Mechanical arm and semiconductor manufacturing equipment
By setting up a shock absorbing device in the push rod of the robot arm, the problem of damage caused by the robot arm when transferring the wafer is solved, and the effect of reducing wafer damage is achieved.
Patent Information
- Application Number
- CN202421738618.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-22
- Publication Date
- 2025-04-25
- Estimated Expiration
- 2034-07-22
AI Technical Summary
During semiconductor manufacturing, wafer damage is easily caused by robotic arms transferring wafers, and the prior art is difficult to effectively avoid such damage.
A mechanical arm is designed, which provides a push rod at the junction of the wafer and the connecting arm, and a shock absorbing device is provided in the push rod to reduce the impact force when clamping the wafer.
Through the absorption and ease of shock and vibration of the shock absorber, the damage to the wafer by the robot arm during the wafer transfer process is reduced, and the safety and efficiency of wafer transfer are improved.
Smart Images
Figure CN222792107U_ABST
Abstract
Description
Technical Field
[0001] The embodiments of the present application relate to the field of semiconductor equipment manufacturing, and specifically to a robotic arm and semiconductor manufacturing equipment. Background Art
[0002] In the field of semiconductor manufacturing, wafer transfer is a key link in the manufacturing process, which requires ensuring the safe and efficient transfer of wafers between various production steps. As an important part of automation equipment, robotic arms play a vital role in the process of wafer transfer.
[0003] In this context, how to optimize the structure of the robotic arm and thereby prevent the wafer from being damaged during the process of wafer transfer by the robotic arm has become an urgent problem that needs to be solved by technical personnel in this field. Utility Model Content
[0004] In view of this, an embodiment of the present application provides a robotic arm and semiconductor manufacturing equipment, which can prevent the wafer from being damaged during the process of transferring the wafer by the robotic arm.
[0005] To achieve the above objectives, the embodiments of the present application provide the following technical solutions.
[0006] In a first aspect, an embodiment of the present application provides a robotic arm, comprising:
[0007] A wafer insert, wherein the wafer insert comprises a carrying portion for carrying a wafer;
[0008] A connecting arm, the connecting arm is connected to the wafer inserter to drive the wafer inserter to rotate and move;
[0009] A push rod is arranged at the junction of the wafer insert and the connecting arm and is located on the wafer insert. The push rod is used to cooperate with the bearing part to clamp the wafer; the push rod at least includes a shock absorbing device.
[0010] Optionally, the push rod further includes:
[0011] A base for placing the shock absorbing device;
[0012] a pushing device connected to a first end of the base, the first end being an end of the push rod close to the connecting arm;
[0013] A front end bracket is arranged at the second end of the base and contacts the shock absorbing device, wherein the second end is an end of the push rod that directly contacts the wafer.
[0014] Optionally, the shock absorbing device is placed in a groove of the base.
[0015] Optionally, the lateral width of the shock absorbing device is greater than the lateral width of the groove.
[0016] Optionally, the shock absorbing device is a shock absorbing spring or a shock absorbing sponge, and the pushing device is a cylinder.
[0017] Optionally, the material of the front end bracket is polyetheretherketone.
[0018] Optionally, the wafer insert also includes: a plurality of branch structures, and end surfaces connected to the plurality of branch structures; the supporting portion includes: a plurality of carriers and a plurality of contact pads; wherein the plurality of carriers are arranged at the ends of the plurality of branch structures, and one carrier is arranged corresponding to one branch structure; and the plurality of contact pads are arranged on the end surfaces.
[0019] Optionally, the multiple branch structures are two branch structures, and the two branch structures form a Y shape or a U shape; the surface of the wafer insert is parallel to the horizontal plane.
[0020] Optionally, the junction between the wafer insert and the connecting arm is located on the end surface, and the plurality of contact pads are located on a side of the end surface close to the junction.
[0021] In a second aspect, an embodiment of the present application provides a semiconductor manufacturing equipment, including a wafer conveying device, wherein the wafer conveying device includes a robotic arm, and the robotic arm is the robotic arm described above.
[0022] The robotic arm provided in the embodiment of the present application includes: a wafer insert, the wafer insert including a bearing portion for bearing a wafer; a connecting arm, the connecting arm being connected to the wafer insert to drive the wafer insert to rotate and move; a push rod, arranged at the junction of the wafer insert and the connecting arm and located on the wafer insert, the push rod being used to cooperate with the bearing portion to clamp the wafer; the push rod at least includes a shock absorbing device.
