Rapid heat dissipation BLE Bluetooth device

Abstract

The utility model provides a BLE Bluetooth device capable of fast heat dissipation, which belongs to the technical field of BLE Bluetooth, and comprises a machine body and a heat dissipation mechanism arranged in the machine body, the heat dissipation mechanism comprises first heat dissipation ports respectively arranged at the lower ends of the front and rear surfaces of the machine body, a second heat dissipation port is arranged in the middle of the lower surface of the machine body, and a semiconductor chilling plate is arranged in an inner cavity of the machine body. The cold end of the semiconductor chilling plate is provided with a cold conduction copper sheet, the upper surface of the cold conduction copper sheet abuts against the lower surface of the BLE Bluetooth module in the machine body, and a heat dissipation assembly is further arranged in the machine body. According to the utility model, through cooperation of the heat dissipation mechanism and the heat dissipation assembly, signal attenuation or interruption caused by overheating of the BLE Bluetooth module is effectively prevented, and omnibearing and three-dimensional cooling of the module is realized. The series of design ensures that the Bluetooth module can be kept in a safe temperature interval even in a high-load operation state, so that the damage risk caused by overheating is avoided, the service life of equipment is prolonged, and the use experience of a user is greatly improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of BLE bluetooth, and in particular relates to a BLE bluetooth device with rapid heat dissipation. Background Art

[0002] As a solution for low-cost, short-range wireless connection, BLE Bluetooth technology has been widely used in smart homes, remote control devices, industrial Internet of Things and other fields. Although the original design of BLE Bluetooth module is low power consumption, it will inevitably generate heat in high-load application scenarios such as high-speed data transmission or dense connection. This phenomenon, especially in the case of high-speed data transmission or dense connection, poses a challenge to the stable operation of the module.

[0003] Traditional heat dissipation methods, such as passive heat dissipation that relies solely on heat sinks, can promote natural heat dissipation by increasing the contact area, but they are unable to meet the heat dissipation requirements during high-load operation. Of course, there are also active heat dissipation solutions that introduce fan assistance. Although they can improve the heat dissipation efficiency to a certain extent, they have not fundamentally solved the problem of single heat dissipation method and limited heat dissipation effect. This leads to the risk of signal quality degradation or even interruption due to overheating under high-speed data transmission or intensive connection working conditions. In severe cases, it may even cause module damage, shorten the service life of the equipment, and thus affect the user experience. Utility Model Content

[0004] In view of this, the utility model provides a BLE Bluetooth device with fast heat dissipation, which can effectively prevent the BLE Bluetooth module from attenuating or interrupting the signal due to overheating through the cooperation of the heat dissipation mechanism and the heat dissipation component, ensure the BLE Bluetooth module to operate stably within the optimal temperature range, and realize all-round and three-dimensional cooling of the module. This series of designs ensures that the Bluetooth module can be maintained in a safe temperature range even under high-load operation, which not only avoids the risk of damage caused by overheating, but also prolongs the service life of the device, greatly improving the user experience.

[0005] In order to solve the above technical problems, the utility model provides a BLE bluetooth device with fast heat dissipation, including a body and a heat dissipation mechanism arranged in the body, the heat dissipation mechanism includes a heat dissipation port 1 respectively arranged at the lower ends of the front and rear surfaces of the body, a heat dissipation port 2 is arranged in the middle of the lower surface of the body, a semiconductor refrigeration plate is arranged in the inner cavity of the body, a cooling copper plate is arranged at the cold end of the semiconductor refrigeration plate, the upper surface of the cooling copper plate is in conflict with the lower surface of the BLE bluetooth module in the body, and a heat dissipation component is also arranged in the body.

[0006] The heat dissipation mechanism also includes a heat-conducting copper sheet arranged at the hot end of the semiconductor refrigeration sheet, and the lower surface of the heat-conducting copper sheet is provided with annular heat dissipation fins evenly distributed.

