AMOLED liquid crystal display screen with hidden drive IC
During the manufacturing process of the AMOLED display, the driving IC is hidden in the groove of the foam under the lower substrate, which solves the problem of the driving IC being easily scratched and improves the product's competitiveness and dust protection ability.
Patent Information
- Application Number
- CN202421653779.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-12
- Publication Date
- 2025-04-22
- Estimated Expiration
- 2034-07-12
AI Technical Summary
During the manufacturing process of AMOLED display screen, the driver IC is prone to interfere with other components and scratches, resulting in poor performance and reducing the competitiveness of the product.
By providing the foam under the lower substrate and opening a groove of appropriate size on the lower surface of the foam, the driving IC is hidden in the groove to avoid interference with other components.
It effectively avoids interference and scratches between the driver IC and other components, improves the dustproof ability of the driver IC, avoids bad luck, and enhances the competitiveness of the product.
Smart Images
Figure CN222784716U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of liquid crystal display, and more specifically to an AMOLED liquid crystal display screen with a hidden driving IC. Background Art
[0002] AMOLED screen has bright display effect, high contrast and small screen, and is widely used in smart watch projects. Smart watches have more and more comprehensive functions, integrating a series of functions such as touch, display and NFC payment. AMOLED display screen is driven by display driver IC. In the process of making AMOLED display module on the production line, the damage of COF IC is quite high, which will lead to large loss of AMOLED module. In the prior art, the driver IC is usually set on the lower surface of FPC, so that when FPC is bent to the bottom of the lower substrate, the driver IC will also be bent to the bottom of the lower substrate. Although it can play a certain role at this time, it is found in actual use that the driver IC of this structure is easy to interfere with other components and be scratched, which will cause the driver IC to be defective and reduce the competitiveness of the product. Utility Model Content
[0003] The technical problem to be solved by the utility model is how to hide the driver IC, avoid the driver IC from being scratched due to interference with other components, avoid driver IC failure, and improve the competitiveness of the product.
[0004] The technical problem to be solved by the utility model is achieved through the following technical solutions:
[0005] In order to solve the above technical problems, the utility model provides an AMOLED liquid crystal display screen with a hidden driver IC, which includes a lower substrate and an upper substrate arranged above the lower substrate, a cover plate is arranged above the upper substrate, and foam is arranged below the lower substrate. The lower substrate is longer than the upper substrate and extends outward to form a step, an FPC is bound to the upper surface of the lower substrate located at the step, and a driver IC is bound to the lower surface of the FPC, the thickness of the driver IC is less than the thickness of the foam, and a groove is opened on the lower surface of the foam, and the driver IC is arranged in the groove after the FPC is bent downward.
[0006] As a preferred implementation of the AMOLED liquid crystal display screen with hidden driver IC provided by the utility model, the driver IC has a length of 2.06 mm, a width of 8.3 mm, and a thickness of 0.3 mm.
[0007] As a preferred implementation of the AMOLED liquid crystal display screen with hidden driver IC provided by the utility model, the thickness of the foam is 0.4 mm.
[0008] As a preferred implementation of the AMOLED liquid crystal display screen with hidden driver IC provided by the utility model, the groove has a length of 2.2 mm, a width of 8.5 mm, and a thickness of 0.4 mm.
[0009] As a preferred embodiment of the AMOLED liquid crystal display screen with hidden driver IC provided by the utility model, an insulating shielding integrated layer is attached to the lower surface of the FPC, and the insulating shielding integrated layer includes insulating paper and a conductive shielding material arranged above the insulating paper. The area of the insulating paper is smaller than the area of the conductive shielding material. The insulating paper can completely cover the driver IC. The conductive shielding material has a through hole at the edge of the insulating paper, and the through hole is located in an area where no components are provided.
[0010] As a preferred implementation of the AMOLED liquid crystal display screen with hidden driver IC provided by the utility model, the through hole is a round hole.
[0011] As a preferred implementation of the AMOLED liquid crystal display screen with hidden driver IC provided by the utility model, one end of the opening waste material at the through hole is connected to the conductive shielding material.
[0012] As a preferred implementation of the AMOLED liquid crystal display screen with hidden driver IC provided by the utility model, a double-sided adhesive tape is arranged at the bottom of the hole-opening waste material.
[0013] As a preferred implementation of the AMOLED liquid crystal display screen with hidden driver IC provided by the utility model, one side of the insulating paper extends beyond the conductive shielding material.
