Integrated circuit packaging pipe round die extrusion molding preforming device

Abstract

The utility model discloses a round die extrusion molding preforming device for an integrated circuit packaging tube, which relates to the technical field of integrated circuit packaging tubes and comprises a main body, a mounting plate is mounted at one end in the main body, an extrusion device is arranged at the upper end of the mounting plate, a die is mounted at one end of the extrusion device, a box cover is mounted at one end of the main body, and the box cover is connected with the mounting plate. And an injection molding opening is formed in one end in the box cover, and a heating device is arranged at the upper end of one side of the main body. After injection molding through the mold, the first electric telescopic machine and the second electric telescopic machine are started at the same time, so that the first electric telescopic machine and the second electric telescopic machine respectively jack the first top plate and the second top plate to ascend, and therefore, when the first top plate and the second top plate ascend, an integrated circuit packaging tube in the mold can be jacked; and after the integrated circuit packaging pipe is taken out, the first electric telescopic machine and the second electric telescopic machine are reversely started, so that the integrated circuit packaging pipe returns to the original positions.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit packaging tubes, in particular to a circular die extrusion preforming device for integrated circuit packaging tubes. Background Art

[0002] The integrated circuit packaging tube is a carrier for carrying integrated circuit packaging. But when we say integrated circuit packaging tube, we also mean integrated circuit packaging. The integrated circuit packaging tube is mainly made of silicone, so it is generally green. The integrated circuit packaging tube adopts semiconductor manufacturing technology to make many transistors, resistors, capacitors and other components on a smaller single crystal silicon wafer, and combines the components into a complete electronic circuit according to the method of multi-layer wiring or tunnel wiring. It is represented by the letter "IC" (also with the text symbol "N", etc.) in the circuit. The production of integrated circuit packaging tube requires the use of a round die extrusion preforming device.

[0003] The existing technology has the following problems:

[0004] 1. The existing integrated circuit packaging tube round die extrusion preforming device, during use, needs to be taken out manually after injection molding, because it is not easy to grab, resulting in troublesome removal and certain inconvenience;

[0005] 2. The existing integrated circuit packaging tube round die extrusion preforming device, during use, requires the user to heat the mold before injection molding to keep it at a certain temperature, but this heating cannot be maintained all the time. It is possible that the mold has cooled during the injection molding process, resulting in poor quality of the finished product;

[0006] 3. The existing integrated circuit packaging tube round die extrusion preforming device generally uses an air pipe to directly evacuate air during use, which has many manual operation processes, is difficult to operate, and has high technical requirements for operators. Utility Model Content

[0007] In order to solve the above technical problems, the technical solution adopted by the utility model is:

[0008] An integrated circuit packaging tube round die extrusion preforming device comprises a main body, a mounting plate is installed at one end of the main body, an extrusion device is arranged at the upper end of the mounting plate, a mold is installed at one end of the extrusion device, a box cover is installed at one end of the main body, an injection port is installed at one end of the box cover, a heating device is arranged at the upper end of one side of the main body, and an exhaust device is arranged at one end of the mold; the extrusion device comprises an extrusion base, the lower end of the extrusion base is fixedly connected to the upper end of the mounting plate, a mounting block is installed at the lower end of one side of the extrusion base, a mounting frame is installed at the upper end of the mounting block, and a first An electric telescopic machine, wherein a first top plate is installed at the upper end of the first electric telescopic machine, a second electric telescopic machine is arranged at the lower end of the other side of the inside of the extrusion base, and a second top plate is installed at the upper end of the second electric telescopic machine; the heating device comprises a support seat, the lower end of the support seat is fixedly connected to the upper end of one side of the main body, a heating machine is arranged at the upper end of the support seat, a heating pipe is installed at one end of the heating machine, a buffer box is installed at one end of the heating pipe, and a heating column is arranged at one end inside the buffer box; a display screen is installed at the upper end of the heating machine, an operation button is installed at one end of the front of the heating machine, and an air inlet is installed at the other end of the heating machine.

