Main control board, controller, outdoor unit and air conditioner of air conditioning system
By setting up strong electric filtering circuit, active PFC circuit and compressor IPM circuit on the main control board of the air conditioning system, and concentrating devices with large heat generation into the same heat dissipation area, the problem that the existing air conditioner controller circuit board layout structure cannot take into account both size, heat dissipation and EMI performance, achieving more efficient heat dissipation and anti-interference capabilities.
Patent Information
- Application Number
- CN202421520827.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-28
- Publication Date
- 2025-04-29
- Estimated Expiration
- 2034-06-28
AI Technical Summary
The circuit board layout structure of existing air conditioner controllers cannot take into account the needs of various aspects such as size performance, heat dissipation performance and EMI performance, resulting in high electromagnetic noise and insufficient anti-interference ability.
Design a main control board of an air conditioning system, and set the strong electric filter circuit, active PFC circuit and compressor IPM circuit adjacently in different areas of the main control board, and concentrate devices with large heat generation into the same heat dissipation area to reduce the current loop distance and improve heat dissipation efficiency.
It has achieved comprehensive consideration of device heat dissipation needs and EMI requirements under a compact layout, improved anti-interference ability, reduced electromagnetic noise, and improved the heat dissipation ability of the main control board.
Smart Images

Figure CN222811848U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of air-conditioning circuits, and in particular to a main control board, a controller, an outdoor unit and an air conditioner of an air-conditioning system. Background Art
[0002] At present, the controller of the air conditioner is large in size and the device layout is loose, which runs counter to the development direction of controller miniaturization; moreover, the layout of power devices often limits the heat dissipation of power devices and cannot adapt to higher frequency control; if the heat dissipation needs of devices with higher heat generation are given priority, it often leads to a longer current loop, which in turn leads to problems such as large electromagnetic noise and insufficient anti-interference ability. Therefore, the circuit board layout structure of the current air conditioner controller cannot take into account the various requirements of the air conditioning system controller in terms of size performance, heat dissipation performance, and EMI performance. Utility Model Content
[0003] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a main control board, a controller, an outdoor unit and an air conditioner of an air conditioning system, which can comprehensively consider the heat dissipation requirements and EMI requirements of the components in a compact layout.
[0004] An embodiment of the first aspect of the present application provides a main control board of an air conditioning system, the air conditioning system comprising a strong electric filter circuit, an active PFC circuit and a compressor IPM circuit electrically connected in sequence, the main control board comprising:
[0005] A first area, wherein the strong electric filter circuit is arranged in the first area;
[0006] a second region, wherein the active PFC circuit is arranged in the second region;
[0007] a third area, wherein the compressor IPM circuit is arranged in the third area;
[0008] Among them, the first area, the second area and the third area are arranged adjacent to each other from right to left in sequence; the active PFC circuit includes an electrolytic capacitor module, a bridge stack device and a power device, the compressor IPM circuit includes an IPM device, the electrolytic capacitor is located in the middle area of the main control board, the bridge stack device and the power device are located in the lower area of the main control board and are adjacent to the first area upward, the IPM device is located in the lower area of the main control board and is adjacent to the second area to the right, and the areas where the bridge stack device, the power device and the IPM device are located together constitute a heat dissipation area.
[0009] According to some embodiments of the present application, the air-conditioning system also includes a switching power supply circuit, a fan IPM circuit and a main control chip circuit, and the main control board also includes a fourth area, the fourth area is located on the left side of the third area, and the switching power supply circuit, the fan IPM circuit and the main control chip circuit are arranged in the fourth area.
[0010] According to some embodiments of the present application, the switching power supply circuit is arranged in the middle of the fourth area, the fan IPM circuit is arranged in the upper part of the fourth area, and the main control chip circuit is arranged in the lower part of the fourth area and adjacent to the compressor IPM circuit.
[0011] According to some embodiments of the present application, the switching power supply circuit supplies power to the wind turbine IPM circuit and the main control chip circuit respectively.
[0012] According to some embodiments of the present application, the main control chip circuit provides control signals to the fan IPM circuit and the compressor IPM circuit respectively.
