Cooling mechanism for cutting fluid processing

Abstract

The utility model is applicable to the technical field of cutting fluid cooling treatment, and provides a cooling mechanism for cutting fluid processing, which comprises a first cooling box, the first cooling box is used for cooling cutting fluid, a semiconductor chilling plate is arranged on the first cooling box, and a second cooling box is arranged on the second cooling box. The semiconductor chilling plate is used for refrigerating cooling water in the first cooling box; the circulating pump is fixedly mounted on the outer wall of one side of the first cooling box; the first cooling pipe is fixedly mounted in the first cooling box, and one end of the first cooling pipe is communicated with the water inlet end of the circulating pump; and the connecting pipe is fixedly arranged on the circulating pump. According to the cooling mechanism for cutting fluid processing, impurities in cutting fluid can be well and fully filtered, the safety of recycling of the cutting fluid is improved, meanwhile, cooling treatment can be conducted on the cutting fluid in different modes, the cooling effect on the cutting fluid is effectively improved, and therefore the using effect of the cutting fluid is guaranteed.

Description

Technical Field

[0001] The utility model belongs to the technical field of cooling treatment of cutting fluid, in particular to a cooling mechanism for cutting fluid processing. Background Art

[0002] When machine tools are processing some metal workpieces, in order to reduce the temperature of the workpieces, cutting fluid is used to cool and lubricate the workpieces.

[0003] At the same time, in order to improve the recycling of cutting fluid, a corresponding cooling mechanism is used to cool and recycle the cutting fluid. After searching, the patent document with the authorization announcement number of CN219767594U discloses a cooling mechanism for cutting fluid processing, which first filters the impurities in the cutting fluid and then cools the cutting fluid. However, it only sets a filter plate and cannot filter some fine impurities in the cutting fluid. The filtering effect is poor, which easily leads to impurities causing wear on the surface of the workpiece when the cutting fluid is reused. Moreover, it can only cool the cutting fluid once, and the cooling effect is poor. Utility Model Content

[0004] The utility model provides a cooling mechanism for cutting fluid processing, aiming to solve the problem that the cooling mechanism currently used in the background technology cannot fully cool the cutting fluid and cannot fully filter the impurities in the cutting fluid.

[0005] To solve the above problems, the utility model is implemented as follows: a cooling mechanism for cutting fluid processing, comprising: a first cooling box, the first cooling box is used to cool the cutting fluid, the first cooling box is provided with a semiconductor refrigeration sheet, the semiconductor refrigeration sheet is used to refrigerate the cooling water in the first cooling box; a circulating pump fixedly installed on the outer wall of one side of the first cooling box; a first cooling pipe fixedly installed in the first cooling box, one end of the first cooling pipe is connected to the water inlet end of the circulating pump; a connecting pipe fixedly installed on the circulating pump; a second cooling box arranged on one side of the first cooling box, a second cooling pipe is arranged in the second cooling box, and the second cooling pipe is connected to the first cooling pipe; a filter box fixedly installed on the top of the second cooling box, the filter box is used to filter impurities in the cutting fluid, the filter box is provided with a vertical pipe, and the vertical pipe is connected to the second cooling pipe; a stirring mechanism arranged on the first cooling box, the stirring mechanism is used to stir the cooling water in the first cooling box; a cooling mechanism assembled on the second cooling box, the cooling mechanism is used to cool the cutting fluid entering the second cooling pipe.

[0006] Preferably, the filter box includes a first filter plate, a second filter plate and activated carbon, and the first filter plate, the second filter plate and the activated carbon are all arranged in the filter box, the first filter plate and the second filter plate are used to filter impurities in the cutting fluid, and the activated carbon is used to filter fine impurities in the cutting fluid.

[0007] Preferably, a boosting mechanism is provided on the filter box, and the boosting mechanism is used to pass the cutting fluid through the activated carbon. The boosting mechanism includes: a boosting pump fixedly mounted on an outer wall of one side of the filter box; a boosting pipe fixedly mounted on the filter box, the boosting pipe is connected to the boosting pump, and the boosting pipe is located above the activated carbon.

