Display device

Abstract

A display device includes: a substrate including a display area and a non-display area; a transistor disposed on the substrate; a light emitting diode electrically connected to the transistor; a color conversion layer and a transmission layer disposed on the light emitting diode; and a partition wall disposed on the light emitting diode, in which the partition wall includes: a first partition wall disposed in the display area between the color conversion layer and the transmission layer; and a second partition wall disposed in the non-display area, and the second partition wall includes: a first portion having a first length from the first end to a boundary between the display area and the non-display area; and a second portion having a second length from the second end to a boundary between the display area and the non-display area, where the first length is greater than the second length.

Description

[0001] This application claims priority to and all benefits derived from Korean Patent Application No. 10-2023-0061044, filed on May 11, 2023, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0002] The present disclosure relates to a display device. Background Art

[0003] The light emitting diode is an element in which holes supplied from an anode and electrons supplied from a cathode are recombined in an emission layer formed between the anode and the cathode to form excitons and the excitons are stabilized to emit light.

[0004] Since the light emitting diode has various desirable characteristics such as a wide viewing angle, a fast response speed, a thin thickness, and low power consumption, the light emitting diode is widely used in various electric and electronic devices such as televisions, monitors, and mobile phones.

[0005] Recently, a display device including a color conversion layer has been proposed to realize a high-efficiency display device.

[0006] The color conversion layer can convert incident light into light of different colors. Utility Model Content

[0007] The embodiment is directed to providing a display device in which color spots do not occur at the edge of a display area by providing a filling layer having a uniform thickness.

[0008] The display device according to the embodiment includes: a substrate including a display area and a non-display area; a transistor disposed on the substrate; a light emitting diode disposed on the transistor and electrically connected to the transistor; a color conversion layer and a transmission layer disposed on the light emitting diode; and a partition wall disposed on the light emitting diode, wherein the partition wall includes: a first partition wall disposed in the display area between the color conversion layer and the transmission layer; and a second partition wall disposed in the non-display area. In such an embodiment, the second partition wall includes: a first portion having a first length from a first end to a boundary between the display area and the non-display area; and a second portion having a second length from a second end to a boundary between the display area and the non-display area, wherein the first length is greater than the second length.

[0009] In an embodiment, in a plan view, the first portion may protrude more from a boundary between the display area and the non-display area than the second portion.

[0010] In an embodiment, the first partition wall may define a first opening in which the color conversion layer and the transmission layer are disposed, and the second partition wall may define a second opening having the same shape as the first opening.

[0011] In an embodiment, the first portion and the second portion may protrude from a boundary between the display area and the non-display area toward the first direction.

[0012] In an embodiment, the first portion and the second portion may be alternately arranged along a second direction perpendicular to the first direction.

[0013] In an embodiment, the display device may further include: a color filter disposed on the color conversion layer, the transmission layer, and the partition wall.

[0014] In an embodiment, the color filter includes: a first color filter disposed on the transmission layer; a second color filter disposed on the second color conversion layer of the color conversion layer; and a third color filter disposed on the first color conversion layer of the color conversion layer, and the partition wall may overlap with at least two selected from the first color filter, the second color filter, and the third color filter.

[0015] In an embodiment, the first color filter, the second color filter, and the third color filter may continuously extend in the non-display area.

[0016] In an embodiment, the display device may further include: a filling layer disposed between the light emitting diode and the color conversion layer and between the light emitting diode and the transmission layer.

[0017] In an embodiment, a filling layer may fill the second opening.

[0018] In an embodiment, the display device may further include: a columnar spacer disposed between the first partition wall and the light emitting diode.

[0019] In an embodiment, the first partition wall may define a first opening in which the color conversion layer and the transmissive layer are located, and no opening may be defined in the second partition wall.

[0020] In an embodiment, the second partition wall may continuously overlap the color filter positioned in the non-display area.

[0021] In an embodiment, the display device may further include: a filling layer disposed on the partition wall, the color conversion layer, and the transmission layer; and a color filter disposed on the filling layer.

[0022] According to an embodiment, a display device includes: a first substrate including a display area and a non-display area; a transistor disposed on the first substrate; a light emitting diode disposed on the first substrate and electrically connected to the transistor; a color conversion layer and a transmission layer disposed on the light emitting diode; and a partition wall disposed on the light emitting diode, wherein the partition wall includes: a first partition wall disposed in the display area between the color conversion layer and the transmission layer; and a second partition wall disposed in the non-display area, the second partition wall including a protruding portion and a recessed portion in a plan view.

[0023] In an embodiment, the display device may further include: an encapsulation layer disposed on the light emitting diode; and a filling layer disposed between the color conversion layer and the encapsulation layer, wherein the filling layer may fill the recessed portion.

[0024] In an embodiment, the first partition wall may define a first opening overlapping the color conversion layer and the transmission layer, and the second partition wall may define a second opening having the same shape as the first opening.

[0025] In an embodiment, the first partition wall may define a first opening overlapping the color conversion layer and the transmission layer, and no opening may be defined in the second partition wall.

[0026] In an embodiment, the display device may further include: a second substrate overlapping the first substrate; and a color filter disposed between the second substrate and the color conversion layer.

[0027] In an embodiment, the display device may further include: a filling layer disposed between the color filter and the color conversion layer.

[0028] According to the embodiment, a display device having improved display quality and controlling color spots at an edge of a display area by providing a filling layer having a uniform thickness may be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 is a schematic exploded perspective view of a display device according to an embodiment.

[0030] Figure 2 is a schematic cross-sectional view of a display panel according to an embodiment.

[0031] Figure 3 is a schematic top view of a display panel according to an embodiment.

[0032] Figure 4 is based on Figure 3 A cross-sectional view of a display panel of an embodiment.

[0033] Figure 5 is based on Figure 3 A cross-sectional view of a display panel of an embodiment.

[0034] Figure 6 is a schematic top view of a display panel according to an embodiment.

[0035] Figure 7 is based on Figure 6 A schematic cross-sectional view of a display panel of an embodiment of the present invention.

[0036] Figure 8 is based on Figure 6A schematic cross-sectional view of a display panel of an embodiment of the present invention.

[0037] Fig. 9 is based on Figure 3 A cross-sectional view of a display panel of an alternative embodiment.

