Diode degumming channel mold
By designing a degluing mold for diodes, the diode surface is cleaned by using hydraulic cylinder and extrusion wheel drive cleaning blocks, the problem that the glue path is not removed in the prior art affects product quality, and efficient glue path removal is achieved.
Patent Information
- Application Number
- CN202421499213.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-28
- Publication Date
- 2025-04-29
- Estimated Expiration
- 2034-06-28
AI Technical Summary
During the glue injection process of existing glue injection molds, if the glue cannot be evenly applied to the diode surface, a glue path will be formed on the diode surface. If the glue path is not removed, the subsequent cutting and foot bending operations will be directly carried out, which will affect the quality of the product.
A diode glue removal mold is designed, including a base plate, bracket, hydraulic cylinder, upper mold and lower mold. The upper mold is driven by the hydraulic cylinder to move the lower mold. The extrusion wheel and connecting rod drive the moving block and the cleaning block to clean the diode surface. The cleaned glue enters the collection box through the liquid collection tank.
The glue path on the diode surface is effectively removed, ensuring the normal progress of subsequent processes and improving product quality.
Smart Images

Figure CN222807536U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of diode glue removal, in particular to a diode glue removal mold. Background Art
[0002] After the diode body is manufactured, it is usually necessary to perform a glue injection process on its outer surface. The glue injection process is to place the diode on the lower mold, which is equipped with a main glue injection channel and multiple glue injection channels. During the glue injection, each diode is fixed in each glue injection channel, and the epoxy resin flowing into the main glue injection channel adheres to the surface of the diode from each glue injection channel.
[0003] In the existing glue injection mold, if the glue is not evenly applied to the surface of the diode during the glue injection process, a glue path will be formed on the surface of the diode. If the glue path is not removed and the subsequent rib cutting and foot bending operations are carried out directly, the quality of the product will be affected. Based on this, this solution provides a diode glue path removal mold to solve the above-mentioned problem. Utility Model Content
[0004] In order to solve the above technical problems, a diode glue line removal mold is provided. This technical solution solves the problem that during the glue injection process of the existing glue injection mold proposed in the above background technology, if the glue is not evenly applied to the surface of the diode, a glue line will be formed on the surface of the diode. If the glue line is not removed and subsequent rib cutting and foot bending operations are carried out directly, the quality of the product will be affected.
[0005] In order to achieve the above purpose, the technical solution adopted by the utility model is:
[0006] A diode degumming mold comprises a base plate, the upper end of the base plate is fixedly connected to a bracket and a lower mold, a hydraulic cylinder is fixedly installed on the top of the bracket, the output end of the hydraulic cylinder passes through the bracket and is fixedly connected to the upper mold, the upper mold is arranged at the upper end of the lower mold, the interior of the lower mold is fixedly connected to a first fixed seat, the left and right ends of the first fixed seat are fixedly connected to a connecting plate, the outer end of the connecting plate is fixedly connected to a pin groove, the upper end of the pin groove is slidably installed with a moving block, the middle part of the moving block is fixedly installed with a cleaning block, the outer end of the moving block is fixedly connected to a connecting rod, the front and rear ends of the connecting rod are respectively fixedly connected with a pair of sliding blocks, the sliding block is slidably installed on the surface of the sliding rod, the upper end of the sliding block is fixedly connected with a driving block, the lower end of the upper mold is fixedly connected to a second fixed seat and a plurality of groups of fixed frames, and the lower end of the fixed frame is rotatably installed with an extrusion wheel.
[0007] Preferably, a return spring is sleeved on the surface of the slide rod, and two ends of the return spring are fixedly connected to the inner wall of the lower mold and the side of the slide block respectively.
[0008] Preferably, positioning rods are fixedly connected to the four corners of the lower end of the upper mold, and positioning grooves matching the positioning rods are formed at the four corners of the upper end of the lower mold.
[0009] Preferably, both sides of the upper end of the pin groove are opened in the slide groove, and the front and rear ends of the moving block are arranged inside the slide groove and are slidably connected with the slide groove.
[0010] Preferably, a pair of liquid collecting troughs are provided at the bottom of the lower mold, the two liquid collecting troughs are symmetrically arranged about the first fixed seat, and a collecting box is provided on the lower side of the liquid collecting trough, the left end of the collecting box extends out of the left end of the lower mold and is fixedly connected to a pull rod.
[0011] Preferably, the driving blocks are symmetrically arranged, and the upper ends of the driving blocks are inclined outwards.
