Numerical control cylindrical grinding machine for processing semiconductor brittle material

Abstract

The utility model relates to the technical field of machine tool machining, in particular to a numerical control cylindrical grinding machine for semiconductor brittle material machining, which comprises a machine tool body, the machine tool body is provided with a workpiece spindle mechanism and a cross-shaped sliding table, the cross-shaped sliding table is provided with a grinding wheel spindle mechanism, and the cross-shaped sliding table is used for enabling the grinding wheel spindle mechanism to slide along an X axis and a Z axis. The lathe bed is a horizontal inclined lathe bed, and the connecting face of the lathe bed and the cross-shaped sliding table is an inclined face. The cross-shaped sliding table comprises an X-axis sliding assembly and a Z-axis sliding assembly, the Z-axis sliding assembly comprises three Z-axis linear guide rails which are parallel to one another in the transverse direction and connected with the lathe bed, and the X-axis sliding assembly is connected with the Z-axis linear guide rails in a sliding mode; movable parts of the grinding machine adopt double-layer protection. And the stability of the grinding machine is enhanced, the service life is prolonged, and the grinding machine can be well suitable for large-scale machining of fragile materials such as quartz, ceramics and silicon carbide.

Description

Technical Field

[0001] The utility model relates to the technical field of machine tool processing, in particular to a numerically controlled cylindrical grinder for processing semiconductor brittle materials. Background Art

[0002] A grinder is a machine tool that uses abrasive tools to grind the surface of a workpiece. Among them, the external cylindrical grinder is the most widely used type. The external cylindrical grinder consists of a bed, a grinding wheel and its drive parts, a workpiece and its limit parts, and other components. It can realize the processing of various cylindrical and conical external surfaces and shoulder end faces.

[0003] Conventional cylindrical grinders have some limitations on the materials they can process. General CNC cylindrical grinders are mainly used for metal processing. Due to the differences in fixtures and grinding wheels, general grinders cannot process brittle non-metallic materials such as quartz, ceramics, and silicon carbide in batches. At present, the domestic semiconductor industry mainly relies on lathe self-modification or machining centers to process quartz ceramic rods, tubes, and discs. Machining centers are not suitable for large-scale production and processing needs due to high equipment costs, small grinding wheels, and long processing cycles. Relatively speaking, modifying general lathes is more in line with processing needs, but this processing method still has certain disadvantages.

[0004] The grinders converted from general lathes by adding grinding heads have the following problems: the X-axis sliding assembly of the existing grinder is perpendicular to the horizontal plane, and is supported only by the bottom surface of the X-axis guide rail and the connection between the bed, which is prone to shaking during operation and lacks stability. At the same time, dust and water vapor are relatively serious during the force grinding process, and the modified machine tool lacks protection, resulting in a short service life of the machine tool. In addition, the existing lathes are only equipped with 1 or 2 guide rails to support the X-axis sliding assembly. In order to ensure the stability of the X-axis sliding, the X-axis stroke needs to be limited, resulting in a small scope of application. The cost of replacing the overall machine tool with a larger specification is high, and it is difficult to meet the processing needs of brittle materials. The machining center is also not suitable for large-scale production and processing needs due to high equipment costs, small grinding wheels, and long processing cycles. Utility Model Content

[0005] In view of the above-mentioned shortcomings and deficiencies of the prior art, the utility model provides a CNC cylindrical grinder for processing semiconductor brittle materials, which enhances the stability of the grinder, prolongs its service life, and can be better applied to the processing of large quantities of brittle materials such as quartz, ceramics and silicon carbide.

