Silicon block end face grinding equipment

Abstract

The utility model discloses silicon block end face grinding equipment which comprises a machine base provided with a waiting area, a grinding area and a rotary table top capable of rotating between the waiting area and the grinding area. The grinding table tops comprise a first set of grinding table tops and a second set of grinding table tops, the first set of grinding table tops and the second set of grinding table tops are arranged on the rotary table top in a mirror symmetry mode and correspond to the waiting areas respectively, the second set of grinding table tops correspond to the grinding areas respectively, and each grinding table top is used for clamping the top face and the bottom face of a silicon block so as to switch end faces to be ground through rotation; and a plurality of surface grinding spindles. The face grinding main shafts are arranged in the grinding area of the machine base, and the face grinding main shafts correspond to the grinding table tops in the second set of grinding table tops respectively and are used for conducting end face grinding operation on the silicon blocks clamped by the grinding table tops.

Description

Technical Field

[0001] The present application relates to the technical field of silicon materials, and in particular to a silicon block end surface grinding device. Background Art

[0002] At present, with the society's emphasis on and openness to the use of green renewable energy, the photovoltaic solar power generation field has been increasingly valued and developed. In the field of photovoltaic power generation, the usual crystalline silicon solar cells are made on high-quality silicon wafers, which are cut from pulled or cast silicon ingots by multi-wire saws and subsequently processed.

[0003] The existing silicon wafer production process, taking single crystal silicon wafers as an example, the general operation procedures may include: first, use a silicon rod cutting machine to cut a long silicon rod with a circular cross-section (the silicon rod is cylindrical as a whole) to form multiple short silicon rods; after the cutting is completed, use a silicon rod squarer to square the cut short silicon rods to form square silicon rods with a rectangular cross-section; then grind, round / chamfer and other grinding operations are performed on the square silicon rods after square cutting, so that the surface shaping of the silicon rod meets the corresponding flatness and dimensional tolerance requirements; and then slice the square silicon rods to obtain silicon wafers.

[0004] Among them, in the squaring operation, in addition to forming square silicon rods, edge materials with arched cross-sections will also be cut and left. In order to make full use of this part of the edge materials, the edge materials can also be cut and squared to form silicon blocks, and then the silicon blocks are subjected to grinding operations such as grinding, rounding / chamfering, and then sliced ​​to obtain small silicon wafers. Generally, when grinding silicon blocks, most manufacturers only process one silicon block at a time, and the processing efficiency is low. Therefore, how to provide a grinding device that can grind multiple silicon blocks at the same time to improve processing efficiency is a technical problem that needs to be solved urgently by those skilled in the art. Summary of the invention

[0005] In view of the shortcomings of the related art mentioned above, the purpose of the present application is to provide a silicon block end surface grinding device to solve the technical problem that the silicon block end surface grinding device in the related art only grinds one silicon block at a time, resulting in low processing efficiency.

[0006] To achieve the above-mentioned purpose and other related purposes, the present application provides a silicon block end surface grinding device, including: a machine base, provided with a waiting area and a grinding area, and a rotating table that can rotate between the waiting area and the grinding area; multiple grinding tables, including a first group of grinding tables that are mirror-symmetrically arranged on the rotating table and correspond to the waiting area respectively, and a second group of grinding tables that correspond to the grinding area, each of the grinding tables is used to clamp the top surface and the bottom surface of a silicon block to switch the end surface to be ground by rotation; and multiple grinding spindles; arranged in the grinding area of ​​the machine base, each of the grinding spindles is respectively arranged corresponding to each grinding table in the second group of grinding tables to perform end surface grinding operations on the silicon block clamped by each grinding table.

[0007] In summary, the silicon block end face grinding equipment provided by the present application ensures the continuous supply of silicon blocks, reduces the time required for loading and unloading silicon blocks, and improves processing efficiency by arranging a waiting area for temporarily placing silicon blocks before performing grinding operations, a grinding area for performing grinding operations, and a turntable that can rotate between the waiting area and the grinding area on the machine base. By arranging multiple grinding tables including a first group of grinding tables and a second group of grinding tables on the turntable, it is possible to clamp multiple silicon blocks at the same time. Furthermore, each grinding table can switch the end face to be ground by rotation, so that each silicon block can grind four end faces under the clamping of its corresponding grinding table. By arranging multiple grinding spindles corresponding to each grinding table in the grinding area of ​​the machine base, it is possible to grind multiple silicon blocks at the same time, thereby further improving processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The specific features of the present application are shown in the attached claims. The features and advantages of the invention involved in the present application can be better understood by referring to the exemplary embodiments and drawings described in detail below. The drawings are briefly described as follows:

[0009] Figure 1 It is a schematic diagram of the structure of a silicon block end surface grinding device in one embodiment of the present application.

[0010] Figure 2 It is a schematic diagram of the structure of a silicon block end surface grinding device in one embodiment of the present application in which the frame is omitted.

[0011] Figure 3 Show this application Figure 2 The schematic diagram of the structure of the silicon block end surface grinding device in the embodiment shown is shown in another perspective.

[0012] Figure 4 Shown is a schematic structural diagram of multiple grinding tables in one embodiment of the present application.

[0013] Figure 5It is a schematic diagram of a plurality of grinding tables in one embodiment of the present application at another viewing angle.

[0014] Figure 6 and Figure 7 They are respectively schematic diagrams of the structure of the first grinding table in one embodiment of the present application.

[0015] Figure 8 It is a schematic diagram showing that a grinding spindle approaches the end surface of a silicon block through a feeding motion in one embodiment of the present application.

[0016] Fig. 9 Shown is a schematic structural diagram of a transverse grinding spindle in one embodiment of the present application.

[0017] Fig.10 It is a schematic diagram showing a six-axis robot placing a silicon block into each grinding table of a first set of grinding tables in sequence according to one embodiment of the present application.

[0018] Fig.11 Shown is a schematic diagram of the structure of a six-axis robot in one embodiment of the present application.

[0019] Fig.12 Shown is a schematic structural diagram of a loading and conveying device in one embodiment of the present application.

[0020] Figures 13 to 16 They are respectively schematic diagrams showing the process of a silicon block end surface grinding device performing a grinding operation in one embodiment of the present application. DETAILED DESCRIPTION

[0021] The following is an explanation of the implementation of the present application by means of specific embodiments. People familiar with the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification.

[0022] In the following description, reference is sometimes made to the accompanying drawings, which describe several embodiments of the present application. It should be understood that other embodiments may also be used, and that changes in module or unit composition, electrical, and operation may be made without departing from the spirit and scope of the present application. The following detailed description should not be considered restrictive, and the scope of the embodiments of the present application is limited only by the claims that are published. The terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the present application.

[0023] It will be understood that, although the terms first, second, etc. can be used to describe various elements or parameters in this article in some instances, these elements or parameters should not be limited by these terms. These terms are only used to distinguish one element or parameter from another element or parameter. For example, the first group of grinding surfaces can be referred to as the second group of grinding surfaces, and similarly, the second group of grinding surfaces can be referred to as the first group of grinding surfaces without departing from the scope of the various described embodiments. The first group of grinding surfaces and the second group of grinding surfaces are both describing a certain group of grinding surfaces, but unless the context clearly indicates otherwise, they are not the same group of grinding surfaces. The terms "or" and "and / or" used in this article are interpreted as inclusive, or mean any one or any combination. Therefore, "A, B or C" or "A, B and / or C" means any one of the following: A; B; C; A and B; A and C; B and C; A, B and C. Only when the combination of elements, functions, steps or operations is inherently mutually exclusive in some way, will there be an exception to this definition.

[0024] It will be understood that when a part or element is referred to as being "on" or extending "onto" another element, the element may be directly on or directly extending onto the other element, or intervening elements may also be present. Conversely, when an element is referred to as being "directly on" or "extending directly onto" another element, there are no intervening elements. It will also be understood that when an element is referred to as being "connected" or "coupled" to another element, it may be directly connected or coupled to the other element, or there may be intervening elements. Conversely, when an element is referred to as being "directly connected" or "directly coupled" to another element, there are no intervening elements.

