Single-chip microcomputer anti-cracking device and monitor

Abstract

The utility model discloses a single-chip microcomputer anti-cracking device and a monitor, and relates to the technical field of data storage security. The single-chip microcomputer anti-cracking device comprises an anti-cracking module and a boost-buck module of a single-chip microcomputer. The anti-cracking module comprises an anti-cracking switch element, an anti-cracking photoelectric element and a switch tube, the anti-cracking switch element is connected with the anti-cracking photoelectric element, the anti-cracking photoelectric element is used for being connected with the switch tube, and the anti-cracking switch element and the anti-cracking photoelectric element are arranged on a circuit board where the single chip microcomputer is located; the buck-boost module is connected to the anti-cracking module, and the buck-boost module outputs the power supply voltage of the single-chip microcomputer corresponding to the voltage of the switching tube according to the voltage of the switching tube, so that the single-chip microcomputer is burnt down when the single-chip microcomputer is cracked.

Description

Technical Field

[0001] The utility model relates to the technical field of data storage security, and in particular to a single-chip computer anti-cracking device and a monitor. Background Art

[0002] With the continuous development of science and technology, the application scope of single-chip microcomputers is becoming more and more extensive, and it plays an important role in medical instruments, smart homes, the Internet of Things and other fields. However, the security of single-chip microcomputer programs is increasingly threatened, and preventing single-chip microcomputer programs from being cracked has become a necessary means. Once the single-chip microcomputer program is cracked, it may lead to serious consequences such as equipment loss of control and data leakage. Therefore, it is of great practical significance to physically prevent single-chip microcomputer programs from being cracked.

[0003] In the existing technology, some people use smart card chips with hardware self-destruction function to effectively deal with physical attacks, and some people use two different models of single-chip computers to back up each other and verify each other, thereby increasing the cost of cracking, and even polish off the chip model and other information or reprint other models to make the fake look real. However, this technology is not only costly, but in theory, attackers can use sufficient investment and time to break through the above methods. Utility Model Content

[0004] The main technical problem solved by the utility model is to provide a simpler single-chip computer anti-cracking device which can prevent the single-chip computer program from being cracked.

[0005] According to the first aspect, an embodiment provides a single-chip computer anti-cracking device, including an anti-cracking module and a buck-boost module of the single-chip computer;

[0006] The anti-cracking module includes an anti-cracking switch element, an anti-cracking photoelectric element and a switch tube, the anti-cracking switch element is connected to the anti-cracking photoelectric element, the anti-cracking photoelectric element is used to connect the switch tube, and the anti-cracking switch element and the anti-cracking photoelectric element are arranged on the circuit board where the single-chip microcomputer is located;

[0007] The buck-boost module is connected to the anti-cracking module, and the buck-boost module outputs a power supply voltage of the microcontroller corresponding to the voltage of the switch tube according to the voltage of the switch tube, so that the microcontroller is burned when the microcontroller is cracked.

[0008] In one embodiment, the anti-cracking module further includes a resistor R4, a resistor R5 and a resistor R6;

[0009] The first end of the anti-cracking switch element is connected to the buck-boost module, the second end of the anti-cracking switch element is connected to the first end of the anti-cracking photoelectric element, the second end of the anti-cracking photoelectric element is connected to the first end of the resistor R5, the second end of the anti-cracking photoelectric element is also connected to the first end of the resistor R6, the second end of the resistor R5 is connected to the control end of the switch tube, the first end of the switch tube is connected to the buck-boost module, the second end of the switch tube is connected to the first end of the resistor R4, and the second end of the resistor R4 is connected to the second end of the resistor R6.