[0008] Preferably, the stirring mechanism includes: a driving motor fixedly installed on the bottom of the first cooling box; two stirring frames rotatably installed on the first cooling box, and one end of one of the stirring frames is fixedly connected to the output shaft of the driving motor; two first pulleys fixedly mounted on the two stirring frames, respectively, and the two first pulleys are provided with a first belt.

[0009] Preferably, the cooling mechanism includes: a placement shaft rotatably mounted on the second cooling box; a fan blade fixedly mounted on the placement shaft, the fan blade being located on one side of the second cooling tube; two second pulleys respectively fixedly mounted on the placement shaft and one of the stirring frames, and a second belt being mounted on the two second pulleys.

[0010] Preferably, a heat dissipation mechanism is provided at the bottom of the first cooling box, and the heat dissipation mechanism is used to dissipate heat from the semiconductor refrigeration plate. The heat dissipation mechanism includes: a mounting shaft rotatably mounted on the bottom of the first cooling box; a fan blade fixedly mounted on the mounting shaft, and the fan blade corresponds to the heat dissipation surface of the semiconductor refrigeration plate; two third pulleys respectively fixedly mounted on the mounting shaft and one of the stirring frames, and a third belt is mounted on the two third pulleys.

[0011] Preferably, a controller is provided on one side outer wall of the second cooling box, and the controller is used to perform control operations.

[0012] Compared with the related art, the cooling mechanism for cutting fluid processing provided by the utility model has the following beneficial effects:

[0013] Compared with the prior art, the cooling mechanism for cutting fluid processing provided by this solution:

[0014] A cooling mechanism for cutting fluid processing is formed by a first cooling box, a semiconductor refrigeration sheet, a circulating pump, a first cooling pipe, a connecting pipe, a second cooling box, a second cooling pipe, a filter box, a stirring mechanism, a cooling mechanism, a pressurizing mechanism, a heat dissipation mechanism and a controller. Impurities in the cutting fluid can be filtered out well to improve the safety of the recycling of the cutting fluid. At the same time, the cutting fluid can be cooled in different ways to effectively improve the cooling effect of the cutting fluid, thereby ensuring the use effect of the cutting fluid. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the main structure of a cooling mechanism for cutting fluid processing provided by the utility model;

[0016] Figure 2 It is a schematic diagram of the main cross-sectional structure of the utility model;

[0017] Figure 3 for Figure 2 Schematic diagram of the enlarged structure of part A shown in FIG.

[0018] Figure numerals: 1. first cooling box; 101. semiconductor refrigeration plate; 2. circulation pump; 3. first cooling pipe; 4. connecting pipe; 5. second cooling box; 6. second cooling pipe; 7. filter box; 701. first filter plate; 702. second filter plate; 703. activated carbon; 704. boost pump; 705. boost pipe; 8. stirring mechanism; 801. drive motor; 802. stirring frame; 803. first pulley; 804. first belt; 9. cooling mechanism; 901. placement shaft; 902. fan blade; 903. second pulley; 904. second belt; 10. installation shaft; 11. fan blade; 12. third pulley; 13. third belt. DETAILED DESCRIPTION