[0023] It can be seen that the robotic arm provided in the embodiment of the present application is provided with a push rod at the junction of the wafer insert and the connecting arm, and a shock absorbing device is provided in the push rod. Therefore, in the process of the connecting arm driving the wafer insert to transfer the wafer carried by the wafer insert, the shock absorbing device provided in the push rod can reduce the impact force when the push rod cooperates with the carrying part of the wafer insert to clamp the wafer, thereby reducing the damage caused to the wafer by the robotic arm during the wafer transfer process. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.
[0025] Figure 1 is a structural example diagram of a robotic arm shown in an embodiment of the present application;
[0026] Figure 2 is a schematic diagram of a three-dimensional structure in which no shock absorbing device is placed in the push rod shown in an embodiment of the present application;
[0027] Figure 3 is a schematic diagram of a three-dimensional structure of a shock absorbing device placed in a push rod shown in an embodiment of the present application;
[0028] Figure 4 It is a top view of the push rod shown in the embodiment of the present application. DETAILED DESCRIPTION
[0029] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0030] Wafers, also known as silicon wafers or semiconductor wafers, are the basic materials for manufacturing integrated circuits. In the process of semiconductor device manufacturing, wafers need to be transferred for multiple process flows, so robotic arms play a vital role in semiconductor manufacturing. Robotic arms are used to precisely position and transfer wafers to ensure the continuity and consistency of the production process. The accuracy and reliability of robotic arms directly affect the quality of the final semiconductor products. Therefore, the structure of the robotic arm needs to be continuously optimized to ensure efficient and safe transfer of wafers.
[0031] A structure of a mechanical arm for realizing wafer transfer may include: a connecting arm and a wafer insert, one end of the connecting arm is connected to the wafer insert, wherein the wafer insert is used to grab and carry the wafer. In the process of transferring the wafer, the wafer insert can be driven to rotate by the connecting arm, so as to transfer the wafer carried by the wafer insert, and the wafer needs to be clamped in the process of transferring the wafer to prevent the wafer from falling.
[0032] Although the structure of the above-mentioned robotic arm can realize the transfer of wafers, during the process of clamping the wafers, the structure used to clamp the wafers in the robotic arm may collide with the wafers. Since the clamping time of the wafer is about 0.2s (seconds), such a rapid collision may cause the wafer to jump (position shift) or be damaged, resulting in certain parts of the wafer being unable to be processed correctly, thereby affecting the quality and performance of the final semiconductor product.
[0033] In view of this, an embodiment of the present application provides a new structure of a robotic arm, in which a push rod can be arranged at the junction of the wafer insert and the connecting arm, and a shock absorbing device is arranged in the push rod, so that in the process of using the bearing part of the wafer insert to carry the wafer and the connecting arm driving the wafer insert to transfer the carried wafer, the push rod can cooperate with the bearing part to clamp the wafer, and the shock absorbing device arranged in the push rod can reduce the impact force when the push rod cooperates with the bearing part to clamp the wafer, thereby reducing the damage caused to the wafer by the robotic arm during the wafer transfer process.
[0034] Figure 1 is a structural example diagram of a robotic arm shown in an embodiment of the present application, referring to Figure 1 , the robotic arm comprises:
[0035] A wafer insert 1, wherein the wafer insert 1 comprises a carrying portion (not shown) for carrying a wafer;
[0036] A connecting arm 2, wherein the connecting arm 2 is connected to the wafer insert 1 to drive the wafer insert 1 to rotate and move;
[0037] The push rod 110 is disposed at the junction of the wafer insert 1 and the connecting arm 2 and is located on the wafer insert 1. The push rod 110 is used to cooperate with the bearing part to clamp the wafer; the push rod 110 at least includes a shock absorbing device ( Figure 1 The shock absorbing device is not shown in the figure).
[0038] During the operation of the robot arm, the connecting arm drives the wafer insert connected to one end of the connecting arm to rotate and move to obtain the wafer and carry the wafer on the wafer insert. After obtaining the wafer, the robot arm carries the wafer for transfer. In order to prevent the wafer from falling during the transfer process, a push rod is provided at the junction of the wafer insert and the connecting arm. The push rod cooperates with the carrying part of the wafer insert to clamp the wafer.
[0039] In the embodiment of the present application, since the push rod in the robot arm collides with the wafer when clamping the wafer, it may cause the wafer to jump or be damaged. Therefore, in order to reduce the impact force when the push rod in the robot arm clamps the wafer, a shock absorbing device can be provided in the push rod to absorb and alleviate shocks and vibrations, thereby reducing the impact force when clamping the wafer.