[0006] In order to achieve the above-mentioned purpose, the main technical solutions adopted by the utility model include:

[0007] A numerically controlled cylindrical grinding machine for processing semiconductor brittle materials comprises a bed, the bed is provided with a workpiece spindle mechanism and a cross slide, the cross slide is provided with a grinding wheel spindle mechanism, and the cross slide is used to make the grinding wheel spindle mechanism slide along the X-axis and the Z-axis;

[0008] The bed is a horizontal inclined bed, and the connecting surface between the bed and the cross slide is an inclined surface;

[0009] The cross slide comprises an X-axis sliding assembly and a Z-axis sliding assembly, wherein the Z-axis sliding assembly comprises three Z-axis linear guide rails which are parallel to each other in the transverse direction and connected to the bed, and the X-axis sliding assembly is slidably connected to the Z-axis linear guide rails;

[0010] The movable parts of the grinding machine are protected by double layers.

[0011] By adopting a horizontal inclined bed, the bed rigidity is better, and the inclined surface disperses the force guiding the bed when the cross slide is working, providing more stable support for the cross slide and reducing the vibration generated during operation.

[0012] By adopting three Z-axis linear guides, the force of the X-axis sliding assembly is stabilized during sliding, breaking through the limitation of the existing Z-axis linear guide on the X-axis stroke, thereby extending the X-axis stroke and increasing the working range, ensuring that larger diameter workpieces can be processed when large-diameter grinding wheels are installed, allowing the equipment to adapt to the processing of workpieces of more specifications.

[0013] By adopting double-layer protection for the movable parts of the grinder, the dust-proof effect is improved, the processing area is isolated from the non-processing area, and the damage to the movable parts caused by a large amount of dust and water vapor during the processing is reduced, thus ensuring the service life of the grinder.

[0014] Furthermore, the angle formed by the inclined plane and the horizontal plane is 60°.

[0015] By adopting a 60° inclined surface, the force guiding the bed when the cross slide is working is more effectively dispersed, further improving the supporting effect of the cross slide.

[0016] Furthermore, the Z-axis sliding assembly also includes a saddle, the top, middle and bottom of the saddle are respectively slidably connected to the three Z-axis linear guide rails, and the X-axis sliding assembly is connected to the saddle. When the saddle slides along the Z-axis linear guide rail, it drives the X-axis sliding assembly to slide along the Z-axis.

[0017] By connecting the three Z-axis linear guides to the top, middle and bottom of the saddle respectively, the situation where the edge of the X-axis sliding assembly is suspended in the air or the center lacks support is avoided, making the force of the X-axis sliding assembly more stable when sliding, further extending the X-axis stroke and increasing the working range.

[0018] Furthermore, the X-axis sliding assembly includes an X-axis linear guide rail, a slide plate and a grinding wheel spindle mechanism. There are two X-axis linear guide rails, which are parallel to each other in the longitudinal direction and connected to the saddle. The slide plate is slidably connected to the two X-axis linear guide rails, and the grinding wheel spindle mechanism is connected to the slide plate.

[0019] Furthermore, the Z-axis sliding assembly includes a Z-axis ball screw nut pair, which is connected to the bed and parallel to the Z-axis linear guide rail, and the X-axis sliding assembly includes an X-axis ball screw nut pair, which is connected to the saddle and parallel to the X-axis linear guide rail.

[0020] By adopting the X-axis ball screw nut pair and the Z-axis ball screw nut pair, the transmission clearance is reduced. When a high-precision ball screw nut pair is adopted, the effect of eliminating the transmission clearance is better.

[0021] Furthermore, the grinding wheel spindle mechanism includes a grinding head fixing seat, an electric spindle grinding head and a grinding wheel. The grinding head fixing seat is connected to the cross slide. The electric spindle grinding head is arranged in the grinding head fixing seat. The rotating end of the electric spindle grinding head is installed with a grinding wheel.

[0022] The grinding wheel spindle adopts an electric spindle, which has good sealing, good torque characteristics, a large constant power speed regulation range and a longer service life; working in conjunction with the workpiece spindle mechanism, it can meet the grinding processing of workpieces of different specifications in a wider range.