[0025] Relative terms such as "below" or "above" or "upper" or "lower" or "horizontal" or "vertical" may be used herein to describe the relationship of one element, layer or region to another element, layer or region as illustrated in the figures. It will be understood that these terms are intended to cover different device orientations other than the orientation depicted in the figures. In this application, the "vertical", "horizontal" and "parallel" are defined as: including the situation of ±10% based on the standard definition. For example, vertical usually refers to an angle of 90° relative to a reference line, but in this application, vertical refers to a situation within 80° to 100°.

[0026] The terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the present application. When used herein, the singular forms "a", "an", and "the" are intended to also include the plural forms unless the context clearly indicates otherwise. It will also be understood that when used herein, the terms "comprise", "include", "include" and / or "comprising" specify the presence of stated features, integers, steps, operations, elements and / or parts, but do not exclude the presence or increase of one or more other features, integers, steps, operations, elements, parts and / or combinations thereof.

[0027] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as those commonly understood by ordinary technicians in the field to which this application belongs. It will also be understood that the terms used herein should be interpreted as having the meaning consistent with their meaning in the context of this specification and the relevant field, and should not be interpreted in an idealized or overly formal sense unless explicitly defined in this article.

[0028] Unless explicitly stated otherwise, comparative quantitative terms such as "above" and "below" are intended to encompass the concept of equality. As an example, "above" may not only mean "greater than" in a mathematical sense, but may also mean "equal to".

[0029] In view of the technical problems mentioned in the background technology, the present application discloses a silicon block end face grinding device. By arranging a waiting area for temporarily placing silicon blocks before performing grinding operations, a grinding area for performing grinding operations, and a rotating table that can rotate between the waiting area and the grinding area on the machine base, the continuous supply of silicon blocks is ensured, the time required for loading and unloading silicon blocks is reduced, and the processing efficiency is improved. By arranging multiple grinding tables including a first group of grinding tables and a second group of grinding tables on the rotating table, multiple silicon blocks can be clamped at the same time. Furthermore, each grinding table can switch the end face to be ground by rotation, so that each silicon block can achieve grinding of four end faces under the clamping of its corresponding grinding table. By arranging multiple grinding spindles corresponding to each grinding table in the grinding area of ​​the machine base, grinding operations on multiple silicon blocks can be achieved at the same time, thereby further improving the processing efficiency.

[0030] In order to clarify the definition of direction and the operation mode between different structures, a three-dimensional space defined by horizontal, vertical and vertical directions is defined in the embodiments disclosed in this application. The horizontal, vertical and vertical directions are all straight lines and are perpendicular to each other. For example, the length extension direction of the bottom of the base is defined as horizontal (e.g. Figure 2 The width extension direction of the bottom of the base is defined as the longitudinal direction (e.g. Figure 2The vertical direction is also called the vertical direction, or the up-down direction is defined as the vertical direction (e.g. Figure 2 The Z direction in the figure).

[0031] In order to clearly illustrate the positional relationship between the various devices, components, structures or mechanisms in the embodiments of the present application, along the lateral direction of the machine base, the silicon block end surface grinding device is connected to the loading and conveying device, that is, the side used for loading is defined as the proximal end, and the silicon block end surface grinding device is connected to the unloading and conveying device, that is, the side used for unloading is defined as the distal end. It should be understood that when the silicon block moves from one side of the silicon block end surface grinding device to the other side opposite to perform loading and conveying, end surface grinding operations, and unloading and conveying respectively, the proximal end and the distal end correspond to the opposite sides of the silicon block end surface grinding device, and the two are opposite and far away from each other.

[0032] In any embodiment provided in the present application, the silicon block is formed by cutting the edge skin material, and the edge skin material is formed by squaring the round silicon rod. The edge skin material includes a rectangular bottom surface and an inferior arc surface opposite to the bottom surface, and its cross section is generally arched, that is, the edge skin material includes an arc top and sharp corners located on both sides of the arc top. The cutting operation of the edge skin material includes cutting and removing the arc top and sharp angle of the edge skin material along the length direction of the edge skin material (for example, first cutting and removing the arc top and then cutting and removing the sharp corner, or first cutting and removing the sharp corner and then cutting and removing the arc top, or simultaneously cutting and removing the arc top and the sharp corner, etc.), so as to form a flat (rectangular cross section) edge skin strip, and subsequently, the edge skin strip is cut to form a shorter silicon block.

[0033] The silicon block is a rectangular block as a whole, having a top surface, a bottom surface, and four end surfaces between the top surface and the bottom surface. The silicon block end surface grinding device disclosed in the present application is suitable for grinding rectangular silicon blocks, specifically, for grinding the four end surfaces of the silicon block, but is not limited to this. For example, based on the inspiration of the present application, in some examples, the silicon block end surface grinding device can also be used for other long strips of hard materials that need to be ground. The grinding operation refers to the process of first rough grinding and then fine grinding the four end surfaces of the silicon block using a grinding wheel of a specific shape.

[0034] The following combination Figures 1 to 16 The silicon block end surface grinding equipment of the present application is described in detail.

[0035] See also Figure 1 and Figure 2 ,in, Figure 1 It is a schematic diagram of the structure of a silicon block end surface grinding device in one embodiment of the present application. Figure 2The schematic diagram of the structure of the silicon block end surface grinding device in one embodiment of the present application omitting the frame is shown. Figure 1 and Figure 2 As shown, the silicon block end surface grinding device includes a machine base 1, a grinding table 2, and a grinding spindle 3.

[0036] The machine base 1 is the main component of the silicon block end surface grinding equipment, which is used to provide a workpiece processing platform and carry working parts. In practical applications, the machine base 1 is large in size and weight to provide a large mounting surface and a strong stability of the whole machine. It should be understood that the machine base 1 can be used as the base of different structures or components that perform processing operations in the silicon block end surface grinding equipment, and the specific structure of the machine base can be changed based on different functional requirements or structural requirements. In some examples, the machine base includes a fixed structure or a limiting structure such as a base, a column, a frame, etc. for receiving different components in the silicon block end surface grinding equipment, which are all the machine bases described in this application. At the same time, in some examples, the machine base 1 can be used as an integrated base. In some examples, the machine base can include multiple independent bases.

[0037] The base 1 has a silicon block processing platform, which can be divided into a plurality of functional areas according to the specific operation content of the silicon block processing operation. For example, in one embodiment, refer to Figure 3 , shown as this application Figure 2 The schematic diagram of the structure of the silicon block end surface grinding device in the embodiment shown in FIG. Figure 3 As shown, the machine base 1 is provided with a waiting area 11 and a grinding area 12. In this embodiment, the waiting area 11 is used to temporarily park the silicon block before performing the grinding operation, and the grinding area 12 is used to perform the grinding operation. And the waiting area 11 and the grinding area 12 are defined by the travel path and range of the processing device at each position. For example, the grinding device of the silicon block end surface grinding equipment is arranged at the grinding area 12, and the range of the grinding area 12 is the range occupied by the grinding device in the process of completing the grinding operation. In some examples, the waiting area 11 and the grinding area 12 together constitute the silicon block processing platform. In some other examples, the silicon block processing platform may further include a loading area and a unloading area for loading and unloading, respectively. It should be noted that in the examples provided in the present application, the functional position is based on the shape of the silicon block processing platform at the functional position, which can be determined according to the machine base, or can be determined jointly according to the processing needs of the machine base, the grinding device, etc.

[0038] In one embodiment, a protective plate (not shown) is vertically arranged between the waiting area 11 and the grinding area 12 of the machine base 1 to form a relatively open waiting area 11 and a relatively closed grinding area 12. It should be understood that the relatively closed grinding area 12 refers to the protective plate and the grinding device at the grinding area 12 together forming an area that can be isolated from the waiting area 11 to a certain extent. Correspondingly, the waiting area 11 is not provided with a grinding device, so it constitutes a relatively open area. In this example, the relatively open waiting area 11 is convenient for positioning and clamping the silicon block; the relatively closed grinding area 12 can effectively prevent the debris, dust, or grinding fluid generated by the silicon block grinding operation from splashing into the waiting area 11, while improving the grinding environment, it can also reduce the interference of the environment outside the grinding area 12 on the grinding operation, thereby ensuring the grinding quality. In some examples, the protective plate can be configured as a stainless steel plate, an aluminum plate, etc., which has a strong tolerance to the impact of grinding debris and the chemical corrosion of the grinding fluid.

