protection circuit.

[0110] In this optional embodiment, optionally, as Fig.14 As shown, Fig.14is a schematic diagram of the structure of a video input chip disclosed in an embodiment of the utility model, wherein the components included in the video input chip and the connection method between the components can be as follows Fig.14 As shown;

[0111] Further, such as Fig.15 As shown, Fig.15 : is a schematic diagram of the structure of an input DDC processing circuit disclosed in an embodiment of the utility model, wherein the components included in the input DDC processing circuit and the connection method between the components can be as follows Fig.15 As shown;

[0112] Further, such as Fig.16 As shown, Fig.16 : is a schematic diagram of the structure of an input HPD conversion circuit disclosed in an embodiment of the utility model, wherein the components included in the input HPD conversion circuit and the connection method between the components can be as follows Fig.16 As shown;

[0113] Further, such as Fig.17 As shown, Fig.17 : is a schematic diagram of the structure of an input ESD protection circuit disclosed in an embodiment of the utility model, wherein the components included in the input ESD protection circuit and the connection method between the components can be as follows Fig.17 shown.

[0114] In this optional embodiment, optionally, the video input chip can be a HDMI_A_SMD chip.

[0115] In this optional embodiment, optionally, the input DDC processing circuit includes a DDC processing circuit, wherein the DDC processing circuit is the abbreviation of a digital downconverter processing circuit, which is used in a communication system to mix with a sinusoidal signal (local oscillator) generated by a local oscillator, thereby changing the frequency band in which the signal is located. Specifically, increasing the frequency is up-conversion, and reducing the frequency is down-conversion. Wherein, the DDC processing circuit includes at least one pull-up resistor, wherein the pull-up resistor is a resistor device, and its main function is to pull a certain signal pin to a high level so that the signal remains in a high level state. The pull-up resistor is usually used together with the pull-down resistor to control the signal transmission and logic function of the circuit. Further, the input signal of the video input chip is maintained at a high level of the signal by the pull-up resistor, which can avoid the signal from having a bad level, can be conducive to improving the accuracy and reliability of the input signal, and can improve the driving ability of the video input chip.

[0116] In this optional embodiment, the input HPD conversion circuit may optionally include an HPD input level conversion circuit, wherein the HPD input level conversion circuit is a circuit specifically used to process HPD (high voltage discharge) signals, and its main function is to convert the level of the input HPD signal into a range suitable for subsequent circuit processing. For example, if the voltage corresponding to the device connected to the video input chip is 5V, and the operating voltage corresponding to the video input chip is 3.3V, then the voltage corresponding to the device connected to the video input chip does not match the voltage corresponding to the video input chip, then the HPD conversion submodule performs a level conversion operation, converting the voltage corresponding to the device connected to the video input chip of 5V to the voltage corresponding to the video input chip of 3.3V, so as to ensure the normal operation of the chip and prevent the chip from being damaged by high voltage.

[0117] In this optional embodiment, the input ESD protection circuit may include an ESD protection circuit, wherein the ESD protection circuit is a circuit design for protecting electronic components from external electrostatic discharge damage. Electrostatic discharge refers to a short-term high-voltage discharge phenomenon caused by an imbalance of charge, which can cause irreversible damage to sensitive electronic devices. The design goal of the ESD protection circuit is to guide the energy of external electrostatic discharge to a safe place to prevent it from causing damage to electronic equipment.

[0118] In this optional embodiment, optionally, for example, the HDMI input signal is collected through the video input chip, and an electrostatic protection operation is performed on the video input chip through the input ESD protection circuit to prevent external static electricity from entering the video input chip and causing damage to the video input chip, and the driving capability of the video input chip is improved through the input DDC processing circuit, and a level conversion operation is performed through the input HPD conversion circuit, which can effectively protect the video input chip from being damaged by external high voltage.