[0013] According to some embodiments of the present application, the power device includes a silicon carbide MOSFET and / or a gallium nitride MOSFET.
[0014] According to some embodiments of the present application, the air-conditioning system also includes a load interface module, and the main control board also includes a fifth area located at the edge of the main control board, the fifth area is downwardly adjacent to the second area and the third area, and the load interface module is arranged in the fifth area.
[0015] According to some embodiments of the present application, the electrolytic capacitor module includes two electrolytic capacitors connected to the output end of the active PFC circuit, and the two electrolytic capacitors are arranged side by side and are downwardly adjacent to the third area.
[0016] According to some embodiments of the present application, the strong current filter circuit includes an AC input end, and the first area includes a phase line terminal, which is connected to the AC input end and arranged on the right edge of the main control board.
[0017] According to some embodiments of the present application, the size of the main control board in the left-right direction is less than 220 mm, and the size in the up-down direction is less than 138.5 mm.
[0018] An embodiment of the second aspect of the present application provides a controller, comprising the main control board of the first aspect.
[0019] An embodiment of the third aspect of the present application provides an outdoor unit, comprising the main control board of the first aspect or the controller of the second aspect.
[0020] An embodiment of the fourth aspect of the present application provides an air conditioner, comprising the main control board of the first aspect or the controller of the second aspect or the outdoor unit of the third aspect.
[0021] The main control board, controller, outdoor unit and air conditioner of the air-conditioning system provided in the embodiment of the present application have at least the following beneficial effects: the main control board of the air-conditioning system carries a strong electric filter circuit, an active PFC circuit and a compressor IPM circuit, the first area of the main control board is arranged with a strong electric filter circuit, the second area is arranged with an active PFC circuit and the third area is arranged with a compressor IPM circuit, and the first area, the second area and the third area are arranged adjacent to each other in sequence, the strong electric filter circuit connects to the AC input to filter the input voltage, the active PFC circuit performs PFC rectification on the filtered voltage and outputs it to the DC bus, and the compressor IPM circuit is based on the voltage inversion of the DC bus The voltage for driving the compressor to operate is obtained. Since the first area, the second area and the third area are arranged adjacent to each other, the distance of the current loop from the AC input to the compressor drive can be reduced. The shorter current loop helps to improve the anti-interference ability and generate less electromagnetic noise. In addition, the devices with high heat generation in the active PFC circuit and the compressor IPM circuit are concentrated in the same area, that is, the area where the bridge stack device, the power device and the IPM device are located is used as the heat dissipation area. A radiator or a refrigerant heat dissipation module can be arranged for the heat dissipation area, thereby improving the heat dissipation capacity of the main control board. Therefore, the device heat dissipation requirements and EMI requirements can be comprehensively considered in a compact layout.
[0022] Other features and advantages of the present application will be described in the following description, and partly become apparent from the description, or understood by practicing the present application. The purpose and other advantages of the present application can be realized and obtained through the structures particularly pointed out in the description and the drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] Figure 1 This is a schematic diagram of the circuit module connection of the main control board provided in an embodiment of the present application;
[0024] Figure 2 It is a schematic diagram of the area division on the main control board provided in an embodiment of the present application;
[0025] Figure 3 It is a schematic diagram of the adjacent relationship between the regions of each circuit module of the main control board provided in an embodiment of the present application;
[0026] Figure 4 It is a partition diagram of each circuit module of the main control board picture provided in the embodiment of the present application;
[0027] Figure 5 It is a schematic diagram of the heat dissipation area of the main control board provided in an embodiment of the present application;
[0028] Figure 6 This is a schematic diagram of the heat dissipation area partition of the main control board image provided in an embodiment of the present application. DETAILED DESCRIPTION
[0029] This section will describe in detail the specific embodiments of the utility model. The preferred embodiments of the utility model are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the utility model, but it cannot be understood as a limitation on the protection scope of the utility model.
[0030] In the description of the embodiments of the present utility model, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, "above", "below", "within", etc. are understood to include the number itself, "at least one" means one or more, "at least one of the following" and similar expressions refer to any combination of these items, including any combination of single or plural items. If there is a description of "first", "second", etc., it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.