[0039] In one embodiment, if Figure 1 As shown, the base 1 may also be provided with a frame 13, the shape of which is adapted to the shape of the base 1, and is used to prevent outsiders from contacting the various devices, components or mechanisms inside the silicon block end surface grinding equipment, thereby reducing the occurrence of safety accidents. At the same time, the frame 13 can protect the various devices, components or mechanisms inside the silicon block end surface grinding equipment from being affected by the external environment, thereby ensuring the life of the silicon block end surface grinding equipment. In one example, a transparent observation window 131 is provided on the frame 13, so that the operator can monitor the grinding process in real time to ensure the smooth progress of the grinding operation. In some other examples, a radiator is provided in the frame 13 to prevent excessive temperature from affecting the performance of the silicon block end surface grinding equipment.

[0040] Furthermore, a control device 132 may be configured on the frame 13 , and the control device 132 is used to operate, control and monitor the real-time status of the silicon block end surface grinding device performing the grinding operation.

[0041] In one embodiment, the control device 132 is provided with a button for operating the silicon block end surface grinding device to perform a specific function. For example, the button may be a switch button for starting or shutting down the silicon block end surface grinding device, an emergency stop button for stopping the grinding operation in an emergency, a fault diagnosis button for starting the self-checking program of the silicon block end surface grinding device, or a program selection button for performing a specific task such as loading or unloading operation, but the button is not limited thereto and may be determined according to the operation requirements.

[0042] In one embodiment, the control device 132 may also be configured with a processing unit, a storage unit and a plurality of interface units, and the interface units are respectively connected to devices or components or mechanisms that are independently packaged in the silicon block end surface grinding equipment such as the grinding device and transmit data through the interface. The interface unit determines its interface type according to the connected device, component or mechanism, which includes but is not limited to: a universal serial interface, a video interface, an industrial control interface, a wireless communication port, etc. The storage unit is used to store the grinding program, and the processing unit is connected to the storage unit, and is used to control the various components, components or structures in the silicon block end surface grinding equipment to coordinate and realize the grinding operation of the silicon block when executing the grinding program.

[0043] In one embodiment, the machine base 1 is provided with a rotating table 14 that can rotate between the waiting area 11 and the grinding area 12. Figure 2 and Figure 3 In the example shown, the turntable 14 is configured to be circular. Of course, it can also be configured to be other shapes, such as hexagonal.

[0044] In one embodiment, see Figure 4 and Figure 5 Combined with Figure 2 ,in, Figure 4 It is a schematic diagram showing the structure of multiple grinding tables in one embodiment of the present application. Figure 5 Shown is a schematic diagram of multiple grinding tables in one embodiment of the present application at another viewing angle. Figure 4 and Figure 5 As shown, the grinding table 2 is configured as a plurality of grinding tables, including a first group of grinding tables 21 and a second group of grinding tables 22. Figure 5 As shown, the first group of grinding tables 21 and the second group of grinding tables 22 are arranged on the rotary table 14 in a mirror-symmetrical manner. Figure 3 The first group of grinding tables 21 corresponds to the waiting area 11 , and the second group of grinding tables 22 corresponds to the grinding area 12 .

[0045] In one embodiment, the rotary table 14 switches the first group of grinding tables 21 located in the waiting area 11 to the grinding area 12 and switches the second group of grinding tables 22 located in the grinding area 12 to the waiting area 11 by rotating 180° forward or reverse. That is, the rotary table 14 can realize the rotation between the waiting area 11 and the grinding area 12, specifically, by rotating 180° clockwise or counterclockwise to exchange the positions of the first group of grinding tables 21 and the second group of grinding tables 22.

[0046] In one implementation, if Figure 4As shown, a rotating shaft 141 may be arranged on the rotating table 14, and a servo motor 142 and a grating encoder (not shown) are arranged on the rotating shaft 141, wherein the servo motor 142 is used to provide power for the forward rotation or reverse rotation of the rotating shaft 141, and the grating encoder is used to provide measurement and feedback of the rotation angle of the rotating table 14. In some examples, the servo motor 142 may be replaced by a hydraulic motor.

[0047] In one embodiment, the grating encoder includes a grating encoder housing, a grating encoder disk and a reading head. The grating encoder housing is arranged around the rotating shaft 141 and accommodates the grating encoder disk and the reading head. The grating encoder disk has grating strips. When the rotating shaft 141 rotates, the grating strips on the grating encoder disk will be blocked and generate corresponding optical signals. The reading head may include an optical measuring device such as a camera, and obtains the rotation information of the rotating shaft 141 by interpreting the generated optical signal, and feeds the information back to the control device 132, thereby realizing real-time control of the rotation of the turntable 14.

[0048] In one embodiment, a brake locator is provided on the turntable 14, and the brake locator is used to stop the rotation of the turntable 14, so as to control the angle of the forward or reverse rotation of the turntable 14 to 180°. At the same time, it can also prevent the turntable 14 from rotating due to external forces when the turntable 14 stops moving, thereby further ensuring the accuracy of the grinding operation. In one implementation, the brake locator can be configured to include a brake driver and a locking pin, and the brake driver controls the movement of the locking pin to lock the locking pin on the turntable 14, thereby stopping the rotation of the turntable 14. The brake driver can be, for example, a motor.

[0049] In the embodiment where the grinding table is configured as a plurality of grinding tables, each grinding table is used to clamp the top surface and the bottom surface of a silicon block so as to switch the end surface to be ground by rotation. Figure 3 or Figure 5 In the example shown, the first group of grinding surfaces 21 and the second group of grinding surfaces 22 each include three grinding surfaces. Figure 5 As shown, for the sake of distinction, the three grinding surfaces included in the first group of grinding surfaces 21 are respectively referred to as the first grinding surface 211, the second grinding surface 212, and the third grinding surface 213, and the three grinding surfaces included in the second group of grinding surfaces 22 are respectively referred to as the fourth grinding surface 221, the fifth grinding surface 222, and the sixth grinding surface 223. In this embodiment, the line connecting the axis of two adjacent grinding surfaces and the axis of the rotary table 14 forms an equilateral triangle relationship. In other words, as Figure 5As shown, the first grinding table 211, the second grinding table 212, the third grinding table 213, the fourth grinding table 221, the fifth grinding table 222, and the sixth grinding table 223 are evenly distributed along the circumference of the turntable 14, that is, the angle α formed by the line connecting the axis of each grinding table and the axis of the turntable 14 and the line connecting the axis of the adjacent grinding table and the turntable 14 is 60°.

[0050] It should be noted that the first grinding table 211, the second grinding table 212, and the third grinding table 213 included in the first group of grinding tables 21 and the fourth grinding table 221, the fifth grinding table 222, and the sixth grinding table 223 included in the second group of grinding tables 22 can all be configured as the same grinding table. The structure of the grinding table is described in detail below taking the first grinding table 211 as an example.

[0051] See also Figure 6 and Figure 7 , respectively, are schematic diagrams showing the structure of the first grinding table in one embodiment of the present application, such as Figure 6 and Figure 7 As shown, the first grinding table 211 includes a bracket 2111, a top table 2112, and a bottom table 2113, wherein the bracket 2111 is arranged on the rotating table 14, the top table 2112 is arranged on the top of the bracket 2111 and can be raised and lowered to release or suppress the top surface of the silicon block A, the bottom table 2113 is arranged at the bottom of the bracket 2111 corresponding to the axis of the top table 2112 for carrying the silicon block A, and a clamping space for clamping the silicon block A is formed between the top table 2112 and the bottom table 2113.

[0052] In this embodiment, the silicon block A can be rotated 90° clockwise or counterclockwise around the axis L1 of the top table 2112 when clamped by the top table 2112 and the bottom table 2113 to switch the end surface to be ground. Figure 6 Rotate 90° in the direction of the arrow in the figure to switch the silicon block A from the short end face to the long end face.