[0119] It can be seen that the implementation of this optional embodiment can enable the video input chip in the video input module to collect HDMI video input signals, and improve the driving capability of the video input chip through the input DDC processing circuit, eliminate the influence of the outside world on the video input chip through the input ESD protection circuit, and perform level conversion operations through the input HPD conversion circuit. The driving capability of the video input chip can be effectively improved through the input DDC processing submodule, which is beneficial to improving the stability and high quality of the HDMI input signal during data transmission, and can reduce signal attenuation and distortion when transmitting over long distances or in complex environments, thereby improving the performance of the overall system, and through the input ESD protection circuit. The circuit can effectively absorb and disperse the energy of electrostatic discharge, protect the video input chip from damage, and improve the stability and reliability of the equipment. The input HPD conversion circuit can help ensure that the signals between different modules can be correctly matched and transmitted, avoiding signal distortion or errors caused by level mismatch. Among them, level conversion is a key step in circuit design. It can make the entire system more flexible and compatible, which is conducive to improving the flexibility and compatibility of the video input chip, thereby achieving the improvement and protection of the performance of the video input chip, and at the same time improving the stability and reliability of the entire system, which is conducive to improving the accuracy, reliability and intelligence of the adaptive gain adjustment.

[0120] In yet another optional embodiment, the video output module includes a video output chip, an output DDC processing circuit, an output HPD conversion circuit, an output ESD protection circuit, and a current limiting protection circuit, wherein:

[0121] The first end of the video output chip is electrically connected to the second end of the video matrix processing module, the second end of the video output chip is used to electrically connect to the target display device, the third end of the video output chip is electrically connected to the first end of the output DDC processing circuit, the fourth end of the video output chip is electrically connected to the first end of the output HPD conversion circuit, the fifth end of the video output chip is electrically connected to the first end of the output ESD protection circuit, and the sixth end of the video output chip is electrically connected to the first end of the current limiting protection circuit.

[0122] In this optional embodiment, optionally, as Fig.18 As shown, Fig.18 is a schematic diagram of the structure of a video output chip disclosed in an embodiment of the utility model, wherein the components included in the video output chip and the connection method between the components can be as follows Fig.18 As shown;

[0123] Further, such as Fig.19 As shown, Fig.19: is a schematic diagram of a structure of an output DDC processing circuit disclosed in an embodiment of the utility model, wherein the components included in the output DDC processing circuit and the connection method between the components can be as follows Fig.19 As shown;

[0124] Further, such as Fig. 20 As shown, Fig. 20 : is a schematic diagram of a structure of an output HPD conversion circuit disclosed in an embodiment of the utility model, wherein the components included in the output HPD conversion circuit and the connection method between the components can be as follows Fig. 20 As shown;

[0125] Further, such as Fig.21 As shown, Fig.21 : is a schematic diagram of the structure of an output ESD protection circuit disclosed in an embodiment of the utility model, wherein the components included in the output ESD protection circuit and the connection method between the components can be as follows Fig.21 As shown;

[0126] Further, such as Fig. 22 As shown, Fig. 22 is a schematic diagram of a current limiting protection circuit disclosed in an embodiment of the utility model, wherein the components included in the current limiting protection circuit and the connection method between the components can be as follows Fig. 22 shown.

[0127] In this optional embodiment, optionally, the video output chip may be a HDMI_A_SMD chip.

[0128] In this optional embodiment, optionally, the current limiting protection circuit includes a current limiting short circuit protection circuit, wherein the current limiting short circuit protection circuit is an electronic protection circuit, wherein it is intended to limit current and provide protection in the event of a short circuit. Further, the basic principle of the current limiting short circuit protection circuit is to monitor the magnitude of the current and trigger protection measures when the current exceeds a certain threshold. Furthermore, specific protection measures may include one or more of cutting off power supply, reducing output voltage, and limiting current to prevent excessive current caused by a short circuit from damaging the circuit.

[0129] In this optional embodiment, optionally, the second target signal is transmitted to the target display device through the video output chip, and the driving capability of the video output chip is improved through the output DDC processing circuit, and a level conversion operation is performed on the level signal corresponding to the output DDC processing circuit and the level signal corresponding to the output ESD protection circuit according to the output HPD conversion circuit, so that the levels between the electronic components are balanced with each other, which can effectively protect the video output chip from being damaged by external high voltage, and can also prevent short circuits and burning of the video output chip through the current limiting protection circuit.