[0012] Compared with the prior art, the utility model provides a diode glue removal mold, which has the following beneficial effects:
[0013] 1. The utility model is provided with a first fixing seat and a second fixing seat, the diode is placed in the first fixing seat, and the pins on both sides of the diode are placed in the pin grooves, so that the pins are aligned with the cleaning block in the middle of the moving block, and then the hydraulic cylinder is started to drive the upper mold to move toward the lower mold. During the movement, the upper end of the driving block is squeezed by the extrusion wheel, so that the driving block moves, and the moving block is driven to move by the connecting rod, and the moving block cooperates with the cleaning block to clean the surface of the pin. At the same time, after the first fixing seat and the second fixing seat are hinged, the surface glue path of the diode is cleaned by pressure, and the cleaned glue enters the collection box through the liquid collecting tank, which is convenient for processing. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a schematic diagram of the overall structure of the utility model;
[0015] Figure 2 It is a structural schematic diagram of the upper mold in the utility model;
[0016] Figure 3 It is a structural schematic diagram of the lower mold in the utility model;
[0017] Figure 4 For this utility model Figure 3 A schematic diagram of the enlarged structure in FIG.
[0018] The numbers in the figure are:
[0019] 1. Bottom plate; 2. Bracket; 3. Hydraulic cylinder; 4. Upper mold; 401. Positioning rod; 5. Lower mold; 501. Positioning groove; 502. Liquid collecting groove; 6. First fixed seat; 7. Connecting plate; 8. Pin groove; 801. Slide groove; 9. Moving block; 901. Cleaning block; 10. Connecting rod; 11. Slide rod; 12. Sliding block; 13. Driving block; 14. Reset spring; 15. Second fixed seat; 16. Fixed frame; 17. Extrusion wheel; 18. Collecting box. DETAILED DESCRIPTION
[0020] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are only examples, and those skilled in the art may think of other obvious variations.
[0021] Reference Figure 1-4 As shown, a diode degumming mold comprises a base plate 1, the upper end of the base plate 1 is fixedly connected with a bracket 2 and a lower mold 5, a hydraulic cylinder 3 is fixedly installed on the top of the bracket 2, the output end of the hydraulic cylinder 3 passes through the bracket 2 and is fixedly connected with an upper mold 4, the upper mold 4 is arranged at the upper end of the lower mold 5, the interior of the lower mold 5 is fixedly connected with a first fixed seat 6, the left and right ends of the first fixed seat 6 are fixedly connected with a connecting plate 7, the outer end of the connecting plate 7 is fixedly connected with a pin groove 8, the upper end of the pin groove 8 is slidably installed with a moving block 9, the middle part of the moving block 9 is fixedly installed with a cleaning block 901, the outer end of the moving block 9 is fixedly connected with a connecting rod 10, the front and rear ends of the connecting rod 10 are respectively fixedly connected with a pair of sliding blocks 12, the sliding block 12 is slidably installed on the surface of the sliding rod 11, the upper end of the sliding block 12 is fixedly connected with a driving block 13, the lower end of the upper mold 4 is fixedly connected with a second fixed seat 15 and a plurality of groups of fixed frames 16, and the lower end of the fixed frame 16 is rotatably installed with an extrusion wheel 17. The device is provided with a first fixing seat 6 and a second fixing seat 15. The diode is placed in the first fixing seat 6, and the pins on both sides of the diode are placed in the pin groove 8, so that the pins are aligned with the cleaning block 901 in the middle of the moving block 9. Then the hydraulic cylinder 3 is started to drive the upper mold 4 to move to the lower mold 5. During the movement, the upper end of the driving block 13 is squeezed by the extrusion wheel 17, so that the driving block 13 moves, and the moving block 9 is driven to move by the connecting rod 10. The moving block 9 then cooperates with the cleaning block 901 to clean the surface of the pin. At the same time, after the first fixing seat 6 and the second fixing seat 15 are hinged, the surface glue path of the diode is cleaned by pressure, and the cleaned glue enters the collection box 18 through the liquid collecting tank 502 for easy processing.
[0022] Specifically, in this embodiment, a return spring 14 is sleeved on the surface of the slide bar 11, and the two ends of the return spring 14 are respectively fixedly connected to the inner wall of the lower mold 5 and the side of the slide block 12. After the upper mold 4 and the lower mold 4 are separated, the drive block 13 drives the cleaning block 901 to reset through the return spring 14, which is convenient for subsequent cleaning.
[0023] Specifically, in this embodiment, the four corners of the lower end of the upper mold 4 are fixedly connected with positioning rods 401, and the four corners of the upper end of the lower mold 5 are provided with positioning grooves 501 matching the positioning rods 401. This avoids the upper mold 4 and the lower mold 5 from deflecting when they are closed, thereby ensuring the accuracy of the entire process.