[0007] The heat dissipation mechanism also includes a fan arranged in the middle of the bottom wall of the machine body, and the fan is located between the heat dissipation fins which are arranged in a ring shape.

[0008] The heat dissipation component includes an air pump arranged at the upper left end of the body, an air inlet pipe is provided at the air inlet of the air pump, and an air outlet pipe is provided at the air outlet of the air pump. The right ends of the air inlet pipe and the air outlet pipe both penetrate the left wall of the body and extend into the interior thereof.

[0009] The heat dissipation component also includes a shunt pipe arranged at the upper left end of the inner cavity of the machine body, the air outlet pipe is connected to the opening arranged on the outer arc surface of the shunt pipe, the air outlet holes arranged uniformly in the longitudinal direction on the right end of the outer arc surface of the shunt pipe are all provided with transmission pipes, and the openings arranged uniformly in the transverse direction on the lower end of the outer arc surface of the transmission pipe are all provided with air outlet heads.

[0010] The heat dissipation component also includes grooves which are uniformly arranged longitudinally on the upper surface of the cooling copper sheet.

[0011] Filters are arranged inside the heat dissipation port 1 and the heat dissipation port 2.

[0012] The beneficial effects of the above technical solution of the utility model are as follows:

[0013] 1. When the BLE Bluetooth device starts running, the internal BLE Bluetooth module will generate heat. In order to prevent the BLE Bluetooth module from overheating and affecting signal transmission, the relevant operator controls the semiconductor refrigeration plate, fan and air pump through an external controller to start working synchronously. The cold end of the semiconductor refrigeration plate uses the cold copper plate to efficiently cool the BLE Bluetooth module, effectively preventing the BLE Bluetooth module from overheating and causing signal attenuation or interruption, ensuring that the BLE Bluetooth module operates stably within the optimal temperature range. In this process, the heat at the hot end of the semiconductor refrigeration plate is dissipated through the heat-conducting copper plate and the heat dissipation fins evenly distributed in an annular shape thereon. The heat dissipation fins increase the contact area with the air and accelerate the natural convection heat dissipation of heat. At the same time, the fan strengthens the air flow around the heat dissipation fins, which can quickly discharge the heat from the body through the heat dissipation port 1 and the heat dissipation port 2, thereby improving the heat dissipation efficiency.

[0014] 2. The air pump operates, draws cold air from the groove and pumps it into the shunt pipe through the outlet pipe, and then distributes it through the shunt pipe and blows it evenly to the upper part of the BLE Bluetooth module through multiple transmission pipes and outlet heads, achieving all-round and three-dimensional cooling of the module. This series of designs ensures that the Bluetooth module can remain in a safe temperature range even under high-load operation, which not only avoids the risk of damage caused by overheating, but also extends the service life of the device, greatly improving the user experience.

[0015] 3. The filter prevents external dust and impurities from entering the body, keeps the interior clean, and ensures the long-term stable operation of the cooling system. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the main structure of a BLE Bluetooth device with rapid heat dissipation according to the utility model;

[0017] Figure 2 This is a schematic diagram of the heat dissipation mechanism structure of the utility model;

[0018] Figure 3 It is a schematic diagram of the enlarged structure of point A of the utility model;

[0019] Figure 4 It is a schematic diagram of the structure of the utility model when viewed from above.

[0020] Explanation of the reference numerals: 100, machine body; 200, heat dissipation port one; 201, heat dissipation port two; 202, semiconductor cooling plate; 203, cooling copper plate; 204, heat conducting copper plate; 205, cooling fins; 206, fan; 300, air pump; 301, air inlet pipe; 302, air outlet pipe; 303, shunt pipe; 304, transmission pipe; 305, air outlet head; 306, groove; 400, filter. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical scheme and advantages of the embodiment of the utility model clearer, the following will be combined with the appended drawings of the embodiment of the utility model. Figure 1-4 , the technical scheme of the embodiment of the utility model is clearly and completely described. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Based on the described embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the utility model.