[0038] Fig.10 is based on Figure 6 A cross-sectional view of a display panel of an alternative embodiment. DETAILED DESCRIPTION

[0039] The present invention will now be more fully described with reference to the accompanying drawings in which various embodiments are shown. However, the present invention can be implemented in many different forms and should not be construed as being limited to the embodiments set forth herein. On the contrary, these embodiments are provided so that the present disclosure will be thorough and complete, and will fully convey the scope of the present invention to those skilled in the art. The same reference numerals always refer to the same elements.

[0040] It will be understood that although the terms "first", "second", "third", etc. may be used herein to describe various elements, components, regions, layers and / or portions, these elements, components, regions, layers and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or portion from another element, component, region, layer or portion. Therefore, the first element, component, region, layer or portion discussed below may be referred to as a second element, component, region, layer or portion without departing from the teachings herein.

[0041] The terms used in this article are only for the purpose of describing specific embodiments and are not intended to be limited. As used in this article, "one", "the (described)" and "at least one" do not represent the limitation of quantity, and unless the context clearly indicates otherwise, it is intended to include both the singular and the plural. For example, unless the context clearly indicates otherwise, "element" has the same meaning as "at least one element". "At least one" should not be interpreted as being limited to "one". "Or" means "and / or". As used in this article, the term "and / or" includes any combination and all combinations of one or more related listed items. It will be further understood that when used in this specification, the term "includes" or "comprising" and / or its variations indicate the existence of stated features, regions, entireties, steps, operations, elements and / or parts, but does not exclude the existence or addition of one or more other features, regions, entireties, steps, operations, elements, parts and / or its groups.

[0042] In addition, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe the relationship of one element to another element illustrated in the drawings. It will be understood that, in addition to the orientation depicted in the drawings, relative terms are intended to include different orientations of the device. For example, if the device in one of the drawings is turned over, the element described as being on the "lower" side of the other element will then be oriented on the "upper" side of the other element. Therefore, depending on the specific orientation of the drawings, the term "lower" can include both "lower" and "upper" orientations. Similarly, if the device in one of the drawings is turned over, the element described as being "below" or "below" the other element will be oriented "above" the other element. Therefore, the term "below..." or "below..." can include both upper and lower orientations.

[0043] In addition, when a part such as a layer, film, region, or plate is referred to as being “on” or “on” another part, this includes not only the case where it is “directly on” the other part but also includes the case where other parts are present therebetween.

[0044] In contrast, when a part is referred to as being "directly on" another part, it means there is no other part in between.

[0045] Additionally, “above” or “on” a reference portion means positioned above or below the reference portion, and does not necessarily mean positioned “above” or “on” it in the opposite direction of gravity.

[0046] In addition, throughout the specification, when reference is made to a “plan view”, it means when a target portion is viewed from above, and when reference is made to a “cross-sectional view”, it means when a vertically cut cross section of the target portion is viewed from the side.

[0047] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as those commonly understood by those skilled in the art to which the present disclosure belongs. It will be further understood that terms (such as those defined in commonly used dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and the present disclosure, and will not be interpreted in an idealized or overly formal sense unless so explicitly defined herein.

[0048] Embodiments are described herein with reference to cross-sectional illustrations that are schematic illustrations of ideal embodiments. As such, variations in the shapes of the illustrations due to, for example, manufacturing techniques and / or tolerances will be expected. Therefore, the embodiments described herein should not be interpreted as being limited to the specific shapes of the zones as illustrated herein, but will include deviations in shapes caused, for example, by manufacturing. For example, a zone illustrated or described as flat may typically have rough and / or nonlinear features. Moreover, the illustrated sharp corners may be rounded. Therefore, the zones illustrated in the accompanying drawings are schematic in nature, and their shapes are not intended to illustrate the precise shapes of the zones and are not intended to limit the scope of the utility model.

[0049] In the following, reference will be made to Figure 1 A display device according to the embodiment is described.

[0050] Figure 1 is a schematic exploded perspective view of a display device according to an embodiment.

[0051] Reference Figure 1 , the display device 1000 according to the embodiment may include a display panel DP and a housing HM.

[0052] One surface of the display panel DP on which an image is displayed is parallel to a surface defined by the first direction DR1 and the second direction DR2.

[0053] The third direction DR3 indicates a normal direction of one surface on which an image is displayed, that is, a thickness direction of the display panel DP.

[0054] The front surface (or upper surface) and the rear surface (or lower surface) of each member are divided by the third direction DR3.

[0055] However, the directions indicated by the first to third directions DR1, DR2, and DR3 may be converted into other directions in a relative concept.

[0056] The display panel DP may be a flat rigid display panel, but is not limited thereto, and may also be a flexible display panel.

[0057] In an embodiment, the display panel DP may be an organic light emitting display panel.

[0058] However, the type of the display panel DP is not limited thereto and may include various types of panels.

[0059] In an embodiment, for example, the display panel DP may be a liquid crystal display panel, an electrophoretic display panel, an electrowetting display panel, or the like.

[0060] Alternatively, the display panel DP may be a next-generation display panel such as a micro light emitting diode (LED) display panel, a quantum dot LED display panel, and a quantum dot organic LED display panel.

[0061] The micro LED display panel is formed in such a manner that each pixel is constituted by an LED having a size of 10 micrometers to 100 micrometers.

[0062] Such a micro LED display panel has advantages such as use of inorganic materials, omission of backlight, fast response speed, high brightness with low power consumption, and no breakage when bent.

[0063] The quantum dot LED display panel is formed by attaching a film containing quantum dots or forming a material containing quantum dots.

[0064] Quantum dots are composed of inorganic materials such as indium and cadmium, and refer to particles that emit light by themselves and have a diameter of several nanometers or less.

[0065] By adjusting the particle size of quantum dots, it is possible to display light of a desired color.

[0066] The quantum dot organic LED display panel uses a blue organic LED as a light source, on which a film containing red and green quantum dots is attached or a material containing red and green quantum dots is deposited to achieve color.

[0067] The display panel DP according to the embodiment may include various other display panels.

[0068] like Figure 1 As shown in FIG. 1 , the display panel DP includes a display area DA displaying an image and a non-display area PA adjacent to the display area DA.

[0069] The non-display area PA is a region where no image is displayed.

[0070] For example, the display area DA may have a rectangular shape, and the non-display area PA may have a shape surrounding the display area DA.