[0010] In one embodiment, the buck-boost module includes a zener diode D1, a zener diode D2, a capacitor C1, a capacitor C2, a resistor R1, a resistor R2, a resistor R3, an inductor L1 and a buck-boost chip;

[0011] The input end of the voltage-stabilizing diode D2 is used to connect an external power supply, the output end of the voltage-stabilizing diode D2 is connected to the first end of the inductor L1, the first end of the inductor L1 is connected to the voltage input pin of the buck-boost chip, the shutdown control pin of the buck-boost chip is connected to the first end of the resistor R1, the second end of the resistor R1 is connected to the first end of the capacitor C1, and the second end of the capacitor C1 is grounded; the second end of the inductor L1 is connected to the input end of the voltage-stabilizing diode D1, the second end of the inductor L1 is also connected to the conversion pin of the buck-boost chip, the output end of the diode D1 is connected to the first end of the capacitor C2, the second end of the capacitor C2 is connected to the ground pin of the buck-boost chip, and the second end of the capacitor C2 is also grounded; the output end of the diode D1 is also connected to the first end of the resistor R2, the second end of the resistor R2 is connected to the feedback pin of the buck-boost chip, the second end of the resistor R2 is also connected to the first end of the resistor R3, the second end of the resistor R3 is grounded, and the feedback pin of the buck-boost chip is also connected to the first end of the switch tube.

[0012] In one embodiment, the single chip anti-cracking device further includes a rechargeable battery, the positive electrode of the rechargeable battery is connected to the first end of the inductor L1, and the negative electrode of the rechargeable battery is connected to the second end of the capacitor C1, for powering the buck-boost module.

[0013] In one embodiment, the anti-cracking switch element is arranged on the back side of the circuit where the single-chip microcomputer is located, and the anti-cracking photoelectric element is arranged on the front side of the circuit where the single-chip microcomputer is located.

[0014] In one embodiment, the anti-cracking switch element is a normally closed reed switch.

[0015] In one embodiment, the normally closed reed switch is a plastic-sealed reed switch after secondary sealing.

[0016] In one embodiment, the anti-cracking photoelectric element is an ambient light sensor.

[0017] In one embodiment, the ambient light sensor is a patch type light sensor.

[0018] According to the second aspect, an embodiment provides a monitor, comprising:

[0019] Single chip microcomputer, used to carry the control program of the monitor;

[0020] The single chip computer anti-cracking device adopts the single chip computer anti-cracking device in any one of the above embodiments.

[0021] According to the single-chip anti-cracking device and monitor of the above-mentioned embodiment, an anti-cracking module and a buck-boost module of the single-chip are provided in the single-chip anti-cracking device, and an anti-cracking switch element, an anti-cracking photoelectric element and a switch tube are provided in the anti-cracking module. When the single-chip is abnormally cracked, the anti-cracking photoelectric element is actuated, so that the voltage at the switch tube connected to the buck-boost module is reduced. At this time, the buck-boost module will increase the vacuum ratio and increase the voltage output by the buck-boost module. This voltage is the power supply voltage of the single-chip. The power supply voltage increases instantly, thereby burning the single-chip. This application adds low-cost electronic components to the power supply circuit of the single-chip, which can effectively prevent the program from being cracked, stolen and copied when the single-chip is disassembled, thereby protecting one's own rights and interests from being infringed. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A schematic diagram of the structure of a single chip computer anti-cracking device according to an embodiment;

[0023] Figure 2 A circuit diagram of a single chip computer anti-cracking device according to an embodiment;

[0024] Figure 3 A schematic diagram of the structure of a monitor according to another embodiment;

[0025] Figure 4 The figure is a schematic diagram of the arrangement of an anti-crack switch element and an anti-crack photoelectric element according to an embodiment. DETAILED DESCRIPTION

[0026] The present invention is further described in detail below by specific embodiments in conjunction with the accompanying drawings. Wherein similar elements in different embodiments adopt associated similar element numbers. In the following embodiments, many detailed descriptions are intended to enable the present application to be better understood. However, those skilled in the art can easily recognize that some of the features can be omitted in different situations, or can be replaced by other elements, materials, and methods. In some cases, some operations related to the present application are not shown or described in the specification, in order to avoid the core part of the present application being overwhelmed by too much description, and for those skilled in the art, it is not necessary to describe these related operations in detail, and they can fully understand the related operations based on the description in the specification and the general technical knowledge in the art.

[0027] In addition, the features, operations or characteristics described in the specification can be combined in any appropriate manner to form various implementations. At the same time, the steps or actions in the method description can also be interchanged or adjusted in a manner that is obvious to those skilled in the art. Therefore, the various sequences in the specification and the drawings are only for the purpose of clearly describing a certain embodiment and are not meant to be a required sequence, unless otherwise specified that a certain sequence must be followed.

