Heat dissipation structure of computer

Abstract

The utility model discloses a heat dissipation structure of a computer, which belongs to the technical field of computers and comprises a bottom plate, a side frame is longitudinally and fixedly mounted on the top surface of the bottom plate, a sliding rail is transversely and fixedly mounted on the top surface of the bottom plate, and a motor is fixedly mounted on the outer wall of one side of the side frame. A reciprocating lead screw is fixedly mounted at one end of an output shaft of the motor, a mounting stud is transversely and fixedly mounted on the outer wall of one side of the side frame, a movable heat dissipation mechanism is slidably mounted on a sliding rail, stable moving assemblies are arranged on the outer walls of the two sides of the movable heat dissipation mechanism, and the movable heat dissipation mechanism comprises a mounting shell; according to the computer heat dissipation structure, the movable heat dissipation mechanism is arranged in a matched mode, the structure is positioned and installed in the computer, through the design, movable heat dissipation treatment in the computer can be achieved, heat dissipation comprehensiveness and heat dissipation effect of the structure in the computer can be greatly improved, and the situation of local high temperature in the computer is avoided.

Description

Technical Field

[0001] The utility model belongs to the technical field of computers, and in particular relates to a heat dissipation structure of a computer. Background Art

[0002] A computer is an intelligent electronic device. It is composed of a hardware system and a software system. The hardware includes physical components such as the chassis, motherboard, CPU, memory, and hard disk, while the software refers to the various programs and data running on the computer. Among the computer accessories, the heat dissipation structure is a very important part, which determines the continuous processing effect of the computer.

[0003] The patent document with publication number CN112130645A discloses a computer heat dissipation structure, including a chassis body, a detachable side panel is installed on one side of the chassis body, a detachable key panel is installed on the outer side wall of the chassis body, a mounting slot corresponding to the key panel is provided on the chassis body, and a computer power supply is connected to the inner top of the chassis body through a fixing screw. The computer heat dissipation structure has a simple structure, a small number of heat dissipation parts, low cost, simple assembly process, low probability of failure, and convenient maintenance. At the same time, it will not occupy the space inside the chassis body to a large extent, and will not affect the chassis miniaturization process. In addition, it can also effectively prevent dust outside the chassis body from entering the inside of the chassis body, avoid dust in the air from adhering to components inside the chassis body, and prevent affecting the heat dissipation of components inside the chassis body. Although the current computer heat dissipation structure can also achieve a certain heat dissipation effect, the general heat dissipation structure is positioned and installed in the computer, which results in uneven and incomplete heat dissipation effect on computer components. At the same time, the stability of the heat dissipation structure cannot be guaranteed, and the actual application effect is not good. In order to solve the above problems, a computer heat dissipation structure is urgently needed to solve the above problems. Utility Model Content

[0004] The purpose of the utility model is to solve the problem that although the current computer heat dissipation structure can also achieve a certain heat dissipation effect, the general heat dissipation structure is positioned and installed in the computer, which leads to uneven and incomplete heat dissipation effect on computer components, and the stability of the heat dissipation structure cannot be guaranteed, resulting in poor actual application effect. A heat dissipation structure for a computer is proposed to solve the problem that although the current computer heat dissipation structure can also achieve a certain heat dissipation effect, the general heat dissipation structure is positioned and installed in the computer, which leads to uneven and incomplete heat dissipation effect on computer components, and the stability of the heat dissipation structure cannot be guaranteed, and the actual application effect is poor.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a heat dissipation structure of a computer, including a base plate, a side frame is longitudinally fixedly installed on the top surface of the base plate, a slide rail is transversely fixedly installed on the top surface of the base plate, a motor is fixedly installed on the outer wall of one side of the side frame, a reciprocating screw is fixedly installed on one end of the output shaft of the motor, a mounting stud is transversely fixedly installed on the outer wall of one side of the side frame, a mobile heat dissipation mechanism is slidably installed on the slide rail, and stable moving components are arranged on the outer walls of both sides of the mobile heat dissipation mechanism.

[0006] As a further description of the above technical solution:

[0007] The mobile heat dissipation mechanism comprises a mounting shell, and the mounting shell is slidably mounted on a slide rail through a slide groove arranged at the bottom thereof. A mounting groove is arranged inside the mounting shell, and side wind nets are arranged on both sides of the mounting groove.

[0008] As a further description of the above technical solution:

[0009] The reciprocating screw is threadedly connected to a threaded hole arranged at the center of the mounting shell, and a heat dissipation component is arranged inside the mounting groove, and the heat dissipation component is located between the two side wind nets.

[0010] As a further description of the above technical solution:

[0011] The heat dissipation assembly comprises a mounting sleeve, wherein the mounting sleeve is fixedly mounted inside the mounting groove, and a threaded sleeve is rotatably mounted inside the mounting sleeve.