[0024] Specifically, in this embodiment, both sides of the upper end of the pin slot 8 are opened in the slide slot 801, and the front and rear ends of the moving block 9 are arranged inside the slide slot 801 and are slidably connected with the slide slot 801. The slide slot 801 has a guide left and right to ensure that the moving path of the moving block 9 is a predetermined path and will not deviate.
[0025] Specifically, in this embodiment, a pair of liquid collecting troughs 502 are opened at the bottom of the lower mold 5, the two liquid collecting troughs 502 are symmetrically arranged about the first fixed seat 6, and a collecting box 18 is arranged on the lower side of the liquid collecting trough 502, and the left end of the collecting box 18 extends out of the left end of the lower mold 5 and is fixedly connected with a pull rod.
[0026] Specifically, in this embodiment, the driving blocks 13 are symmetrically arranged, and the upper ends of the driving blocks 13 are inclined outward.
[0027] The working principle of the utility model is as follows: the device is provided with a first fixing seat 6 and a second fixing seat 15, the diode is placed in the first fixing seat 6, and the pins on both sides of the diode are placed in the pin groove 8, so that the pins are aligned with the cleaning block 901 in the middle of the moving block 9, and then the hydraulic cylinder 3 is started to drive the upper mold 4 to move toward the lower mold 5. During the movement, the upper end of the driving block 13 is squeezed by the extrusion wheel 17, so that the driving block 13 is moved, and the moving block 9 is driven to move by the connecting rod 10, and the moving block 9 cooperates with the cleaning block 901 to clean the surface of the pin. At the same time, after the first fixing seat 6 and the second fixing seat 15 are hinged, the surface glue path of the diode is cleaned by pressure, and the cleaned glue enters the collection box 18 through the liquid collecting tank 502 for easy processing.
[0028] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and the specification only describe the principles of the utility model. The utility model may be subject to various changes and improvements without departing from the spirit and scope of the utility model. These changes and improvements fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.
Claims
1. A diode debonding mold, characterized in that: The invention comprises a bottom plate (1), the upper end of which is fixedly connected to a bracket (2) and a lower mold (5), the top end of which is fixedly mounted with a hydraulic cylinder (3), the output end of which passes through the bracket (2) and is fixedly connected to an upper mold (4), the upper mold (4) being arranged at the upper end of the lower mold (5), the interior of which is fixedly connected to a first fixing seat (6), the left and right ends of which are fixedly connected to a connecting plate (7), the outer end of which is fixedly connected to a pin groove (8), the upper end of which is a sliding plate A moving block (9) is movably installed, a cleaning block (901) is fixedly installed in the middle of the moving block (9), the outer end of the moving block (9) is fixedly connected to a connecting rod (10), and a pair of sliding blocks (12) are fixedly connected to the front and rear ends of the connecting rod (10), respectively, and the sliding block (12) is slidably installed on the surface of the sliding rod (11), and the upper end of the sliding block (12) is fixedly connected to a driving block (13), and the lower end of the upper mold (4) is fixedly connected to a second fixed seat (15) and a plurality of groups of fixed frames (16), and the lower end of the fixed frame (16) is rotatably installed with an extrusion wheel (17).
2. A diode glue removal mold according to claim 1, characterized in that: A return spring (14) is sleeved on the surface of the slide rod (11), and two ends of the return spring (14) are fixedly connected to the inner wall of the lower mold (5) and the side of the slide block (12) respectively.
3. A diode glue removal mold according to claim 1, characterized in that: The four corners of the lower end of the upper mold (4) are fixedly connected with positioning rods (401), and the four corners of the upper end of the lower mold (5) are provided with positioning grooves (501) matching the positioning rods (401).
4. A diode glue removal mold according to claim 1, characterized in that: Both sides of the upper end of the pin groove (8) are opened in the slide groove (801), and the front and rear ends of the moving block (9) are arranged inside the slide groove (801) and are slidably connected with the slide groove (801).
5. The diode glue removal mold according to claim 1, characterized in that: A pair of liquid collecting grooves (502) are provided at the bottom of the lower mold (5), and the two liquid collecting grooves (502) are symmetrically arranged about the first fixed seat (6), and a collecting box (18) is provided on the lower side of the liquid collecting groove (502), and the left end of the collecting box (18) extends out of the left end of the lower mold (5) and is fixedly connected to a pull rod.
6. The diode glue removal mold according to claim 1, characterized in that: The driving blocks (13) are symmetrically arranged, and the upper ends of the driving blocks (13) are inclined outwards.