Chip deblocking device

Abstract

The utility model discloses a chip deblocking device, which belongs to the technical field of semiconductor equipment and comprises a device body, the top end of the device body is provided with a cleaning groove, the bottom end of the cleaning groove is provided with three water leakage holes, and the center of the bottom end of the cleaning groove is fixedly connected with a deblocking table. The three water leakage holes are formed around the unsealing table, a clamping assembly is arranged at the top end of the unsealing table, sliding doors are fixedly connected to the two sides of the front face of the device body, a cleaning cavity is formed in the device body, and a cleaning assembly is arranged in the cleaning cavity. A driving assembly is arranged right behind the top end of the device body, and five fixing frames arranged in a rectangular array are fixedly connected right in front of the left side of the device body; according to the utility model, the clamping assembly is used for fixing a chip needing to be decapsulated, then the driving assembly is used for moving the plasma torch to a proper ablation position to ablate the chip, and finally the cleaning assembly is used for cleaning the chip.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor equipment, and in particular relates to a chip decapsulation device. Background Art

[0002] Integrated circuits manufactured on the surface of semiconductor chips are also called thin film integrated circuits. Another type of thick film integrated circuit is a miniaturized circuit consisting of independent semiconductor devices and passive components integrated into a substrate or circuit board. The shell used to install semiconductor integrated circuit chips plays the role of placing, fixing, sealing, protecting the chip and enhancing the electrical and thermal performance. It is also a bridge between the internal world of the chip and the external circuit - the contacts on the chip are connected to the pins of the package shell with wires, and these pins are connected to other devices through wires on the printed circuit board. Therefore, packaging plays an important role in CPUs and other LSI integrated circuits.

[0003] The chip unsealing device with patent announcement number CN219937006U in the prior art includes a chip clamping assembly, a plasma device, an ultrasonic cleaning tank and a driving assembly, wherein the chip clamping assembly is used to clamp the chip to be unsealed, and the chip clamping assembly can drive the chip to move under the plasma device, and the plasma device is used to ablate the chip; a cleaning liquid is provided in the ultrasonic cleaning tank, and the chip clamping assembly can drive the chip to be immersed in the cleaning liquid of the ultrasonic cleaning tank, the ultrasonic cleaning tank is used to clean the chip surface, and the driving assembly is used to drive the chip clamping assembly to move.

[0004] However, the operation of the device is complicated and cumbersome when performing chip unsealing operations, which makes the chip easily damaged. Therefore, a chip unsealing device is needed to solve the problems existing in the prior art. Utility Model Content

[0005] The purpose of the utility model is to provide a chip decapsulation device to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a chip unsealing device, comprising a device body, a cleaning groove is provided at the top of the device body, three leakage holes are provided at the bottom of the cleaning groove, an unsealing platform is fixedly connected to the center of the bottom of the cleaning groove, the three leakage holes are arranged around the unsealing platform, a clamping assembly is provided at the top of the unsealing platform, sliding doors are fixedly connected to the front sides of the device body, a cleaning cavity is provided inside the device body, a cleaning assembly is provided inside the cleaning cavity, a driving assembly is provided directly behind the top of the device body, and five fixing frames in a rectangular array are fixedly connected to the front left side of the device body.

[0007] As a preferred embodiment, the clamping assembly includes a connecting plate, the connecting plates are in two pieces and the bottom ends are fixedly connected to the front and rear sides of the top of the unsealing table, a support column is fixedly connected to the inner center of the connecting plate, a telescopic column is slidably connected to the top of the support column, a fixed plate is fixedly connected to the top of the telescopic column, two clamping plates are fixedly connected to the inner side of the fixed plate, and silicone sponge is provided on the inner surfaces of the fixed plate and the clamping plate.

