Semiconductor chemical liquid pipe joint structure

Abstract

The utility model relates to a semiconductor chemical liquid pipe joint structure, which is mainly characterized in that a through hole with two through sides is formed in a pressing joint main body of a pipe joint, thread sections are formed on the outer edges of the two sides of the pressing joint main body, airtight rings are correspondingly sleeved on the inner edges of the two sides of the through hole, and pressing rings are sleeved on the outer edges of the airtight rings. The pressing ring is pressed and fixed on the outer edge of the airtight ring, and a pressing nut is locked and fixed on the thread section; therefore, the pipe joint has the performances of corrosion resistance, wear resistance, leakage prevention and the like, and meanwhile, an adhesive is not used in a chemical conveying pipeline, so that volatile organic compound overflow can be effectively removed, pollution of volatile organic compounds can be reduced, alarm detection action can be prevented, and the stability of a wafer manufacturing process can be ensured; and the integral implementation and use are more practical.

Description

Technical Field

[0001] The utility model relates to a semiconductor chemical liquid pipe joint structure, and more particularly to an innovative design of a semiconductor chemical liquid pipe joint structure that enables the pipe joint to have corrosion resistance, wear resistance, and leakage resistance, and can reduce the pollution of volatile organic compounds and prevent alarm detection to ensure the stability of the wafer manufacturing process. The overall implementation and use of the semiconductor chemical liquid pipe joint structure has more practical effects. Background Art

[0002] In the semiconductor industry's manufacturing process, it is divided into upstream, midstream and downstream, which includes the overall structure of IC design, wafer manufacturing, IC packaging, testing and other stages; among them, in the scope of wafer manufacturing, it also includes the use and transportation of chemical processes.

[0003] With the vigorous development of the semiconductor industry, the process capacity continues to expand, the proportion of chemical use demand increases, and the demand for chemical process materials increases, which leads to the problem of how to properly solve the problem of volatile organic compounds. Volatile organic compounds (VOCs) include many liquids and gases, many of which are colorless and odorless; because they are volatile, they evaporate easily at room temperature. Volatile organic compounds (VOCs) may contain carcinogens, which directly endanger human health.

[0004] Clear PVC is one of the materials used to transport chemicals in the semiconductor industry. Adhesives are required for bonding during the configuration of the clear PVC. Therefore, it has the following disadvantages:

[0005] (1) This type of adhesive will produce volatile organic compounds (VOC) odor, causing the (VOCs) concentration detector alarm to activate.

[0006] (2) The transported chemicals may cause corrosion to the adhesive, thereby causing chemical leakage during the transportation process, resulting in room for improvement in the overall structural design.

[0007] Therefore, in view of this, the inventor, based on his many years of rich design, development and actual production experience in the related industry, further researched and improved the existing technical means to provide a semiconductor chemical liquid pipe joint structure in order to achieve better practical value. Utility Model Content

[0008] The main purpose of the utility model is to provide a semiconductor chemical liquid pipe joint structure, which mainly makes the pipe joint have the properties of corrosion resistance, wear resistance, and leakage prevention. At the same time, no adhesive is used in the chemical delivery pipeline configuration, which can effectively remove the spillage of volatile organic compounds (VOCs), reduce the pollution of volatile organic compounds, and prevent the alarm detection from being activated, so as to ensure the stability of the wafer manufacturing process, and it has more practical effects in its overall implementation and use.

[0009] The main purpose and effect of the semiconductor chemical liquid pipe joint structure of the utility model are achieved by the following specific technical means:

[0010] It mainly includes pipe joints; among which:

[0011] The pipe joint is provided with a compression joint body, through holes are formed on both sides of the compression joint body, and threaded sections are formed on both sides of the outer edges of the compression joint body. Airtight rings are sleeved on the inner edges of the through holes on both sides of the compression joint body, and a pressing ring is sleeved on the outer edge of the airtight ring, so that the pressing ring is tightened and fixed to the outer edge of the airtight ring, and then tightening nuts are locked and fixed on the threaded sections on both sides of the outer edges of the compression joint body.

[0012] In a preferred embodiment of the semiconductor chemical liquid pipe joint structure of the utility model, the material of the compression joint body is polyvinyl chloride (PVC).

[0013] In a preferred embodiment of the semiconductor chemical liquid pipe joint structure of the utility model, the material of the airtight ring is ethylene propylene rubber (EPDM).

[0014] In a preferred embodiment of the semiconductor chemical liquid pipe joint structure of the utility model, the material of the tight ring is polypropylene (PP).

[0015] In a preferred embodiment of the semiconductor chemical liquid pipe joint structure of the utility model, the material of the locking nut is polyvinyl chloride (PVC).

[0016] The beneficial effects of the utility model are: the pipe joint has the properties of corrosion resistance, wear resistance, and leakage prevention. At the same time, no adhesive is used in the chemical delivery pipeline configuration, which can effectively remove the spillage of volatile organic compounds (VOCs), reduce the pollution of volatile organic compounds, and prevent the alarm detection from being activated, so as to ensure the stability of the wafer manufacturing process, and it is more practical in its overall implementation and use. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The following drawings are only intended to illustrate and explain the present invention, and do not limit the scope of the present invention.