[0023] Furthermore, the workpiece spindle mechanism includes a transmission belt, a reducer, a servo spindle motor, a spindle box and a workpiece fixing mechanism. The servo spindle motor is connected to the reducer, and the reducer is also connected to the spindle box through a transmission belt. The end of the spindle box away from the transmission belt is connected to the workpiece fixing mechanism.

[0024] By using the servo spindle motor directly connected to the reducer, and then using the transmission belt for two-stage speed reduction, a large reduction ratio is achieved, ensuring a large output torque.

[0025] Furthermore, the movable parts of the grinding machine include a Z-axis linear guide, a Z-axis ball screw nut pair, an X-axis linear guide and an X-axis ball screw nut pair, and the double-layer protection is a dust cover provided on the outside of the movable parts, and a dust baffle is provided on the outside of the dust cover.

[0026] Furthermore, the workpiece fixing mechanism comprises a three-jaw self-centering chuck, one end of which is connected to the spindle box, and the other end is used to clamp the workpiece. The three-jaw self-centering chuck is used to clamp the workpiece stably.

[0027] The beneficial effects of the utility model are:

[0028] The utility model discloses a numerically controlled cylindrical grinder for processing semiconductor brittle materials, which adopts a horizontal inclined bed. The bed has better rigidity, and the inclined surface disperses the force of guiding the bed when the cross slide is working, thereby providing more stable support for the cross slide and reducing vibration generated during operation.

[0029] Three Z-axis linear guides are used to stabilize the force of the X-axis sliding assembly when it slides, breaking through the limitation of the existing Z-axis linear guide on the X-axis stroke, thereby extending the X-axis stroke and increasing the working range, ensuring that larger diameter workpieces can be processed when large-diameter grinding wheels are installed, allowing the equipment to adapt to the processing of workpieces of more specifications.

[0030] The movable parts of the grinder adopt double-layer protection, which improves the dust-proof effect, isolates the processing area from the non-processing area, reduces the damage to the movable parts caused by a large amount of dust and water vapor during the processing, and ensures the service life of the grinder.

[0031] Based on the above effects, the grinder can be well applied to the processing of large quantities of brittle materials such as quartz, ceramics and silicon carbide. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 This is a schematic diagram of the internal structure of a CNC cylindrical grinder for processing semiconductor brittle materials;

[0033] Figure 2 A schematic diagram of the internal structure of a CNC cylindrical grinder for processing semiconductor brittle materials from another perspective;

[0034] Figure 3 This is a front view of the external structure of a CNC cylindrical grinder for processing semiconductor brittle materials;

[0035] Figure 4 The figure is a side view of the external structure of a CNC cylindrical grinder used for processing semiconductor brittle materials.

[0036] In the figure: 1. bed; 2. transmission belt; 3. speed reducer; 4. servo spindle motor; 5. spindle box; 6. three-jaw self-centering chuck; 7. Z-axis linear guide; 8. Z-axis ball screw nut pair; 9. saddle; 10. slide plate; 11. grinding head fixing seat; 12. electric spindle grinding head; 13. grinding wheel; 14. X-axis servo motor; 15. servo motor seat; 16. X-axis linear guide; 17. X-axis ball screw nut pair; 18. Z-axis servo motor. DETAILED DESCRIPTION

[0037] In order to better explain the utility model and facilitate understanding, the utility model is described in detail below in conjunction with the accompanying drawings through specific implementation methods. In order to better understand the above technical solution, exemplary embodiments of the utility model will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the utility model are shown in the accompanying drawings, it should be understood that the utility model can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a clearer and thorough understanding of the utility model, and to be able to fully convey the scope of the utility model to those skilled in the art.