[0071] However, the shapes of the display area DA and the non-display area PA may be relatively designed without being limited thereto.

[0072] The housing HM provides a predetermined inner space.

[0073] The display panel DP is installed inside the housing HM.

[0074] In addition to the display panel DP, various electronic components such as a power supply unit, a storage device, and an audio input / output module may be mounted inside the housing HM.

[0075] In the following, reference will be made to Figure 2 A display area of ​​a display panel according to an embodiment is described.

[0076] Figure 2is a schematic cross-sectional view of a display panel according to an embodiment.

[0077] Reference Figure 2 , a plurality of pixels PA1, PA2 and PA3 may be arranged or formed in Figure 1 On the substrate SUB corresponding to the display area DA.

[0078] Each of the pixels PA1, PA2, and PA3 may include a plurality of transistors and a light emitting element connected thereto.

[0079] The encapsulation layer ENC may be positioned on the plurality of pixels PA1 , PA2 , and PA3 .

[0080] The display area DA may be protected from external air or moisture by the encapsulation layer ENC.

[0081] The encapsulation layer ENC may be integrally provided to overlap the entire surface of the display area DA, and may also be partially disposed in the non-display area PA.

[0082] The first color conversion portion CC1, the second color conversion portion CC2, and the transmissive portion CC3 may be positioned on the encapsulation layer ENC.

[0083] The first color conversion portion CC1 overlaps the first pixel PA1, the second color conversion portion CC2 overlaps the second pixel PA2, and the transmissive portion CC3 overlaps the third pixel PA3.

[0084] Light emitted from the first pixel PA1 may pass through the first color conversion portion CC1 to provide red light LR.

[0085] Light emitted from the second pixel PA2 may pass through the second color conversion portion CC2 to provide green light LG.

[0086] Light emitted from the third pixel PA3 may pass through the transmissive portion CC3 to provide blue light LB.

[0087] In the following, reference will be made to Figures 3 to 5 The structure of the display panel according to the embodiment is described in more detail.

[0088] Figure 3 is a schematic top view of a display panel according to an embodiment, Figure 4 is based on Figure 3 A cross-sectional view of a display panel of an embodiment of the present invention, and Figure 5 is based on Figure 3 A cross-sectional view of a display panel of an embodiment.

[0089] First refer to Figure 3, the display area DA according to the embodiment includes a red light emitting area RLA, a green light emitting area GLA, and a blue light emitting area BLA.

[0090] The non-emission area NLA1 may be positioned between the red, green, and blue light emitting areas RLA, GLA, and BLA.

[0091] Each light emitting area may correspond to a pixel.

[0092] In an embodiment, for example, the blue light emitting area BLA, the red light emitting area RLA, and the green light emitting area GLA may correspond to a blue pixel, a red pixel, and a green pixel, respectively.

[0093] Although each light emitting region is shown as a rectangle in a plan view, it may have other shapes such as a rhombus, a pentagon, and an octagon and may have various shapes and areas according to embodiments.

[0094] Reference Figure 3 and Figure 4 , a cross-sectional structure of the display area DA will be described.

[0095] The display unit DC according to the embodiment includes a first substrate SUB1.

[0096] The first substrate SUB1 may include a flexible material such as plastic that can be easily bent, folded, or rolled.

[0097] The buffer layer BF may be positioned on the first substrate SUB1.

[0098] The buffer layer BF may include silicon nitride (SiN x ), silicon oxide (SiO 2 ) or silicon oxynitride.

[0099] In an embodiment, a buffer layer BF is positioned between the first substrate SUB1 and the semiconductor layer ACT to block impurities from the first substrate SUB1 during a crystallization process for forming polysilicon, thereby improving the characteristics of polysilicon, and the stress of the semiconductor layer ACT formed on the buffer layer BF can be relieved by planarizing the first substrate SUB1.

[0100] In an embodiment, the semiconductor layer ACT is positioned on the buffer layer BF.

[0101] The semiconductor layer ACT may include or be formed of polycrystalline silicon or an oxide semiconductor.

[0102] The semiconductor layer ACT may include a channel region C, a source region S, and a drain region D.

[0103] In an embodiment, the source region S and the drain region D are disposed or defined on opposite sides of the channel region C.

[0104] The channel region C is an intrinsic semiconductor that is not doped with impurities, and the source region S and the drain region D are extrinsic semiconductors that are doped with conductive impurities.

[0105] The semiconductor layer ACT may include an oxide semiconductor or be formed of an oxide semiconductor, and in this case, a passivation layer (not shown) may be added to protect the oxide semiconductor material susceptible to an external environment such as a high temperature.

[0106] In an embodiment, the gate insulating layer GI is positioned on the semiconductor layer ACT.

[0107] The gate insulating layer GI may include a material selected from silicon nitride (SiN x ), silicon oxide (SiO 2 ) and silicon oxynitride, a single layer or multiple layers of at least one of the above.

[0108] In an embodiment, the gate electrode GE is positioned on the gate insulating layer GI, and the gate electrode GE includes at least one selected from copper (Cu), a copper alloy, aluminum (Al), an aluminum alloy, molybdenum (Mo), and a molybdenum alloy.

[0109] In an embodiment, the interlayer insulating layer IL1 is positioned on the gate electrode GE and the gate insulating layer GI.

[0110] The interlayer insulating layer IL1 may include silicon nitride (SiN x ), silicon oxide (SiO 2 ) or silicon oxynitride.

[0111] Openings exposing the source region S and the drain region D may be defined or formed in the interlayer insulating layer IL1 .

[0112] In an embodiment, the source electrode SE and the drain electrode DE are positioned on the interlayer insulating layer IL1 .

[0113] The source electrode SE and the drain electrode DE may be connected to the source region S and the drain region D of the semiconductor layer ACT, respectively, through openings defined or formed in the interlayer insulating layer IL1 .

[0114] In an embodiment, the passivation layer IL2 is positioned on the interlayer insulating layer IL1 , the source electrode SE, and the drain electrode DE.

[0115] In such an embodiment, the passivation layer IL2 covers and planarizes the interlayer insulating layer IL1 , the source electrode SE, and the drain electrode DE, so that the first electrode E1 may be formed on the passivation layer IL2 without a step.

[0116] The passivation layer IL2 may include or be made of an organic material such as a polyacrylate resin or a polyimide resin, or a laminated film of an organic material and an inorganic material.