[0031] It should be noted that the words such as setting, installing, and connecting in the embodiments of the present invention should be understood in a broad sense, and the technical personnel in the relevant technical field can reasonably determine the specific meanings of the above words in the embodiments of the present invention in combination with the specific content of the technical solution. For example, the term "connection" can be a mechanical connection, an electrical connection, or mutual communication; it can be directly connected or indirectly connected through an intermediate medium.
[0032] It should be noted that the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.
[0033] At present, the controller of the air conditioner is large, which runs counter to the development direction of controller miniaturization. The size of the main control board restricts the reduction of the size of the air conditioner body. Moreover, the layout of power devices often limits the heat dissipation of power devices and cannot adapt to higher frequency control. If the heat dissipation needs of devices with higher heat generation need to be given priority, it often leads to a longer current loop, which in turn leads to problems such as high electromagnetic noise and insufficient anti-interference ability. Therefore, the circuit board layout structure of the current air conditioner controller cannot take into account the various requirements of the air conditioning system controller in terms of size performance, heat dissipation performance, and EMI performance. In addition, the main control board of the air conditioner often has the problem of loose device layout and inconvenient assembly and plugging during the production process.
[0034] Based on this, the present application provides a main control board, a controller, an outdoor unit and an air conditioner of an air-conditioning system, which can comprehensively consider the heat dissipation requirements and EMI requirements of the components in a compact layout.
[0035] The following is a further description of the embodiments of the present invention in conjunction with the accompanying drawings.
[0036] Reference Figure 1 , Figure 1 It is a circuit schematic diagram of an air conditioning system provided by an embodiment of the utility model. The air conditioning system includes a strong electric filter circuit F, an active PFC circuit D, an electrolytic capacitor module H, a compressor IPM circuit E, a switching power supply circuit B, a fan IPM circuit A and a main control chip circuit C, wherein the input end of the strong electric filter circuit F is connected to a three-phase AC power supply L1, L2, and L3; the strong electric filter circuit F, the active PFC circuit D, the electrolytic capacitor module H and the compressor IPM circuit E are connected in sequence; the compressor IPM circuit E supplies power to the compressor M1; the switching power supply circuit B can obtain power from the electrolytic capacitor module H, or from one phase of the three-phase AC power supply for rectification to obtain power, the switching power supply circuit B provides low-voltage direct current to the main control chip circuit C and the fan IPM circuit A, and the main control chip circuit C provides control signals to the active PFC circuit D, the compressor IPM circuit E and the fan IPM circuit A, etc.
[0037] Reference Figure 2 , Figure 2 This is a schematic diagram of the partitions of the main control panel of the air conditioning system provided by an embodiment of the utility model. The main control panel includes a first area, a second area, a third area, a fourth area and a fifth area, wherein the first area, the second area, the third area and the fourth area are arranged from right to left, and the fifth area is located above the first area and the second area. It can be understood that Figure 2 The partitions shown are relatively ideal, that is, the boundaries between the partitions are relatively straight. However, in actual situations, the boundaries between the partitions may be inclined or tortuous.
[0038] Reference Figure 3 and Figure 4 , Figure 3 and Figure 4 : is a schematic diagram of the layout of the main control board of the air-conditioning system provided by the first embodiment of the utility model. Specifically, the main control board of the air-conditioning system includes at least a first area, a second area and a third area:
[0039] Wherein, the strong electric filter circuit F is arranged in the first area;
[0040] The active PFC circuit D is arranged in the second area;
[0041] The compressor IPM circuit E is arranged in the third area;
[0042] The first area, the second area and the third area are arranged adjacent to each other from right to left in sequence; the active PFC circuit D includes an electrolytic capacitor module H, a bridge stack device and a power device, the compressor IPM circuit E includes an IPM device, the electrolytic capacitor is located in the middle area of the main control board, the bridge stack device and the power device are located in the lower area of the main control board and are adjacent to the first area upward, the IPM device is located in the lower area of the main control board and is adjacent to the second area to the right, and the areas where the bridge stack device, the power device and the IPM device are located together constitute the heat dissipation area Z.
