Clamping device for wafer cutting machine

Abstract

The utility model relates to a clamping device for a wafer cutting machine, and relates to the technical field of wafer processing, the clamping device comprises a circular truncated cone-shaped fixed seat, the fixed seat is detachably connected with a mounting disc, and the mounting disc is provided with an adhesive film for bonding a wafer. And the wafer is bonded and fixed through the adhesive film on the mounting disc, so that the problem of damage or breakage caused by direct pressing of the wafer by a traditional pressing plate is avoided, and the wafer cutting precision and the yield effect are improved.

Description

Technical Field

[0001] The present application relates to the technical field of wafer cutting machines, and in particular to a clamping device for wafer cutting machines. Background Art

[0002] Wafer refers to the silicon chip used in the manufacture of semiconductor integrated circuits. Because its shape is usually round, it is called a wafer. Before the wafer leaves the factory, it needs to be cut to facilitate the installation and use of the wafer. Wafer cutting is a very precise processing operation, so it is particularly important to fix the wafer before cutting. In existing technology, wafer cutting machines are usually used to cut wafers, and the clamping device in the cutting machine is related to the cutting accuracy of the wafer.

[0003] The Chinese utility model patent with publication number CN204045560U discloses an automatic wafer cutting clamping device, including a device body, a control component is provided in the device body, a rotating clamping structure for clamping a wafer is provided on the device body, and the rotating clamping structure includes a plurality of fixed blocks, a rotating cylinder is provided on the fixed block, and also includes a rotating pressure plate provided on the rotating axis of the rotating cylinder. When clamping the wafer, the rotating cylinder is started to press the pressure plate against the wafer, thereby fixing the wafer.

[0004] With respect to the above-mentioned related technologies, the inventors believe that the following defects exist: the pressure plate will press tightly on the wafer and directly contact the wafer, so that the wafer is subjected to greater pressure, which may easily damage the wafer or cause the wafer to break. Utility Model Content

[0005] In order to reduce the possibility of damage to the wafer, the present application provides a clamping device for a wafer cutting machine.

[0006] The present application provides a clamping device for a wafer cutting machine using the following technical solution:

[0007] A clamping device for a wafer cutting machine comprises a truncated cone-shaped fixing seat, a mounting plate detachably connected to the fixing seat, a sticky film for bonding the wafer being provided on the mounting plate, a connecting plate being provided on the circumferential side wall of the fixing seat, a plurality of clamping grooves being provided on the connecting plate, a spring groove being provided on the side wall of the clamping groove, a first spring being connected in the spring groove, a clamping rod being connected at one end of the first spring away from the spring groove, an electromagnet being provided on the wall of the clamping groove opposite to the first spring, the clamping rod being an iron rod, a plug-in rod being provided on the mounting plate corresponding to the plurality of clamping grooves one by one, a limiting hole for inserting the plug-in rod, and when the electromagnet is energized, one end of the clamping rod is inserted into the limiting hole.

[0008] By adopting the above technical solution, when using, the operator first connects the adhesive film to the mounting plate, then sticks the wafer to the adhesive film, and then connects the mounting plate to the fixing seat. The wafer uses the adhesive film and the mounting plate as carriers and is fixed on the fixing seat, and then cuts and processes. The wafer has high stability, is not easy to loosen, and is not squeezed by external forces, is not easy to break, saves costs, and reduces the possibility of damage to the wafer. When connecting, insert the plug rod into the clamping groove, and then energize the electromagnet. The electromagnet absorbs the clamping rod, so that the first spring is deformed, and one end of the clamping rod is inserted into the limit hole, so as to achieve a stable connection between the mounting plate and the fixing seat. When the mounting plate needs to be removed from the fixing seat, the electromagnet is powered off, and the clamping rod moves out of the limit hole under the action of the elastic deformation force restored by the first spring, so as to facilitate the plug-in and removal.

[0009] Optionally, the adhesive film is connected to the mounting plate via Velcro.

[0010] By adopting the above technical solution, it is convenient to replace the damaged adhesive film.

[0011] Optionally, an adsorption cavity is provided on the fixing seat, a plurality of adsorption holes connected with the adsorption cavity are provided on the top surface of the fixing seat, and the adsorption cavity is connected with an air suction pump through an air suction pipe.

[0012] By adopting the above technical solution, when in use, the vacuum pump is started, and the vacuum pump extracts the air in the adsorption chamber, so that negative pressure is formed in the adsorption chamber, so that multiple adsorption holes adsorb the sticky film and maintain the stability of the sticky film on the mounting plate.

[0013] Optionally, a branch pipe is provided on the adsorption chamber, a flat-mouthed pipe is provided at one end of the branch pipe, the flat-mouthed pipe is connected to the branch pipe through a bellows, and a control valve is provided on the branch pipe.