[0117] The first electrode E1 may be positioned on the passivation layer IL2 .

[0118] The first electrode E1 may be connected to the source electrode SE through the opening of the passivation layer IL2 .

[0119] A driving transistor including a gate electrode GE, a semiconductor layer ACT, a source electrode SE, and a drain electrode DE may be connected to the first electrode E1 to supply a driving current to the light emitting element ED.

[0120] remove Figure 4 In addition to the driving transistor shown in the figure, the display device 1000 according to the embodiment may further include a switching transistor not shown, which is connected to a data line for transmitting a data voltage in response to a scan signal and is connected to the driving transistor and is driven in response to the scan signal. A compensation transistor not shown for compensating for a threshold voltage of the transistor may be further included.

[0121] The pixel defining layer PDL may be positioned on the passivation layer IL2 and the first electrode E1 , and the pixel defining layer PDL may be provided with a pixel opening overlapping the first electrode E1 to define a light emitting area.

[0122] The pixel defining layer PDL may include an organic material such as a polyacrylate resin or a polyimide resin, or a silicon-based inorganic material.

[0123] The pixel opening may have a planar shape substantially similar to that of the first electrode E1 and may have a planar rhombus shape or an octagonal shape similar to the rhombus shape, but is not limited thereto and may have any shape such as a rectangle or other polygons.

[0124] In an embodiment, the emission layer EML is positioned on the first electrode E1 overlapping the pixel opening.

[0125] The emission layer EML may include or be formed of a low molecular weight organic material or a high molecular weight organic material such as poly 3,4-ethylenedioxythiophene (PEDOT).

[0126] In an embodiment, the emission layer EML is a multi-layer including at least two selected from the group consisting of a hole injection layer HIL, a hole transport layer HTL, an electron transport layer ETL, and an electron injection layer EIL.

[0127] Most of the emission layer EML may be positioned within the pixel opening, and may also be positioned on or over the side surface of the pixel defining layer PDL.

[0128] In an embodiment, the second electrode E2 is positioned on the emission layer EML.

[0129] The second electrode E2 may be positioned throughout a plurality of pixels and may receive a common voltage through a common voltage transmission unit not shown in the non-display area PA.

[0130] The first electrode E1, the emission layer EML, and the second electrode E2 may constitute a light emitting element (eg, LED) ED.

[0131] In an embodiment, the first electrode E1 may be an anode that is a hole injection electrode, and the second electrode E2 may be a cathode that is an electron injection electrode.

[0132] However, the embodiment is not necessarily limited thereto, and alternatively, according to a driving method of the organic light emitting display device, the first electrode E1 may function as a cathode and the second electrode E2 may function as an anode.

[0133] Holes and electrons are injected into the emission layer EML from the first electrode E1 and the second electrode E2, respectively, and when excitons in which the injected holes and electrons are recombined drop from an excited state to a ground state, light emission occurs.

[0134] In an embodiment, the encapsulation layer ENC is positioned on the second electrode E2.

[0135] The encapsulation layer ENC may cover not only the upper surface of the display layer including the light emitting element ED but also the side surface of the display layer including the light emitting element ED, thereby sealing the display layer.

[0136] In an embodiment, the light emitting element ED may be highly susceptible to moisture and oxygen, and the encapsulation layer ENC may protect the light emitting element ED by sealing the display layer to block the inflow of external moisture and oxygen.

[0137] The encapsulation layer ENC may include a plurality of layers, and may include or be formed of a composite layer including both an inorganic layer and an organic layer. The encapsulation layer ENC may include an inorganic layer EIL1 , an organic layer EOL, and an inorganic layer EIL2 .

[0138] In an embodiment, the color conversion cell CC is positioned on the encapsulation layer ENC.

[0139] The color conversion cell CC includes a second substrate SUB2 opposite to the first substrate SUB1.

[0140] The second substrate SUB2 may include a flexible material such as plastic that can be easily bent, folded, or rolled.

[0141] The color conversion unit CC may include a first color filter CF1, a second color filter CF2, and a third color filter CF3 positioned between the second substrate SUB2 and the display unit DC.

[0142] The third color filter CF3 may overlap the first color conversion layer CCL1 which will be described later.

[0143] The third color filter CF3 transmits the red light having passed through the first color conversion layer CCL1 and absorbs light of other wavelengths, thereby increasing the purity of the red light emitted to the outside of the display device 1000 .

[0144] The second color filter CF2 may overlap the second color conversion layer CCL2 and transmit the green light having passed through the second color conversion layer CCL2 and absorb light of other wavelengths, thereby increasing the purity of the green light emitted to the outside of the display device 1000 .

[0145] The first color filter CF1 may overlap the transmission layer TL. The first color filter CF1 transmits blue light having passed through the transmission layer TL and absorbs light of other wavelengths, thereby increasing the purity of blue light emitted to the outside of the display device 1000.

[0146] At least two selected from among the third color filter CF3 , the second color filter CF2 , and the first color filter CF1 may overlap each other in the non-emission area NLA1 to serve as a light blocking layer.

[0147] The non-emission area NLA1 may overlap the pixel defining layer PDL of the display unit DC.

[0148] The insulating layer IL3 may be positioned between the first, second, and third color filters CF1, CF2, and CF3 and the display cell DC.

[0149] The insulating layer IL3 may include silicon oxide, silicon nitride, or silicon oxynitride.

[0150] The first partition wall BK1 may be positioned between the display cell DC and the insulating layer IL3. The first partition wall BK1 may define a first opening OP1 overlapping the pixel opening.

[0151] The first color converting layer CCL1 , the second color converting layer CCL2 , and the transmissive layer TL may be positioned in the first opening OP1 .

[0152] The first color conversion layer CCL1 may convert supplied light (or light incident thereto) into red light. The first color conversion layer CCL1 may include quantum dots.

[0153] The second color conversion layer CCL2 may convert the supplied light into green light. The second color conversion layer CCL2 may include quantum dots.

[0154] The quantum dots will be described in detail below.

[0155] In the specification, quantum dots (hereinafter referred to as semiconductor nanocrystals) are II-VI compounds, III-V compounds, IV-VI compounds, IV elements or compounds, I-III-VI compounds, II-III-VI compounds, I-II-IV-VI compounds or combinations thereof.