[0053] In one embodiment, in order to realize the lifting movement of the top table 2112 relative to the support 2111, and thereby realize the pressing or releasing of the top surface of the silicon block A, the first grinding table 211 further includes a lifting drive unit, and the lifting drive unit may include a lifting screw and a lifting motor, and the lifting screw is associated with the top table 2112. The lifting motor and the lifting screw can be used to drive the top table 2112 to perform lifting movement in the vertical direction. For example, the lifting motor drives the lifting screw to rotate forward, thereby driving the top table 2112 to perform an upward movement, thereby realizing the release of the top surface of the silicon block A; the lifting motor drives the lifting screw to flip, thereby driving the top table 2112 to perform a downward movement, thereby realizing the pressing of the top surface of the silicon block A.

[0054] In one embodiment, if Figure 5 and Figure 6 As shown, a driving mechanism 2114 is provided on the top of the bracket 2111, and the driving mechanism 2114 is used to drive the top table 2112 to rotate to switch the end face of the clamped silicon block A, and the bottom table 2113 is configured as a passive rotating table. In some examples, the driving mechanism 2114 may include a rotating shaft, a motor, and a grating encoder. In some other examples, the driving mechanism 2114 may further include a brake locator, which is used to stop the rotational movement of the top table 2112, so as to control the clockwise or counterclockwise rotation angle of the top table 2112 to 90°. The specific structure and function of the rotating shaft, the motor, the grating encoder, and the brake locator can be found in the previous description, which will not be repeated here.

[0055] In the embodiment where the bottom table is configured as a passive rotating table, the bottom table 2113 may include a fixed base and a rotating table, wherein the fixed base is fixedly connected to the bracket 2111 and connected to the rotating table via a bearing. Specifically, the driving mechanism 2114 drives the top table 2112 to rotate, and the top table 2112 drives the silicon block A to rotate. Further, the silicon block A drives the bottom table 2113 to rotate, thereby enabling the silicon block A to switch its end face under the clamping of the top table 2112 and the bottom table 2113.

[0056] In one embodiment, if Figure 1 and Figure 4As shown, the three grinding tables in the first group of grinding tables 21 or the second group of grinding tables 22 include a grinding table with a longitudinally open clamping space and two grinding tables with transversely open clamping spaces located on opposite sides of the grinding table with a longitudinally open clamping space. As mentioned above, the first group of grinding tables 21 and the second group of grinding tables 22 are arranged on the rotary table 14 in a mirror-symmetrical manner. Therefore, the following description will be made by taking the first group of grinding tables 21 as an example. It should be understood that the clamping space of a certain grinding table refers to the area between the top table and the bottom table of the grinding table for clamping silicon blocks. For example, Figure 6 and Figure 7 As shown, the clamping space of the first grinding table 211 refers to the area for clamping the silicon block A between the top table 2112 and the bottom table 2113 .

[0057] The opening direction of the clamping space refers to the direction opposite to the bracket, for example Figure 6 In the example shown, the opening direction of the clamping space of the first grinding table 211 is the direction opposite to the bracket 2111, that is, Figure 6 The dotted arrow indicates the direction. The longitudinal opening of the clamping space means that the direction relative to the bracket of the grinding table is facing the longitudinal direction, and the transverse opening of the clamping space means that the direction relative to the bracket of the grinding table is facing the transverse direction. Figure 1 and Figure 4 In the example shown, the clamping space of the second grinding table 212 in the first group of grinding tables 21 is open longitudinally, while the clamping spaces of the first grinding table 211 and the third grinding table 213 are open transversely. Correspondingly, the clamping space of the fifth grinding table 222 in the second group of grinding tables 22 is open longitudinally, while the clamping spaces of the fourth grinding table 221 and the sixth grinding table 223 are open transversely.

[0058] In order to realize the grinding operation of the silicon block clamped by each grinding table, Figure 2 and Figure 3 As shown, the grinding spindle 3 is configured as a plurality and is arranged in the grinding area 12 of the machine base 1. Each of the grinding spindles is respectively arranged corresponding to each grinding table in the second group of grinding tables 22 to perform end surface grinding operations on the silicon block clamped by each grinding table. In this embodiment, in order to perform end surface grinding operations on the fourth grinding table 221, the fifth grinding table 222, and the sixth grinding table 223 included in the second group of grinding tables 22, the grinding spindle 3 is configured as three. For the convenience of description, they can be respectively referred to as the first grinding spindle 31, the second grinding spindle 32, and the third grinding spindle 33. In the subsequent embodiments, the second grinding spindle 32 is also referred to as the transverse grinding spindle, and the first grinding spindle 31 and the third grinding spindle 33 are referred to as the longitudinal grinding spindles. The transverse grinding spindle and the longitudinal grinding spindle are not repeated in the subsequent reference.

[0059] In one embodiment, the plurality of grinding spindles 3 include a transverse grinding spindle (i.e., a second grinding spindle 32) corresponding to the grinding table surface of the clamping space being longitudinally open, and two longitudinal grinding spindles (i.e., a first grinding spindle 31 and a third grinding spindle 33) located on opposite sides of the transverse grinding spindle and corresponding to the grinding table surface of the clamping space being transversely open. Figure 2 and Figure 3 As shown, the first grinding spindle 31 corresponds to the fourth grinding table 221 , the second grinding spindle 32 corresponds to the fifth grinding table 222 , and the third grinding spindle 33 corresponds to the sixth grinding table 223 .

[0060] The direction of the grinding spindle refers to the direction of movement of the grinding spindle when performing the end face grinding operation. For example, the transverse grinding spindle refers to the second grinding spindle 32 moving in the transverse direction when performing the end face grinding operation on the silicon block clamped by the fifth grinding table 222, and the longitudinal grinding spindle refers to the first grinding spindle 31 and the third grinding spindle 33 moving in the longitudinal direction when performing the end face grinding operation on the silicon block clamped by the fourth grinding table 221 and the sixth grinding table 223, respectively. It should be understood that when the clamping space is open longitudinally, the clamped silicon block faces the longitudinal direction, and the end face of the silicon block faces the transverse direction, and the corresponding grinding spindle needs to move in the transverse direction to grind the end face. Correspondingly, when the clamping space is open transversely, the clamped silicon block faces the transverse direction, and the end face of the silicon block faces the longitudinal direction, and the corresponding grinding spindle needs to move in the longitudinal direction to grind the end face.

[0061] It should be noted that the present application is described by taking the configuration of three first and second grinding tables 21 and 22 and three grinding spindles 3 as an example, which should not be construed as a limitation of the present application, and those skilled in the art may adjust the number according to the teachings of the present application.

[0062] In one embodiment, each grinding spindle approaches the end face of the silicon block by feeding motion to perform grinding operation. The feeding motion refers to each grinding spindle moving in a direction close to the end face of the silicon block until the grinding spindle is in contact with the end face of the silicon block, so as to facilitate the subsequent end face grinding operation. Figure 8 , which is a schematic diagram showing that the grinding spindle approaches the end face of the silicon block through a feeding motion in one embodiment of the present application. Figure 8 In the figure, the rotating table 14 is indicated by a large circle, each grinding table is indicated by a small circle in the large circle, the silicon block clamped by each grinding table is indicated by a rectangle located in the small circle, and each grinding spindle is indicated by a rectangle located outside the large circle. Figure 8As shown, the first grinding spindle 31 , the second grinding spindle 32 , and the third grinding spindle 33 are respectively fed in the direction of the arrows in the figure to approach the silicon block clamped by the first grinding table 211 , the second grinding table 212 , and the third grinding table 213 .

[0063] In one embodiment, each of the grinding spindles moves away from the end face of the silicon block through a retraction movement to wait for the silicon block to switch the end face. The retraction movement refers to the movement of each grinding spindle in a direction away from the end face of the silicon block until the grinding spindle is in contact with the end face of the silicon block, so as to facilitate the subsequent end face switching of the silicon block. It should be understood that when the silicon block switches the end face, it needs to rotate 90° under the clamping of the top table and the bottom table of the grinding table. During this process, in order to prevent the grinding spindle from colliding with the silicon block and causing damage to the grinding spindle or the silicon block, the grinding spindle needs to perform the retraction movement after completing the grinding operation of one of the end faces of the silicon block. That is, in Figure 8 In the example shown, the first grinding spindle 31, the second grinding spindle 32, and the third grinding spindle 33 respectively move in directions opposite to the directions of the arrows in the figure to move away from the silicon blocks clamped by the first grinding table 211, the second grinding table 212, and the third grinding table 213, thereby providing space for the rotation of each silicon block when the end face is switched.