[0009] A further improvement of the technical solution of the utility model is that one side of the interior of the extrusion base is fixedly connected to the lower end of the mounting block.

[0010] A further improvement of the technical solution of the utility model is that the upper end of the second electric telescopic machine is fixedly connected to the lower end of the second top plate.

[0011] A further improvement of the technical solution of the utility model is that the upper end of the support seat is fixedly connected to the lower end of the heating machine.

[0012] A further improvement of the technical solution of the utility model is that the other end of the heating machine is fixedly connected to one end of the air inlet.

[0013] A further improvement of the technical solution of the utility model is that: the exhaust device includes an exhaust port, one end of the exhaust port is fixedly connected to one end inside the mold, a sensor is provided at the upper end of the exhaust port, an exhaust pipe is installed at the lower end of the exhaust port, a check valve is installed at one end of the exhaust pipe, a buffer tank is installed at one end of the check valve, an exhaust pump is provided at one end of the buffer tank, and an exhaust port is installed at one end of the exhaust pump.

[0014] A further improvement of the technical solution of the utility model is that the upper end of the air suction port is fixedly connected to the lower end of the sensor, and one end of the air suction pump is fixedly connected to one end of the exhaust port.

[0015] Due to the adoption of the above technical solution, the utility model has achieved the following technical progress compared with the prior art:

[0016] 1. The utility model provides an integrated circuit packaging tube circular die extrusion preforming device. Through the joint action of an extrusion base, a mounting block, a mounting frame, a first electric telescopic machine, a first top plate, a second electric telescopic machine and a second top plate, the extrusion preforming device is increased to have the function of extruding the formed integrated circuit packaging tube after injection molding. After the mold is injection molded, the first electric telescopic machine and the second electric telescopic machine are simultaneously started, so that the first electric telescopic machine and the second electric telescopic machine respectively push the first top plate and the second top plate to rise, so that when the first top plate and the second top plate rise, the integrated circuit packaging tube inside the mold will be pushed, so that the integrated circuit packaging tube is squeezed out, so that the user can easily take it out. After taking it out, the first electric telescopic machine and the second electric telescopic machine are reversely started to return it to its original position.

[0017] 2. The utility model provides an integrated circuit packaging tube round die extrusion preforming device. Through the joint action of a support seat, a heater, a heating pipe, a buffer box, a heating column, a display screen, an operation button and an air inlet, the extrusion preforming device is increased to heat the mold, so that the quality of the injection molded integrated circuit packaging tube is better. This modification starts the heater, so that the heater inhales fresh air through the air inlet, and then heats the air, and then transmits it to the buffer box through the heating pipe. Then the buffer box will evenly transmit the hot air to the heating column, so that the heating column heats the mold. At the same time, because a plurality of heating columns are provided, three sides can be heated at the same time, so that the heating speed of the mold is faster.

[0018] 3. The utility model provides an integrated circuit packaging tube circular die extrusion preforming device. Through the joint action of an exhaust port, a sensor, an exhaust pipe, a check valve, a buffer tank, an exhaust pump and an exhaust port, the extrusion preforming device is increased to have the function of exhausting the air inside the mold, and at the same time the overall operation difficulty can be reduced. This modification starts the exhaust pump to generate suction, thereby sucking the air inside the mold into the exhaust pipe through the exhaust port, and then entering the buffer tank through the exhaust pipe, and finally being discharged through the exhaust port. When the sensor senses that there is no air inside, the exhaust pump will be stopped, thereby reducing the difficulty of manual operation. In addition, two exhaust ports are provided at the same time to make the exhaust speed faster, and the check valve prevents air from flowing back. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural schematic diagram of the circular die extrusion preforming device of the integrated circuit packaging tube of the utility model;

[0020] Figure 2It is a structural schematic diagram of the extrusion device of the utility model;

[0021] Figure 3 It is a structural schematic diagram of the heating device of the utility model;

[0022] Figure 4 It is a structural schematic diagram of the air extraction device of the utility model.