[0156] The II-VI group compound is a binary compound selected from CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnO, HgS, HgSe, HgTe, MgSe, MgS and mixtures thereof, a binary compound selected from AgInS, CuInS, CdSeS, CdSeTe, CdSTe, ZnSeS, ZnSeTe, ZnSTe, HgSeS, HgSeTe, HgSTe, CdZnS, CdZnSe, A ternary compound selected from CdZnTe, CdHgS, CdHgSe, CdHgTe, HgZnS, HgZnSe, HgZnTe, MgZnSe or a quaternary compound selected from HgZnTeS, CdZnSeS, CdZnSeTe, CdZnSTe, CdHgSeS, CdHgSeTe, CdHgSTe, HgZnSeS, HgZnSeTe, HgZnSTe and mixtures thereof.

[0157] The Group II-VI compound may further include a Group III metal.

[0158] The III-V compound is a binary compound selected from GaN, GaP, GaAs, GaSb, AlN, AlP, AlAs, AlSb, InN, InP, InAs, InSb and a mixture thereof, a ternary compound selected from GaNP, GaNAs, GaNSb, GaPAs, GaPSb, AlNP, AlNAs, AlNSb, AlPAs, AlPSb, InGaP, InNP, InNAs, InNSb, InPAs, InZnP, InPSb and a mixture thereof, or a quaternary compound selected from GaAlNP, GaAlNAs, GaAlNSb, GaAlPAs, GaAlPSb, GaInNP, GaInNAs, GaInNSb, GaInPAs, GaInPSb, InAlNP, InAlNAs, InAlNSb, InAlPAs, InAlPSb and a mixture thereof.

[0159] The Group III-V compound may further include a Group II metal (eg, InZnP).

[0160] The IV-VI Group compound is a binary compound selected from SnS, SnSe, SnTe, PbS, PbSe, PbTe and a mixture thereof, a ternary compound selected from SnSeS, SnSeTe, SnSTe, PbSeS, PbSeTe, PbSTe, SnPbS, SnPbSe, SnPbTe and a mixture thereof, or a quaternary compound selected from SnPbSSe, SnPbSeTe, SnPbSTe and a mixture thereof.

[0161] The Group IV element or compound is a single atomic material selected from Si, Ge, and a combination thereof, or a binary compound selected from SiC, SiGe, and a combination thereof, but is not limited thereto.

[0162] Examples of Group I-III-VI compounds include, but are not limited to, CuInSe 2 、CuInS 2 , CuInGaSe and CuInGaS.

[0163] Examples of Group I-II-IV-VI compounds include, but are not limited to, CuZnSnSe and CuZnSnS.

[0164] The II-III-VI group compound may be ZnGaS, ZnAlS, ZnInS, ZnGaSe, ZnAlSe, ZnInSe, ZnGaTe, ZnAlTe, ZnInTe, ZnGaO, ZnAlO, ZnInO, HgGaS, HgAlS, HgInS, HgGaSe, HgAlSe, HgInSe, HgGaTe or HgAlTe. The II-III-VI group compound may be selected from HgInTe, MgGaS, MgAlS, MgInS, MgGaSe, MgAlSe, MgInSe and combinations thereof, but is not limited thereto.

[0165] In an embodiment, the quantum dots may not include cadmium.

[0166] Quantum dots may include semiconductor nanocrystals based on Group III-V compounds including indium and phosphorus.

[0167] The Group III-V compound may further include zinc.

[0168] The quantum dots may include semiconductor nanocrystals based on Group II-VI compounds including zinc and a chalcogen (eg, sulfur, selenium, tellurium, or a combination thereof).

[0169] In quantum dots, the above-mentioned binary compound, ternary compound and / or quaternary compound may be present in a particle at a uniform concentration, or may be present in the same particle at a partially different concentration distribution.

[0170] Additionally, one quantum dot may have a core-shell structure surrounding another quantum dot.

[0171] The interface between the core and the shell may have a concentration gradient in which the concentration of the element present in the shell decreases toward the center.

[0172] In some embodiments, the quantum dot may have a core-shell structure including a core including the aforementioned nanocrystal and a shell surrounding the core.

[0173] The shell of the quantum dot may serve as a protective layer for maintaining semiconductor properties by preventing chemical denaturation of the core and / or a charging layer for imparting electrophoretic properties to the quantum dot.

[0174] The shell can be single-layer or multi-layer.

[0175] Examples of quantum dot shells include metal oxides or non-metal oxides, semiconductor compounds, or combinations thereof.

[0176] For example, the metal oxide or non-metal oxide may be SiO 2 、Al 2 O 3 、TiO 2 、ZnO、MnO、Mn 2 O 3 , Mn 3 O 4 , CuO, FeO, Fe 2 O 3 , Fe 3 O 4 , CoO, Co 3 O 4 , NiO or such as MgAl 2 O 4 、CoFe 2 O 4 、NiFe 2 O 4 and CoMn 2 O 4 The present invention may be a ternary compound of the type described above, but the present invention is not limited thereto.

[0177] In addition, examples of semiconductor compounds include CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnSeS, ZnTeS, GaAs, GaP, GaSb, HgS, HgSe, HgTe, InAs, InP, InGaP, InSb, AlAs, AlP, and AlSb, etc. However, the present invention is not limited thereto.

[0178] In addition, the semiconductor nanocrystal may have a structure including a single semiconductor nanocrystal core and a multi-layered shell surrounding the semiconductor nanocrystal core.

[0179] In embodiments, the multi-layer shell can have two or more layers, such as two, three, four, five or more layers.

[0180] Two adjacent layers of the shell may have a single composition or different compositions.

[0181] Each layer in a multilayer shell can have a composition that varies along the radius.

[0182] The quantum dots may have a full width at half maximum (FWHM) of an emission wavelength spectrum of about 45 nanometers (nm) or less (eg, about 40 nm or less or about 30 nm or less), and can improve color purity or color reproducibility in this range.

[0183] In addition, since light emitted by quantum dots is emitted in all directions, the wide viewing angle can be improved.

[0184] In quantum dots, the shell material and the core material can have different energy band gaps.

[0185] For example, the band gap of the shell material may be larger than the band gap of the core material.

[0186] In other embodiments, the energy band gap of the shell material may be smaller than the energy band gap of the core material.

[0187] Quantum dots can have multiple shells.

[0188] In a multi-layer shell, the energy band gap of the outer layer may be larger than the energy band gap of the inner layer (ie, the layer closer to the core).