[0022] like Figure 1-4 As shown:

[0023] The present embodiment provides a BLE bluetooth device with fast heat dissipation, including a body 100 and a heat dissipation mechanism arranged in the body 100, the heat dissipation mechanism includes a heat dissipation port 1 200 respectively arranged at the lower ends of the front and rear surfaces of the body 100, a heat dissipation port 201 is arranged in the middle of the lower surface of the body 100, and the heat dissipation port 1 200 and the heat dissipation port 201 cooperate to enhance air circulation, the inner cavity of the body 100 is provided with a semiconductor cooling plate 202, the cold end of the semiconductor cooling plate 202 is provided with a cooling copper plate 203, the upper surface of the cooling copper plate 203 is in contact with the lower surface of the BLE bluetooth module in the body 100, so as to realize the rapid conduction and dissipation of heat, and a heat dissipation component is also arranged in the body 100, and the semiconductor cooling plate 202 is electrically connected to an external controller.

[0024] like Figure 2-4As shown, the heat dissipation mechanism also includes a heat-conducting copper sheet 204 arranged at the hot end of the semiconductor cooling sheet 202, and the lower surface of the heat-conducting copper sheet 204 is provided with annular heat dissipation fins 205 evenly distributed to increase the heat exchange area and improve the heat dissipation efficiency.

[0025] like Figure 2-3 As shown, the heat dissipation mechanism also includes a fan 206 arranged in the middle of the bottom wall of the body 100. The fan 206 is located between the heat dissipation fins 205 which are arranged in a ring shape. The fan 206 is placed in the middle of the heat dissipation fins 205 to further improve the heat dissipation effect through forced convection. The fan 206 is electrically connected to an external controller.

[0026] like Figure 2-3 As shown, the heat dissipation component includes an air pump 300 arranged at the upper left end of the body 100, an air inlet pipe 301 is provided at the air inlet of the air pump 300, and an air outlet pipe 302 is provided at the air outlet of the air pump 300. The right ends of the air inlet pipe 301 and the air outlet pipe 302 both penetrate the left wall surface of the body 100 and extend to the interior thereof. Gas is sucked in through the air inlet pipe 301 and then delivered into the body 100 through the air outlet pipe 302. The air pump 300 is electrically connected to an external controller.

[0027] like Figure 2-3 As shown, the heat dissipation component also includes a shunt pipe 303 arranged at the upper left end of the inner cavity of the body 100, the air outlet pipe 302 is connected to the opening arranged on the outer arc surface of the shunt pipe 303, and transmission pipes 304 are arranged in the air outlet holes uniformly arranged longitudinally at the right end of the outer arc surface of the shunt pipe 303, and air outlet heads 305 are arranged in the openings uniformly arranged laterally at the lower end of the outer arc surface of the transmission pipe 304. The air is evenly distributed to the upper part of the air outlet head 305 through multiple transmission pipes 304 and air outlet heads 305, thereby improving the uniformity of heat dissipation.

[0028] like Figure 2-3 As shown, the heat dissipation assembly further includes grooves 306 uniformly arranged longitudinally on the upper surface of the cooling copper sheet 203 .

[0029] The working principle of a BLE bluetooth device with fast heat dissipation provided by the utility model is as follows: when the BLE bluetooth device starts to run, the internal BLE bluetooth module will generate heat. In order to prevent the BLE bluetooth module from overheating and affecting signal transmission, the relevant operator controls the semiconductor refrigeration plate 202, the fan 206 and the air pump 300 through the external controller to start working synchronously. The cold end of the semiconductor refrigeration plate 202 uses the cooling copper plate 203 to efficiently cool the BLE bluetooth module, effectively preventing the BLE bluetooth module from overheating and causing signal attenuation or interruption, ensuring that the BLE bluetooth module operates stably within the optimal temperature range. In this process, the heat at the hot end of the semiconductor refrigeration plate 202 is The heat is dissipated by the heat-conducting copper sheet 204 and the heat-dissipating fins 205 evenly distributed in an annular shape thereon. The heat-dissipating fins 205 increase the contact area with the air and accelerate the natural convection heat dissipation of the heat. At the same time, the fan 206 strengthens the air flow around the heat-dissipating fins 205, and can quickly discharge the heat from the body through the heat-dissipating port 1 200 and the heat-dissipating port 2 201, thereby improving the heat dissipation efficiency. The air pump 300 operates to draw the cold air at the groove 306 and pump the cold air into the shunt pipe 303 through the air outlet pipe 302, and then distributes it through the shunt pipe 303, and evenly blows it to the upper part of the BLE Bluetooth module through multiple transmission pipes 304 and the air outlet head 305, thereby realizing all-round and three-dimensional cooling of the module. This series of designs ensures that the Bluetooth module can be kept in a safe temperature range even under high-load operation, which not only avoids the risk of damage caused by overheating, but also prolongs the service life of the device and greatly improves the user experience.