[0023] In the figure: 1. main body; 2. mounting plate; 3. extrusion device; 4. mold; 5. box cover; 6. injection port; 7. heating device; 8. exhaust device; 31. extrusion base; 32. mounting block; 33. mounting frame; 34. first electric telescopic machine; 35. first top plate; 36. second electric telescopic machine; 37. second top plate; 71. support seat; 72. heating machine; 73. heating pipe; 74. buffer box; 75. heating column; 76. display screen; 77. operation button; 78. air inlet; 81. exhaust port; 82. sensor; 83. exhaust pipe; 84. check valve; 85. buffer tank; 86. exhaust pump; 87. exhaust port. DETAILED DESCRIPTION

[0024] The present invention is further described in detail below in conjunction with the embodiments:

[0025] Example 1

[0026] like Figure 1-4 As shown, the utility model provides an integrated circuit packaging tube round die extrusion preforming device, including a main body 1, a mounting plate 2 is installed at one end inside the main body 1, an extrusion device 3 is arranged at the upper end of the mounting plate 2, a mold 4 is installed at one end of the extrusion device 3, a box cover 5 is installed at one end of the main body 1, an injection port 6 is installed at one end inside the box cover 5, a heating device 7 is arranged at the upper end of one side of the main body 1, and an exhaust device 8 is arranged at one end inside the mold 4.

[0027] Example 2

[0028] like Figure 1-4 As shown, on the basis of Example 1, the utility model provides a technical solution: preferably, the extrusion device 3 includes an extrusion base 31, the lower end of the extrusion base 31 is fixedly connected to the upper end of the mounting plate 2, a mounting block 32 is installed at the lower end of one side of the extrusion base 31, and a mounting frame 33 is installed at the upper end of the mounting block 32. A first electric telescopic machine 34 is arranged at the lower end of the mounting frame 33, and a first top plate 35 is installed at the upper end of the first electric telescopic machine 34. A second electric telescopic machine 36 is arranged at the lower end of the other side of the extrusion base 31, and a second top plate 37 is installed at the upper end of the second electric telescopic machine 36. One side of the interior of the extrusion base 31 is fixedly connected to the lower end of the mounting block 32, and the upper end of the second electric telescopic machine 36 is fixedly connected to the lower end of the second top plate 37.

[0029] In this embodiment, the function of the extrusion preforming device to extrude the formed integrated circuit packaging tube after injection molding is added. After the mold 4 is injection molded, the first electric telescopic machine 34 and the second electric telescopic machine 36 are started at the same time, so that the first electric telescopic machine 34 and the second electric telescopic machine 36 respectively push the first top plate 35 and the second top plate 37 to rise, so that when the first top plate 35 and the second top plate 37 rise, the integrated circuit packaging tube inside the mold 4 will be pushed, so that the integrated circuit packaging tube is squeezed out and the user can easily take it out. After taking it out, the first electric telescopic machine 34 and the second electric telescopic machine 36 are reversed to return it to its original position.

[0030] Example 3

[0031] like Figure 1-4 As shown, on the basis of Example 1, the utility model provides a technical solution: preferably, the heating device 7 includes a support seat 71, the lower end of the support seat 71 is fixedly connected to the upper end of one side of the main body 1, a heating machine 72 is provided at the upper end of the support seat 71, a heating pipe 73 is installed at one end of the heating machine 72, a buffer box 74 is installed at one end of the heating pipe 73, and a heating column 75 is provided at one end inside the buffer box 74; a display screen 76 is installed at the upper end of the heating machine 72, an operation button 77 is installed at one end of the front of the heating machine 72, an air inlet 78 is installed at the other end of the heating machine 72, the upper end of the support seat 71 is fixedly connected to the lower end of the heating machine 72, and the other end of the heating machine 72 is fixedly connected to one end of the air inlet 78.