[0008] As a preferred embodiment, the cleaning assembly includes a filter cartridge, the top of the filter cartridge is fixedly connected to the top of the cleaning cavity, the filter cartridge is arranged directly below the water leakage hole, the bottom end of the filter cartridge is provided with a plurality of filter holes in a circular array, the bottom end of the cleaning cavity is fixedly connected to a liquid storage tank, the left side wall of the liquid storage tank is fixedly connected to a water inlet pipe, the water inlet pipe passes through the left side wall of the liquid storage tank and the left side wall of the device body and extends to the outside and is fixedly connected to a booster water pump, the bottom end of the booster water pump is arranged at the left bottom end of the device body, the side of the booster water pump is fixedly connected to a water outlet pipe, the water outlet pipe is mounted on a plurality of the fixed frames, and the top of the outlet pipe is fixedly connected to a cleaning elbow.

[0009] As a preferred embodiment, the driving assembly includes a driving motor, the bottom end of the driving motor is fixedly connected to the top end directly behind the left side of the device body, a sliding groove is opened directly behind the top of the device body, the sliding groove is arranged directly behind the cleaning groove, and sliding grooves are opened on the front and back sides of the inner surface of the cleaning groove, the output end of the driving motor is rotatably connected to a screw rod, the screw rod rotates inside the sliding groove, the outer surface of the screw rod is rotatably connected to a sliding block, the front and back sides of the sliding block are fixedly connected to sliding blocks, the sliding block slides left and right in the sliding groove, and the sliding block slides left and right in the sliding groove, the top of the sliding block is fixedly connected to a support seat, the top of the support seat is fixedly connected to a hydraulic cylinder directly behind, two limiting plates are fixedly connected to the front of the top of the support seat, and the tops of the two limiting plates are fixedly connected to a blocking plate, the output end of the driving motor is fixedly connected to a telescopic rod, the telescopic rod moves back and forth between the two limiting plates, and an unsealing assembly is arranged on the top of the telescopic rod.

[0010] As a preferred embodiment, the unsealing assembly includes a mounting frame, the top rear end of the mounting frame is fixedly connected to the top end of the telescopic rod, the mounting frame is arranged around the limiting plate, the bottom end of the mounting frame is fixedly connected to a support rod, the bottom end of the support rod is slidably connected to a connecting rod, the bottom end of the connecting rod is fixedly connected to a connecting seat, and the bottom end of the connecting seat is fixedly connected to a plasma torch.

[0011] Compared with the prior art, the chip unsealing device provided by the present invention has at least the following beneficial effects:

[0012] 1. The chip to be unsealed is placed on the unsealing table through the clamping assembly, so that the support columns on the front and rear sides drive the telescopic columns to slide inward, so that the telescopic columns drive the fixed plate and the clamping plate to move inward, so that the clamping plate fixes the chip up and down, so that the inner side of the fixed plate abuts against the front and rear sides of the chip under the continuous push of the telescopic columns, thereby fixing the chip on the unsealing table. Through the coordinated use of the fixed plate and the clamping plate, the chip will not loosen during the unsealing operation, thereby improving the stability of the device. Through the silicone sponge arranged on the inner surfaces of the fixed plate and the clamping plate, the fixed plate and the clamping plate will not be damaged due to excessive pressure when fixing the chip front and back, thereby improving the safety of the device.

[0013] 2. Through the driving component, the driving motor is started to make its output end drive the lead screw to rotate, so that the lead screw drives the sliding block to slide left and right in the sliding groove, so that the sliding block drives the support seat to slide, so that the unsealing component set on the support seat can slide left and right, and then the hydraulic cylinder drives the telescopic rod to slide back and forth, so that the telescopic rod drives the mounting frame to slide back and forth, so that the plasma torch on the mounting frame slides back and forth, so that the device can adjust the position of the unsealing component at any time when unsealing the chip, thereby improving the convenience of the device.

[0014] 3. The chip is unsealed through the cleaning component, and the booster pump is started to drive the cleaning liquid in the liquid storage tank through the water inlet pipe and the water inlet pipe, so that the position on the chip surface that needs to be cleaned is cleaned through the cleaning elbow, so that the impurities left by the unsealing flow into the filter cartridge through the leakage hole, so that the impurities are filtered out through the filter hole and the cleaning liquid flows back to the liquid storage tank, so that the cleaning liquid can be recycled and will not be wasted, thereby improving the practicality of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0016] Figure 2 It is a left side structural schematic diagram of the utility model;

[0017] Figure 3 It is a schematic diagram of the top view structure of the utility model;

[0018] Figure 4 It is a right sectional structural schematic diagram of the utility model.

