Chip packaging structure, application structure thereof and electronic equipment

Abstract

The utility model discloses a chip packaging structure, an application structure thereof and an electronic device, the chip packaging structure comprises a first substrate, an optical sensing chip, a processing chip, a light guide collimation structure and a shading packaging layer, the processing chip is fixed on the first substrate and is electrically connected with the first substrate; the optical sensing chip is fixed on the processing chip and is electrically connected with the processing chip, or the optical sensing chip is fixed on the first substrate and is electrically connected with the first substrate, and the light guide collimation structure is fixed on the optical sensing chip and is positioned above a light sensing area of the optical sensing chip; the shading packaging layer is fixed on the first substrate and packages the side part of the light guide collimation structure, the optical sensing chip and the processing chip, and the light guide collimation structure is used for collimating light rays and guiding the light rays to a light sensing area of the optical sensing chip. The electronic equipment comprises the chip packaging structure. The problem of side light leakage and the problem of optical signal interference caused by light reflection in the transparent package are solved, and large-angle light is limited from entering.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging, and more specifically, to a chip packaging structure and an application structure thereof and an electronic device. Background Art

[0002] As electronic products become thinner and lighter, the space left for optical sensors in the era of full screens and narrow bezels is getting smaller and smaller, giving rise to the demand for under-screen ambient light sensors and proximity sensor system integration products. System integration also brings corresponding problems. For some special application scenarios, it is necessary to limit the incident angle of light and not allow large-angle light to enter. The current integrated system cannot meet this demand. Most of the optical sensing products on the market are fully transparent or packaged with transparent glass. Light can be reflected between the interfaces in the transparent package, which will affect the optical signal acquisition of the sensor. For example, the ambient light sensor receives the reflected infrared light signal, causing the real light signal to be distorted, and the transparent package cannot limit the entry of large-angle light. Utility Model Content

[0003] In view of the deficiencies in the prior art, the utility model innovatively provides a chip packaging structure and its application structure and electronic device, which uses a light-shielding packaging layer to encapsulate the side of the light-guiding collimating structure, the optical sensor chip and the processing chip, thereby achieving side light blocking, solving the problem of side light leakage, and eliminating the problem of optical signal interference introduced by light reflection inside the transparent package, effectively reducing interference and improving the signal-to-noise ratio; the light-guiding collimating structure limits the incident angle of light, achieves collimated light entry, limits the entry of light at large angles, reduces interference from other stray light, and improves the accuracy of optical signal recognition.

[0004] In order to achieve the above technical objectives, the first aspect of the utility model discloses a chip packaging structure, including a first substrate, an optical sensor chip, a processing chip, a light guiding collimation structure and a light shielding packaging layer.

[0005] The processing chip is fixed on the first substrate and electrically connected to the first substrate, the optical sensor chip is fixed on the processing chip and electrically connected to the processing chip, or the optical sensor chip is fixed on the first substrate and electrically connected to the first substrate,

[0006] The light guiding collimating structure is fixed on the optical sensor chip and is located above the light sensing area of ​​the optical sensor chip.

[0007] The light-shielding packaging layer is fixed on the first substrate and encapsulates the side of the light-guiding collimating structure, the optical sensor chip and the processing chip. The light-guiding collimating structure is used to collimate the light and guide it to the photosensitive area of ​​the optical sensor chip.

[0008] Furthermore, the light guiding and collimating structure includes one or more optical fibers and a light absorbing film wrapped around the sides of the optical fibers, and the gaps between adjacent optical fibers are filled with the light absorbing film.

[0009] Furthermore, the light guiding collimating structure is bonded and fixed to the optical sensor chip by light-transmitting glue.

[0010] Furthermore, a light-transmitting conductive layer is provided above the light-shielding packaging layer and the light-guiding collimating structure, and the light-transmitting conductive layer is electrically connected to the processing chip or the first substrate.

[0011] Furthermore, the light-transmitting conductive layer includes at least one of indium tin oxide, indium zinc oxide, transparent conductive ink, nanosilver, or a metal grid.

[0012] Furthermore, the light-transmitting conductive layer is electrically connected to the processing chip or the first substrate via a conductive member penetrating the light-shielding packaging layer.

[0013] Furthermore, the conductive member includes at least one of a welding wire, a metal column, or a conductive through hole.

[0014] Furthermore, the light-shielding packaging layer is a black epoxy resin molding material layer.

[0015] Furthermore, the optical sensor chip includes at least one of an ambient light sensor, a proximity sensor, a color temperature sensor, an image sensor, or a light intensity sensing chip.