[0018] Figure 1: A three-dimensional exploded structural schematic diagram of the utility model.

[0019] Figure 2 : Schematic diagram of the three-dimensional combined structure of the utility model.

[0020] Figure 3 : A schematic diagram of the combined sectional structure of the present utility model.

[0021] Figure 4 : A schematic diagram of the cross-sectional structure of the utility model in use state.

[0022] Description of Figure Numbers:

[0023] 1: Pipe joint

[0024] 11: Tightening connector body

[0025] 111:Through hole

[0026] 112: Screw thread section

[0027] 12: Airtight ring

[0028] 13: Emergency Ring

[0029] 14: Locking nut

[0030] 2: Transparent tube DETAILED DESCRIPTION

[0031] In order to make the technical content, purpose and effect of the utility model more complete and clear, the following is a detailed description, and please refer to the drawings and the reference numerals in the specification:

[0032] First, see Figure 1 The utility model is a three-dimensional decomposition structure diagram, Figure 2 The three-dimensional combined structure diagram of the utility model and Figure 3 As shown in the schematic diagram of the combined cross-sectional structure of the utility model, the utility model mainly comprises a pipe joint (1); wherein:

[0033] The pipe joint 1 is provided with a compression joint body 11, which is made of polyvinyl chloride (PVC) material. Through holes 111 are formed on both sides of the compression joint body 11, and screw segments 112 are formed on the outer edges of both sides of the compression joint body 11. Airtight rings 12 are sleeved on the inner edges of both sides of the through holes 111 of the compression joint body 11. The airtight rings 12 are made of ethylene propylene rubber (EPDM) material. A pressing ring 13 is sleeved on the outer edge of the airtight ring 12. The pressing ring 13 is made of polypropylene (PP) material. The pressing ring 13 is tightened and fixed to the outer edge of the airtight ring 12, and then a tightening nut 14 is locked and fixed on the screw segments 112 on the outer edges of both sides of the compression joint body 11. The tightening nut 14 is made of polyvinyl chloride (PVC) material.

[0034] In this case, please also refer to Figure 4 As shown in the schematic diagram of the cross-sectional structure of the use state of the utility model, the utility model can be used in operation. The transparent tube (clear pvc) 2 can be inserted into the through hole 111 of the compression joint body 11 of the pipe joint 1, and the airtight ring 12 is sleeved between the inner edge of the through hole 111 and the outer edge of the transparent tube 2, and the compression ring 13 is tightly and fixedly sleeved on the outer edge of the airtight ring 12, and the compression nut 14 is locked and fixed with the thread segments 112 on both sides of the outer edge of the compression joint body 11, so that the transparent tube 2 can be tightly joined through the pipe joint 1, and when transporting chemicals in the semiconductor process, it can be achieved that there is no leakage.

[0035] The following is a comparison table of the utility model and the existing structure:

[0036]

[0037] From the above description, it can be seen from the composition and use implementation instructions of the structure of the utility model that compared with the existing structure, the utility model mainly makes the pipe joint have the properties of corrosion resistance, wear resistance, and leakage prevention. At the same time, no adhesive is used in the chemical delivery pipeline configuration, which can effectively remove the spillage of volatile organic compounds (VOCs), reduce the pollution of volatile organic compounds, and prevent the alarm detection from being activated, so as to ensure the stability of the wafer manufacturing process, and it is more practical in its overall implementation and use.

[0038] The aforementioned embodiments or drawings do not limit the structural mode of the present invention. Any appropriate changes or modifications by a person skilled in the art should be deemed to be within the patent scope of the present invention.

[0039] To sum up, the embodiments of the utility model can indeed achieve the expected use effect, and the specific structure recorded therein has not only never been seen in similar products, but has also not been disclosed before the application. It is truly in full compliance with the provisions and requirements of the Patent Law. Now an application for a utility model patent is filed in accordance with the law.

Claims

1. A semiconductor chemical liquid pipe joint structure, comprising a pipe joint; characterized in that: The pipe joint is provided with a compression joint body, through holes are formed on both sides of the compression joint body, and threaded sections are formed on both sides of the outer edges of the compression joint body. Airtight rings are sleeved on the inner edges of the through holes on both sides of the compression joint body, and a pressing ring is sleeved on the outer edge of the airtight ring, so that the pressing ring is tightened and fixed to the outer edge of the airtight ring, and then tightening nuts are locked and fixed on the threaded sections on both sides of the outer edges of the compression joint body.

2. The semiconductor chemical liquid pipe joint structure according to claim 1, characterized in that: The material of the compression joint body is polyvinyl chloride.

3. The semiconductor chemical liquid pipe joint structure according to claim 1, characterized in that: The material of the airtight ring is ethylene propylene rubber.

4. The semiconductor chemical liquid pipe joint structure according to claim 1, characterized in that: The material of the tightening ring is polypropylene.

5. The semiconductor chemical liquid pipe joint structure according to claim 1, characterized in that: The material of the locking nut is polyvinyl chloride.

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