[0189] In a multilayer shell, the band gap of the outer layer can be smaller than that of the inner layer.

[0190] Quantum dots can control the absorption / emission wavelength by adjusting their composition and size.

[0191] The maximum emission peak wavelength of the quantum dots may have a wavelength range from ultraviolet wavelength to infrared wavelength or higher.

[0192] Quantum dots can have a quantum efficiency of about 10% or greater, such as about 30% or greater, about 50% or greater, about 60% or greater, about 70% or greater, about 90% or greater, or even 100%.

[0193] Quantum dots can have a relatively narrow spectrum.

[0194] The quantum dots may have, for example, a full width at half maximum of an emission wavelength spectrum of about 50 nm or less, such as about 45 nm or less, about 40 nm or less, or about 30 nm or less.

[0195] The quantum dots may have a particle size of about 1 nm or more and about 100 nm or less.

[0196] The size of a particle refers to the diameter of the particle or the diameter of an assumed spherical shape converted from a two-dimensional image obtained by transmission electron microscopy.

[0197] The quantum dots can have a size of about 1 nm to about 50 nm, such as 2 nm or more, 3 nm or more, or 4 nm or more and 50 nm or less, 40 nm or less, 30 nm or less, 20 nm or less, 15 nm or less, or 10 nm or less.

[0198] The shape of the quantum dots is not particularly limited.

[0199] For example, the shape of the quantum dot may include a sphere, a polyhedron, a pyramid, a multipod, a cube, a cuboid, a nanotube, a nanorod, a nanowire, a nanosheet, or a combination thereof, but is not limited thereto.

[0200] Quantum dots are commercially available or can be suitably synthesized.

[0201] The particle size of quantum dots can be controlled relatively freely, and the particle size can be uniformly controlled during colloidal synthesis.

[0202] Quantum dots can include organic ligands (eg, having a hydrophobic portion and / or a hydrophilic portion).

[0203] Organic ligand moieties can be bound to the surface of the quantum dots.

[0204] Organic ligands include RCOOH, RNH 2 , R 2 NH, R 3 N, RSH, R 3 PO, R 3 P, ROH, RCOOR, RPO(OH) 2 , RHPOOH, R 2Each R is independently a C3 to C40 (e.g., C5 or more and C24 or less) substituted or unsubstituted alkyl, a C3 to C40 substituted or unsubstituted alkenyl, a C3 to C40 substituted or unsubstituted aliphatic hydrocarbon group, a substituted or unsubstituted C6 to C40 aryl group, a C6 to C40 (e.g., C6 or more and C20 or less) substituted or unsubstituted aromatic hydrocarbon group, or a combination thereof.

[0205] Examples of the organic ligand include thiol compounds such as methyl mercaptan, ethyl mercaptan, propyl mercaptan, butyl mercaptan, pentyl mercaptan, hexyl mercaptan, octyl mercaptan, dodecanethiol, hexadecyl mercaptan, octadecyl mercaptan and benzyl mercaptan, amines such as methylamine, ethylamine, propylamine, butylamine, pentylamine, hexylamine, octylamine, nonylamine, decylamine, dodecylamine, hexadecylamine, octadecylamine, dimethylamine, diethylamine, dipropylamine, tributylamine and trioctylamine, carboxylic acid compounds such as formic acid, acetic acid, propionic acid, butyric acid, valeric acid, hexanoic acid, heptanoic acid, octanoic acid, dodecanoic acid, hexadecanoic acid, octadecanoic acid, oleic acid and benzoic acid, and methylphosphine, ethylphosphine, , phosphine compounds of propylphosphine, butylphosphine, pentylphosphine, octylphosphine, dioctylphosphine, tributylphosphine and trioctylphosphine, oxides of phosphine compounds such as methylphosphine oxide, ethylphosphine oxide, propylphosphine oxide, butylphosphine oxide, pentylphosphine oxide, tributylphosphine oxide, octylphosphine oxide, dioctylphosphine oxide and trioctylphosphine oxide compounds, diphenylphosphine, triphenylphosphine or its oxide, C5 to C20 alkylphosphinic acids such as hexylphosphinic acid, octylphosphinic acid, dodecylphosphinic acid, tetradecylphosphinic acid, hexadecylphosphinic acid and octadecylphosphinic acid, and C5 to C20 alkylphosphinic acids, but are not limited thereto.

[0206] The quantum dots may include the hydrophobic organic ligand alone or as a mixture of one or more hydrophobic organic ligands.

[0207] The hydrophobic organic ligand may not include a photopolymerizable moiety (eg, an acrylate group or a methacrylate group).

[0208] The transmission layer TL may be positioned in a portion corresponding to the blue light emitting area BLA in an area partitioned by the first partition wall BK1. The transmission layer TL may include a scattering material.

[0209] The scattering material can be selected from SiO 2 ,BaSO 4 、Al 2 O 3 、ZnO、ZrO 2 and TiO 2 At least one of. The transmission layer TL may include a polymer resin and a scattering material included in the polymer resin. In an embodiment, for example, the transmission layer TL may include TiO 2 , but not limited to this.

[0210] The transmission layer TL may transmit light incident from the light emitting element ED.

[0211] In the display panel DP according to the embodiment, the first color conversion layer CCL1 color-converts the incident light (i.e., converts the color of the incident light) into red light and emits red light. In addition, the second color conversion layer CCL2 color-converts the incident light into green light and emits green light. However, the light incident on the transmission layer TL is transmitted without color conversion.

[0212] The incident light may include blue light. The incident light may be blue light alone or a mixture of blue light and green light. Alternatively, the incident light may include blue light, green light and red light.

[0213] The filling layer FL may be positioned between the first color conversion layer CCL1 and the display unit DC, between the second color conversion layer CCL2 and the display unit DC, and between the transmission layer TL and the display unit DC. The filling layer FL may couple the color conversion unit CC and the display unit DC. In addition, the columnar spacer CS may be positioned between the first partition wall BK1 and the encapsulation layer ENC. The columnar spacer CS may be provided on the encapsulation layer ENC or on the first partition wall BK1.

[0214] The column spacer CS may maintain a gap between the display cell DC and the color conversion cell CC.

[0215] In the following, reference will be made to Figure 3 and Figure 4 The non-display area PA is described.