[0064] See also Fig. 9 , which is a schematic diagram of the structure of the transverse grinding spindle in one embodiment of the present application. Fig. 9 As shown, the transverse grinding spindle (i.e., the second grinding spindle 32) realizes transverse grinding of the end face of the silicon block through the transverse guide rail 321 arranged on the machine base 1. Specifically, the transverse guide rail 321 is arranged on the machine base 1 along the transverse direction. Further, the second grinding spindle 32 also includes a grinding tool mounting seat 323 and a transverse driving mechanism, and the bottom of the grinding tool mounting seat 323 is provided with a slider matching the transverse guide rail 321. The transverse driving mechanism may include a transverse rack, a transverse driving gear, and a transverse gear driving motor. Among them, the transverse rack can be arranged in parallel with the transverse guide rail 321, the transverse driving gear is meshed with the transverse rack, and the transverse gear driving motor is associated with the transverse driving gear and is arranged on the grinding tool mounting seat 323. The transverse gear driving motor drives the connected transverse driving gear to rotate, and through the meshing of the transverse driving gear and the transverse rack, the grinding tool mounting seat 323 is driven to move on the transverse guide rail 321 along the transverse direction.

[0065] For example, the transverse gear driving motor drives the connected transverse driving gear to rotate forward, and the grinding tool mounting seat 323 drives the second grinding spindle 32 to move from the proximal end to the distal end on the transverse guide rail 321 in the transverse direction, so as to achieve a rough grinding of the silicon block clamped by the fifth grinding table 222. The transverse gear driving motor drives the connected transverse driving gear to rotate reversely, and the grinding tool mounting seat 323 drives the second grinding spindle 32 to move from the distal end to the proximal end on the transverse guide rail 321 in the transverse direction, so as to achieve a fine grinding of the silicon block clamped by the fifth grinding table 222.

[0066] In one embodiment, if Fig. 9 As shown, the transverse grinding spindle (i.e., the second grinding spindle 32) realizes feeding motion or retraction motion through the longitudinal guide rail 322 arranged on the machine base 1. Specifically, the longitudinal guide rail 322 is arranged on the machine base 1 along the longitudinal direction. Further, the second grinding spindle 32 also includes a mold support 324 and a longitudinal driving mechanism, and a slider matching the longitudinal guide rail 322 is arranged at the bottom of the mold support 324. The longitudinal driving mechanism may include a longitudinal rack, a longitudinal driving gear, and a longitudinal gear driving motor. Among them, the longitudinal rack can be arranged in parallel with the longitudinal guide rail 322, the longitudinal driving gear is meshed with the longitudinal rack, and the longitudinal gear driving motor is associated with the longitudinal driving gear and is arranged on the mold support 324. The longitudinal gear driving motor drives the connected longitudinal driving gear to rotate, and through the meshing of the longitudinal driving gear and the longitudinal rack, the mold support 324 is driven to move on the longitudinal guide rail 322 along the longitudinal direction.

[0067] For example, the longitudinal gear drive motor drives the connected longitudinal drive gear to rotate forward, and the tool support 324 drives the second grinding spindle 32 to achieve feeding motion along the longitudinal direction on the longitudinal guide rail 321. The longitudinal gear drive motor drives the connected longitudinal drive gear to rotate reversely, and the tool support 324 drives the second grinding spindle 32 to achieve retraction motion along the longitudinal direction on the longitudinal guide rail 321.

[0068] In one embodiment, the longitudinal grinding spindles (i.e., the first grinding spindle 31 and the third grinding spindle 33) realize longitudinal grinding of the end surface of the silicon block through the longitudinal guide rails provided on the machine base 1, and realize feeding motion or retraction motion through the transverse guide rails provided on the machine base 1. In a specific implementation, the first grinding spindle 31 and the third grinding spindle 33 can be rotated 90° by the second grinding spindle 32 and are arranged corresponding to their respective grinding tables, and their structures can be configured in the same manner as the second grinding spindle 32. For details, please refer to the description in the aforementioned embodiment, which will not be repeated here.

[0069] In one embodiment, the end surface of each grinding spindle is respectively provided with a fine grinding wheel and a retractable coarse grinding wheel sleeved in the fine grinding wheel. Fig. 9 As shown, the end surface of the second grinding spindle 32 is provided with a fine grinding wheel 325 and a rough grinding wheel 326, and the rough grinding wheel 326 is telescopically sleeved in the fine grinding wheel 325. In this example, the rough grinding wheel 326 and the fine grinding wheel 325 are concentrically arranged on the end surface of the spindle and are arranged on the machine base 1 in the longitudinal direction. Such an arrangement makes the structure of the second grinding spindle 32 more compact.

[0070] In one embodiment, the second grinding spindle 32 may include a first transmission shaft (bushing) of a cylindrical structure and a second transmission shaft accommodated in the cylindrical structure, wherein the bushing is connected to the fine grinding wheel 325 so as to drive the fine grinding wheel 325 to be connected when the bushing rotates, and the second transmission shaft is connected to the rough grinding wheel 326 so as to drive the rough grinding wheel 326 to be connected when the second transmission shaft rotates. The principle of the second grinding spindle 32 to achieve its end face grinding operation is: when it is necessary to perform a rough grinding operation on the silicon block, the second transmission shaft is moved along its axial direction so that the rough grinding wheel 326 extends out of the fine grinding wheel 325, so that the rough grinding wheel 326 reaches the grinding position, and the rough grinding wheel 326 is driven to rotate by rotating the second transmission shaft. When it is necessary to perform a fine grinding operation on the silicon block, the rough grinding wheel 326 is placed in a position that does not interfere with the fine grinding wheel 325 through the telescopic movement of the second transmission shaft, so that the fine grinding wheel 325 reaches the grinding position, and the fine grinding wheel 325 is driven to rotate by rotating the first transmission shaft.

[0071] In another embodiment, the rough grinding wheel 326 is arranged concentrically with the fine grinding wheel 325, and the fine grinding wheel 325 is nested in the rough grinding wheel 326. In certain implementations, the second grinding spindle 32 further includes a first transmission shaft (bushing) of a cylindrical structure and a second transmission shaft accommodated in the cylindrical structure, wherein the bushing is connected to the rough grinding wheel 326 so as to drive the rough grinding wheel 326 to connect when the bushing rotates, and the second transmission shaft is connected to the fine grinding wheel 325 so as to drive the fine grinding wheel 325 to connect when the second transmission shaft rotates. The principle of the second grinding spindle 32 to achieve its grinding operation is: when the silicon block needs to be finely ground, the second transmission shaft is moved along its axial direction so that the fine grinding wheel 325 extends out of the rough grinding wheel 326, so that the fine grinding wheel 325 reaches the grinding position, and the fine grinding wheel 325 is driven to rotate by rotating the second transmission shaft. When the silicon block needs to be roughly ground, the fine grinding wheel 325 is placed in a position not to interfere with the rough grinding wheel 326 through the telescopic movement of the second transmission shaft, so that the rough grinding wheel 326 reaches the grinding position, thereby driving the rough grinding wheel 326 to rotate by rotating the first transmission shaft.

[0072] In certain embodiments of the present application, the rough grinding wheel 326 is circular and has a through hole in the middle. The rough grinding wheel 326 is formed by consolidating abrasive grains and a binder to form a surface with an abrasive grain portion that rotates in contact with the surface of the silicon block to be ground. The rough grinding wheel 326 has a certain abrasive grain size and abrasive grain density, and there are pores in the rough grinding wheel 326. The abrasive of the rough grinding wheel 326 can be set to abrasive grains with a hardness greater than the hardness of the silicon block material, such as aluminum oxide, silicon carbide, and diamond cubic boron nitride, according to the needs of grinding the silicon block. The abrasive grain size of the fine grinding wheel 325 is smaller than that of the rough grinding wheel 326, and the general configuration of the remaining grinding wheels is basically the same as that of the rough grinding wheel 326.