[0014] By adopting the above technical solution, when in use, open the control valve and suck the debris generated by cutting on the fixed seat into the adsorption chamber through the branch pipe, which plays a cleaning role. The setting of the flat mouth tube is more conducive to adsorption, thereby reducing the possibility of residual debris making the adhesive film placed on the fixed seat uneven.

[0015] Optionally, a discharge hole communicating with the adsorption chamber is formed at the bottom of the fixing seat, and a sealing plate is threadedly connected to the discharge hole.

[0016] By adopting the above technical solution, when it is necessary to remove the debris accumulated in the adsorption chamber, the sealing plate is opened to take out the debris, which is easy to operate.

[0017] Optionally, the connecting plate is arranged in an annular shape, the inner ring wall of the connecting plate is rotatably connected to the fixing seat via a rotating bearing, and a limiting member is provided between the connecting plate and the fixing seat.

[0018] By adopting the above technical solution, the limiting part limits the connecting plate, reducing the possibility of the connecting plate rotating during the cutting process. When the position of the mounting plate needs to be adjusted, the limiting part is unlocked and the connecting plate is rotated. The connecting plate drives the mounting plate to rotate, which is easy to operate.

[0019] Optionally, the limiting member includes a limiting plate, one end of the limiting plate is connected to the fixed seat, and the other end is suspended in the air, the suspended end is threadedly connected to the resistance rod, the bottom surface of the connecting plate is provided with an annular groove, the side walls opposite to the annular groove are provided with rubber pads, the end of the resistance rod is provided with a magnetic block, the connecting plate is made of iron, the rubber pads arranged opposite to each other clamp the resistance rod, and the magnetic block absorbs the connecting plate.

[0020] By adopting the above technical solution, when in use, the operator rotates the resistance rod, the resistance rod is inserted into the annular groove, the two rubber pads are deformed and clamp the resistance rod, the magnetic block at the end of the resistance rod resists the bottom of the annular groove, and the magnetic block adsorbs the connecting plate, thereby further improving the stability of the connection.

[0021] In summary, the present application includes at least one of the following beneficial technical effects:

[0022] 1. The present application sets a fixing seat, a mounting plate and an adhesive film, firstly sticks the adhesive film on the mounting plate, then connects the wafer to the adhesive film, and then connects the mounting plate to the fixing seat. The wafer uses the adhesive film and the mounting plate as carriers and is fixed on the fixing seat, and then cuts and processes. The wafer is highly stable and not easy to loosen, and is not squeezed by external forces, so it is not easy to break, which saves costs and reduces the possibility of damage to the wafer.

[0023] 2. The present application sets a connecting plate, a first spring, an electromagnet and a clamping rod, inserts the plug-in rod into the clamping groove, and then energizes the electromagnet. The electromagnet adsorbs the clamping rod, causing the first spring to deform, and one end of the clamping rod is inserted into the limiting hole, thereby achieving a stable connection between the mounting plate and the fixing seat. When the mounting plate needs to be removed from the fixing seat, the electromagnet is powered off, and the clamping rod moves out of the limiting hole under the action of the first spring to restore the elastic deformation force, thereby facilitating the removal of the plug-in. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the overall structure of the clamping device of this application.

[0025] Figure 2 It is a cross-sectional view of the adsorption chamber structure in the embodiment of the present application.

[0026] Figure 3 Yes Figure 2 Enlarged view of part A.

[0027] Explanation of the reference numerals in the accompanying drawings: 1. fixing seat; 11. mounting plate; 111. plug-in rod; 112. limiting hole; 12. adhesive film; 13. connecting plate; 131. snap-in groove; 132. spring groove; 133. first spring; 134. snap-in rod; 135. electromagnet; 136. annular groove; 2. adsorption chamber; 21. adsorption hole; 22. vacuum pump; 23. discharge hole; 24. sealing plate; 3. branch pipe; 31. flat-mouth pipe; 32. bellows; 33. control valve; 4. limiting plate; 41. resistance rod; 42. rubber pad; 43. magnetic block. DETAILED DESCRIPTION

[0028] The following is combined with Figure 1-3 This application is described in further detail.

[0029] Example 1

[0030] The present application embodiment discloses a clamping device for a wafer cutting machine, such as Figure 1 As shown, it includes a truncated cone-shaped fixing seat 1, to which a mounting plate 11 is detachably connected, and a sticky film 12 for bonding wafers is provided on the bottom wall of the mounting plate 11. The sticky film 12 is sticky on one side, and the sticky side is arranged away from the fixing seat 1.