[0130] It can be seen that the implementation of this optional embodiment can transmit the second target signal to the preset target device through the video output chip, and improve the driving ability of the video output chip through the output DDC processing circuit, and perform level conversion operations on the level signal corresponding to the output DDC processing circuit and the level signal corresponding to the output HPD conversion circuit through the output HPD conversion circuit, and eliminate the influence of static electricity on the video output chip through the output ESD protection circuit, and prevent the video output chip from short-circuiting and thus burning the chip through the current limiting protection circuit. The driving ability of the video output chip can be significantly improved through the output DDC processing circuit, which is conducive to making the video signal more stable and more efficiently transmitted to the target device, and the output HPD conversion circuit not only realizes the conversion of the output level signal of the output DDC processing circuit, but also processes the level signal of the output ESD protection circuit, so that the signal is ensured through double level conversion. The accuracy and completeness of the system enable the entire system to adapt to a variety of different devices or interfaces, greatly improving compatibility. The output ESD protection circuit provides effective electrostatic protection for the video output chip to prevent external static electricity from having a negative impact on the video output chip. Once a short circuit is detected through the current limiting protection circuit, the circuit can quickly cut off or limit the current to avoid irreversible damage to the chip and other related components. This not only optimizes the transmission and processing of HDMI signals, but also strengthens the system's protection mechanism, so that it can operate stably and safely in the face of various challenges, and thus can also achieve the improvement and protection of the performance of the video output chip, while also improving the stability and reliability of the entire system, which is conducive to improving the accuracy, reliability and intelligence of the adaptive gain adjustment.

[0131] In yet another optional embodiment, Figure 4 As shown, the audio separation input and output circuit also includes: a video signal processing module 112, wherein:

[0132] The first end of the video signal processing module 112 is used to electrically connect to the video input module 104, and the second end of the video signal processing module 112 is electrically connected to the first end of the video matrix processing module 101;

[0133] The video signal processing module 112 is used to receive the video signal input by the video input module 104 , perform signal processing operations on the video signal, obtain a video signal after signal processing, and transmit the video signal after signal processing to the video matrix processing module 101 .

[0134] In this optional embodiment, optionally, the video signal processing module 112 can be composed of an HDMI2.1 video processing chip PS8419 with a Redriver and peripheral circuits. The video signal processing module 112 is used to receive the video signal input by the video input module 104, and perform signal processing operations on the video signal to obtain a video signal after signal processing, and transmit the video signal after signal processing to the video matrix processing module 101. The signal processing operation may include gain control of the compensation insertion loss of the received video signal.

[0135] In this optional embodiment, the video signal processing module 112 may include a video signal processing chip, such as Fig.23 As shown, Fig.23 The utility model discloses a schematic diagram of the structure of a video signal processing chip, wherein the components included in the video signal processing chip and the connection method between the components can be as follows Fig.23 The video signal processing chip may be an HDMI2.1 video processing chip PS8419 with a redriver.

[0136] It can be seen that the implementation of this optional embodiment can perform gain control on the compensated insertion loss of the received video through the video signal processing chip, thereby improving the quality and stability of the HDMI signal.

[0137] In another optional embodiment, the video signal input by the video input module 104 includes four HDMI video input signals, wherein after the video matrix processing module 101 performs target processing operations on the four HDMI video input signals input by the video input module, the output video output signal includes two HDMI video output signals.

[0138] In this optional embodiment, optionally, the video input module 104 can be used to connect a first HDMI video input module, a second HDMI video input module, a third HDMI video input module, and a fourth HDMI video input module. Further, the video input module 104 can collect video signals corresponding to the first HDMI video input module, the second HDMI video input module, the third HDMI video input module, and the fourth HDMI video input module; for example, the first HDMI video input module can be HDMIIN1, the second HDMI video input module can be HDMIIN2, the third HDMI video input module can be HDMIIN3, and the fourth video input module can be HDMIIN4, and the video input module 104 can collect four HDMI video signals and transmit them to the video matrix processing module 101 to perform target processing operations. After the video matrix processing module 101 performs the target processing operations on the four HDMI video input signals input by the video input module, the output video output signals include two HDMI video output signals, and the two HDMI video output signals can be 8K video output signals.