[0073] In some other embodiments, the second grinding spindle 32 further includes a cooling device to cool the rough grinding wheel 326 and the fine grinding wheel 325, reduce the damage to the surface layer of the silicon block during the grinding process, and improve the grinding efficiency and service life of the grinding wheel. In one implementation, the cooling device includes a cooling water pipe, a guide groove, and a guide hole.

[0074] In another implementation, a protective cover for placing cooling water into the rotating drive motor of the grinding wheel is provided on the outer edge of the circumference of the grinding wheel. One end of the cooling water pipe is connected to a cooling water source, and the other end is connected to the surface of the protective cover of the grinding wheel. The guide groove is provided on the protective cover as a contact point between the protective cover and the cooling water pipe, and the guide hole is provided in the cooling groove. The coolant of the cooling device can be common cooling water. The cooling water pipe is connected to a cooling water source. The cooling water sucked by the cooling water pipe is guided to the guide groove and the guide hole on the surface of the grinding wheel and is guided to the contact surface between the grinding wheel and the silicon block to be ground for cooling. During the grinding of the grinding wheel, the cooling water from the guide hole of the grinding wheel is centrifuged to enter the interior of the grinding wheel for sufficient cooling.

[0075] In one embodiment, a detection device is provided at the distal end of the second grinding spindle 32, and the detection device is used to detect the flatness of the silicon block being ground in real time. In one implementation, the detection device is associated with the second grinding spindle 32, and calculates the remaining processing times according to the flatness of the top surface of the silicon block. When the remaining processing times are zero, the detection device controls the second grinding spindle 32 to stop working and move away from the silicon block through a retraction movement, thereby ending the grinding operation of one end surface of the silicon block.

[0076] In order to realize the end surface grinding operation of each silicon block located on each grinding table by each grinding spindle, in one embodiment, as Figure 1 and Figure 2 As shown, the silicon block end surface grinding equipment also includes a six-axis robot 4, which is arranged corresponding to the waiting area 11 of the machine base 1, and is used to place the silicon block in sequence into the first grinding table 211, the second grinding table 212, and the third grinding table 213 in the first group of grinding tables 21.

[0077] See also Fig.10 , which is a schematic diagram showing a six-axis robot placing silicon blocks sequentially into each grinding table of the first group of grinding tables in one embodiment of the present application. Fig.10 As shown, the six-axis robot 4 sequentially places the silicon block on the first grinding table 211, the second grinding table 212, and the third grinding table 213 of the waiting area 11, and each grinding table clamps each silicon block in the clamping space formed by its own top table and bottom table. Fig.10 The direction of the dotted arrow is rotated 180°, the first group of grinding tables 21 are switched to the grinding area 12, and the second group of grinding tables 22 are switched to the waiting area 11, so as to present Figure 8 At the same time, the six-axis robot 4 can continue to place the silicon blocks in the fourth grinding table 221, the fifth grinding table 222, and the sixth grinding table 223 of the second group of grinding tables 22 of the waiting area 11 in sequence.

[0078] See also Fig.11 , which is a schematic diagram of the structure of a six-axis robot in one embodiment of the present application. Fig.11 As shown, the six-axis robot 4 includes a joint arm 41, an end effector 42, and a base 43. The joint arm 41 has a proximal end and a distal end opposite to each other, the proximal end of which is connected to the base 43, and the distal end of which is configured with the end effector 42. In this embodiment, the joint arm 41 provides the end effector 42 with a degree of freedom of movement in space, so that the end effector 42 can move to each grinding table to sequentially place each silicon block.

[0079] In one embodiment, the base 43 is used to support the articulated arm 41, so that the articulated arm 41 can rotate in space with the support surface as the base point, so that the end effector 42 can be freely oriented in space and positioned near each grinding table. In one example, the base 43 can be fixedly connected to the support surface by bolts. The support surface can be, for example, the ground.

[0080] In one embodiment, if Fig.11 As shown, the articulated arm 41 includes a first arm component 411, a second arm component 412, and six axis components, wherein the six axis components can be disposed separately or in combination on the base 43, the first arm component 411, the second arm component 412, and the end effector 42. Each axis component can provide a rotary rotation around its axis or a hinge rotation perpendicular to its axis.

[0081] In some embodiments, the axis assemblies that are combined together to connect the first arm component 411 to the base 43 are collectively referred to as a first joint mechanism. Similarly, the axis assemblies that are combined together to connect the first arm component 411 to the second arm component 412 are collectively referred to as a second joint mechanism, and the axis assemblies that are combined together to connect the end effector 42 to the second arm component 412 are collectively referred to as a third joint mechanism. Of course, the axis assemblies can be combined in any manner, and the present application does not impose any limitation on this.

[0082] like Fig.11 The articulated arm 41 in the illustrated embodiment is provided with six axis assemblies to provide six-axis rotation. In certain other embodiments, the articulated arm can provide more or less than six-axis rotation, that is, the six-axis robot 4 can also be configured as a five-axis robot, or a seven-axis robot, etc.

[0083] In one embodiment, the arm member in the articulated arm 41 may be configured as an elongated cylindrical shape and may be made of a suitable rigid material, for example, a lightweight and high-strength metal alloy such as an aluminum alloy or a magnesium alloy, or a carbon composite material.

[0084] In one embodiment, the end effector 42 is disposed at the end of the second arm member 412 and is used to determine whether the six-axis robot 4 performs a specific task or operation. Fig.11 In the illustrated embodiment, the end effector 42 of the six-axis robot 4 includes a pair of fork arms 421, 422 for clamping the top and bottom surfaces of the silicon block, and each fork arm has a space 423 for avoiding the grinding table. Fig.11 As shown, the fork arms 421 and 422 are in a "U"-shaped structure, and a space 423 for avoiding the grinding table is formed in the middle of the "U"-shaped structure, so that the fork arms 421 and 422 will not interfere with the grinding table when clamping the two sides of the silicon block.

[0085] In one embodiment, a buffer layer is provided on the surface of the fork arm 421 in contact with the top surface of the silicon block and on the surface of the fork arm 422 in contact with the bottom surface of the silicon block. The buffer layer may be made of a flexible material such as rubber or polyurethane, which increases the friction between the fork arm 421 and the silicon block to ensure the clamping stability while protecting the silicon block from mechanical damage.

[0086] In one embodiment, the fork arms 421, 422 can open and close in the vertical direction to achieve clamping or releasing of the silicon block. In one implementation, the end actuator 42 also includes a fork arm driving mechanism, which is used to drive at least one of the fork arms 421, 422 to move in the vertical direction to adjust the clamping distance between the two fork arms 421, 422. In some examples, the fork arm driving mechanism may include a screw and a driving source, the screw is arranged in the vertical direction and is associated with at least one of the fork arms 421, 422. The driving source is used to drive the screw to rotate so that at least one associated fork arm moves in the vertical direction. In some examples, the fork arm driving mechanism may include a bidirectional screw and a driving source, the bidirectional screw is arranged in the vertical direction and is associated with the fork arms 421, 422, and the driving source is used to drive the bidirectional screw to rotate so that the associated fork arms 421, 422 move toward or away from each other in the vertical direction. The fork arm driving mechanism is not limited thereto, and may also adopt a structure such as a telescopic rod and a driving cylinder or a driving hydraulic cylinder. In some examples, the clamping or releasing of the silicon block by the fork arms 421 and 422 is controlled by the control device 132 described in the above embodiments.

[0087] In one embodiment, the forks 421 and 422 are equipped with force sensors and position sensors. The force sensors can monitor the clamping force of the forks on the silicon block to prevent the silicon block from falling off due to too small clamping force and from being damaged by too large clamping force. The position sensor is used to monitor the real-time position of the silicon block to indicate that the forks 421 and 422 clamp the silicon block until it is placed on the corresponding grinding table. In some examples, the real-time information of the force sensor and the position sensor is fed back to the control device 132, and the control device 132 controls the next operation of the end effector.

[0088] In another embodiment, the end effector of the six-axis robot 4 includes a clamping arm for clamping the end faces on both sides of the silicon block in the length direction. It should be understood that the clamping arm can open and close in the length direction of the silicon block to clamp or release the silicon block. In one example, the clamping arm is configured as two clamping arms parallel to the length direction of the silicon block, so as to clamp the end faces on both sides of the silicon block.