[0040] The robotic arm provided in the embodiment of the present application is provided with a push rod at the junction of the wafer insert and the connecting arm, and a shock absorbing device is provided in the push rod. Therefore, in the process of the connecting arm driving the wafer insert to transfer the wafer carried by the wafer insert, the shock absorbing device provided in the push rod can reduce the impact force when the push rod cooperates with the carrying part of the wafer insert to clamp the wafer, thereby reducing the damage caused to the wafer by the robotic arm during the wafer transfer process.
[0041] Continue to refer to Figure 1 The wafer insert 1 may further include a plurality of branch structures and end surfaces to which the branch structures are connected; the bearing portion may include: a plurality of carriers 120 and a plurality of contact pads 130; wherein the plurality of carriers 120 may be arranged at the ends of the plurality of branch structures, and one carrier 120 may be arranged corresponding to one branch structure; the plurality of contact pads 130 may be arranged on the end surfaces.
[0042] In the embodiment of the present application, one branch structure is provided with one carrier. The carriers respectively provided on the multiple branch structures can be used to cooperate with the push rod to clamp and fix the wafer, load the wafer in a balanced manner, and prevent the wafer from falling during the transfer process.
[0043] In a specific implementation, the multiple branch structures may be two branch structures, and the two branch structures form a Y shape or a U shape; the surface of the wafer insert 1 is parallel to the horizontal plane.
[0044] The Y-shaped or U-shaped design can provide a stable support point, and the surface of the wafer insert is parallel to the horizontal plane, which can keep the wafer stable during the entire transfer process and can accommodate wafers of different sizes.
[0045] Furthermore, the connection between the wafer insert 1 and the connecting arm 2 is located at the end surface, and the plurality of contact pads 130 are located on a side of the end surface close to the connection, that is, a side opposite to the carrier 120, thereby maintaining the stability of the wafer.
[0046] In an optional implementation, Figure 2 The schematic diagram of the three-dimensional structure of the push rod in the embodiment of the present application without the shock absorbing device is shown as an example. Figure 3 The schematic diagram of the three-dimensional structure of the shock absorbing device placed in the push rod in the embodiment of the present application is exemplarily shown; Figure 4 The top view of the push rod of the embodiment of the present application is shown as an example, wherein: Figure 4 The direction of the arrow in the figure indicates the moving direction of the push rod 110 when the push rod 110 cooperates with the supporting part to clamp the wafer.
[0047] Combination Figure 2 and Figure 3The push rod 110 may include a shock absorbing device 111, a base 112 for placing the shock absorbing device 111, a pushing device 113 connected to the first end of the base 112, the first end being the end of the push rod 110 close to the connecting arm 2; a front end bracket 114 arranged at the second end of the base 112 and in contact with the shock absorbing device 111, the second end being the end of the push rod that directly contacts the wafer.
[0048] The shock absorbing device 111 is used to absorb shock and vibration to reduce the impact of shock and vibration on the wafer. Since the edge of the wafer is relatively sharp, the shock absorbing device 111 should avoid direct contact with the wafer. Therefore, a front bracket 114 can be set at the second end of the shock absorbing device 111, wherein the second end is the end of the push rod that directly contacts the wafer.
[0049] In the embodiment of the present application, the material of the front end bracket 114 can be polyetheretherketone.
[0050] Since the front-end bracket is in direct contact with the wafer during the wafer transfer process, and polyetheretherketone (PEEK) has the characteristics of high temperature resistance, dimensional stability, antistatic, low outgassing and low precipitation, and is not easily worn by the wafer, therefore, using polyetheretherketone as the material of the front-end bracket can avoid direct contact between the wafer and the shock absorber during the wafer transfer process, thereby preventing wear on the shock absorber.
[0051] In the embodiment of the present application, the pushing device 113 can be used to provide power for the shock absorbing device 111 .
[0052] In the specific implementation, combined with reference Figure 2 and Figure 3 The shock absorbing device 111 can be placed in the groove 1121 of the base 112 , and the lateral width of the shock absorbing device 111 is greater than the lateral width of the groove 1121 .
[0053] refer to Figure 4 Since the lateral width of the shock absorbing device is greater than the lateral width of the groove, when the push rod moves toward the direction of the wafer 3 to cooperate with the supporting part to clamp the wafer, the shock absorbing device 111 will be squeezed by the pushing device 113, so that the shock absorbing device 111 is subjected to force to play a buffering role, thereby reducing the impact force when the push rod cooperates with the supporting part to clamp the wafer.