[0028] The serial numbers of the components in this document, such as "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. The "connection" and "coupling" mentioned in this application, unless otherwise specified, include direct and indirect connections (couplings).

[0029] The present application provides a single-chip computer anti-cracking device for preventing a program from being cracked. The device has a simple structure and low cost, and can effectively prevent others from obtaining the single-chip computer program by disassembly and reverse deduction. The specific description is as follows.

[0030] Please refer to Figure 1 In one embodiment, a single-chip computer anti-cracking device 110 is provided. The device 110 includes an anti-cracking module 111, a buck-boost module 112 of the single-chip computer, and a rechargeable battery 113.

[0031] Please refer to Figure 2 In one embodiment, the anti-cracking module 111 includes an anti-cracking switch element J1, an anti-cracking photoelectric element Q2, a switch tube Q1, a resistor R4, a resistor R5 and a resistor R6.

[0032] In one embodiment, the first end of the anti-cracking switch element J1 is connected to the buck-boost module 112, the second end of the anti-cracking switch element J1 is connected to the first end of the anti-cracking photoelectric element Q2, the second end of the anti-cracking photoelectric element Q2 is connected to the first end of the resistor R5, the second end of the anti-cracking photoelectric element Q2 is also connected to the first end of the resistor R6, the second end of the resistor R5 is connected to the control end of the switch tube Q1, the first end of the switch tube Q1 is connected to the buck-boost module, the second end of the switch tube Q1 is connected to the first end of the resistor R4, and the second end of the resistor R4 is connected to the second end of the resistor R6.

[0033] In one embodiment, the anti-cracking switch element J1 and the anti-cracking photoelectric element Q2 are arranged on the circuit board where the microcontroller is located. In this application, the anti-cracking switch element J1 is arranged close to the back of the circuit where the microcontroller is located, and the anti-cracking photoelectric element Q2 is arranged close to the front of the circuit where the microcontroller is located, so as to prevent the cracking device from being triggered by disassembly under abnormal circumstances.

[0034] It should be noted that the anti-cracking switch element J1 and the anti-cracking photoelectric element Q2 are not limited to being placed on the back and front of the circuit where the microcontroller is located as specified in the present application, but can also be set at other locations as long as they are in a position that can be frequently touched by humans when the microcontroller is disassembled abnormally.

[0035] In one embodiment, the anti-cracking switch element J1 adopts a normally closed reed switch. The normally closed reed switch adopts a plastic-sealed reed switch after secondary sealing. Compared with a bare tube, the plastic-sealed reed switch after secondary sealing is not easy to break and has a certain degree of drop resistance. Through magnetic field control, the connection and disconnection speed of the plastic-sealed reed switch after secondary sealing is faster. In addition, the plastic-sealed reed switch after secondary sealing is small in size and low in cost, and has low requirements for structural design.

[0036] In one embodiment, the anti-cracking photoelectric element Q2 uses an ambient light sensor. The ambient light sensor uses a high-sensitivity SMD light sensor with a 0603 SMD package. It is small in size and similar to commonly used resistors and capacitors, making it difficult to detect.

[0037] In one embodiment, the buck-boost module 112 is connected to the anti-cracking module 111. The buck-boost module 112 outputs a power supply voltage of the microcontroller corresponding to the voltage of the switch tube Q1 according to the voltage of the switch tube Q1. When the circuit board where the microcontroller is located is cracked, the voltage of the switch tube Q1 decreases. At this time, the power supply voltage of the microcontroller output by the buck-boost module 112 increases sharply, so that the microcontroller is burned when it is cracked.

[0038] Please refer to Figure 2 In one embodiment, the buck-boost module 112 includes a zener diode D1, a zener diode D2, a capacitor C1, a capacitor C2, a resistor R1, a resistor R2, a resistor R3, an inductor L1 and a buck-boost chip.