[0019] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field of the present application; the terms used in the specification of the application herein are only for the purpose of describing specific embodiments and are not intended to limit the present application; the terms "including" and "having" in the specification and claims of the present application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of the present application or the above-mentioned figures are used to distinguish different objects, rather than to describe a specific order; the terms "inside", "outside", "left", and "right" indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0020] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0021] The utility model embodiment provides a cooling mechanism for cutting fluid processing, such as Figure 1-3 As shown, the cooling mechanism for cutting fluid processing includes: a first cooling box 1, the first cooling box 1 is used to cool the cutting fluid, the first cooling box 1 is provided with a semiconductor refrigeration sheet 101, the semiconductor refrigeration sheet 101 is used to cool the cooling water in the first cooling box 1; a circulating pump 2 fixedly installed on the outer wall of one side of the first cooling box 1; a first cooling pipe 3 fixedly installed in the first cooling box 1, one end of the first cooling pipe 3 is connected to the water inlet end of the circulating pump 2; a connecting pipe 4 fixedly installed on the circulating pump 2; a second cooling box 5 arranged on one side of the first cooling box 1, A second cooling pipe 6 is provided in the second cooling box 5, and the second cooling pipe 6 is connected to the first cooling pipe 3; a filter box 7 is fixedly installed on the top of the second cooling box 5, and the filter box 7 is used to filter impurities in the cutting fluid, and a vertical pipe is provided on the filter box 7, and the vertical pipe is connected to the second cooling pipe 6; a stirring mechanism 8 is arranged on the first cooling box 1, and the stirring mechanism 8 is used to stir the cooling water in the first cooling box 1; a cooling mechanism 9 is assembled on the second cooling box 5, and the cooling mechanism 9 is used to cool the cutting fluid entering the second cooling pipe 6.

[0022] In this embodiment, the cutting fluid discharge pipe on the lathe is connected to the filter box 7, and the used cutting fluid enters the filter box 7 for filtration. Through the multi-stage filtration of the filter box 7, the impurities in the cutting fluid can be fully filtered, thereby improving the safety of the recycling of the cutting fluid. The circulation pump 2 is started, and the filtered cutting fluid enters the second cooling tube 6 in the second cooling box 5. The semiconductor refrigeration sheet 101 is started to stir the cooling water in the first cooling box 1, and the stirring mechanism 8 is started at the same time, so that the semiconductor refrigeration sheet 101 evenly cools the coolant water in the first cooling box 1. When the stirring mechanism 8 is used, the cooling mechanism 9 will be started to cool the cutting fluid entering the second cooling tube 6 (the second cooling box 5 is opened There is a heat dissipation port), the cutting fluid after preliminary cooling enters the first cooling tube 3, the low-temperature cooling water in the first cooling box 1 contacts the high-temperature cutting fluid in the first cooling tube 3, and according to the principle of heat exchange, the cutting fluid in the first cooling tube 3 can be cooled overnight, and the cutting fluid after cooling overnight is sprayed onto the workpiece processed by the machine tool again through the connecting tube 4 (the connecting tube 4 is connected to the corresponding pipeline for spraying cutting fluid on the bed) for recycling. During the whole process of cutting fluid treatment, the impurities in the cutting fluid can be fully filtered and treated, thereby improving the safety of the recycling of the cutting fluid. At the same time, the cutting fluid can be cooled in different ways to effectively improve the cooling effect of the cutting fluid, thereby ensuring the use effect of the cutting fluid.

[0023] In a further preferred embodiment of the utility model, the filter box 7 includes a first filter plate 701, a second filter plate 702 and activated carbon 703, and the first filter plate 701, the second filter plate 702 and the activated carbon 703 are all arranged in the filter box 7, the first filter plate 701 and the second filter plate 702 are used to filter impurities in the cutting fluid, and the activated carbon 703 is used to filter fine impurities in the cutting fluid.

[0024] In this embodiment, the first filter plate 701 and the second filter plate 702 are used to filter impurities of different sizes in the cutting fluid, and the activated carbon 703 can filter out fine impurities in the cutting fluid. Through multiple filtering treatments in different ways, the impurities in the cutting fluid can be fully filtered and treated, thereby improving the safety of the recycling of the cutting fluid.

[0025] In a further preferred embodiment of the utility model, a boosting mechanism is provided on the filter box 7, and the boosting mechanism is used to pass the cutting fluid through the activated carbon 703, and the boosting mechanism includes: a boosting pump 704 fixedly mounted on the outer wall of one side of the filter box 7; a boosting pipe 705 fixedly mounted on the filter box 7, the boosting pipe 705 is connected to the boosting pump 704, and the boosting pipe 705 is located above the activated carbon 703.