[0054] In an optional embodiment, the shock absorbing device 111 may be a shock absorbing spring or a shock absorbing sponge, and the pushing device 113 may be a cylinder.
[0055] Compared with ordinary springs or ordinary sponges, shock-absorbing springs and shock-absorbing sponges have more complex geometric shapes and material properties, and thus have good shock-absorbing effects, which can absorb shocks and vibrations, thereby reducing damage to the wafer.
[0056] The cylinder can provide power through compressed air to push the shock absorber. By adjusting the air pressure of the cylinder, the compression force or extension force of the shock absorber can be changed, and the shock absorption effect can be adjusted to adapt to wafers of different weights or sizes. At the same time, the cylinder can provide a stable support force for the shock absorber to ensure the stability and reliability of the shock absorber during operation. Therefore, through the coordinated use of the cylinder and the shock absorber, a good shock absorption effect can be achieved, thereby reducing the impact force when the push rod clamps the wafer.
[0057] It can be seen that the robotic arm provided in the embodiment of the present application is provided with a push rod at the junction of the wafer insert and the connecting arm, and a shock absorbing device is provided in the push rod. Therefore, in the process of the connecting arm driving the wafer insert to transfer the wafer carried by the wafer insert, the shock absorbing device provided in the push rod can reduce the impact force when the push rod cooperates with the carrying part of the wafer insert to clamp the wafer, thereby reducing the damage caused to the wafer by the robotic arm during the wafer transfer process.
[0058] An embodiment of the present application also provides a semiconductor manufacturing equipment, including a wafer conveying device, wherein the wafer conveying device includes a robotic arm, and the robotic arm is the robotic arm described in the above embodiment.
[0059] The above describes multiple implementation schemes provided by the embodiments of the present application. The various optional methods introduced in each implementation scheme can be combined and cross-referenced with each other without conflict, thereby extending a variety of possible implementation schemes, which can all be considered as implementation schemes disclosed and open in the embodiments of the present application.
[0060] Although the embodiments of the present application are disclosed above, the present application is not limited thereto. Any person skilled in the art may make various changes and modifications without departing from the spirit and scope of the present application. Therefore, the scope of protection of the present application shall be subject to the scope defined by the claims.
Claims
1. A robotic arm, characterized in that: include: A wafer insert, wherein the wafer insert comprises a carrying portion for carrying a wafer; A connecting arm, the connecting arm is connected to the wafer inserter to drive the wafer inserter to rotate and move; A push rod is arranged at the junction of the wafer insert and the connecting arm and is located on the wafer insert. The push rod is used to cooperate with the bearing part to clamp the wafer; the push rod at least includes a shock absorbing device.
2. The robotic arm according to claim 1, characterized in that: The push rod also includes: A base for placing the shock absorbing device; a pushing device connected to a first end of the base, the first end being an end of the push rod close to the connecting arm; A front end bracket is arranged at the second end of the base and contacts the shock absorbing device, wherein the second end is an end of the push rod that directly contacts the wafer.
3. The robotic arm according to claim 2, characterized in that: The shock absorbing device is placed in the groove of the base.
4. The robotic arm according to claim 3, characterized in that: The transverse width of the shock absorbing device is greater than the transverse width of the groove.
5. The robotic arm according to claim 4, characterized in that: The shock absorbing device is a shock absorbing spring or a shock absorbing sponge, and the pushing device is a cylinder.
6. The robotic arm according to claim 2, characterized in that: The material of the front end bracket is polyetheretherketone.
7. The robotic arm according to claim 1, characterized in that: The wafer insert also includes: a plurality of branch structures, and end surfaces connected to the plurality of branch structures; the supporting portion includes: a plurality of carriers and a plurality of contact pads; wherein the plurality of carriers are arranged at the ends of the plurality of branch structures, and one carrier is arranged corresponding to one branch structure; and the plurality of contact pads are arranged on the end surfaces.
8. The robotic arm according to claim 7, characterized in that: The multiple branch structures are two branch structures, and the two branch structures form a Y shape or a U shape; the surface of the wafer insert is parallel to the horizontal plane.
9. The robotic arm according to claim 7, characterized in that: The connection point between the wafer insert and the connecting arm is located on the end surface, and the plurality of contact pads are located on one side of the end surface close to the connection point.
10. A semiconductor manufacturing equipment, characterized in that: It comprises a wafer conveying device, and the wafer conveying device comprises a robotic arm, and the robotic arm is the robotic arm as described in any one of claims 1-9.