[0019] In the figure: 1, device body; 2, cleaning slot; 3, leaking hole; 4, unsealing platform; 5, clamping assembly; 501, connecting plate; 502, supporting column; 503, telescopic column; 504, fixing plate; 505, clamping plate; 506, silicone sponge; 6, sliding door; 7, cleaning cavity; 8, cleaning assembly; 801, filter cartridge; 802, filter hole; 803, liquid storage tank; 804, water inlet pipe; 805, booster pump; 806, water outlet pipe; 807, cleaning Bending pipe; 9. Driving assembly; 901. Driving motor; 902. Sliding groove; 903. Sliding groove; 904. Screw rod; 905. Sliding block; 906. Support seat; 907. Hydraulic cylinder; 908. Limiting plate; 909. Blocking plate; 910. Telescopic rod; 911. Sliding block; 10. Unsealing assembly; 1001. Mounting frame; 1002. Support rod; 1003. Connecting rod; 1004. Connecting seat; 1005. Plasma torch; 11. Fixing frame. DETAILED DESCRIPTION

[0020] The present invention will be further described below in conjunction with the embodiments.

[0021] See also Figure 1-4 The utility model provides a chip unsealing device, including a device body 1, a cleaning groove 2 is opened at the top of the device body 1, three leakage holes 3 are opened at the bottom of the cleaning groove 2, an unsealing platform 4 is fixedly connected to the center of the bottom of the cleaning groove 2, the three leakage holes 3 are arranged around the unsealing platform 4, a clamping component 5 is arranged at the top of the unsealing platform 4, sliding doors 6 are fixedly connected to both sides of the front of the device body 1, a cleaning cavity 7 is opened inside the device body 1, a cleaning component 8 is arranged inside the cleaning cavity 7, a driving component 9 is arranged directly behind the top of the device body 1, and five fixing frames 11 in a rectangular array are fixedly connected to the front of the left side of the device body 1.

[0022] Further as Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, it is worth explaining in detail that the clamping assembly 5 includes a connecting plate 501, the connecting plate 501 is two pieces and the bottom end is fixedly connected to the front and rear sides of the top of the unsealing platform 3, a support column 502 is fixedly connected to the inner center of the connecting plate 501, and a telescopic column 503 is slidably connected to the top of the support column 502, and a fixed plate 504 is fixedly connected to the top of the telescopic column 503, and two clamping plates 505 are fixedly connected to the inner side of the fixed plate 504, and the inner surfaces of the fixed plate 504 and the clamping plate 505 are provided with silicone sponges 506. Through the clamping assembly 5, the chip to be unsealed is placed on the unsealing platform 4, so that the support columns 502 on the front and rear sides drive the telescopic column 503 to slide inward, so that The telescopic column 503 drives the fixing plate 504 and the clamping plate 505 to move inward, so that the clamping plate 505 fixes the chip up and down, so that the inner side of the fixing plate 504 abuts against the front and back sides of the chip under the continuous push of the telescopic column 503, thereby fixing the chip on the unsealing table 4. Through the coordinated use of the fixing plate 504 and the clamping plate 505, the chip will not loosen during the unsealing operation, thereby improving the stability of the device. Through the silicone sponge 506 set on the inner surfaces of the fixing plate 504 and the clamping plate 505, the fixing plate 504 and the clamping plate 505 will not be damaged due to excessive pressure when fixing the chip front and back, thereby improving the safety of the device.