[0039] In one embodiment, the input end of the voltage zener diode D2 is used to connect to an external power supply, the output end of the voltage zener diode D2 is connected to the first end of the inductor L1, and the first end of the inductor L1 is connected to the voltage input pin of the buck-boost chip (i.e. Figure 2 The VIN pin in the boost / buck chip. Figure 2 The SHDN pin in the figure is connected to the first end of the resistor R1, the second end of the resistor R1 is connected to the first end of the capacitor C1, and the second end of the capacitor C1 is grounded. The second end of the inductor L1 is connected to the input end of the voltage regulator diode D1, and the second end of the inductor L1 is also connected to the conversion pin of the buck-boost chip (i.e. Figure 2 The output end of the diode D1 is connected to the first end of the capacitor C2, and the second end of the capacitor C2 is connected to the ground pin of the buck-boost chip (i.e. Figure 2 The output end of the diode D1 is also connected to the first end of the resistor R2, and the second end of the resistor R2 is connected to the feedback pin of the buck-boost chip (i.e. Figure 2 The second end of the resistor R2 is also connected to the first end of the resistor R3, the second end of the resistor R3 is grounded, and the feedback pin of the buck-boost chip is also (i.e. Figure 2 The FB pin in the circuit is connected to the first end of the switch tube Q1.

[0040] In one embodiment, the rechargeable battery 113 (i.e. Figure 2 The positive electrode of Li1) is connected to the first end of the inductor L1, and the negative electrode of the rechargeable battery 113 is connected to the second end of the capacitor C1. The rechargeable battery 113 is used to power the buck-boost module 112 under normal working conditions, wherein the rechargeable battery 113 is a lithium battery.

[0041] In one embodiment, in the buck-boost module 112, the first end of the resistor R2 is connected to the positive electrode of the microcontroller power supply, and the second end of the resistor R3 is connected to the negative electrode of the microcontroller power supply, so as to supply power to the microcontroller.

[0042] It should be noted that when the single-chip microcomputer anti-cracking device 110 is working normally, the buck-boost module 112 and the rechargeable power supply 113 provide the power supply voltage so that the single-chip microcomputer can work normally. However, when the single-chip microcomputer is disassembled, the anti-cracking photoelectric element Q2 is turned on, thereby triggering the anti-program cracking mechanism. After the cracking photoelectric element Q2 is turned on, the current flows from the cracking photoelectric element Q2 to the resistor R6, so that a positive voltage is generated between the cracking photoelectric element Q2 and the resistor R6. The current also flows from the cracking photoelectric element Q2 to the resistor R5, and flows to the control end of the switch tube Q1 through the resistor R5. At this time, the switch tube Q1 is turned on, and the resistors R3 and R4 are connected in parallel, so that the voltage of the switch tube Q1 is pulled down, thereby causing the feedback voltage at the feedback pin of the buck-boost chip connected to the switch tube Q1 to decrease sharply. When the feedback voltage at the feedback pin of the buck-boost chip decreases sharply, the buck-boost chip will increase the internal duty cycle, thereby increasing the output voltage of the buck-boost chip. The output voltage is the power supply voltage of the microcontroller. Then the power supply voltage of the microcontroller will increase instantly and far exceed the maximum limit, thereby instantly burning the microcontroller and making its program impossible to crack.

[0043] Please refer to Figure 3 Another embodiment further provides a monitor 100, which includes a single-chip anti-cracking device 110 and a single-chip microcomputer 120 equipped with a control program for the monitor. Various programs for the monitor are executed in the control chip inside the single-chip microcomputer 120. The single-chip anti-cracking program 110 provides a power supply voltage to the single-chip microcomputer 120 under normal working conditions. When the single-chip microcomputer 120 is abnormally cracked, the single-chip anti-cracking program provides a voltage far exceeding the upper limit value to burn the single-chip microcomputer 120 to prevent the single-chip microcomputer 120 program from being cracked.

[0044] In one embodiment, the single-chip computer anti-cracking device 110 includes an anti-cracking module 111 , a buck-boost module 112 of the single-chip computer, and a rechargeable battery 113 .

[0045] In one embodiment, the anti-cracking module 111 includes an anti-cracking switch element J1, an anti-cracking photoelectric element Q2, a switch tube Q1, a resistor R4, a resistor R5, and a resistor R6. The first end of the anti-cracking switch element J1 is connected to the buck-boost module 112, the second end of the anti-cracking switch element J1 is connected to the first end of the anti-cracking photoelectric element Q2, the second end of the anti-cracking photoelectric element Q2 is connected to the first end of the resistor R5, the second end of the anti-cracking photoelectric element Q2 is also connected to the first end of the resistor R6, the second end of the resistor R5 is connected to the control end of the switch tube Q1, the first end of the switch tube Q1 is connected to the buck-boost module, the second end of the switch tube Q1 is connected to the first end of the resistor R4, and the second end of the resistor R4 is connected to the second end of the resistor R6.