[0016] Furthermore, the processing chip includes at least one of an analog front-end chip, a control chip, or a signal processing chip.

[0017] To achieve the above-mentioned technical objectives, the second aspect of the utility model discloses an application structure including the chip packaging structure described in the first aspect, wherein the chip packaging structure is arranged on a circuit board, and the circuit board is arranged on a second substrate. A first optical structure and a second optical structure are stacked above the chip packaging structure, and the stacked first optical structure and the second optical structure are supported by a bracket and arranged above the chip packaging structure.

[0018] Furthermore, the first optical structure is a Fresnel lens.

[0019] Furthermore, the second optical structure is a diffuser or ink.

[0020] Furthermore, the circuit board is a flexible circuit board, and the second substrate is a PCB board.

[0021] In order to achieve the above technical objectives, the second aspect of the present utility model discloses an electronic device, including the chip packaging structure described in the first aspect or the application structure described in the second aspect.

[0022] The beneficial effects of the utility model are:

[0023] The chip packaging structure of the utility model adopts a light-shielding packaging layer to encapsulate the side of the light-guiding collimating structure, the optical sensor chip and the processing chip, thereby realizing side light blocking, solving the problem of side light leakage, and eliminating the problem of optical signal interference introduced by light reflection inside the transparent package, effectively reducing interference and improving the signal-to-noise ratio; the light-guiding collimating structure limits the incident angle of light, realizes collimated entry of light, limits the entry of light at large angles, reduces interference from other stray light, and improves the accuracy of optical signal recognition. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a longitudinal cross-sectional view of the chip packaging structure of the first embodiment of the utility model.

[0025] Figure 2 It is a longitudinal cross-sectional view of a chip packaging structure according to a second embodiment of the present invention.

[0026] Figure 3 It is a top view of the light guiding collimating structure of an embodiment of the utility model.

[0027] Figure 4 It is a side view of the light guiding collimating structure of an embodiment of the utility model.

[0028] Figure 5 It is a longitudinal cross-sectional view of a chip packaging structure according to a third embodiment of the present invention.

[0029] Figure 6 It is a longitudinal cross-sectional view of a chip packaging structure according to a fourth embodiment of the present invention.

[0030] Figure 7 It is a longitudinal cross-sectional view of the application structure of the chip packaging structure of the embodiment of the utility model.

[0031] Figure 8 It is a longitudinal cross-sectional view of an application structure of a chip packaging structure according to another embodiment of the utility model.

[0032] In the figure,

[0033] 1. First substrate; 2. Optical sensor chip; 3. Processing chip; 4. Light-guiding collimating structure; 41. Optical fiber; 42. Light-absorbing film; 5. Light-shielding packaging layer; 6. Light-transmitting conductive layer; 7. Conductive member; 8. Silver paste or DAF film; 9. Welding wire; 10. Light-transmitting glue; 11. Circuit board; 12. Second substrate; 13. First optical structure; 14. Second optical structure; 15. Bracket; 16. Double-sided tape. DETAILED DESCRIPTION

[0034] The chip packaging structure and its application structure and electronic device provided by the utility model are explained and illustrated in detail below in conjunction with the drawings in the specification.

[0035] This embodiment specifically discloses a chip packaging structure, such as Figure 1 and 2 As shown, it includes a first substrate 1, an optical sensor chip 2, a processing chip 3, a light-guiding collimating structure 4 and a light-shielding packaging layer 5. The processing chip 3 is fixed on the first substrate 1 and electrically connected to the first substrate 1. Specifically, the processing chip 3 is fixed on the upper surface of the first substrate 1. The processing chip 3 is bonded and fixed to the first substrate 1 through silver paste or DAF film 8 (Die Attach Film). The processing chip 3 is electrically connected to the first substrate 1 through welding wires 9. A circuit is provided in the first substrate 1, which serves as a carrier of the package and can be interconnected with external signals. The processing chip 3 includes at least one of an analog front-end chip, a control chip, or a signal processing chip. The type of the processing chip 3 is set according to needs. As shown in FIG. Figure 1 As shown, the optical sensor chip 2 is fixed on the processing chip 3 and electrically connected to the processing chip 3. Specifically, the optical sensor chip 2 is fixed on the upper surface of the processing chip 3, the optical sensor chip 2 is bonded and fixed to the processing chip 3 through silver paste or DAF film 8, and the optical sensor chip 2 is electrically connected to the processing chip 3 through welding wires 9; in another embodiment, as Figure 2 As shown, the optical sensor chip 2 is fixed on the first substrate 1 and electrically connected to the first substrate 1. Specifically, the optical sensor chip 2 is fixed on the upper surface of the first substrate 1, and the optical sensor chip 2 is bonded and fixed to the first substrate 1 through silver paste or DAF film 8. The optical sensor chip 2 is electrically connected to the first substrate 1 through welding wires 9, and the optical sensor chip 2 and the processing chip 3 are electrically connected through the circuit inside the first substrate 1. The optical sensor chip 2 can receive external light signals and convert the received light signals into electrical signals; the processing chip 3 can process the electrical signals transmitted by the optical sensor chip 2 and transmit the processing results to the outside. The optical sensor chip 2 is a device for transmitting light signals with the outside world. The optical sensor chip 2 includes at least one of an ambient light sensor, a proximity sensor, a color temperature sensor, an image sensor, or a light intensity sensor chip. The type of the optical sensor chip 2 is set according to needs.