[0032] In this embodiment, the function of heating the mold 4 by the extrusion preforming device is added to improve the quality of the injection molded integrated circuit packaging tube. This modification starts the heater 72, allowing the heater 72 to inhale fresh air through the air inlet 78, and then heats the air. The air is then transmitted to the buffer box 74 through the heating pipe 73. The buffer box 74 then evenly transmits the hot air to the heating column 75, so that the heating column 75 heats the mold 4. At the same time, because a plurality of heating columns 75 are provided, three sides can be heated at the same time, so that the heating speed of the mold 4 is faster.

[0033] Example 4

[0034] like Figure 1-4As shown, on the basis of Example 1, the utility model provides a technical solution: preferably, the exhaust device 8 includes an exhaust port 81, one end of the exhaust port 81 is fixedly connected to one end inside the mold 4, a sensor 82 is provided at the upper end of the exhaust port 81, an exhaust pipe 83 is installed at the lower end of the exhaust port 81, a check valve 84 is installed at one end of the exhaust pipe 83, a buffer tank 85 is installed at one end of the check valve 84, an exhaust pump 86 is provided at one end of the buffer tank 85, an exhaust port 87 is installed at one end of the exhaust pump 86, the upper end of the exhaust port 81 is fixedly connected to the lower end of the sensor 82, and one end of the exhaust pump 86 is fixedly connected to one end of the exhaust port 87.

[0035] In this embodiment, the extrusion preforming device is added with the function of exhausting the air inside the mold 4, and the overall operation difficulty can be reduced. This modification starts the vacuum pump 86 to generate suction, thereby sucking the air inside the mold 4 into the vacuum pipe 83 through the vacuum port 81, and then entering the buffer tank 85 through the vacuum pipe 83, and finally discharged through the exhaust port 87. When the sensor 82 senses that there is no air inside, the vacuum pump 86 will be stopped, thereby reducing the difficulty of manual operation. In addition, two vacuum ports 81 are set at the same time to make the vacuuming speed faster, and the check valve 84 prevents air from flowing back.

[0036] The working principle of the integrated circuit packaging tube round die extrusion preforming device is described in detail below.

[0037] like Figure 1-4As shown, when this integrated circuit packaging tube circular die extrusion preforming device is used, first, the extrusion preforming device is added with a function that the formed integrated circuit packaging tube can be extruded after injection molding through the extrusion device 3. This modification is performed after the mold 4 is injection molded, and the first electric telescopic machine 34 and the second electric telescopic machine 36 are simultaneously started, so that the first electric telescopic machine 34 and the second electric telescopic machine 36 respectively push the first top plate 35 and the second top plate 37 to rise, so that when the first top plate 35 and the second top plate 37 rise, the integrated circuit packaging tube inside the mold 4 will be pushed, so that the integrated circuit packaging tube can be squeezed out, so that the user can easily take it out. After taking it out, the first electric telescopic machine 34 and the second electric telescopic machine 36 are reversed to return it to its original position, and then the extrusion preforming device is added with a function that the mold 4 can be heated through the heating device 7, so that the quality of the injection molded integrated circuit packaging tube is better. This modification is performed by starting the heating machine 72 so that the heating machine 72 inhales air through the air inlet 78 Fresh air, then heats the air, and then transmits it to the buffer box 74 through the heating pipe 73, and then the buffer box 74 will evenly transmit the hot air to the heating column 75, so that the heating column 75 heats the mold 4, and at the same time, because multiple heating columns 75 are set, the three sides can be heated at the same time, so that the heating speed of the mold 4 is faster, and finally the extrusion preforming device is increased through the exhaust device 8 to exhaust the air inside the mold 4, and at the same time, the overall operation difficulty can be reduced. This modification starts the vacuum pump 86 to generate suction force, so that the air inside the mold 4 is sucked into the exhaust pipe 83 through the exhaust port 81, and then enters the buffer tank 85 through the exhaust pipe 83, and finally discharged through the exhaust port 87. When the sensor 82 senses that there is no air inside, the vacuum pump 86 will be stopped, thereby reducing the difficulty of manual operation, and two exhaust ports 81 are set at the same time to make the exhaust speed faster, and then the check valve 84 prevents air from flowing back.