[0216] In the non-display area PA, a buffer layer BF, an interlayer insulating layer IL1, a passivation layer IL2, a second electrode E2, and an encapsulation layer ENC, which are positioned on the first substrate SUB1 and extend from the display area DA, are positioned therein.

[0217] The display unit DC and the color conversion unit CC may be coupled to each other by the sealant SL positioned in the non-display area PA.

[0218] In an embodiment, in the non-display area PA, the first color filter CF1, the second color filter CF2, and the third color filter CF3 are disposed to continuously overlap each other between the second substrate SUB2 and the display unit DC to overlap the entire portion of the non-display area PA. In other words, the first color filter CF1, the second color filter CF2, and the third color filter CF3 may extend continuously in the non-display area PA.

[0219] The first, second, and third color filters CF1, CF2, and CF3 may serve as light blocking members to prevent the non-display area PA from being observed.

[0220] In an embodiment, the second partition wall BK2 may be positioned between the insulating layer IL3 and the encapsulation layer ENC. The second partition wall BK2 may include the same material as the first partition wall BK1 or be formed of the same material as the first partition wall BK1 in the same process. The second partition wall BK2 may include a second opening OP2 having the same shape and the same arrangement as the first opening OP1 included in the first partition wall BK1. The partition walls BK1 and BK2 may overlap at least two selected from the first color filter CF1, the second color filter CF2, and the third color filter CF3.

[0221] The color conversion layer or the transmission layer may be positioned in the first opening OP1, and the filling layer FL may be positioned in the second opening OP2. The filling layer FL may have a shape for filling the second opening OP2.

[0222] The second partition wall BK2 may include a first portion P1 and a second portion P2. The first portion P1 is a portion protruding from a boundary between the display area DA and the non-display area PA to the sealant SL in a plan view, and the second portion P2 refers to a portion that is more recessed toward the display area DA (or protrudes less from the display area DA) than the first portion P1 in a plan view.

[0223] In an embodiment, Figure 3 As shown in , the first portion P1 may have a first length L1 from the boundary between the display area DA and the non-display area PA to the first end E1. The second portion P2 may have a second length L2 from the boundary between the display area DA and the non-display area PA to the second end E2. In such an embodiment, the first length L1 may be greater than the second length L2.

[0224] The first portions P1 and the second portions P2 may be alternately disposed along the second direction DR2. Figure 3 An embodiment having a structure in which the first part P1 and the second part P2 are arranged in the order of first part P1 / second part P2 / first part P1 / second part P2 / first part P1 is shown, but the utility model is not limited thereto. Alternatively, the first part P1 and the second part P2 may be arranged in the order of second part P2 / first part P1 / second part P2 / first part P1.

[0225] According to an embodiment, in a process of combining the display unit DC and the color conversion unit CC, a material (eg, filler) for forming the filling layer FL may be applied to the first and second partition walls BK1 and BK2 .

[0226] In this process, the filling material is restricted from moving by the second partition wall BK2, and there may be a height difference between the filling layer FL positioned in the non-display area PA and the filling layer FL positioned in the display area DA. The height difference may appear or be observed as color spots at the edge of the display area DA.

[0227] According to the embodiment, the second partition wall BK2 positioned in the non-display area PA includes the second portion P2 , which may allow the filler to smoothly move to form a filling material of uniform thickness even in the non-display area PA, and thus may be able to provide the filling layer FL having a uniform thickness.

[0228] Accordingly, the distance between the display unit DC and the color conversion unit CC can be kept uniform, and coloring at the edge of the display area DA can be restricted. A display device with improved display quality can be provided.

[0229] In the following, reference will be made to Figures 6 to 8 A display panel according to the embodiment is described.

[0230] Figure 6 is a schematic top view of a display panel according to an embodiment, Figure 7 is based on Figure 6 A schematic cross-sectional view of a display panel of an embodiment of the present invention is provided, and Figure 8 is based on Figure 6 Schematic cross-sectional view of a display panel of an embodiment of the present invention. Hereinafter, for the convenience of description, any repeated detailed description of constituent elements that are the same as or similar to the above-mentioned constituent elements will be omitted or simplified.

[0231] Reference Figures 6 to 8 , unlike the first partition wall BK1, the second partition wall BK2 according to the embodiment may not be provided with an opening. The second partition wall BK2 may provide a continuous structure in the non-display area PA. The second partition wall BK2 may be provided as a single integral body. The second partition wall BK2 may continuously overlap the color filters CF1, CF2, and CF3 positioned in the non-display area PA.

[0232] The second partition wall BK2 may include a first portion P1 protruding relatively more from a boundary between the display area DA and the non-display area PA and a second portion P2 protruding relatively less from the boundary between the display area DA and the non-display area PA. In a plan view, the first portion P1 may be a protrusion, and the second portion P2 may be a depression.

[0233] The first portion P1 may have a first length L1 from a boundary between the display area DA and the non-display area PA to the first end E1. The second portion P2 may have a second length L2 from a boundary between the display area DA and the non-display area PA to the second end E2. In this case, the first length L1 may be greater than the second length L2.

[0234] The first portions P1 and the second portions P2 may be alternately disposed along the second direction DR2. Figure 6 An embodiment having a structure in which the first part P1 and the second part P2 are arranged in the order of first part P1 / second part P2 / first part P1 / second part P2 / first part P1 is shown, but the utility model is not limited thereto. Alternatively, the first part P1 and the second part P2 may be arranged in the order of second part P2 / first part P1 / second part P2 / first part P1.

[0235] According to an embodiment, in a process of combining the display unit DC and the color conversion unit CC, a material (eg, a filling material) for forming the filling layer FL is provided on the first and second partition walls BK1 and BK2 .

[0236] In this process, movement of the filler may be restricted by the second partition wall BK2 , and a height difference may occur between the filling layer FL positioned in the non-display area PA and the filling layer FL positioned in the display area DA.

[0237] The height difference may appear or be observed as color spots at the edge of the display area DA. According to an embodiment, the second partition wall BK2 positioned in the non-display area PA includes a second portion P2 that is more recessed from the non-display area PA than the first portion P1, and may be able to provide a filling layer FL having a uniform thickness by allowing a filler to smoothly move through the second portion P2.

[0238] Accordingly, the distance between the display unit DC and the color conversion unit CC may be maintained uniform, and coloring at the edge of the display area DA may be restricted.