[0036] The light-guiding collimating structure 4 is fixed on the optical sensor chip 2 and is located above the photosensitive area (AtiveArea, AA area, effective display area) of the optical sensor chip 2. The orthographic projection of the light-guiding collimating structure 4 covers the photosensitive area of ​​the optical sensor chip 2. The light-guiding collimating structure 4 is used to limit the incident angle of the light and play a role in light collimation. The light-guiding collimating structure 4 collimates the light and guides it to the photosensitive area of ​​the optical sensor chip 2, limiting the entry of large-angle light, reducing the interference of other stray light, and improving the accuracy of optical signal recognition.

[0037] The light-shielding packaging layer 5 is fixed on the first substrate 1 and encapsulates the side of the light-guiding collimating structure 4, the optical sensor chip 2 and the processing chip 3. The light-shielding packaging layer 5 does not cover the top of the light-guiding collimating structure 4. The light-guiding collimating structure 4 is used to collimate the light and guide it to the photosensitive area of ​​the optical sensor chip 2 to limit the incident angle of the light. Preferably, the upper surface of the light-guiding collimating structure 4 is flush with the upper surface of the light-shielding packaging layer 5. Preferably, the light-shielding packaging layer 5 is a black epoxy molding compound (EMC) layer. The black epoxy molding compound layer is made of a transparent EMC filled with a black material, which improves the thermal expansion coefficient relative to the transparent EMC, thereby improving the warping and stress problems of the chip packaging structure and reducing the reliability risk caused by stress. The light-shielding packaging layer 5 wraps the processing chip 3, the sides and non-AA areas of the optical sensor chip 2, and the sides of the light-guiding collimating structure 4, leaving only the top of the light-guiding collimating structure 4 exposed, thereby solving the problem of light leakage from the side and eliminating the problem of light reflection inside the transparent package and thereby introducing light signal interference, thereby improving the signal-to-noise ratio and the accuracy of optical signal recognition, thereby improving the reliability of light-sensing products and meeting more complex application environments.

[0038] When the light shielding packaging layer 5 plastic-seales the processing chip 3, the optical sensor chip 2 and the light guiding collimating structure 4, the light guiding collimating structure 4 can be exposed by a grinding process; or the light guiding collimating structure 4 can be directly exposed by an open mold process.

[0039] Alternatively, if Figure 3 and 4 As shown, the light guiding collimation structure 4 includes one or more optical fibers 41 and a light absorbing film 42 wrapped on the side of the optical fibers 41. The gaps between adjacent optical fibers 41 are filled with the light absorbing film 42. The specific material of the light absorbing film 42 is set according to the wavelength of the light to be absorbed, and this application does not make any specific restrictions. The optical fibers 41 and the optical fibers 41 can be arranged closely, and there can also be a spacing between adjacent optical fibers 41, such as Figure 4 As shown, the spacing is also filled with light absorbing film 42. The light guiding collimating structure 4 is used to limit the incident angle of light, realize collimated light entry, and reduce the interference of other stray light; in a large-angle light environment, almost no large-angle light is incident. When the light guiding collimating structure 4 includes multiple optical fibers 41, the collimation effect is better.

[0040] Optionally, the light guiding collimating structure 4 is bonded and fixed to the optical sensor chip 2 by a light-transmitting glue 10. The light-transmitting glue 10 is preferably a DAF glue with high transmittance.

[0041] In some embodiments, Figure 5 and 6As shown, a light-transmitting conductive layer 6 is disposed above the light-shielding packaging layer 5 and the light-guiding collimating structure 4, and the light-transmitting conductive layer 6 is connected to the processing chip 3 (such as Figure 5 As shown) or the first substrate 1 (as Figure 6 As shown) to achieve grounding, thereby realizing the electromagnetic shielding function.