[0031] When in use, the operator first connects the adhesive film 12 to the mounting plate 11, then sticks the wafer on the adhesive film 12, and then connects the mounting plate 11 to the fixing seat 1. Since the fixing seat 1 is in a truncated cone shape, when the adhesive film 12 abuts against the upper surface of the fixing seat 1, the adhesive film 12 is deformed, the tension is increased, and the possibility of wrinkles on the adhesive film 12 is reduced, so that the wafer is indirectly abutted against the flat upper surface of the fixing seat 1. The wafer uses the adhesive film 12 and the mounting plate 11 as carriers and is fixed on the fixing seat 1, and then cuts. The wafer has high stability, is not easy to loosen, and is not squeezed by external forces, so it is not easy to break, saving costs, and thus reducing the possibility of damage to the wafer.

[0032] Reference Figure 1 , Figure 2 and Figure 3A connecting plate 13 is provided on the circumferential side wall of the fixing seat 1. The connecting plate 13 is arranged in an annular shape. A plurality of clamping grooves 131 are provided on the connecting plate 13. A spring groove 132 is provided on the side wall of the clamping groove 131. A first spring 133 is connected in the spring groove 132. A clamping rod 134 is connected to one end of the first spring 133 away from the spring groove 132. An electromagnet 135 opposite to the first spring 133 is provided on the side wall of the clamping groove 131. The clamping rod 134 is an iron rod. A plug-in rod 111 corresponding to the plurality of clamping grooves 131 is provided on the mounting plate 11. A limiting hole 112 for inserting the plug-in rod 134 is provided on the plug-in rod 111. When the electromagnet 135 is energized, one end of the clamping rod 134 is inserted into the limiting hole 112.

[0033] When connecting, the plug rod 111 is inserted into the clamping groove 131, and then the electromagnet 135 is energized, and the electromagnet 135 absorbs the clamping rod 134, so that the first spring 133 is deformed, and one end of the clamping rod 134 is inserted into the limiting hole 112, so as to achieve a stable connection between the mounting plate 11 and the fixing seat 1. When the mounting plate 11 needs to be removed from the fixing seat 1, the electromagnet 135 is powered off, and the clamping rod 134 moves out of the limiting hole 112 under the action of the elastic deformation force restored by the first spring 133, so as to facilitate the removal of the plug.

[0034] In order to facilitate the replacement of the damaged adhesive film 12, the adhesive film 12 is connected to the installation disk 11 through Velcro (not shown in the figure).

[0035] In order to maintain the stability of the adhesive film 12 on the mounting plate 11, an adsorption chamber 2 is provided on the fixing seat 1, and a plurality of adsorption holes 21 connected to the adsorption chamber 2 are provided on the top surface of the fixing seat 1. The adsorption chamber 2 is connected to an air pump 22 through an air suction pipe. When in use, the air pump 22 is started, and the air pump 22 extracts the air in the adsorption chamber 2, so that a negative pressure is formed in the adsorption chamber 2, and the plurality of adsorption holes 21 can stably adsorb the adhesive film 12.

[0036] Example 2

[0037] The difference between the embodiment of the present application and embodiment 1 is that, Figure 1 and Figure 2 The adsorption chamber 2 is provided with a branch pipe 3 , one end of which is provided with a flat-mouthed pipe 31 , which is connected to the branch pipe 3 through a bellows 32 , and a control valve 33 is provided on the branch pipe 3 .

[0038] When in use, the control valve 33 is opened, and the debris generated by cutting on the fixing seat 1 can be sucked into the adsorption chamber 2 through the branch pipe 3 to play a cleaning role. The setting of the flat nozzle pipe 31 is more conducive to adsorption, thereby reducing the possibility that the residual debris causes the adhesive film 12 placed on the fixing seat 1 to be uneven.

[0039] In order to facilitate the removal of the debris accumulated in the adsorption chamber 2, a discharge hole 23 communicating with the adsorption chamber 2 is provided at the bottom of the fixed seat 1, and a sealing plate 24 is threadedly connected to the discharge hole 23. When the debris accumulated in the adsorption chamber 2 needs to be removed, the sealing plate 24 is opened to remove the debris, which is very convenient to operate.

[0040] Example 3

[0041] The difference between the embodiment of the present application and embodiment 2 is that, referring to Figure 1 , Figure 2 and Figure 3 The inner ring wall of the connecting plate 13 is rotatably connected to the fixing seat 1 through a rotating bearing (not shown in the figure), and a limiting member is provided between the connecting plate 13 and the fixing seat 1.

[0042] The limiting member can limit the connection plate 13, thereby reducing the possibility of the connection plate 13 rotating during the cutting process. When the position of the mounting plate 11 needs to be adjusted, the limiting member can be unlocked, and the connection plate 13 can be rotated, and the connection plate 13 can drive the mounting plate 11 to rotate, which is very convenient to operate.