[0026] In this embodiment, when the cutting fluid passes through the first filter plate 701 and the second filter plate 702, the booster pump 704 is started by the controller to increase the pressure in the filter box 7, so that the cutting fluid can quickly pass through the activated carbon 703 for filtration, thereby improving the filtration efficiency.

[0027] In a further preferred embodiment of the utility model, the stirring mechanism 8 includes: a driving motor 801 fixedly installed at the bottom of the first cooling box 1; two stirring frames 802 rotatably installed on the first cooling box 1, and one end of one of the stirring frames 802 is fixedly connected to the output shaft of the driving motor 801; two first pulleys 803 respectively fixedly mounted on the two stirring frames 802, and the two first pulleys 803 are provided with a first belt 804.

[0028] In this embodiment, when the stirring mechanism 8 is used, the driving motor 801 is started by the controller, and the interaction between the first pulley 803 and the first belt 804 drives the two stirring frames 802 to rotate to stir the cooling water in the first cooling box 1, thereby allowing the semiconductor refrigeration plate 101 to evenly cool the coolant water in the first cooling box 1.

[0029] In a further preferred embodiment of the utility model, the cooling mechanism 9 includes: a placement shaft 901 rotatably mounted on the second cooling box 5; a fan blade 902 fixedly mounted on the placement shaft 901, and the fan blade 902 is located on one side of the second cooling tube 6; two second pulleys 903 respectively fixedly mounted on the placement shaft 901 and one of the stirring frames 802, and a second belt 904 is mounted on the two second pulleys 903.

[0030] In this embodiment, when the stirring frame 802 rotates, the interaction between the second pulley 903 and the second belt 904 drives the fan blades 902 on the placement shaft 901 to rotate, thereby accelerating the flow of air on the surface of the second cooling tube 6, thereby cooling the cutting fluid in the second cooling tube 6.

[0031] In a further preferred embodiment of the utility model, a heat dissipation mechanism is provided at the bottom of the first cooling box 1, and the heat dissipation mechanism is used to dissipate heat for the semiconductor refrigeration plate 101, and the heat dissipation mechanism comprises: a mounting shaft 10 rotatably mounted on the bottom of the first cooling box 1; a fan 11 fixedly mounted on the mounting shaft 10, and the fan 11 corresponds to the heat dissipation surface of the semiconductor refrigeration plate 101; two third pulleys 12 fixedly mounted on the mounting shaft 10 and one of the stirring frames 802, respectively, and a third belt 13 is mounted on the two third pulleys 12.

[0032] In this embodiment, when the stirring frame 802 rotates, the interaction between the third pulley 12 and the third belt 13 can drive the fan blade 11 on the mounting shaft 10 to rotate, thereby dissipating the heat of the semiconductor refrigeration plate 101 and improving the use effect of the semiconductor refrigeration plate 101.

[0033] In a further preferred embodiment of the present invention, a controller is provided on one side outer wall of the second cooling box 5, and the controller is used for performing control operations.

[0034] In this embodiment, the control operation is conveniently performed through a controller.

[0035] To sum up, compared with the related art, a cooling mechanism for cutting fluid processing is formed by the first cooling box 1, semiconductor refrigeration sheet 101, circulating pump 2, first cooling tube 3, connecting tube 4, second cooling box 5, second cooling tube 6, filter box 7, stirring mechanism 8, cooling mechanism 9, boosting mechanism, heat dissipation mechanism and controller. The impurities in the cutting fluid can be fully filtered and treated, thereby improving the safety of the recycling of the cutting fluid. At the same time, the cutting fluid can be cooled in different ways to effectively improve the cooling effect of the cutting fluid, thereby ensuring the use effect of the cutting fluid.

[0036] In the several embodiments provided in this application, it should be understood that the disclosed device can be implemented in other ways.