[0046] Please refer to Figure 4In one embodiment, the monitor 100 is divided into an upper shell and a lower shell. The upper shell is provided with an operation panel of the monitor, and the lower shell is provided with a single-chip anti-cracking device 110 and a single-chip 120 carrying a control program of the monitor. In the single-chip anti-cracking module 110, the anti-cracking switch element J1 and the anti-cracking photoelectric element Q2 are provided on the circuit board where the single-chip is located. In this application, the anti-cracking switch element J1 is provided closely to the back of the circuit where the single-chip is located, and the anti-cracking photoelectric element Q2 is provided closely to the front of the circuit where the single-chip is located, so as to prevent the cracking device from being triggered by disassembly under abnormal circumstances.

[0047] It should be noted that the anti-cracking switch element J1 and the anti-cracking photoelectric element Q2 are not limited to being placed on the back and front of the circuit where the microcontroller is located as specified in the present application, but can also be set at other locations as long as they are in a position that can be frequently touched by humans when the microcontroller is disassembled abnormally.

[0048] In one embodiment, the buck-boost module includes a zener diode D1, a zener diode D2, a capacitor C1, a capacitor C2, a resistor R1, a resistor R2, a resistor R3, an inductor L1, and a buck-boost chip. The input end of the zener diode D2 is used to connect to a charging power source, the output end of the zener diode D2 is connected to the first end of the inductor L1, and the first end of the inductor L1 is connected to the voltage input pin (i.e., Figure 2 The VIN pin in the boost / buck chip. Figure 2 The SHDN pin in the figure is connected to the first end of the resistor R1, the second end of the resistor R1 is connected to the first end of the capacitor C1, and the second end of the capacitor C1 is grounded. The second end of the inductor L1 is connected to the input end of the voltage regulator diode D1, and the second end of the inductor L1 is also connected to the conversion pin of the buck-boost chip (i.e. Figure 2 The output end of the diode D1 is connected to the first end of the capacitor C2, and the second end of the capacitor C2 is connected to the ground pin of the buck-boost chip (i.e. Figure 2 The output end of the diode D1 is also connected to the first end of the resistor R2, and the second end of the resistor R2 is connected to the feedback pin of the buck-boost chip (i.e. Figure 2 The second end of the resistor R2 is also connected to the first end of the resistor R3, the second end of the resistor R3 is grounded, and the feedback pin of the buck-boost chip is also (i.e. Figure 2 The FB pin in the circuit is connected to the first end of the switch tube Q1.

[0049] In one embodiment, when the single-chip computer is disassembled, the anti-cracking photoelectric element Q2 is turned on, thereby triggering the anti-program cracking mechanism. After the cracking photoelectric element Q2 is turned on, the current flows from the cracking photoelectric element Q2 to the resistor R6, so that a positive voltage is generated between the cracking photoelectric element Q2 and the resistor R6. The current also flows from the cracking photoelectric element Q2 to the resistor R5, and flows to the control end of the switch tube Q1 through the resistor R5. At this time, the switch tube Q1 is turned on, and the resistors R3 and R4 are connected in parallel, so that the voltage of the switch tube Q1 is pulled down, thereby causing the feedback voltage at the feedback pin of the buck-boost chip connected to the switch tube Q1 to decrease sharply. When the feedback voltage at the feedback pin of the buck-boost chip decreases sharply, the buck-boost chip will increase the internal duty cycle, thereby increasing the output voltage of the buck-boost chip, which is the power supply voltage of the single-chip computer. Then the power supply voltage of the single-chip computer will increase instantly, and far exceed the maximum limit, thereby instantly burning the single-chip computer, making its program unable to be cracked.

[0050] The above specific examples are used to illustrate the present invention, which are only used to help understand the present invention and are not intended to limit the present invention. For those skilled in the art of the present invention, some simple deductions, deformations or substitutions can be made based on the idea of ​​the present invention.