[0043] Reference Figure 5 and Figure 6 , the heat dissipation area Z covers the bridge stack device, power device and IPM device, that is, the bridge stack device, power device and IPM device are centrally arranged on the main control board, so that a single heat dissipation component can be used to dissipate heat for the bridge stack device, power device and IPM device. A heat dissipation component of a corresponding shape can be designed according to the shape of the heat dissipation area Z. In some possible embodiments, the bridge stack device, power device and IPM device are arranged at the bottom of the main control board and close to the right edge, so that the heat dissipation area Z is located at the lower right corner of the main control board. When the main control board is installed in the outdoor unit of the air conditioner, the heat dissipation area Z is located above the compressor, and the refrigerant pipe can be easily led to the heat dissipation area Z, and the refrigerant is used to take away the heat emitted by the heat dissipation area Z. This layout method can optimize the arrangement of the refrigerant heat dissipation pipes and reduce the difficulty of outdoor unit assembly.
[0044] Therefore, it can be known that the main control board of the air-conditioning system carries a strong electric filter circuit F, an active PFC circuit D and a compressor IPM circuit E. The first area of the main control board is arranged with the strong electric filter circuit F, the second area is arranged with the active PFC circuit D and the third area is arranged with the compressor IPM circuit E, and the first area, the second area and the third area are arranged adjacent to each other in sequence. The strong electric filter circuit F connects to the AC input to filter the input voltage, the active PFC circuit D performs PFC rectification on the filtered voltage and outputs it to the DC bus, and the compressor IPM circuit E inverts the voltage of the DC bus to the voltage that drives the compressor to operate. The first area, the second area and the third area are arranged adjacent to each other, which can reduce the distance of the current loop from the AC input to the compressor drive. The shorter current loop helps to improve the anti-interference ability and generate less electromagnetic noise. In addition, the devices with high heat generation in the active PFC circuit D and the compressor IPM circuit E are concentrated in the same area, that is, the area where the bridge stack device, the power device and the IPM device are located is used as the heat dissipation area Z. A radiator or a refrigerant heat dissipation module can be arranged for the heat dissipation area Z, thereby improving the heat dissipation capacity of the main control board. Therefore, the device heat dissipation requirements and EMI requirements can be comprehensively considered in a compact layout.
[0045] In some embodiments, the air-conditioning system also includes a switching power supply circuit B, a fan IPM circuit A and a main control chip circuit C, and the main control board also includes a fourth area, which is located on the left side of the third area, and the switching power supply circuit B, the fan IPM circuit A and the main control chip circuit C are arranged in the fourth area.
[0046] Among them, the switching power supply circuit B is arranged in the middle of the fourth area, the fan IPM circuit A is arranged in the upper part of the fourth area, and the main control chip circuit C is arranged in the lower part of the fourth area and is adjacent to the compressor IPM circuit E. Therefore, it can be understood that the fan IPM circuit A and the main control chip circuit C are respectively located on the upper and lower sides of the switching power supply circuit B, so that the switching power supply circuit B can supply power to the fan IPM circuit A and the main control chip circuit CC respectively through the shortest power supply line. The switching power supply circuit B, the fan IPM circuit A and the main control chip circuit C are arranged in the fourth area, which can separate the circuit of the low-voltage DC control part from other strong electric circuits and have better EMI performance.
[0047] In addition, it can also be understood that the main control chip circuit C is adjacent to the compressor IPM circuit E, so that the control signal can be provided to the compressor IPM circuit E through a shorter communication line; the main control chip circuit C and the fan IPM circuit A are both arranged in the fourth area, and the distance between the two is also relatively close. The main control chip circuit C can provide a control signal to the fan IPM circuit A through a shorter communication line.
[0048] In addition, in order to further reduce the area of the main control board and achieve a miniaturized layout, the power device in the active PFC circuit D includes a silicon carbide MOSFET. By utilizing the characteristics of the silicon carbide MOSFET, the carrier frequency of the software control of the main control board is improved, and the power density of the active PFC circuit D is higher, so that a smaller circuit device carried by the second area can be selected. In addition to using silicon carbide MOSFET, power devices can also use gallium nitride MOSFET, which can also increase the carrier frequency, increase the power density, and thus reduce the circuit layout.