[0030] like Figure 1-4 As shown, both the heat dissipation port 1 200 and the heat dissipation port 2 201 are provided with a filter 400, and the filter 400 prevents external dust and impurities from entering the body, keeps the interior clean, and ensures the long-term stable operation of the heat dissipation system.

[0031] In addition, it should be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0032] The above is a preferred embodiment of the present invention. It should be pointed out that, for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A BLE device with rapid heat dissipation, characterized in that: The invention comprises a body (100) and a heat dissipation mechanism arranged in the body (100), wherein the heat dissipation mechanism comprises a heat dissipation port 1 (200) respectively arranged at the lower ends of the front and rear surfaces of the body (100), a heat dissipation port 2 (201) is arranged in the middle of the lower surface of the body (100), the inner cavity of the body (100) is provided with a semiconductor cooling plate (202), the cold end of the semiconductor cooling plate (202) is provided with a cooling copper plate (203), the upper surface of the cooling copper plate (203) is in contact with the lower surface of the BLE bluetooth module in the body (100), and a heat dissipation component is also arranged in the body (100).

2. A BLE device with rapid heat dissipation as claimed in claim 1, characterized in that: The heat dissipation mechanism also includes a heat-conducting copper sheet (204) arranged at the hot end of the semiconductor cooling sheet (202), and the lower surface of the heat-conducting copper sheet (204) is provided with annular evenly distributed heat dissipation fins (205).

3. A BLE device with rapid heat dissipation as claimed in claim 1, characterized in that: The heat dissipation mechanism further comprises a fan (206) arranged in the middle of the bottom wall of the machine body (100), and the fan (206) is located between a group of annular heat dissipation fins (205).

4. A BLE device with rapid heat dissipation as claimed in claim 1, characterized in that: The heat dissipation component comprises an air pump (300) arranged at the upper left end of the body (100); an air inlet pipe (301) is provided at the air inlet of the air pump (300); an air outlet pipe (302) is provided at the air outlet of the air pump (300); and the right ends of the air inlet pipe (301) and the air outlet pipe (302) both penetrate the left wall surface of the body (100) and extend into the interior thereof.

5. A BLE device with rapid heat dissipation as claimed in claim 4, characterized in that: The heat dissipation component further comprises a shunt pipe (303) arranged at the upper left end of the inner cavity of the body (100); the air outlet pipe (302) is connected to an opening arranged on the outer arc surface of the shunt pipe (303); air outlet holes uniformly arranged longitudinally at the right end of the outer arc surface of the shunt pipe (303) are provided with transmission pipes (304); and air outlet heads (305) are provided in openings uniformly arranged transversely at the lower end of the outer arc surface of the transmission pipe (304).

6. A BLE device with rapid heat dissipation as claimed in claim 4, characterized in that: The heat dissipation component also includes grooves (306) uniformly arranged longitudinally on the upper surface of the cooling copper sheet (203).

7. A BLE device with rapid heat dissipation as claimed in claim 1, characterized in that: The heat dissipation port 1 (200) and the heat dissipation port 2 (201) are both provided with filter screens (400).

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