[0023] Further Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, it is worth specifically explaining that the cleaning component 8 includes a filter cartridge 801, the top of the filter cartridge 801 is fixedly connected to the top of the cleaning cavity 7, the filter cartridge 801 is arranged directly below the water leakage hole 3, and the bottom end of the filter cartridge 801 is provided with a plurality of filter holes 802 in a circular array, the bottom end of the cleaning cavity 7 is fixedly connected to a liquid storage tank 803, and the left side wall of the liquid storage tank 803 is fixedly connected to an inlet pipe 804, the inlet pipe 804 passes through the left side wall of the liquid storage tank 803 and the left side wall of the device body 1 and extends to the outside and is fixedly connected to a booster water pump 805, the bottom end of the booster water pump 805 is arranged at the left bottom end of the device body 1, and the side of the booster water pump 805 is fixedly connected to a water outlet pipe 806, the water outlet pipe 806 is mounted on a plurality of fixed frames 11, and the top of the water outlet pipe 806 is fixedly connected with a cleaning elbow 807. Through the cleaning component 10, the chip is unsealed, thereby starting the booster pump 805 to drive the cleaning liquid in the liquid storage tank 803 through the water inlet pipe 804 and the water inlet pipe 806, so that the position on the chip surface that needs to be cleaned is cleaned through the cleaning elbow 807, so that the impurities left by the unsealing flow into the filter cartridge 801 through the leakage hole 3, so that the impurities are filtered out through the filter hole 802 and the cleaning liquid flows back to the liquid storage tank 803, so that the cleaning liquid can be recycled and will not be wasted, thereby improving the practicality of the device.

[0024] Further Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, it is worth specifically explaining that the driving component 9 includes a driving motor 901, the bottom end of the driving motor 901 is fixedly connected to the top of the left rear of the device body 1, a sliding groove 902 is provided at the rear of the top of the device body 1, the sliding groove 902 is arranged at the rear of the cleaning groove 2, and the inner surface of the cleaning groove 2 is provided with sliding grooves 903 on the front and rear sides, the output end of the driving motor 901 is rotatably connected to a screw rod 904, the screw rod 904 is rotated inside the sliding groove 902, and the outer surface of the screw rod 904 is rotatably connected to a sliding block 905, the front and rear sides of the sliding block 905 are fixedly connected to sliders 911, the sliding block 905 slides left and right in the sliding groove 902, the slider 911 slides left and right in the sliding groove 903, the top of the sliding block 905 is fixedly connected to a support seat 906, the top of the support seat 906 is fixedly connected to a hydraulic cylinder 907, and the top of the support seat 906 is fixedly connected to two limiting plates 908, two The top of the limiting plate 908 is fixedly connected with a blocking plate 909, and the output end of the driving motor 901 is fixedly connected with a telescopic rod 910. The telescopic rod 910 is located between the two limiting plates 908 and moves back and forth. The top of the telescopic rod 910 is provided with an unsealing component 10 through the driving component 9, so that the driving motor 901 is started so that its output end drives the screw rod 904 to rotate, so that the screw rod 904 drives the sliding block 905 to slide left and right in the sliding groove 902, so that the sliding block 902 drives the support seat 906 to slide, so that the unsealing component 10 set on the support seat 906 can slide left and right, and then the telescopic rod 910 is driven to slide back and forth by the hydraulic cylinder 907, so that the telescopic rod 910 drives the mounting frame 110 to slide back and forth, so that the plasma torch 1005 on the mounting frame 1001 slides back and forth, so that the device can adjust the position of the unsealing component 10 at any time when unsealing the chip, thereby improving the convenience of the device.

[0025] Further Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, it is worth specifying that the unsealing component 10 includes a mounting frame 1001, the top rear end of the mounting frame 1001 is fixedly connected to the top of the telescopic rod 910, the mounting frame 1001 is arranged around the limiting plate 908, the bottom end of the mounting frame 1001 is fixedly connected to a support rod 1002, the bottom end of the support rod 1002 is slidably connected to a connecting rod 1003, the bottom end of the connecting rod 1003 is fixedly connected to a connecting seat 1004, and the bottom end of the connecting seat 1004 is fixedly connected to a plasma torch 1005.