[0012] As a further description of the above technical solution:

[0013] A heat dissipation fan is fixedly mounted on the outer surface of the threaded sleeve, and the mounting stud is threadedly connected to a threaded hole arranged inside the threaded sleeve.

[0014] As a further description of the above technical solution:

[0015] The stable moving assembly includes two mounting frames, both of which are fixedly mounted on the outer surface of the mounting shell, a moving roller is rotatably mounted between the two mounting frames, the moving roller is rollingly connected to the bottom plate, and a dust suction pad is arranged outside the moving roller.

[0016] In summary, due to the adoption of the above technical solution, the beneficial effects of the utility model are:

[0017] 1. In the utility model, a mobile heat dissipation mechanism is provided and the structure is positioned and installed in the computer. When the computer is used, the motor is energized to drive the reciprocating screw to rotate, and the reciprocating screw can drive the mobile heat dissipation mechanism to move. Through this design, mobile heat dissipation processing in the computer can be achieved, which can greatly improve the comprehensiveness and heat dissipation effect of the structure in the computer and avoid the occurrence of local high temperature in the computer.

[0018] 2. In the utility model, a stable moving component is provided on the outside of the mobile heat dissipation mechanism. When the mobile heat dissipation mechanism moves, the stable moving component will also move with it. Through this design, when mobile heat dissipation is performed in the computer, a stable protection effect can be generated for the movement of the mobile heat dissipation structure to ensure the heat dissipation effect. At the same time, the deposited dust can be attached, and the structure also has a certain dust absorption effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 The present invention is a three-dimensional structural schematic diagram of a heat dissipation structure of a computer.

[0020] Figure 2 The figure is a schematic diagram of an exploded three-dimensional structure of a heat dissipation structure of a computer.

[0021] Figure 3 The invention is a schematic diagram of an exploded three-dimensional structure of a mobile heat dissipation mechanism and a stable mobile component in a heat dissipation structure of a computer.

[0022] Figure 4 The present invention is a three-dimensional structural schematic diagram of a heat dissipation component in a heat dissipation structure of a computer.

[0023] Legend:

[0024] 1. Side frame; 2. Motor; 3. Bottom plate; 4. Mobile heat dissipation mechanism; 41. Mounting shell; 42. Side air net; 43. Slide groove; 44. Heat dissipation assembly; 441. Cooling fan; 442. Threaded sleeve; 443. Mounting sleeve; 5. Mounting stud; 6. Reciprocating screw; 7. Slide rail; 8. Stable moving assembly; 81. Mounting shaft; 82. Dust pad; 83. Mounting frame; 84. Moving roller. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] See also Figure 1-4The utility model provides a technical solution: a heat dissipation structure of a computer, comprising a bottom plate 3, a side frame 1 is longitudinally fixedly installed on the top surface of the bottom plate 3, a slide rail 7 is transversely fixedly installed on the top surface of the bottom plate 3, a motor 2 is fixedly installed on one side outer wall of the side frame 1, a reciprocating screw 6 is fixedly installed on one end of the output shaft of the motor 2, a mounting stud 5 is transversely fixedly installed on one side outer wall of the side frame 1, a mobile heat dissipation mechanism 4 is slidably installed on the slide rail 7, and stable moving components 8 are arranged on both side outer walls of the mobile heat dissipation mechanism 4;

[0027] The mobile heat dissipation mechanism 4 includes a mounting shell 41, and the mounting shell 41 is slidably mounted on the slide rail 7 through a slide groove 43 arranged at the bottom thereof. A mounting groove is arranged inside the mounting shell 41, and side wind nets 42 are arranged on both sides of the mounting groove. The reciprocating screw 6 is threadedly connected to a threaded hole arranged at the center position of the mounting shell 41, and a heat dissipation component 44 is arranged inside the mounting groove, and the heat dissipation component 44 is located between the two side wind nets 42.

[0028] The heat dissipation assembly 44 includes a mounting sleeve 443, which is fixedly mounted inside a mounting groove. A threaded sleeve 442 is rotatably mounted inside the mounting sleeve 443, a heat dissipation fan 441 is fixedly mounted on the outer surface of the threaded sleeve 442, and the mounting stud 5 is threadedly connected to a threaded hole arranged inside the threaded sleeve 442.

[0029] The specific implementation method is as follows: the structure is positioned and installed in the computer. When the computer is used, the motor 2 is powered on to drive the reciprocating screw 6 to rotate, and the reciprocating screw 6 can drive the mobile heat dissipation mechanism 4 to move. When the mobile heat dissipation mechanism 4 moves, the threaded sleeve 442 can move on the mounting stud 5. Due to the threaded connection between the two, the threaded sleeve 442 can drive the heat dissipation fan 441 to rotate, and the generated airflow can be guided out through the side wind net 42. As the mobile heat dissipation mechanism 4 moves, the structure in the computer is cooled.