[0038] The above generally describes the present invention in detail, but it is obvious to a person skilled in the art that some modifications or improvements can be made to the present invention. Therefore, modifications or improvements that do not deviate from the spirit of the present invention are within the scope of protection of the present invention.

Claims

1. An integrated circuit packaging tube round die extrusion preforming device, comprising a main body (1), characterized in that: A mounting plate (2) is installed at one end of the main body (1), an extrusion device (3) is provided at the upper end of the mounting plate (2), a mold (4) is installed at one end of the extrusion device (3), a box cover (5) is installed at one end of the main body (1), an injection port (6) is installed at one end of the box cover (5), a heating device (7) is provided at the upper end of one side of the main body (1), and an exhaust device (8) is provided at one end of the mold (4); The extrusion device (3) comprises an extrusion base (31), the lower end of the extrusion base (31) is fixedly connected to the upper end of the mounting plate (2), a mounting block (32) is installed at the lower end of one side of the interior of the extrusion base (31), a mounting frame (33) is installed at the upper end of the mounting block (32), a first electric telescopic machine (34) is arranged at the lower end of the interior of the mounting frame (33), a first top plate (35) is installed at the upper end of the first electric telescopic machine (34), a second electric telescopic machine (36) is arranged at the lower end of the other side of the interior of the extrusion base (31), and a second top plate (37) is installed at the upper end of the second electric telescopic machine (36); The heating device (7) comprises a support base (71), the lower end of the support base (71) is fixedly connected to the upper end of one side of the main body (1), a heating machine (72) is arranged at the upper end of the support base (71), a heating pipe (73) is installed at one end of the heating machine (72), a buffer box (74) is installed at one end of the heating pipe (73), and a heating column (75) is arranged at one end of the buffer box (74); a display screen (76) is installed at the upper end of the heating machine (72), an operation button (77) is installed at one end of the front of the heating machine (72), and an air inlet (78) is installed at the other end of the heating machine (72).

2. The device for preforming an integrated circuit packaging tube by a circular die extrusion molding according to claim 1, characterized in that: One side of the interior of the extrusion base (31) is fixedly connected to the lower end of the mounting block (32).

3. The device for preforming an integrated circuit packaging tube by a circular die extrusion molding according to claim 2, characterized in that: The upper end of the second electric telescopic machine (36) is fixedly connected to the lower end of the second top plate (37).

4. The device for preforming an integrated circuit packaging tube by a circular die extrusion molding according to claim 1, characterized in that: The upper end of the support seat (71) is fixedly connected to the lower end of the heating machine (72).

5. The device for preforming an integrated circuit packaging tube by a circular die extrusion molding according to claim 4, characterized in that: The other end of the heater (72) is fixedly connected to one end of the air inlet (78).

6. The device for preforming an integrated circuit packaging tube by a circular die extrusion molding according to claim 1, characterized in that: The air extraction device (8) comprises an air extraction port (81), one end of which is fixedly connected to one end of the interior of the mold (4), a sensor (82) is provided at the upper end of the air extraction port (81), an air extraction pipeline (83) is installed at the lower end of the air extraction port (81), a check valve (84) is installed at one end of the air extraction pipeline (83), a buffer tank (85) is installed at one end of the check valve (84), an air extraction pump (86) is provided at one end of the buffer tank (85), and an exhaust port (87) is installed at one end of the air extraction pump (86).

7. The device for preforming an integrated circuit packaging tube by a circular die extrusion molding according to claim 6, characterized in that: The upper end of the air suction port (81) is fixedly connected to the lower end of the sensor (82), and one end of the air suction pump (86) is fixedly connected to one end of the exhaust port (87).

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