[0014] As a preferred implementation of the AMOLED liquid crystal display screen with hidden driver IC provided by the utility model, the conductive shielding material is conductive paper or copper foil.
[0015] The utility model has the following beneficial effects:
[0016] Since the thickness of the foam is greater than that of the driver IC, a groove of appropriate size is opened on the foam under the lower substrate, and this groove can just accommodate the driver IC. After the FPC is bent, the driver IC can be hidden in the groove. At this time, the driver IC can avoid scratches caused by interference with other components, and can also prevent dust from entering, which is beneficial to improve the dustproof ability of the driver IC, avoid driver IC defects, and improve product competitiveness. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the scheme in the present application, a brief introduction is given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0018] Figure 1 The present invention provides a schematic structural diagram of an AMOLED liquid crystal display screen with a hidden driver IC.
[0019] Figure 2 for Figure 1 Bottom view of .
[0020] Figure 3 Schematic diagram of the improved structure of FPC.
[0021] Figure 4 for Figure 3 Bottom view of the middle insulation and shielding integrated layer.
[0022] Description of Figure Numbers:
[0023] Lower substrate 1; upper substrate 2; cover plate 3; foam 4; FPC 5; driver IC 6; groove 41;
[0024] Insulating shielding integrated layer 7; insulating paper 71; conductive shielding material 72; through hole 73. DETAILED DESCRIPTION
[0025] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.
[0026] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
[0027] In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", and "third" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0028] The utility model provides an AMOLED liquid crystal display screen with a hidden driver IC, which comprises a lower substrate and an upper substrate arranged above the lower substrate, a cover plate is arranged above the upper substrate, foam is arranged below the lower substrate, the lower substrate is longer than the upper substrate and extends outward to form a step, an FPC is bound to the upper surface of the lower substrate located at the step, a driver IC is bound to the lower surface of the FPC, the thickness of the driver IC is less than the thickness of the foam, a groove is opened on the lower surface of the foam, and the driver IC is arranged in the groove after the FPC is bent downward.
[0029] Since the thickness of the foam is greater than that of the driver IC, a groove of appropriate size is opened on the foam under the lower substrate, and this groove can just accommodate the driver IC. After the FPC is bent, the driver IC can be hidden in the groove. At this time, the driver IC can avoid scratches caused by interference with other components, and can also prevent dust from entering, which is beneficial to improve the dustproof ability of the driver IC, avoid driver IC defects, and improve product competitiveness.
[0030] In order to enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings. The present invention is described in detail below in conjunction with the accompanying drawings and embodiments, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limitations on the present invention.
[0031] See also Figure 1 and Figure 2, an AMOLED liquid crystal display screen with hidden driver IC provided by the utility model, comprising a lower substrate 1 and an upper substrate 2 arranged above the lower substrate 1, a cover plate 3 arranged above the upper substrate 2, a foam 4 arranged below the lower substrate 1, the lower substrate 1 is longer than the upper substrate 2 and extends outward to form a step, an FPC5 is bound to the upper surface of the lower substrate 1 located at the step, a driver IC6 is bound to the lower surface of the FPC5, the thickness of the driver IC6 is less than the thickness of the foam 4, a groove 41 is provided on the lower surface of the foam 4, and the driver IC6 is arranged in the groove 41 after the FPC5 is bent downward. Since the thickness of the foam 4 is greater than the thickness of the driver IC6, a groove 41 of appropriate size is provided on the foam 4 below the lower substrate 1, and the groove 41 can just accommodate the driver IC6. After the FPC5 is bent, the driver IC6 can be hidden in the groove 41, and at this time, the driver IC6 can avoid being scratched by interference with other components, and can also prevent dust from entering, which is conducive to improving the dustproof ability of the driver IC6, avoiding the defect of the driver IC6, and improving the competitiveness of the product.
[0032] Furthermore, the length of the driver IC6 is 2.06 mm, the width is 8.3 mm, and the thickness is 0.3 mm. The thickness of the foam 4 is 0.4 mm. The length of the groove 41 is 2.2 mm, the width is 8.5 mm, and the thickness is 0.4 mm. That is, the groove 41 of the foam 4 penetrates to the upper surface of the foam 4. The length and width of the groove 41 are slightly larger than the length and width of the driver IC6, so that the driver IC6 can be hidden in the groove 41.