[0038] like Figure 1-Figure 4 As shown, a CNC cylindrical grinding machine for processing semiconductor brittle materials comprises a bed 1, wherein the bed 1 is provided with a workpiece spindle mechanism and a cross slide, wherein the cross slide is provided with a grinding wheel spindle mechanism, and wherein the cross slide is used to make the grinding wheel spindle mechanism slide along the X-axis and the Z-axis;

[0039] The bed 1 is a horizontal inclined bed 1, and the connection surface between the bed 1 and the cross slide is an inclined surface;

[0040] The cross slide comprises an X-axis sliding assembly and a Z-axis sliding assembly, wherein the Z-axis sliding assembly comprises three Z-axis linear guide rails 7 which are parallel to each other in the transverse direction and connected to the bed 1, and the X-axis sliding assembly is slidably connected to the Z-axis linear guide rails 7;

[0041] The movable parts of the grinding machine are protected by double layers.

[0042] By adopting a horizontal inclined bed 1, the bed 1 has better rigidity, and the inclined surface disperses the force guiding the bed 1 when the cross slide is working, providing more stable support for the cross slide and reducing vibration generated during operation.

[0043] By adopting three Z-axis linear guides 7, the force of the X-axis sliding assembly is stabilized during sliding, breaking through the limitation of the existing Z-axis linear guide 7 on the X-axis stroke, thereby extending the X-axis stroke and increasing the working range, ensuring that larger diameter workpieces can be processed when a large-diameter grinding wheel 13 is installed, allowing the equipment to adapt to the processing of workpieces of more specifications.

[0044] By adopting double-layer protection for the movable parts of the grinder, the dust-proof effect is improved, the processing area is isolated from the non-processing area, and the damage to the movable parts caused by a large amount of dust and water vapor during the processing is reduced, thus ensuring the service life of the grinder.

[0045] Specifically, the angle formed by the inclined plane and the horizontal plane is 60°.

[0046] By adopting a 60° inclined surface, the force guiding the bed 1 when the cross slide is working is more effectively dispersed, and the supporting effect of the cross slide is further improved.

[0047] Specifically, the Z-axis sliding assembly also includes a saddle 9, the top, middle and bottom of which are respectively slidably connected to the three Z-axis linear guide rails 7, and the X-axis sliding assembly is connected to the saddle 9. When the saddle 9 slides along the Z-axis linear guide rail 7, it drives the X-axis sliding assembly to slide along the Z-axis.

[0048] By connecting the three Z-axis linear guide rails 7 to the top, middle and bottom of the slide saddle 9 respectively, the situation where the edge of the X-axis sliding component is suspended in the air or the center lacks support is avoided, so that the force of the X-axis sliding component during sliding is more stable, further extending the X-axis stroke and increasing the working range.

[0049] Specifically, the X-axis sliding assembly includes an X-axis linear guide rail 16, a slide plate 10 and a grinding wheel spindle mechanism. There are two X-axis linear guide rails 16, and the two X-axis linear guide rails 16 are parallel to each other in the longitudinal direction and connected to the slide saddle 9. The slide plate 10 is slidably connected to the two X-axis linear guide rails 16, and the grinding wheel spindle mechanism is connected to the slide plate 10.

[0050] Specifically, the Z-axis sliding assembly includes a Z-axis ball screw nut pair 8, which is connected to the bed 1 and parallel to the Z-axis linear guide 7. The X-axis sliding assembly includes an X-axis ball screw nut pair 17, which is connected to the saddle 9 and parallel to the X-axis linear guide 16.

[0051] By adopting the X-axis ball screw nut pair 17 and the Z-axis ball screw nut pair 8, the transmission clearance is reduced. When a high-precision ball screw nut pair is adopted, the effect of eliminating the transmission clearance is better.

[0052] Specifically, the grinding wheel spindle mechanism includes a grinding head fixing seat 11, an electric spindle grinding head 12 and a grinding wheel 13. The grinding head fixing seat 11 is connected to the cross slide. The electric spindle grinding head 12 is arranged in the grinding head fixing seat 11. The rotating end of the electric spindle grinding head 12 is installed with a grinding wheel 13.

[0053] The grinding wheel 13 spindle adopts an electric spindle, which has good sealing, good torque characteristics, a large constant power speed regulation range, and a longer service life; working in conjunction with the workpiece spindle mechanism can meet the grinding processing of workpieces of different specifications in a wider range.