[0049] In some embodiments, the air conditioning system further includes a load interface module G, the main control board further includes a fifth area located at the edge of the main control board, the fifth area is downwardly adjacent to the second area and the third area, and the load interface module G is arranged in the fifth area.
[0050] It should be noted that the load interface module GG may include both high-voltage load interfaces and low-voltage load interfaces, such as main load control relay plug-in ports, expansion valve plug-in ports, solenoid valve plug-in ports, various sensor plug-in ports, and the like.
[0051] In some embodiments, the electrolytic capacitor module H includes two electrolytic capacitors connected to the output end of the active PFC circuit D. The two electrolytic capacitors are arranged side by side and are adjacent to the third area downward. The two electrolytic capacitors can be arranged in the up and down direction or in the left and right direction. The actual application scenario of the main control board of the embodiment of the present application is mainly used in controllers with a power range of 3500W-4000W. In order to ensure the temperature rise requirements of the power device and the influence of the current waveform, a dual electrolytic capacitor method is adopted, that is, the electrolytic capacitor module H includes two electrolytic capacitors connected to the output end of the active PFC circuit D. Compared with the single electrolytic capacitor solution, the dual electrolytic capacitor solution has a higher power range and can ensure the normal operation of the circuit of the main control board. The overall layout is combined with Figure 3 and Figure 4 It can be seen that the three-phase AC power supply enters from the right layout area of the first area. From top to bottom, this part is the strong electric filter circuit F; then from right to left, it goes to the electrolytic capacitor module H of the active PFC circuit D in the second area, and then to the compressor IPM circuit E in the third area, completing the minimum current loop design; the biggest advantage of the minimum current path is that it has strong anti-interference ability and generates little electromagnetic noise; the lower part of the third area is the main control chip circuit C, which controls the fan drive control of the fan IPM circuit A upward and controls the compressor drive control of the compressor IPM circuit E to the right. The switching power supply circuit B is the power supply output, and the fan IPM circuit A at the top of the fourth area and the corresponding functional load in the load interface module G in the fifth area are upward, and the main control chip circuit C at the bottom of the fourth area and the compressor IPM circuit E at the bottom of the third area are downward.
[0052] In general, the layout of the entire main control board is mainly designed around the refrigerant heat dissipation method, which can achieve an increase in power density; on the other hand, the layout is designed around miniaturization, which is combined with the application of silicon carbide MOSFET and / or gallium nitride MOSFET. The carrier frequency controlled by software is increased, and the devices in the circuit of the active PFC circuit D in the second area can be reduced in size to complete Figure 3 and Figure 4 The layout of this minimum loop is shown.
[0053] In some embodiments, the PCB area is optimized and reduced by optimizing the device layout. Figure 3 and Figure 4 The dimension in the left-right direction is less than 220 mm, and the dimension in the up-down direction is less than 138.5 mm, that is, the length of the main control board is less than 220 mm, and the width is less than 138.5 mm.
[0054] In a second aspect, an embodiment of the utility model provides a controller, comprising a main control board as described in the embodiment of the first aspect above.
[0055] According to the controller provided by the embodiment of the utility model, the main control board carries the strong electric filter circuit F, the active PFC circuit D and the compressor IPM circuit E, the first area of the main control board is arranged with the strong electric filter circuit F, the second area is arranged with the active PFC circuit D and the third area is arranged with the compressor IPM circuit E, and the first area, the second area and the third area are arranged adjacent to each other in sequence, the strong electric filter circuit F connects to the AC input to filter the input voltage, the active PFC circuit D performs PFC rectification on the filtered voltage and outputs it to the DC bus, and the compressor IPM circuit E inverts the voltage of the DC bus to obtain the voltage that drives the compressor to operate Since the first area, the second area and the third area are arranged adjacent to each other, the distance of the current loop from the AC input to the compressor drive can be reduced. The shorter current loop is helpful to improve the anti-interference ability and generate less electromagnetic noise. In addition, the devices with high heat generation in the active PFC circuit D and the compressor IPM circuit E are concentrated in the same area, that is, the area where the bridge stack device, the power device and the IPM device are located is used as the heat dissipation area Z. A radiator or a refrigerant heat dissipation module can be arranged for the heat dissipation area Z, thereby improving the heat dissipation capacity of the main control board. Therefore, the device heat dissipation requirements and EMI requirements can be comprehensively considered in a compact layout.