[0042] Optionally, the light-transmitting conductive layer 6 includes at least one of indium tin oxide, indium zinc oxide, transparent conductive ink (the main component of which is conductive polymer PEDOT (polyethylene dioxythiophene)), nanosilver, or a metal grid. The light-transmitting conductive layer 6 is disposed on the upper surface of the light-shielding encapsulation layer 5 and the light-guiding collimating structure 4 by processes such as plating, printing, or spraying, and is interconnected with the processing chip 3 or the first substrate 1 to be grounded, thereby realizing an electromagnetic shielding function.

[0043] Optionally, the light-transmitting conductive layer 6 is connected to the processing chip 3 (such as Figure 5 As shown) or the first substrate 1 (as Figure 6 The light-shielding encapsulation layer 5 exposes the top of the conductive member 7 through a grinding process or an open mold process, the top of the conductive member 7 is electrically connected to the light-transmitting conductive layer 6, and the bottom of the conductive member 7 is electrically connected to the processing chip 3 or the first substrate 1 to achieve grounding and realize the electrical shielding function.

[0044] The conductive member 7 includes at least one of a welding wire, a metal column, or a conductive through hole. The conductive through hole can be formed by first opening a through hole on the light shielding packaging layer 5 and then filling the through hole with a conductive material.

[0045] The present application realizes the electromagnetic shielding function of the chip packaging structure by providing the light-transmitting conductive layer 6, further reduces the electrical noise interference, and improves the accuracy of optical signal recognition.

[0046] The present application also discloses an application structure including the chip packaging structure described in the above embodiment, such as Figure 7 and 8 As shown, the chip packaging structure is arranged on a circuit board 11. In this embodiment, the circuit board 11 is a flexible circuit board. The circuit board 11 is arranged on a second substrate 12. The second substrate 12 is a PCB board. A first optical structure 13 and a second optical structure 14 are stacked above the chip packaging structure. One of the first optical structure 13 and the second optical structure 14 is arranged on the other. Figure 7 As shown, the first optical structure 13 is arranged above the second optical structure 14; Figure 8 As shown, the second optical structure 14 is arranged above the first optical structure 13 , and the present application does not specifically limit the stacking order of the first optical structure 13 and the second optical structure 14 .

[0047] Specifically, the stacked first optical structure 13 and the second optical structure 14 are supported by a bracket 15 and arranged above the chip packaging structure. The stacked first optical structure 13 and the second optical structure 14 maintain a certain distance from the chip packaging structure and do not contact the chip packaging structure. The bottom of the bracket 15 is fixedly connected to the circuit board 11, and the top of the bracket 15 is fixedly connected to the stacked first optical structure 13 and the second optical structure 14. Optionally, the first optical structure 13 and the second optical structure 14 are bonded by a double-sided tape 16, and the stacked first optical structure 13 and the second optical structure 14 are bonded to the bracket 15 by the double-sided tape 16. Figure 7 As shown, the first optical structure 13 is arranged above the second optical structure 14, and the second optical structure 14 located below is bonded to the bracket 15 by a double-sided adhesive 16; Figure 8 As shown, the second optical structure 14 is disposed above the first optical structure 13 , and the first optical structure 13 located below is bonded to the bracket 15 via a double-sided adhesive 16 .

[0048] Optionally, the first optical structure 13 is a Fresnel lens, and the second optical structure 14 is a diffuser. The Fresnel lens is used to change the path of light, and the diffuser is used to shape the light beam to form a light beam with a characteristic shape and a specific angle.

[0049] Optionally, the first optical structure 13 is a Fresnel lens, and the second optical structure 14 is ink. The Fresnel lens is used to change the path of light, and the ink is used for filtering. When the second optical structure 14 is ink, the ink is disposed on the glass substrate and then bonded to the first optical structure 13 by a double-sided adhesive tape 16. If the second optical structure 14 is disposed below the first optical structure 13 (e.g. Figure 7 As shown), the second optical structure 14 is also bonded to the bracket 15 via a double-sided adhesive 16.

[0050] In another optional embodiment, only a second optical structure 14 is provided above the chip packaging structure. Optionally, the second optical structure 14 is a diffusion sheet or ink provided on a glass substrate. By simplifying the optical structure, the difficulty of the packaging process can be reduced.