[0054] Specifically, the workpiece spindle mechanism includes a transmission belt 2, a reducer 3, a servo spindle motor 4, a spindle box 5 and a workpiece fixing mechanism. The servo spindle motor 4 is connected to the reducer 3, and the reducer 3 is also connected to the spindle box 5 through the transmission belt 2. The end of the spindle box 5 away from the transmission belt 2 is connected to the workpiece fixing mechanism.

[0055] By adopting the servo spindle motor 4 directly connected to the reducer 3, and then achieving a two-stage speed reduction through the transmission belt 2, a large reduction ratio is achieved, ensuring a large output torque.

[0056] Specifically, the movable parts of the grinding machine include Z-axis linear guide 7, Z-axis ball screw nut pair 8, X-axis linear guide 16 and X-axis ball screw nut pair 17. The double-layer protection is a dust cover provided on the outside of the movable parts, and a dust baffle is provided on the outside of the dust cover.

[0057] The double-layer protection can also be used to protect the movable parts of the grinder such as the motor. The double-layer form is not limited to the combination of the dust cover and the dust baffle, and can be a superposition of any protection form that can be thought of by technicians in this field. The purpose is to provide secondary protection for the movable parts of the grinder. Compared with the traditional unprotected and simple single-layer shielding form, better dustproof performance is achieved.

[0058] Specifically, the workpiece fixing mechanism includes a three-jaw self-centering chuck 6, one end of which is connected to the spindle box 5, and the other end is used to clamp the workpiece. The three-jaw self-centering chuck 6 is used to clamp the workpiece stably.

[0059] The workpiece is stably clamped by using a three-jaw self-centering chuck 6. The three-jaw self-centering chuck 6 is a prior art, and its specific structure is not described in detail here. Those skilled in the art can also add an eccentric correction structure to the workpiece fixing mechanism to further expand the applicability of the grinding machine.

[0060] Specifically, the X-axis sliding assembly further includes an X-axis servo motor 14, and the Z-axis sliding assembly further includes a Z-axis servo motor 18. The X-axis servo motor 14 is used to drive the slide plate 10 to move along the X-axis, and the Z-axis servo motor 18 is used to drive the slide 9 to move along the Z-axis. A servo motor seat 15 is provided outside the X-axis servo motor 14. By adopting the servo motor drive, the feeding accuracy is accurate and reliable, and stepless speed change is achieved.

[0061] Since the main structural parts used in the grinding machine are all castings, they also have the characteristics of small deformation, high rigidity and good stability.

[0062] During operation, the three-jaw self-centering chuck 6 on the workpiece spindle mechanism clamps the workpiece and rotates slowly outward, and the electric spindle grinding head 12 drives the grinding wheel 13 to rotate inward at high speed. The two spindles rotate in opposite directions to ensure that the linear speed of the grinding wheel 13 reaches the optimal state during grinding. The grinding process is controlled by the CNC system, and the X and Z axes are linked to complete the grinding of the outer circle, inner hole, end face, chamfer, etc. of the workpiece. The specific design of the CNC system can be obtained by a technician in this field by simply adjusting the conventional system combined with the grinder structure, and will not be repeated here.

[0063] Based on the structure of the grinder, it can be further equipped with a water break detection device, a belt break detection device, a cooling system, a lubrication system and an electrical system to achieve a high degree of automation of the machine tool processing operation.