[0089] In order to realize the opening and closing movement of the two clamping arms on the end surfaces on both sides of the silicon block, in one embodiment, the end effector 42 may include a clamping arm driving mechanism, and the clamping arm driving mechanism is used to drive at least one of the two clamping arms to move in the length direction of the silicon block to adjust the clamping distance between the two clamping arms. In some examples, the clamping arm driving mechanism may include a screw and a driving source, the screw is arranged along the length direction of the silicon block and is associated with at least one of the two clamping arms, and the driving source is used to drive the screw to rotate so that at least one associated clamping arm moves along the length direction of the silicon block. In some other examples, the clamping arm driving mechanism may include a bidirectional screw and a driving source, the bidirectional screw is arranged along the length direction of the silicon block and is associated with the two clamping arms, and the driving source is used to drive the bidirectional screw to rotate so that the two associated clamping arms move toward or away from each other along the length direction of the silicon block.

[0090] In some embodiments, the clamp arm may also be provided with at least one of a buffer layer, a force sensor, and a position sensor. The specific configuration and functions of the buffer layer, the force sensor, and the position sensor can be found in the previous description and will not be repeated here.

[0091] In certain embodiments, such as Figure 1 and Figure 2 As shown, the silicon block end surface grinding device further includes a loading conveyor device 5 and a unloading conveyor device 6. In this embodiment, the six-axis robot 4 can, on the one hand, clamp the silicon block and transfer the silicon block from the loading conveyor device 4 to each grinding table for end surface grinding, and on the other hand, can transfer the silicon block that has completed the surface grinding operation from each grinding table to the unloading conveyor device 6 to complete the unloading operation.

[0092] In one embodiment, if Figure 1 and Figure 2 As shown, a loading conveyor 5 for conveying the silicon blocks to be ground is disposed on the first side of the six-axis robot 4, and a unloading conveyor 6 for unloading the silicon blocks after grinding is disposed on the second side of the six-axis robot 4. The first side of the six-axis robot 4 corresponds to the proximal end of the machine base 1, and the second side of the six-axis robot 4 corresponds to the distal end of the machine base 1.

[0093] In one embodiment, the loading conveying device 5 and the unloading conveying device 6 may have the same configuration, and the loading conveying device 5 is taken as an example for description below.

[0094] See also Fig.12 , which is a schematic diagram of the structure of a feeding and conveying device in one embodiment of the present application. Fig.12As shown, the loading and conveying device 5 includes a carrier frame 51, and a conveyor belt 52 arranged on the carrier frame for loading silicon blocks. The conveyor belt 52 can be configured as two rows of roller groups arranged on opposite sides of the carrier frame 51, and the two rows of roller groups include a plurality of rollers arranged in sequence along the length of the carrier frame 51, each roller can be connected to the carrier frame 51 through a bearing seat and protrude from the carrier frame 51, and the rollers in the two rows of roller groups can form a supporting surface for supporting the silicon blocks. After the silicon blocks are placed on the two rows of roller groups of the carrier frame 51 in the longitudinal direction, the two rows of roller groups can be used to directly push the silicon blocks to convey the silicon blocks and complete the silicon block loading operation.

[0095] In some embodiments, the conveyor belt 52 also includes a silicon block pushing mechanism. The silicon block pushing mechanism can be used to push the silicon block to move on the two rows of rollers alone or in cooperation with manpower. In some embodiments, the silicon block pushing mechanism can also be configured as a chain drive mechanism, including an endless chain, an ejection member provided on the endless chain, and a chain drive unit for the movement of the endless chain, the ejection member may include an ejection block or an ejection rod, and the chain drive unit may include a driving gear meshed with the endless chain and a driving motor associated with the driving gear. In practical applications, the driving motor drives the driving gear to rotate, and the driving gear drives the endless chain and the ejection block or ejection rod thereon, and the moving ejection block or ejection rod pushes the silicon block to move along the endless chain.

[0096] In some embodiments, in the two-row roller group, in the longitudinal direction, the rollers in the first row of roller groups and the rollers in the second row of roller groups are opposite to each other to form a roller pair, and the two rollers in a roller pair can be connected through a rotating shaft, and the silicon block pushing mechanism includes a cascade chain driving mechanism, including multiple cascade chains and a driving motor. Specifically, the silicon block pushing mechanism is arranged on one side of the two-row roller group as the driving side, and the roller on the driving side in each roller pair is configured with a double driving gear. The cascade of all rollers in the two-row roller group is achieved by connecting two adjacent rollers in the longitudinal direction through a cascade chain (for example, a short ring chain) on the corresponding driving rack. The driving motor is also connected to the two-row roller group through a short ring chain and a driving gear. In actual application, the driving motor drives the driving gear to rotate, drives all rollers in the two-row roller group to roll through the cascade chain, and drives the silicon block to move by means of the friction between the roller and the silicon block. Compared with ordinary chain drive mechanisms, the cascade chain drive mechanism can generate greater power, and all rollers rotate synchronously, ensuring that the silicon block moves more smoothly and steadily.

[0097] In one embodiment, the loading and conveying device 5 includes a detection mechanism, which is used to detect that the six-axis robot 4 is performing a piece-picking operation and to stop the loading and conveying device 5 from feeding. It should be understood that when the six-axis robot 4 places the silicon blocks to be ground on the loading and conveying device 5 into each grinding table in sequence, the loading and conveying device 5 stops the operation of continuously conveying the silicon blocks to be ground to the six-axis robot, for example, stops the conveying of the conveyor belt 52, so as to prevent the six-axis robot 4 from being unable to accurately pick up the silicon blocks due to continuous conveying, and to prevent the silicon blocks from mechanically colliding with the end effector of the six-axis robot 4.

[0098] In one example, the detection mechanism may be configured to include a sensor for detecting the position and movement of the six-axis robot 4, such as an ultrasonic sensor or an infrared sensor. For example, when the detection mechanism detects that the six-axis robot 4 is performing a pick-up operation of the silicon block to be ground, a signal is sent to the control device 132, and the control device 132 controls the loading and conveying device 5 to stop feeding. When the detection mechanism detects that the six-axis robot 4 has completed the pick-up operation of the current silicon block, the control device 132 controls the loading and conveying device 5 to feed, so that the next silicon block on the conveyor belt 52 continues to move toward the six-axis robot 4, so that the six-axis robot 4 can place the silicon blocks to be ground on each grinding table in turn. Overall, with the cooperation of the detection mechanism and the control device 132, the loading and conveying device 5 feeds intermittently, and the interval time of each feeding is adapted to the time when the six-axis robot 4 transports the silicon block to be ground.

[0099] In one embodiment, the loading and conveying device 5 may further include a push rod, which may be arranged at the position where the loading and conveying device 5 and the six-axis robot 4 are connected to the silicon block, and may be rotated to push the silicon block into a pair of forks or clamping arms of the six-axis robot 4, so that the silicon block can be stably clamped by the six-axis robot 4 while being centered. In one example, the push rod may be driven by a cylinder, and the cylinder is controlled by the detection mechanism and the control device 132. For example, when the detection mechanism detects that the six-axis robot 4 is performing a piece-picking operation, a signal is sent to the control device 132, and the control device 132 controls the loading and conveying device 5 to stop feeding, and controls the cylinder to drive the push rod to rotate and touch the silicon block, so that the silicon block is stably clamped by the six-axis robot 4. In one example, the push rod may be configured as two symmetrically arranged along both sides of the conveyor belt, but it is not limited thereto. Those skilled in the art may adjust the specific configuration form and quantity of the push rod under the enlightenment of this application.

[0100] See also Figures 13 to 16 Combined with Figure 8 and Fig.10 ,in, Figures 13 to 16 The following are schematic diagrams showing the process of the silicon block end surface grinding device performing the grinding operation in one embodiment of the present application. Figure 8 , Fig.10 , Figures 13 to 16 The working process of the silicon block end surface grinding equipment of the present application is described in detail.