[0030] The stable moving assembly 8 includes two mounting frames 83, both of which are fixedly mounted on the outer surface of the mounting shell 41, and a moving roller 84 is rotatably mounted between the two mounting frames 83, the moving roller 84 is rollingly connected to the bottom plate 3, and a dust suction pad 82 is arranged outside the moving roller 84;

[0031] The specific implementation method is as follows: when the mobile heat dissipation mechanism 4 moves, the mobile roller 84 can roll stably on the bottom plate 3, and the mobile roller 84 can produce a stable protection effect for the moving mobile heat dissipation mechanism 4 to prevent the mobile heat dissipation mechanism 4 from being offset, etc. At the same time, when the mobile roller 84 rolls, the dust absorption pad 82 on its outside can adhere to the dust deposited on the bottom plate 3.

[0032] Working principle: the structure is positioned and installed in the computer. When the computer is used, the motor 2 is energized to drive the reciprocating screw 6 to rotate, and the reciprocating screw 6 can drive the mobile heat dissipation mechanism 4 to move. When the mobile heat dissipation mechanism 4 moves, the threaded sleeve 442 can move on the mounting stud 5. Due to the threaded connection between the two, the threaded sleeve 442 can drive the heat dissipation fan 441 to rotate, and the generated airflow can be discharged through the side wind net 42. As the mobile heat dissipation mechanism 4 moves, the structure in the computer is cooled; when the mobile heat dissipation mechanism 4 moves, the moving roller 84 can roll stably on the bottom plate 3. The moving roller 84 can produce a stable protection effect for the moving mobile heat dissipation mechanism 4 to prevent the mobile heat dissipation mechanism 4 from being offset, etc. At the same time, when the moving roller 84 rolls, the dust absorption pad 82 on its outside can adhere to the dust deposited on the bottom plate 3.

[0033] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A heat dissipation structure of a computer, comprising a bottom plate (3), characterized in that: A side frame (1) is longitudinally fixedly mounted on the top surface of the bottom plate (3), a slide rail (7) is transversely fixedly mounted on the top surface of the bottom plate (3), a motor (2) is fixedly mounted on an outer wall of one side of the side frame (1), a reciprocating screw (6) is fixedly mounted on one end of an output shaft of the motor (2), a mounting stud (5) is transversely fixedly mounted on an outer wall of one side of the side frame (1), a mobile heat dissipation mechanism (4) is slidably mounted on the slide rail (7), and stable moving components (8) are provided on both side outer walls of the mobile heat dissipation mechanism (4).

2. A heat dissipation structure for a computer according to claim 1, characterized in that: The mobile heat dissipation mechanism (4) comprises a mounting shell (41), wherein the mounting shell (41) is slidably mounted on a slide rail (7) via a slide groove (43) provided at the bottom thereof, and a mounting groove is provided inside the mounting shell (41), and side wind nets (42) are provided on both sides of the mounting groove.

3. A heat dissipation structure for a computer according to claim 2, characterized in that: The reciprocating screw (6) is threadedly connected to a threaded hole provided at the center of the mounting shell (41), and a heat dissipation component (44) is provided inside the mounting groove.

4. A heat dissipation structure for a computer according to claim 3, characterized in that: The heat dissipation component (44) is located between the two side wind nets (42).

5. A heat dissipation structure for a computer according to claim 4, characterized in that: The heat dissipation component (44) comprises a mounting sleeve (443), wherein the mounting sleeve (443) is fixedly mounted inside the mounting groove, and a threaded rotating sleeve (442) is rotatably mounted inside the mounting sleeve (443).

6. A heat dissipation structure for a computer according to claim 5, characterized in that: A heat dissipation fan (441) is fixedly mounted on the outer surface of the threaded rotating sleeve (442).

7. A heat dissipation structure for a computer according to claim 6, characterized in that: The mounting stud (5) is threadedly connected to a threaded hole provided inside the threaded sleeve (442).

8. The heat dissipation structure of a computer according to claim 7, characterized in that: Four of the stable moving components (8) are symmetrically arranged on both sides of the mounting shell (41), and two of the stable moving components (8) form a group.

9. The heat dissipation structure of a computer according to claim 8, characterized in that: The stable moving assembly (8) comprises two mounting frames (83), the two mounting frames (83) are fixedly mounted on the outer surface of the mounting shell (41), and a moving roller (84) is rotatably mounted between the two mounting frames (83).

10. The heat dissipation structure of a computer according to claim 9, characterized in that: The movable roller (84) is rollingly connected to the bottom plate (3), and a dust suction pad (82) is arranged outside the movable roller (84).

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