[0043] Specifically, refer to Figure 1 , Figure 2 and Figure 3 The limiting member includes two limiting plates 4, one end of which is connected to the fixing seat 1, and the other end is suspended, and one end of the suspended end is threadedly connected to the contact rod 41, and the bottom surface of the connecting plate 13 is provided with an annular groove 136, and the side wall opposite to the annular groove 136 is provided with a rubber pad 42, and the end of the contact rod 41 is provided with a magnetic block 43, and the material of the connecting plate 13 is iron. When the rubber pads 42 arranged oppositely clamp the contact rod 41, and the magnetic block 43 sucks the connecting plate 13, the stability of the connection can be further improved.

[0044] When in use, the operator rotates the abutment rod 41 to insert the abutment rod 41 into the annular groove 136. At this time, the two rubber pads 42 will deform and clamp the abutment rod 41, and at the same time, the magnetic block 43 at the end of the abutment rod 41 will abut the bottom of the annular groove 136 and attract the connecting plate 13 due to magnetic force, thereby achieving stable positioning of the connecting plate 13.

[0045] In summary, the clamping device for a wafer cutting machine provided in the embodiment of the present application can stably fix the wafer and reduce the possibility of damage to the wafer during the cutting process by providing a detachable mounting plate 11 and an adhesive film 12. At the same time, by providing structures such as a connecting plate 13, a clamping groove 131, and a clamping rod 134, convenient disassembly and assembly between the mounting plate 11 and the fixing seat 1 is achieved. In addition, the designs of the adsorption chamber 2, the branch pipe 3, and the limiter further enhance the convenience and stability of the use of the clamping device.

[0046] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A clamping device for a wafer cutting machine, comprising a truncated cone-shaped fixing seat (1), characterized in that: The fixing seat (1) is detachably connected to a mounting plate (11), the mounting plate (11) is provided with an adhesive film (12) for bonding a wafer, a connecting plate (13) is provided on a circumferential side wall of the fixing seat (1), a plurality of snap-in grooves (131) are provided on the connecting plate (13), a spring groove (132) is provided on the side wall of the snap-in groove (131), a first spring (133) is connected in the spring groove (132), and a snap-in spring (133) is connected at one end of the first spring (133) away from the spring groove (132). A connecting rod (134), an electromagnet (135) opposite to the first spring (133) is provided on the wall of the clamping groove (131), the clamping rod (134) is an iron rod, and a plug-in rod (111) corresponding to a plurality of clamping grooves (131) is provided on the mounting plate (11), and a limiting hole (112) for inserting the clamping rod (134) is provided on the plug-in rod (111), and when the electromagnet (135) is energized, one end of the clamping rod (134) is inserted into the limiting hole (112).

2. The clamping device for a wafer cutting machine according to claim 1, characterized in that: The adhesive film (12) is connected to the mounting plate (11) via Velcro.

3. The clamping device for a wafer cutting machine according to claim 1, characterized in that: The fixing seat (1) is provided with an adsorption chamber (2), the top surface of the fixing seat (1) is provided with a plurality of adsorption holes (21) connected to the adsorption chamber (2), and the adsorption chamber (2) is connected to an air suction pump (22) via an air suction pipe.

4. The clamping device for a wafer cutting machine according to claim 3, characterized in that: The adsorption chamber (2) is provided with a branch pipe (3), one end of the branch pipe (3) is provided with a flat mouth pipe (31), the flat mouth pipe (31) is connected with the branch pipe (3) through a bellows (32), and the branch pipe (3) is provided with a control valve (33).

5. The clamping device for a wafer cutting machine according to claim 3, characterized in that: The bottom of the fixing seat (1) is provided with a discharge hole (23) communicating with the adsorption chamber (2), and the discharge hole (23) is threadedly connected with a sealing plate (24).

6. The clamping device for a wafer cutting machine according to claim 1, characterized in that: The connecting plate (13) is arranged in an annular shape, the inner annular wall of the connecting plate (13) is rotatably connected to the fixing seat (1) via a rotating bearing, and a limiting member is provided between the connecting plate (13) and the fixing seat (1).

7. The clamping device for a wafer cutting machine according to claim 6, characterized in that: The limiting member comprises a limiting plate (4), one end of the limiting plate (4) is connected to the fixing seat (1), and the other end is suspended, the suspended end is threadedly connected to the abutment rod (41), an annular groove (136) is provided on the bottom surface of the connecting plate (13), a rubber pad (42) is provided on the side wall opposite to the annular groove (136), a magnetic block (43) is provided on the end of the abutment rod (41), the connecting plate (13) is made of iron, the rubber pad (42) arranged opposite to each other clamps the abutment rod (41), and the magnetic block (43) sucks the connecting plate (13) tightly.

Images