[0056] In a third aspect, an embodiment of the utility model provides an outdoor unit, comprising a main control board as in the embodiment of the first aspect above or a controller as in the embodiment of the second aspect above.
[0057] According to the outdoor unit provided by the embodiment of the utility model, the main control board carries the strong electric filter circuit F, the active PFC circuit D and the compressor IPM circuit E, the first area of the main control board is arranged with the strong electric filter circuit F, the second area is arranged with the active PFC circuit D and the third area is arranged with the compressor IPM circuit E, and the first area, the second area and the third area are arranged adjacent to each other in sequence, the strong electric filter circuit F connects to the AC input to filter the input voltage, the active PFC circuit D performs PFC rectification processing on the filtered voltage and outputs it to the DC bus, and the compressor IPM circuit E inverts the voltage of the DC bus to obtain the voltage that drives the compressor to operate Since the first area, the second area and the third area are arranged adjacent to each other, the distance of the current loop from the AC input to the compressor drive can be reduced. The shorter current loop is helpful to improve the anti-interference ability and generate less electromagnetic noise. In addition, the devices with high heat generation in the active PFC circuit D and the compressor IPM circuit E are concentrated in the same area, that is, the area where the bridge stack device, the power device and the IPM device are located is used as the heat dissipation area Z. A radiator or a refrigerant heat dissipation module can be arranged for the heat dissipation area Z, thereby improving the heat dissipation capacity of the main control board. Therefore, the device heat dissipation requirements and EMI requirements can be comprehensively considered in a compact layout.
[0058] In a fourth aspect, an embodiment of the utility model provides an air conditioner, comprising a main control board as described in the first aspect embodiment above, or comprising a controller as described in the second aspect embodiment above, or comprising an outdoor unit as described in the third aspect embodiment above.
[0059] According to the air conditioner provided by the embodiment of the utility model, the main control board carries the strong electric filter circuit F, the active PFC circuit D and the compressor IPM circuit E, the first area of the main control board is arranged with the strong electric filter circuit F, the second area is arranged with the active PFC circuit D and the third area is arranged with the compressor IPM circuit E, and the first area, the second area and the third area are arranged adjacent to each other in sequence, the strong electric filter circuit F connects to the AC input to filter the input voltage, the active PFC circuit D performs PFC rectification processing on the filtered voltage and outputs it to the DC bus, and the compressor IPM circuit E inverts the voltage of the DC bus to obtain the voltage that drives the compressor to operate Since the first area, the second area and the third area are arranged adjacent to each other, the distance of the current loop from the AC input to the compressor drive can be reduced. The shorter current loop is helpful to improve the anti-interference ability and generate less electromagnetic noise. In addition, the devices with high heat generation in the active PFC circuit D and the compressor IPM circuit E are concentrated in the same area, that is, the area where the bridge stack device, the power device and the IPM device are located is used as the heat dissipation area Z. A radiator or a refrigerant heat dissipation module can be arranged for the heat dissipation area Z, thereby improving the heat dissipation capacity of the main control board. Therefore, the device heat dissipation requirements and EMI requirements can be comprehensively considered in a compact layout.
[0060] It will be appreciated by those skilled in the art that all or some of the steps and systems in the disclosed methods above may be implemented as software, firmware, hardware and appropriate combinations thereof. Some physical components or all physical components may be implemented as software executed by a processor, such as a central processing unit, a digital signal processor or a microprocessor, or implemented as hardware, or implemented as an integrated circuit, such as an application specific integrated circuit. Such software may be distributed on a computer-readable medium, which may include a computer storage medium or a non-transitory medium and a communication medium or a temporary medium. As known to those skilled in the art, the term computer storage medium includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information such as computer-readable instructions, data structures, program modules or other data. Computer storage media include, but are not limited to, RAM, ROM, EEPROM, flash memory or other memory technologies, CD-ROM, digital versatile disk DVD or other optical disk storage, magnetic cassettes, magnetic tapes, disk storage or other magnetic storage devices, or any other medium that may be used to store desired information and may be accessed by a computer. Furthermore, it is well known to those skilled in the art that communication media typically embodies computer readable instructions, data structures, program modules, or other data in a modulated data signal such as a carrier wave or other transport mechanism, and may include any information delivery media.