Claims

1. A single chip computer anti-cracking device, characterized in that: Including anti-cracking module and microcontroller buck-boost module; The anti-cracking module includes an anti-cracking switch element, an anti-cracking photoelectric element and a switch tube, the anti-cracking switch element is connected to the anti-cracking photoelectric element, the anti-cracking photoelectric element is used to connect the switch tube, and the anti-cracking switch element and the anti-cracking photoelectric element are arranged on the circuit board where the single-chip microcomputer is located; The buck-boost module is connected to the anti-cracking module, and the buck-boost module outputs a power supply voltage of the microcontroller corresponding to the voltage of the switch tube according to the voltage of the switch tube, so that the microcontroller is burned when the microcontroller is cracked.

2. The single chip computer anti-cracking device according to claim 1, characterized in that: The anti-cracking module also includes a resistor R4, a resistor R5 and a resistor R6; The first end of the anti-cracking switch element is connected to the buck-boost module, the second end of the anti-cracking switch element is connected to the first end of the anti-cracking photoelectric element, the second end of the anti-cracking photoelectric element is connected to the first end of the resistor R5, the second end of the anti-cracking photoelectric element is also connected to the first end of the resistor R6, the second end of the resistor R5 is connected to the control end of the switch tube, the first end of the switch tube is connected to the buck-boost module, the second end of the switch tube is connected to the first end of the resistor R4, and the second end of the resistor R4 is connected to the second end of the resistor R6.

3. The single chip computer anti-cracking device according to claim 2, characterized in that: The buck-boost module includes a zener diode D1, a zener diode D2, a capacitor C1, a capacitor C2, a resistor R1, a resistor R2, a resistor R3, an inductor L1 and a buck-boost chip; The input end of the voltage-stabilizing diode D2 is used to connect an external power supply, the output end of the voltage-stabilizing diode D2 is connected to the first end of the inductor L1, the first end of the inductor L1 is connected to the voltage input pin of the buck-boost chip, the shutdown control pin of the buck-boost chip is connected to the first end of the resistor R1, the second end of the resistor R1 is connected to the first end of the capacitor C1, and the second end of the capacitor C1 is grounded; the second end of the inductor L1 is connected to the input end of the voltage-stabilizing diode D1, the second end of the inductor L1 is also connected to the conversion pin of the buck-boost chip, the output end of the diode D1 is connected to the first end of the capacitor C2, the second end of the capacitor C2 is connected to the ground pin of the buck-boost chip, and the second end of the capacitor C2 is also grounded; the output end of the diode D1 is also connected to the first end of the resistor R2, the second end of the resistor R2 is connected to the feedback pin of the buck-boost chip, the second end of the resistor R2 is also connected to the first end of the resistor R3, the second end of the resistor R3 is grounded, and the feedback pin of the buck-boost chip is also connected to the first end of the switch tube.

4. The single chip computer anti-cracking device as claimed in claim 3, characterized in that: The single chip anti-cracking device also includes a rechargeable battery, the positive electrode of the rechargeable battery is connected to the first end of the inductor L1, and the negative electrode of the rechargeable battery is connected to the second end of the capacitor C1, which is used to supply power to the buck-boost module.

5. The single chip computer anti-cracking device according to claim 1, characterized in that: The anti-cracking switch element is arranged on the back side of the circuit where the single chip microcomputer is located, and the anti-cracking photoelectric element is arranged on the front side of the circuit where the single chip microcomputer is located.

6. The single chip computer anti-cracking device according to claim 1, characterized in that: The anti-cracking switch element is a normally closed reed switch.

7. The single chip computer anti-cracking device according to claim 6, characterized in that: The normally closed reed switch is a plastic-sealed reed switch after secondary sealing.

8. The single chip computer anti-cracking device according to claim 1, characterized in that: The anti-cracking photoelectric element is an ambient light sensor.

9. The single chip computer anti-cracking device according to claim 8, characterized in that: The ambient light sensor is a patch type light sensor.

10. A monitor, characterized in that: include: Single chip microcomputer, used to carry the control program of the monitor; The single chip computer anti-cracking device adopts the single chip computer anti-cracking device as described in any one of claims 1-9.

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