[0026] This solution has the following working process: first, the chip to be unsealed is placed on the unsealing platform 4, so that the support columns 502 on the front and rear sides drive the telescopic columns 503 to slide inward, so that the telescopic columns 503 drive the fixing plate 504 and the clamping plate 505 to move inward, so that the clamping plate 505 fixes the chip up and down, so that the inner side of the fixing plate 504 abuts against the front and rear sides of the chip under the continuous push of the telescopic columns 503, so that the chip is fixed on the unsealing platform 4, and then the driving motor 901 is started so that its output end drives the screw rod 904 to rotate, so that the screw rod 904 drives the sliding block 905 to slide left and right in the sliding groove 902, so that the sliding block 902 drives the support seat 906 to slide, so that the unsealing component 10 set on the support seat 906 can slide left and right, and then the telescopic rod 910 is driven by the hydraulic cylinder 907 to slide back and forth, so that The telescopic rod 910 drives the mounting frame 110 to slide forward and backward, thereby making the plasma torch 1005 on the mounting frame 1001 slide forward and backward, and then the driving motor 901 and the hydraulic cylinder 907 stop when they move to the appropriate unsealing position, so that the support rod 1002 drives the connecting rod 1003 to move downward, so that the plasma torch 1005 is aimed at the chip surface for unsealing operation, and then after the ablation of the plasma torch 1005 is completed, the booster pump 805 is started to drive the cleaning liquid in the liquid storage tank 803 through the water inlet pipe 804 and the water inlet pipe 806, so that the position on the chip surface that needs to be cleaned is cleaned through the cleaning elbow 807, so that the impurities left by the unsealing flow into the filter cartridge 801 through the leakage hole 3, so that the impurities are filtered out through the filter hole 802 and the cleaning liquid flows back to the liquid storage tank 803, so that the filter cartridge 801 is taken out and the impurities are processed uniformly.

[0027] According to the above working process, it can be known that: the chip to be unsealed is placed on the unsealing platform 4 through the clamping assembly 5, so that the support columns 502 on the front and rear sides drive the telescopic columns 503 to slide inward, so that the telescopic columns 503 drive the fixing plate 504 and the clamping plate 505 to move inward, so that the clamping plate 505 fixes the chip up and down, so that the inner side of the fixing plate 504 is constantly pushed by the telescopic columns 503 to abut against the front and rear sides of the chip, thereby fixing the chip on the unsealing platform 4, and the fixing plate 504 and the clamping plate The chip will not loosen during the unsealing operation, thereby improving the stability of the device. The silicone sponge 506 arranged on the inner surface of the fixing plate 504 and the clamping plate 505 will not be damaged due to excessive pressure when the chip is fixed front and back, thereby improving the safety of the device. The driving component 9 is used to start the driving motor 901 so that its output end drives the screw rod 904 to rotate, so that the screw rod 904 drives the sliding block 905 in the sliding groove 90 2, so that the sliding block 902 drives the support seat 906 to slide, so that the unsealing component 10 set on the support seat 906 can slide left and right, and then the hydraulic cylinder 907 drives the telescopic rod 910 to slide forward and backward, so that the telescopic rod 910 drives the mounting frame 110 to slide forward and backward, so that the plasma torch 1005 on the mounting frame 1001 slides forward and backward, so that the device can adjust the position of the unsealing component 10 at any time when the chip is unsealed, thereby improving the convenience of the device. Component 10, the chip is unsealed, so that the booster pump 805 is started to drive the cleaning liquid in the liquid storage tank 803 through the water inlet pipe 804 and the water inlet pipe 806, so as to clean the position on the chip surface that needs to be cleaned through the cleaning elbow 807, so that the impurities left by the unsealing flow into the filter cartridge 801 through the leakage hole 3, so that the impurities are filtered out through the filter hole 802 and the cleaning liquid flows back to the liquid storage tank 803, so that the cleaning liquid can be recycled and will not be wasted, thereby improving the practicality of the device.

[0028] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions only describe the principles of the present invention. The present invention may be subject to various changes and improvements without departing from the spirit and scope of the present invention. These changes and improvements fall within the scope of the present invention. The scope of protection claimed by the present invention is defined by the attached claims and their equivalents.