[0239] In the following, reference will be made to Fig. 9 and Fig.10 A display panel according to an alternative embodiment is described.

[0240] Fig. 9 is based on Figure 3 A cross-sectional view of a display panel of an alternative embodiment, and Fig.10 is based on Figure 6 A cross-sectional view of a display panel of an alternative embodiment of the present invention. Hereinafter, for the convenience of description, any repeated detailed description of constituent elements that are the same as or similar to the above-mentioned constituent elements will be omitted or simplified.

[0241] first, Fig. 9 and Figure 4 The embodiment is similar to that of Fig. 9 The color conversion cell CC of the embodiment of the present invention may include a first partition wall BK1 and a second partition wall BK2 positioned on the encapsulation layer ENC.

[0242] The first color converting layer CCL1 , the second color converting layer CCL2 , and the transmissive layer TL may be positioned in the first opening OP1 of the first partition wall BK1 .

[0243] The filling layer FL is between the partition walls BK1 and BK2 and the color filters CF1, CF2, and CF3, between the first color conversion layer CCL1 and the color filters CF1, CF2, and CF3, between the second color conversion layer CCL2 and the color filters CF1, CF2, and CF3, and between the transmission layer TL and the color filters CF1, CF2, and CF3.

[0244] The filling layer FL may contact one surface of the color conversion layers CCL1 and CCL2 , the transmission layer TL, and the partition walls BK1 and BK2 .

[0245] In addition, the filling layer FL may contact one surface of the insulating layer IL3 .

[0246] exist Fig. 9 In the embodiment of Figure 4 Compared with the embodiment of FIG. 1 , the position of the filling layer FL can be modified.

[0247] Except according to Fig.10 The color conversion unit CC of the embodiment may include a first partition wall BK1 and a second partition wall BK2 positioned on the encapsulation layer ENC, Fig.10 and Figure 7 The embodiments are similar.

[0248] The first color converting layer CCL1 , the second color converting layer CCL2 , and the transmissive layer TL may be positioned in the first opening OP1 of the first partition wall BK1 .

[0249] The filling layer FL is between the partition walls BK1 and BK2 and the color filters CF1, CF2, and CF3, between the first color conversion layer CCL1 and the color filters CF1, CF2, and CF3, between the second color conversion layer CCL2 and the color filters CF1, CF2, and CF3, and between the transmission layer TL and the color filters CF1, CF2, and CF3.

[0250] The filling layer FL may contact one surface of the color conversion layers CCL1 and CCL2 , the transmission layer TL, and the partition walls BK1 and BK2 .

[0251] In addition, the filling layer FL may contact one surface of the insulating layer IL3 .

[0252] exist Fig.10 In the embodiment of Figure 7 Compared with the embodiment of FIG. 1 , the position of the filling layer FL can be modified.

[0253] According to an embodiment, in a process of combining a first substrate SUB1 on which color conversion layers CCL1 and CCL2 are formed and a second substrate SUB2 on which color filters CF1, CF2, and CF3 are formed, a material (eg, filler) for forming a filling layer FL is provided on first and second partition walls BK1 and BK2.

[0254] In such a process, the filling material is restricted in movement by the second partition wall BK2 , and a height difference between the filling layer FL positioned in the non-display area PA and the filling layer FL positioned in the display area DA may occur.

[0255] This height difference may appear or be observed as color spots at the edge of the display area DA. According to an embodiment, the second partition wall BK2 positioned in the non-display area PA includes the second portion P2. In such an embodiment, since the filler can be allowed to move smoothly even in the non-display area PA to form a filling material of uniform thickness, it may be possible to provide a filling layer FL having a uniform thickness. Accordingly, the appearance of color spots at the edge of the display area DA can be limited.

[0256] The utility model should not be interpreted as being limited to the embodiments set forth herein. Instead, these embodiments are provided so that the present disclosure will be thorough and complete and will fully convey the concept of the utility model to those skilled in the art.

[0257] While the invention has been particularly shown and described with reference to embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit or scope of the invention as defined by the claims.

Claims

1. A display device, comprising: A substrate including a display area and a non-display area; A transistor, disposed on the substrate; a light emitting diode disposed on the transistor and electrically connected to the transistor; A color conversion layer and a transmission layer are arranged on the light emitting diode; as well as A partition wall is disposed on the light emitting diode, The partition wall includes: a first partition wall disposed in the display area between the color conversion layer and the transmission layer; and a second partition wall disposed in the non-display area. The second partition wall includes: a first portion having a first length from a first end to a boundary between the display area and the non-display area; and a second portion having a second length from a second end to the boundary between the display area and the non-display area. Wherein, the first length is greater than the second length.

2. The display device according to claim 1, wherein: The first portion protrudes more from the boundary between the display area and the non-display area than the second portion does.

3. The display device according to claim 1, wherein: The first partition wall defines a first opening in which the color conversion layer and the transmission layer are disposed, and The second partition wall defines a second opening having the same shape as the first opening.

4. The display device according to claim 1, wherein: The first portion and the second portion protrude from the boundary between the display area and the non-display area toward a first direction.

5. The display device according to claim 4, wherein: The first portions and the second portions are alternately arranged along a second direction perpendicular to the first direction.

6. The display device according to any one of claims 1 to 5, further comprising: a color filter disposed on the color conversion layer, the transmission layer and the partition wall, The color filter includes: a first color filter disposed on the transmission layer; a second color filter disposed on the second color conversion layer of the color conversion layer; and a third color filter disposed on the first color conversion layer of the color conversion layer. The partition wall overlaps with at least two selected from the first color filter, the second color filter, and the third color filter.

7. The display device according to claim 6, wherein: The first color filter, the second color filter, and the third color filter continuously extend in the non-display area.

8. The display device according to claim 3, further comprising: a filling layer, arranged between the light-emitting diode and the color conversion layer and between the light-emitting diode and the transmission layer, Wherein, the filling layer fills the second opening.

9. The display device according to claim 1, wherein: the first partition wall defines a first opening in which the color conversion layer and the transmissive layer are positioned, No opening is defined in the second partition wall, and The second partition wall continuously overlaps the color filter positioned in the non-display area.

10. The display device according to claim 1, further comprising: A filling layer, disposed on the partition wall, the color conversion layer and the transmission layer; as well as A color filter is arranged on the filling layer.

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