[0101] First, the six-axis robot 4 sequentially places the silicon block to be ground delivered by the loading conveyor 5 into the first group of grinding tables 21 of the waiting area 11, including the first grinding table 211, the second grinding table 212, and the third grinding table 213. Each grinding table clamps each silicon block in the clamping space formed by its own top table and bottom table to present Fig.10 Next, the turntable 14 is rotated around Fig.10 The direction of the dotted arrow is rotated 180°, the first group of grinding tables 21 are switched to the grinding area 12, and the second group of grinding tables 22 are switched to the waiting area 11, so as to present Figure 8 Status shown.

[0102] Next, the first grinding spindle 31, the second grinding spindle 32, and the third grinding spindle 33 are respectively Figure 8 The six-axis robot 4 moves in the direction of the arrow in the middle to approach the end face of each silicon block. At the same time, the six-axis robot 4 sequentially places the silicon blocks to be ground conveyed by the feeding conveyor 5 into the fourth grinding table 221, the fifth grinding table 222, and the sixth grinding table 223 of the second group of grinding tables 22 in the waiting area 11 to present Fig.13 Then, the first grinding spindle 31, the second grinding spindle 32, and the third grinding spindle 33 are respectively Fig.13 Move in the direction of the middle arrow to the dotted line position until one end face of each silicon block clamped by each grinding table completes a rough grinding operation.

[0103] Subsequently, the first grinding spindle 31, the second grinding spindle 32, and the third grinding spindle 33 are respectively Fig.14 The silicon blocks are retracted in the direction of the arrow to move away from the end faces of the silicon blocks. Each silicon block is clamped by its own grinding table and rotated 90° in the forward or reverse direction to switch the end faces to be ground, thereby presenting Fig.15 Furthermore, the first grinding spindle 31, the second grinding spindle 32, and the third grinding spindle 33 are respectively along Fig.15 Move in the direction of the arrow in the middle to approach the end face of each silicon block again, thus presenting Fig.16 Afterwards, the first grinding spindle 31, the second grinding spindle 32, and the third grinding spindle 33 are respectively Fig.16 Move in the direction of the middle arrow to the dotted line position until the other end surface of each silicon block clamped by each grinding table completes a rough grinding operation.

[0104] Each grinding spindle and each grinding table can repeat the above operation process until the four end faces of each silicon block have completed the rough grinding and fine grinding operations. At this time, the rotary table 14 can rotate 180 degrees, and the silicon blocks that have completed the grinding operation carried by the first group of grinding tables 21 are switched back to the waiting area 11, and the silicon blocks to be ground carried by the second group of grinding tables 22 are switched to the grinding area 12 to continue the end face grinding operation. Finally, the six-axis robot 4 transfers the silicon blocks that have completed the grinding operation carried by the first group of grinding tables 21 to the unloading conveyor 6 for unloading.

[0105] It should be noted here that when each grinding spindle performs end face grinding operation on the silicon block, it can complete rough grinding on the four end faces of the silicon block and then perform fine grinding on the four end faces of the silicon block respectively, or it can complete rough grinding and fine grinding on one end face of the silicon block and then switch the end faces to perform rough grinding and fine grinding on the next end face. The present application does not impose any restrictions on this, and it is determined according to actual production needs.

[0106] In summary, in order to overcome the technical problem that the silicon block end face grinding equipment in the above-mentioned related art only grinds one silicon block at a time, resulting in low processing efficiency, the silicon block end face grinding equipment provided by the present application, by setting a waiting area for temporarily placing silicon blocks before performing grinding operations, a grinding area for performing grinding operations, and a rotating table that can rotate between the waiting area and the grinding area on the machine base, ensures the continuous supply of silicon blocks, reduces the time required for loading and unloading silicon blocks, and improves processing efficiency. By setting a plurality of grinding tables including a first group of grinding tables and a second group of grinding tables on the rotating table, it is possible to clamp a plurality of silicon blocks at the same time. Furthermore, each grinding table can switch the end face to be ground by rotation, so that each silicon block can grind four end faces under the clamping of its corresponding grinding table. By setting a plurality of grinding spindles corresponding to each grinding table in the grinding area of ​​the machine base, it is possible to grind a plurality of silicon blocks at the same time, thereby further improving processing efficiency.

[0107] In addition, by setting up a loading and conveying device and a unloading and conveying device, automatic loading and unloading of silicon blocks is realized, avoiding manual handling. At the same time, by setting up a six-axis robot between the loading and conveying device and the unloading and conveying device, the six-axis robot can not only place the silicon blocks to be ground on each grinding table in the waiting area in sequence, but also transfer the silicon blocks that have completed the grinding operation to the unloading and conveying device to realize the unloading of the silicon blocks, thereby further improving the automation performance of the equipment and further improving the silicon block processing efficiency.

[0108] The above embodiments are merely illustrative of the principles and effects of the present application and are not intended to limit the present application. Anyone familiar with the technology may modify or change the above embodiments without violating the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by a person of ordinary skill in the art without departing from the spirit and technical ideas disclosed in the present application shall still be covered by the claims of the present application.

Claims

1. A silicon block end surface grinding device, characterized in that: include: A machine base is provided with a waiting area and a grinding area, and a rotating table that can rotate between the waiting area and the grinding area; A plurality of grinding tables, including a first group of grinding tables which are arranged on the rotary table in a mirror-symmetrical manner and correspond to the waiting areas respectively, and a second group of grinding tables which correspond to the grinding areas, each of which is used to clamp the top and bottom surfaces of a silicon block to switch the end surface to be ground by rotation; as well as A plurality of grinding spindles are arranged in the grinding area of ​​the machine base, and each of the grinding spindles corresponds to each grinding table in the second group of grinding tables and is used for performing end surface grinding operations on the silicon blocks clamped by each grinding table.

2. The silicon block end surface grinding device according to claim 1, characterized in that: A protective plate is vertically arranged between the waiting area and the grinding area of ​​the machine base to form a relatively open waiting area and a relatively closed grinding area.

3. The silicon block end surface grinding device according to claim 1, characterized in that: The rotary table switches the first group of grinding tables located in the waiting area to the grinding area and switches the second group of grinding tables located in the grinding area to the waiting area by rotating 180 degrees in a forward or reverse direction.

4. The silicon block end surface grinding device according to claim 1, characterized in that: The first group of grinding tables and the second group of grinding tables include three grinding tables respectively, and the connecting line between the axis centers of two adjacent grinding tables and the axis center of the rotary table forms an equilateral triangle relationship.

5. The silicon block end surface grinding device according to claim 4, characterized in that: Each grinding table in the first group of grinding tables or the second group of grinding tables includes a bracket arranged on the rotating table, a top table arranged on the top of the bracket and capable of lifting and lowering to release or suppress the top surface of the silicon block, a bottom table arranged at the bottom of the bracket corresponding to the axis of the top table for supporting the silicon block, and a clamping space for clamping the silicon block is formed between the top table and the bottom table.

6. The silicon block end surface grinding device according to claim 4, characterized in that: The three grinding tables in the first group of grinding tables or the second group of grinding tables include a grinding table with a longitudinally open clamping space and two grinding tables with transversely open clamping spaces located on opposite sides of the grinding table with a longitudinally open clamping space.

7. The silicon block end surface grinding device according to claim 6, characterized in that: The plurality of grinding spindles include a transverse grinding spindle corresponding to the grinding table surface of the longitudinal opening of the clamping space, and two longitudinal grinding spindles located on opposite sides of the transverse grinding spindle and corresponding to the grinding table surface of the transverse opening of the clamping space.

8. The silicon block end surface grinding device according to claim 7, characterized in that: Each of the grinding spindles approaches the end face of the silicon block through a feeding motion to perform a grinding operation, and moves away from the end face of the silicon block through a retracting motion to wait for the end face of the silicon block to be switched.

9. The silicon block end surface grinding device according to claim 1, characterized in that: It also includes a six-axis robot which is arranged in a waiting area corresponding to the machine base and is used to sequentially place the silicon blocks into each of the grinding tables in the first group of grinding tables.

10. The silicon block end surface grinding device according to claim 9, characterized in that: The end effector of the six-axis robot comprises a pair of fork arms for clamping the top surface and the bottom surface of the silicon block, and each fork arm has a space for avoiding the grinding table.

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