[0061] The device embodiments described above are merely illustrative, and the units described as separate components may or may not be physically separated, that is, they may be located in one place or distributed on multiple network nodes. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
[0062] The above is a specific description of the preferred implementation of the present application, but the present application is not limited to the above-mentioned implementation mode. Technical personnel familiar with the field can also make various equivalent deformations or substitutions without violating the spirit of the present application. These equivalent deformations or substitutions are all included in the scope defined by the claims of the present application.
Claims
1. The main control panel of the air conditioning system is characterized by: The air conditioning system includes a strong electric filter circuit, an active PFC circuit and a compressor IPM circuit which are electrically connected in sequence, and the main control board includes: A first area, wherein the strong electric filter circuit is arranged in the first area; a second region, wherein the active PFC circuit is arranged in the second region; a third area, wherein the compressor IPM circuit is arranged in the third area; Among them, the first area, the second area and the third area are arranged adjacent to each other from right to left in sequence; the active PFC circuit includes an electrolytic capacitor module, a bridge stack device and a power device, the compressor IPM circuit includes an IPM device, the electrolytic capacitor is located in the middle area of the main control board, the bridge stack device and the power device are located in the lower area of the main control board and are adjacent to the first area upward, the IPM device is located in the lower area of the main control board and is adjacent to the second area to the right, and the areas where the bridge stack device, the power device and the IPM device are located together constitute a heat dissipation area.
2. The main control board according to claim 1, characterized in that: The air conditioning system also includes a switching power supply circuit, a fan IPM circuit and a main control chip circuit. The main control board also includes a fourth area, which is located on the left side of the third area. The switching power supply circuit, the fan IPM circuit and the main control chip circuit are arranged in the fourth area.
3. The main control board according to claim 2, characterized in that: The switching power supply circuit is arranged in the middle of the fourth area, the fan IPM circuit is arranged in the upper part of the fourth area, and the main control chip circuit is arranged in the lower part of the fourth area and adjacent to the compressor IPM circuit.
4. The main control board according to claim 3, characterized in that: The switch power supply circuit supplies power to the fan IPM circuit and the main control chip circuit respectively.
5. The main control board according to claim 3, characterized in that: The main control chip circuit provides control signals to the fan IPM circuit and the compressor IPM circuit respectively.
6. The main control board according to claim 1, characterized in that: The power device includes a silicon carbide MOSFET and / or a gallium nitride MOSFET.
7. The main control board according to claim 1, characterized in that: The air conditioning system further includes a load interface module, and the main control board further includes a fifth area located at an edge of the main control board, the fifth area is downwardly adjacent to the second area and the third area, and the load interface module is arranged in the fifth area.
8. The main control board according to claim 1, characterized in that: The electrolytic capacitor module includes two electrolytic capacitors connected to the output end of the active PFC circuit, and the two electrolytic capacitors are arranged side by side and are downwardly adjacent to the third area.
9. The main control board according to claim 1, characterized in that: The strong electric filter circuit includes an AC input terminal, and the first area includes a phase line terminal, which is connected to the AC input terminal and arranged on the right edge of the main control board.
10. The main control board according to claim 1, characterized in that: The size of the main control board in the left-right direction is less than 220 mm, and the size in the up-down direction is less than 138.5 mm.
11. A controller, characterized in that: A main control board comprising any one of claims 1 to 10.
12. An outdoor unit, characterized in that: It comprises the main control board according to any one of claims 1 to 10 or the controller according to claim 11.
13. An air conditioner, characterized in that: It comprises the main control board according to any one of claims 1 to 10, or comprises the controller according to claim 11, or comprises the outdoor unit according to claim 12.