[0033] See also Figure 3 and Figure 4 As a further optimization scheme of Example 1, in this embodiment, an insulating shielding integrated layer 7 is attached to the lower surface of FPC5, and the insulating shielding integrated layer 7 includes insulating paper 71 and conductive shielding material 72. The conductive shielding material 72 is arranged above the insulating paper 71, and the area of the insulating paper 71 is smaller than the area of the conductive shielding material 72. The insulating paper 71 can completely cover the driver IC6. The conductive shielding material 72 has a through hole 73 at the edge of the insulating paper 71, and the through hole 73 is located in the area where no components are provided. Since the conductive shielding material 72 has a through hole 73 at the edge of the insulating paper 71, the operator can see the edge of the insulating paper 71, so that the operator can judge the position of the insulating paper 71 when attaching, so as to avoid being attached to the driver IC6 or not being attached, thereby preventing a short circuit and avoiding economic losses.
[0034] Furthermore, the through hole 73 is a circular hole, and one end of the opening waste is connected to the conductive shielding material 72. So that the position of the insulating paper 71 can still be observed by breaking the opening waste at the circular hole, and the opening waste is covered back after being pasted, so as to avoid the opening being unable to ensure conductive shielding.
[0035] Furthermore, a double-sided tape is provided at the bottom of the waste material with holes, and the waste material with holes is pasted back by the double-sided tape to avoid failure to ensure conductive shielding at the holes.
[0036] Furthermore, one side of the insulating paper 71 extends beyond the conductive shielding material 72, so that the operator can determine the specific position of the insulating paper 71 through the insulating paper 71 extending beyond the conductive shielding material 72, thereby avoiding biased or no attachment to the driver IC 6, thereby preventing a short circuit and economic losses.
[0037] Furthermore, the conductive shielding material 72 is conductive paper or copper foil, which can form a conductive shielding effect.
[0038] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0039] Obviously, the embodiments described above are only some embodiments of the present application, rather than all embodiments. The preferred embodiments of the present application are given in the accompanying drawings, but they do not limit the patent scope of the present application. The present application can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. Although the present application is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to perform equivalent replacement of some of the technical features therein. Any equivalent structure made using the contents of the specification and drawings of this application, directly or indirectly used in other related technical fields, is similarly within the scope of patent protection of this application.
Claims
1. An AMOLED liquid crystal display screen with a hidden driver IC, characterized in that: It includes a lower substrate and an upper substrate arranged above the lower substrate, a cover plate is arranged above the upper substrate, foam is arranged below the lower substrate, the lower substrate is longer than the upper substrate and extends outward to form a step, an FPC is bound to the upper surface of the lower substrate located at the step, a driver IC is bound to the lower surface of the FPC, the thickness of the driver IC is less than the thickness of the foam, a groove is opened on the lower surface of the foam, and the driver IC is arranged in the groove after the FPC is bent downward.
2. The AMOLED liquid crystal display screen with hidden driver IC according to claim 1, characterized in that: The driver IC has a length of 2.06 mm, a width of 8.3 mm, and a thickness of 0.3 mm.
3. The AMOLED liquid crystal display screen with hidden driver IC according to claim 1, characterized in that: The thickness of the foam is 0.4 mm.
4. The AMOLED liquid crystal display screen with hidden driver IC according to claim 1, characterized in that: The groove has a length of 2.2 mm, a width of 8.5 mm and a thickness of 0.4 mm.
5. The AMOLED liquid crystal display screen with hidden driver IC according to claim 1, characterized in that: An insulating shielding integrated layer is attached to the lower surface of the FPC, and the insulating shielding integrated layer includes insulating paper and a conductive shielding material arranged above the insulating paper. The area of the insulating paper is smaller than the area of the conductive shielding material. The insulating paper can completely cover the driver IC. The conductive shielding material has a through hole at the edge of the insulating paper, and the through hole is located in an area where no components are provided.
6. The AMOLED liquid crystal display screen with hidden driver IC according to claim 5, characterized in that: The through hole is a round hole.
7. The AMOLED liquid crystal display screen with hidden driver IC according to claim 5, characterized in that: One end of the open hole waste material at the through hole is connected to the conductive shielding material.
8. The AMOLED liquid crystal display screen with hidden driver IC according to claim 7, characterized in that: The bottom of the open hole waste material is provided with double-sided adhesive tape.
9. The AMOLED liquid crystal display screen with hidden driver IC according to claim 5, characterized in that: One side of the insulating paper exceeds the conductive shielding material.
10. The AMOLED liquid crystal display screen with hidden driver IC according to claim 5, characterized in that: The conductive shielding material is conductive paper or copper foil.