Claims

1. A chip unsealing device, comprising a device body (1), characterized in that: The top of the device body (1) is provided with a cleaning groove (2), the bottom of the cleaning groove (2) is provided with three leakage holes (3), the bottom center of the cleaning groove (2) is fixedly connected with an unsealing platform (4), the three leakage holes (3) are arranged around the unsealing platform (4), the top of the unsealing platform (4) is provided with a clamping assembly (5), the front sides of the device body (1) are fixedly connected with sliding doors (6), the inside of the device body (1) is provided with a cleaning cavity (7), the inside of the cleaning cavity (7) is provided with a cleaning assembly (8), a driving assembly (9) is arranged directly behind the top of the device body (1), and five fixed frames (11) in a rectangular array are fixedly connected to the left front of the device body (1).

2. A chip decapsulation device according to claim 1, characterized in that: The clamping assembly (5) comprises a connecting plate (501), the connecting plate (501) is composed of two pieces and the bottom ends are fixedly connected to the front and rear sides of the top of the unsealing platform (4), a support column (502) is fixedly connected to the inner center of the connecting plate (501), a telescopic column (503) is slidably connected to the top of the support column (502), a fixed plate (504) is fixedly connected to the top of the telescopic column (503), two clamping plates (505) are fixedly connected to the inner side of the fixing plate (504), and silicone sponges (506) are provided on the inner surfaces of the fixing plate (504) and the clamping plate (505).

3. A chip decapsulation device according to claim 1, characterized in that: The cleaning assembly (8) comprises a filter cartridge (801), the top end of the filter cartridge (801) is fixedly connected to the top end of the cleaning cavity (7), the filter cartridge (801) is arranged directly below the water leakage hole (3), the bottom end of the filter cartridge (801) is provided with a plurality of filter holes (802) in a circular array, the bottom end of the cleaning cavity (7) is fixedly connected to a liquid storage tank (803), the left side wall of the liquid storage tank (803) is fixedly connected to a water inlet pipe (804), and the water inlet pipe (804) penetrates the left side wall of the liquid storage tank (803) and the left side wall of the device body (1) and extends to the outside where a booster water pump (805) is fixedly connected. The bottom end of the booster water pump (805) is arranged at the left bottom end of the device body (1). The side of the booster water pump (805) is fixedly connected to a water outlet pipe (806). The water outlet pipe (806) is mounted on a plurality of the fixed frames (11). The top end of the water outlet pipe (806) is fixedly connected to a cleaning elbow pipe (807).

4. A chip decapsulation device according to claim 1, characterized in that: The driving assembly (9) comprises a driving motor (901), the bottom end of the driving motor (901) is fixedly connected to the top end of the left rear side of the device body (1), a sliding groove (902) is provided at the rear side of the top end of the device body (1), the sliding groove (902) is arranged at the rear side of the cleaning groove (2), the inner surface of the cleaning groove (2) is provided with sliding grooves (903) at the front and rear sides, the output end of the driving motor (901) is rotatably connected to a screw rod (904), the screw rod (904) is rotated inside the sliding groove (902), the outer surface of the screw rod (904) is rotatably connected to a sliding block (905), the front and rear sides of the sliding block (905) are fixedly connected to sliding blocks (911), the sliding The block (905) slides left and right in the sliding groove (902), the sliding block (911) slides left and right in the sliding groove (903), the top of the sliding block (905) is fixedly connected to a support seat (906), the rear of the top of the support seat (906) is fixedly connected to a hydraulic cylinder (907), the front of the top of the support seat (906) is fixedly connected to two limiting plates (908), the tops of the two limiting plates (908) are fixedly connected to a blocking plate (909), the output end of the driving motor (901) is fixedly connected to a telescopic rod (910), the telescopic rod (910) is moved forward and backward between the two limiting plates (908), and the top of the telescopic rod (910) is provided with an unsealing component (10).

5. A chip decapsulation device according to claim 4, characterized in that: The unsealing component (10) includes a mounting frame (1001), the top of the mounting frame (1001) at the rear is fixedly connected to the top of the telescopic rod (910), the mounting frame (1001) is arranged around the limiting plate (908), the bottom end of the mounting frame (1001) is fixedly connected to a support rod (1002), the bottom end of the support rod (1002) is slidably connected to a connecting rod (1003), the bottom end of the connecting rod (1003) is fixedly connected to a connecting seat (1004), and the bottom end of the connecting seat (1004) is fixedly connected to a plasma torch (1005).

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