[0051] The present application also discloses an electronic device, including the chip packaging structure or the application structure of the chip packaging structure described in the above embodiment. The electronic device can be a laptop, a mobile phone, a tablet computer, a desktop computer, a gaming device, a vehicle-mounted electronic device, a wearable smart device, etc. When the chip packaging structure of the present application is applied under the screen, it is implemented by the application structure described in the above embodiment. By setting the light-shielding packaging layer 5, the surrounding of the chip packaging structure is already black, and there is no need to fill foam, so that the foam can be reduced or eliminated during the processing of the electronic device, reducing the module size and reducing the cost.

[0052] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0053] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0054] In the description of this specification, the description with reference to the terms "this embodiment", "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in a suitable manner in any at least one embodiment or example. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0055] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0056] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modification, equivalent replacement and simple improvement made to the essential content of the present invention shall be included in the protection scope of the present invention.

Claims

1. A chip packaging structure, characterized in that: It comprises a first substrate (1), an optical sensor chip (2), a processing chip (3), a light-guiding collimating structure (4) and a light-shielding packaging layer (5), The processing chip (3) is fixed on the first substrate (1) and electrically connected to the first substrate (1), the optical sensor chip (2) is fixed on the processing chip (3) and electrically connected to the processing chip (3), or the optical sensor chip (2) is fixed on the first substrate (1) and electrically connected to the first substrate (1), The light guiding collimating structure (4) is fixed on the optical sensor chip (2) and is located above the light sensing area of ​​the optical sensor chip (2). The light-shielding encapsulation layer (5) is fixed on the first substrate (1) and encapsulates the side of the light-guiding collimating structure (4), the optical sensor chip (2) and the processing chip (3); the light-guiding collimating structure (4) is used to collimate light and guide it to the photosensitive area of ​​the optical sensor chip (2).

2. The chip packaging structure according to claim 1, characterized in that: The light guiding collimating structure (4) comprises one or more optical fibers (41) and a light absorbing film (42) wrapped around the side of the optical fiber (41), and the gaps between adjacent optical fibers (41) are filled with the light absorbing film (42).

3. The chip packaging structure according to claim 1 or 2, characterized in that: The light guiding collimating structure (4) is bonded and fixed to the optical sensor chip (2) via a light-transmitting adhesive (10).

4. The chip packaging structure according to claim 1, characterized in that: A light-transmitting conductive layer (6) is provided above the light-shielding encapsulation layer (5) and the light-guiding collimating structure (4), and the light-transmitting conductive layer (6) is electrically connected to the processing chip (3) or the first substrate (1).

5. The chip packaging structure according to claim 4, characterized in that: The light-transmitting conductive layer (6) comprises at least one of indium tin oxide, indium zinc oxide, transparent conductive ink, nanosilver, or a metal grid.

6. The chip packaging structure according to claim 4 or 5, characterized in that: The light-transmitting conductive layer (6) is electrically connected to the processing chip (3) or the first substrate (1) via a conductive member (7) that penetrates the light-shielding packaging layer (5).

7. The chip packaging structure according to claim 6, characterized in that: The conductive member (7) comprises at least one of a welding wire, a metal column, or a conductive through hole.

8. The chip packaging structure according to claim 1, characterized in that: The light-shielding packaging layer (5) is a black epoxy resin molding compound layer.

9. The chip packaging structure according to claim 1, characterized in that: The optical sensor chip (2) comprises at least one of an ambient light sensor, a proximity sensor, a color temperature sensor, an image sensor, or a light intensity sensing chip.

10. The chip packaging structure according to claim 1, characterized in that: The processing chip (3) comprises at least one of an analog front-end chip, a control chip, or a signal processing chip.

11. An application structure comprising the chip packaging structure according to any one of claims 1 to 10, characterized in that: The chip packaging structure is arranged on a circuit board (11), and the circuit board (11) is arranged on a second substrate (12). A first optical structure (13) and a second optical structure (14) are stacked above the chip packaging structure. The stacked first optical structure (13) and the second optical structure (14) are supported and arranged above the chip packaging structure via a bracket (15).

12. The application structure according to claim 11, characterized in that: The first optical structure (13) is a Fresnel lens.

13. The application structure according to claim 11 or 12, characterized in that: The second optical structure (14) is a diffuser or ink.

14. The application structure according to claim 11, characterized in that: The circuit board (11) is a flexible circuit board, and the second substrate (12) is a PCB board.

15. An electronic device, characterized in that: It comprises the chip packaging structure described in any one of claims 1 to 10 or the application structure described in any one of claims 11 to 14.

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