[0139] In this optional embodiment, the video matrix processing module 101 may optionally perform target processing operations on the four HDMI video signals collected by the video input module 104 simultaneously, or may process each HDMI video signal separately, which is not specifically limited in the embodiment of the utility model.

[0140] It can be seen that the implementation of this optional embodiment can collect HDMI video signals through the four-channel video input module, so that multiple video sources can be processed simultaneously, which is beneficial to improving the efficiency and intelligence of video processing, and by processing the four-channel HDMI video signals, the flexibility and intelligence of video signal processing can be improved, and the high definition and stability of the processing of the four-channel HDMI video signals can be guaranteed, thereby meeting the user's requirements for efficient processing operations on multiple video sources, and further, the design of collecting four-channel HDMI video signals through the video input module and performing target processing operations on the video signals by the video matrix processing module brings higher flexibility, scalability, video quality and performance to the system.

[0141] Embodiment 2

[0142] See also Fig.24 , Fig.24It is a structural diagram of an input-output matrix disclosed in an embodiment of the utility model. Among them, the input-output matrix includes an input port for receiving an HDMI video input signal, and includes an input-output circuit for audio separation as in any one of the first embodiments, and the HDMI video input signal is processed by an input-output circuit for audio separation as in any one of the first embodiments to obtain a target output signal, and includes an output port for outputting the target output signal. And the input-output matrix can realize the separation and de-embedding of the audio and video in the video, which is conducive to improving the intelligence of audio de-embedding, and can also switch and distribute multiple signals to multiple devices, realize 8K video signal output, improve video output clarity, and thus improve user convenience. It should be noted that for the detailed description of the input-output matrix, please refer to the specific description of the relevant content in the first embodiment, which will not be repeated in this embodiment.

[0143] It can be seen that implementation Fig.24 The described input and output matrix can separate and de-embed the audio in the video, which is beneficial to improve the intelligence of audio de-embedding. It can also switch and distribute multiple signals to multiple devices to achieve 8K video signal output, improve video output clarity, and thus improve user convenience.

[0144] The above is a detailed introduction to an audio separation input-output circuit and an input-output matrix disclosed in an embodiment of the utility model. Specific embodiments are used in this article to illustrate the principles and implementation methods of the utility model, but the above preferred embodiments are not used to limit the utility model. The description of the above embodiments is only used to help understand the method of the utility model and its core idea; at the same time, for general technical personnel in this field, based on the idea of ​​the utility model, without departing from the spirit and scope of the utility model, there will be changes in the specific implementation method and application scope. Therefore, the protection scope of the utility model shall be based on the scope defined by the claims.

Claims

1. An audio separation input and output circuit, characterized in that: The circuit includes a video matrix processing module, a video output module and an audio output module, wherein: The first end of the video matrix processing module is used to electrically connect to the video input module, the second end of the video matrix processing module is electrically connected to the first end of the video output module and the first end of the audio output module respectively, the second end of the video output module is used to electrically connect to the target display device, and the second end of the audio output module is used to electrically connect to the target audio device; The video matrix processing module is used to receive the video signal input by the video input module, and perform a target processing operation on the video signal to obtain a target output signal and transmit the target output signal to the video output module and the audio output module, wherein the target output signal includes a video output signal and an audio output signal; The video output module is used to transmit the video output signal to the target display device; The audio output module is used to transmit the audio output signal to the target audio device.

2. The audio separation input and output circuit according to claim 1, characterized in that: The circuit also includes a control module, wherein: The first end of the control module is electrically connected to the third end of the video matrix processing module; The control module is used to determine the output audio signal format corresponding to the video signal, so that the video matrix processing module performs the target processing operation on the video signal to obtain an audio output signal matching the output audio signal format.