[0037] The above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit the protection scope of the utility model. Obviously, the described embodiments are only some embodiments of the utility model, rather than all embodiments. Based on these embodiments, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model. Although the utility model has been described in detail with reference to the above embodiments, ordinary technicians in this field can still combine, add, delete or make other adjustments to the features in the various embodiments of the utility model according to the circumstances without conflict, without making creative work, so as to obtain different other technical solutions that do not deviate from the concept of the utility model in essence, and these technical solutions also belong to the scope of protection of the utility model.

Claims

1. A cooling mechanism for cutting fluid processing, characterized in that: include: A first cooling box, the first cooling box is used to cool the cutting fluid, the first cooling box is provided with a semiconductor cooling sheet, the semiconductor cooling sheet is used to cool the cooling water in the first cooling box; A circulating pump fixedly mounted on an outer wall of one side of the first cooling box; A first cooling pipe fixedly installed in the first cooling box, one end of the first cooling pipe being connected to the water inlet end of the circulation pump; A connecting pipe fixedly mounted on the circulating pump; A second cooling box is arranged on one side of the first cooling box, wherein a second cooling pipe is arranged in the second cooling box, and the second cooling pipe is connected to the first cooling pipe; A filter box fixedly mounted on the top of the second cooling box, the filter box is used to filter impurities in the cutting fluid, a vertical pipe is provided on the filter box, and the vertical pipe is connected to the second cooling pipe; a stirring mechanism disposed on the first cooling box, the stirring mechanism being used to stir the cooling water in the first cooling box; A cooling mechanism is mounted on the second cooling box, and is used to cool the cutting fluid entering the second cooling pipe.

2. The cooling mechanism for cutting fluid processing according to claim 1, characterized in that: The filter box includes a first filter plate, a second filter plate and activated carbon. The first filter plate, the second filter plate and the activated carbon are all arranged in the filter box. The first filter plate and the second filter plate are used to filter impurities in the cutting fluid, and the activated carbon is used to filter fine impurities in the cutting fluid.

3. The cooling mechanism for cutting fluid machining according to claim 2, characterized in that: The filter box is provided with a pressurizing mechanism, which is used to pass the cutting fluid through the activated carbon, and the pressurizing mechanism includes: A booster pump fixedly mounted on an outer wall of one side of the filter box; A boosting pipe is fixedly mounted on the filter box, the boosting pipe is connected to the boosting pump, and the boosting pipe is located above the activated carbon.

4. The cooling mechanism for cutting fluid machining according to claim 1, characterized in that: The stirring mechanism comprises: A drive motor fixedly mounted on the bottom of the first cooling box; Rotating two stirring racks mounted on the first cooling box, wherein one end of one of the stirring racks is fixedly connected to the output shaft of the driving motor; Two first belt pulleys are respectively fixedly mounted on the two stirring frames, and the first belt pulleys are mounted with a first belt.

5. The cooling mechanism for cutting fluid machining according to claim 4, characterized in that: The cooling mechanism comprises: Rotating a placement shaft mounted on the second cooling box; A fan blade fixedly mounted on the placement shaft, wherein the fan blade is located on one side of the second cooling tube; Two second belt pulleys are respectively fixedly sleeved on the placement shaft and one of the stirring frames, and the two second belt pulleys are sleeved with a second belt.

6. The cooling mechanism for cutting fluid machining according to claim 4, characterized in that: A heat dissipation mechanism is provided at the bottom of the first cooling box, and the heat dissipation mechanism is used to dissipate heat from the semiconductor refrigeration sheet, and the heat dissipation mechanism includes: Rotating a mounting shaft mounted on the bottom of the first cooling box; A fan piece fixedly mounted on the mounting shaft, wherein the fan piece corresponds to a heat dissipation surface of the semiconductor refrigeration sheet; Two third belt pulleys are respectively fixedly mounted on the installation shaft and one of the stirring frames, and a third belt is mounted on the two third belt pulleys.

7. The cooling mechanism for cutting fluid machining according to claim 1, characterized in that: A controller is disposed on one side outer wall of the second cooling box, and the controller is used for performing control operations.

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