[0064] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are illustrative and cannot be understood as limitations of the present invention. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A CNC cylindrical grinding machine for processing semiconductor brittle materials, comprising a bed (1), the bed (1) being provided with a workpiece spindle mechanism and a cross slide, the cross slide being provided with a grinding wheel spindle mechanism, the cross slide being used to make the grinding wheel spindle mechanism slide along an X-axis and a Z-axis, characterized in that: The bed (1) is a horizontal inclined bed (1), and the connecting surface between the bed (1) and the cross slide is an inclined surface; The cross slide comprises an X-axis sliding assembly and a Z-axis sliding assembly, wherein the Z-axis sliding assembly comprises three Z-axis linear guide rails (7) which are parallel to each other in the transverse direction and connected to the bed (1), and the X-axis sliding assembly is slidably connected to the Z-axis linear guide rails (7); The movable parts of the grinding machine are protected by double layers.

2. A CNC cylindrical grinding machine for processing semiconductor brittle materials as claimed in claim 1, characterized in that: The angle formed by the inclined plane and the horizontal plane is 60°.

3. A CNC cylindrical grinding machine for processing semiconductor brittle materials as claimed in claim 1, characterized in that: The Z-axis sliding assembly further comprises a sliding saddle (9), the top, middle and bottom of which are respectively connected in a sliding manner to three Z-axis linear guide rails (7), and the X-axis sliding assembly is connected to the sliding saddle (9). When the sliding saddle (9) slides along the Z-axis linear guide rail (7), it drives the X-axis sliding assembly to slide along the Z-axis.

4. A CNC cylindrical grinding machine for processing semiconductor brittle materials as claimed in claim 3, characterized in that: The X-axis sliding assembly comprises an X-axis linear guide rail (16), a slide plate (10) and a grinding wheel spindle mechanism, wherein the X-axis linear guide rails (16) are two in number, the two X-axis linear guide rails (16) are parallel to each other in the longitudinal direction and are connected to the slide saddle (9), the slide plate (10) is slidably connected to the two X-axis linear guide rails (16), and the grinding wheel spindle mechanism is connected to the slide plate (10).

5. A CNC cylindrical grinding machine for processing semiconductor brittle materials as claimed in claim 4, characterized in that: The Z-axis sliding assembly comprises a Z-axis ball screw nut pair (8), the Z-axis ball screw nut pair (8) is connected to the bed (1) and is parallel to the Z-axis linear guide rail (7), and the X-axis sliding assembly comprises an X-axis ball screw nut pair (17), the X-axis ball screw nut pair (17) is connected to the slide saddle (9) and is parallel to the X-axis linear guide rail (16).

6. A CNC cylindrical grinding machine for processing semiconductor brittle materials as claimed in claim 1, characterized in that: The grinding wheel spindle mechanism comprises a grinding head fixing seat (11), an electric spindle grinding head (12) and a grinding wheel (13); the grinding head fixing seat (11) is connected to a cross slide; the electric spindle grinding head (12) is arranged in the grinding head fixing seat (11); and the grinding wheel (13) is installed at the rotating end of the electric spindle grinding head (12).

7. A CNC cylindrical grinding machine for processing semiconductor brittle materials as claimed in claim 1, characterized in that: The workpiece spindle mechanism comprises a transmission belt (2), a reducer (3), a servo spindle motor (4), a spindle box (5) and a workpiece fixing mechanism, wherein the servo spindle motor (4) is connected to the reducer (3), the reducer (3) is further connected to the spindle box (5) via the transmission belt (2), and an end of the spindle box (5) away from the transmission belt (2) is connected to the workpiece fixing mechanism.

8. A CNC cylindrical grinding machine for processing semiconductor brittle materials as claimed in claim 5, characterized in that: The movable parts of the grinding machine include a Z-axis linear guide rail (7), a Z-axis ball screw nut pair (8), an X-axis linear guide rail (16) and an X-axis ball screw nut pair (17), and the double-layer protection is a dust cover provided outside the movable parts, and a dust baffle is provided outside the dust cover.

9. A CNC cylindrical grinding machine for processing semiconductor brittle materials as claimed in claim 7, characterized in that: The workpiece fixing mechanism comprises a three-jaw self-centering chuck (6), one end of the three-jaw self-centering chuck (6) is connected to the spindle box (5), and the other end is used for clamping the workpiece.

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