3. The audio separation input and output circuit according to claim 1 or 2, characterized in that: The circuit also includes a signal conversion module and a signal amplification module, wherein: The first end of the signal conversion module is electrically connected to the second end of the video matrix processing module, the second end of the signal conversion module is electrically connected to the first end of the signal amplification module, and the second end of the signal amplification module is electrically connected to the first end of the audio output module; The signal conversion module is used to receive the first sub audio output signal transmitted by the video matrix processing module, perform a signal type conversion operation on the first sub audio output signal to obtain a first target audio output signal, and transmit the first target audio output signal to the signal amplification module, wherein the audio output signal includes the first sub audio output signal; The signal amplification module is used to receive the first target audio output signal transmitted by the signal conversion module, perform a first signal amplification operation on the first target audio output signal, obtain the first target audio output signal after signal amplification, and transmit the first target audio output signal after signal amplification to the audio output module.

4. The audio separation input and output circuit according to claim 3, characterized in that: The circuit further comprises a driving module, wherein: The first end of the driving module is electrically connected to the second end of the video matrix processing module, and the second end of the driving module is used to electrically connect to the optical fiber transmitting seat; The driving module is used to receive the second sub-audio output signal transmitted by the video matrix processing module, perform a second signal amplification operation on the second sub-audio output signal, obtain a second target audio output signal, and transmit the second target audio output signal to the optical fiber transmitting seat. The audio output signal includes the second sub-audio output signal.

5. The audio separation input and output circuit according to claim 2, characterized in that: The control module includes a control chip, an EDID dialing circuit and a CEC circuit, wherein: The first end of the control chip is electrically connected to the third end of the video matrix processing module, the second end of the control chip is electrically connected to the first end of the EDID dialing circuit, and the third end of the control chip is electrically connected to the first end of the CEC circuit; The EDID dial code circuit is used to manage the video signal format of the video output signal output by the video output module, and to manage the audio signal format of the audio output signal output by the audio output module.

6. The audio separation input and output circuit according to claim 1 or 2, characterized in that: The circuit also includes the video input module, which includes a video input chip, an input DDC processing circuit, an input HPD conversion circuit, and an input ESD protection circuit, wherein: The first end of the video input chip is electrically connected to the first end of the video matrix processing module, the second end of the video input chip is electrically connected to the first end of the input DDC processing circuit, the third end of the video input chip is electrically connected to the first end of the input HPD conversion circuit, and the fourth end of the video input chip is electrically connected to the first end of the input ESD protection circuit.

7. The audio separation input and output circuit according to claim 1 or 2, characterized in that: The video output module includes a video output chip, an output DDC processing circuit, an output HPD conversion circuit, an output ESD protection circuit and a current limiting protection circuit, wherein: The first end of the video output chip is electrically connected to the second end of the video matrix processing module, the second end of the video output chip is used to electrically connect to the target display device, the third end of the video output chip is electrically connected to the first end of the output DDC processing circuit, the fourth end of the video output chip is electrically connected to the first end of the output HPD conversion circuit, the fifth end of the video output chip is electrically connected to the first end of the output ESD protection circuit, and the sixth end of the video output chip is electrically connected to the first end of the current limiting protection circuit.

8. The audio separation input and output circuit according to claim 4, characterized in that: The circuit also includes a video signal processing module, wherein: The first end of the video signal processing module is used to electrically connect to the video input module, and the second end of the video signal processing module is electrically connected to the first end of the video matrix processing module; The video signal processing module is used to receive the video signal input by the video input module, perform signal processing operations on the video signal, obtain the video signal after signal processing, and transmit the video signal after signal processing to the video matrix processing module.

9. The audio separation input and output circuit according to claim 1, characterized in that: The video signal input by the video input module includes four HDMI video input signals, wherein after the video matrix processing module performs the target processing operation on the four HDMI video input signals input by the video input module, the video output signal output includes two HDMI video output signals.

10. An input-output matrix, characterized in that: The input-output matrix includes an input port for receiving an HDMI video input signal, and includes an audio separation input-output circuit as described in any one of claims 1-9, the HDMI video input signal is processed by the audio separation input-output circuit as described in any one of claims 1-9 to obtain a target output signal, and includes an output port for outputting the target output signal.

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