Composite semiconductor ceramic heating plate structure

By designing support, adjustment and buffering mechanisms in the composite semiconductor ceramic heating disk, the problem of heating disk being susceptible to mechanical impacts and uneven ground during use is solved, achieving higher stability and service life, and providing an overweight warning function.

CN222839825UActive Publication Date: 2025-05-06DONGTAI SMILE NEW MATERIAL TECH
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Patent Information

Application Number
CN202421343161.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-13
Publication Date
2025-05-06
Estimated Expiration
2034-06-13

AI Technical Summary

Technical Problem

Composite semiconductor ceramic heating disks are susceptible to mechanical impacts and thermal stress during use, which increases the risk of damage. At the same time, they are easily tilted when used on uneven grounds, affecting the stability of the equipment.

Method used

A composite semiconductor ceramic heating disk structure is designed, including a support mechanism, an adjustment mechanism and a buffer mechanism. The buffering mechanism is evenly distributed on three surfaces of the mounting seat, and the impact force is absorbed through the buffering spring and the shock absorbing spring. The support mechanism fixes the heating disk body through the mounting seat and the support column, and the adjustment mechanism adjusts the height and horizontal position of the heating disk through the threaded column and the internal thread sleeve.

Benefits of technology

It effectively reduces the risk of damage to the heating plate body by mechanical impact, improves the stability and service life of the equipment, and reminds the user to avoid overweight heating through indicator lights to prevent equipment damage.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of heating plates, and discloses a composite semiconductor ceramic heating plate structure, which comprises a heating plate main body, a support mechanism, an adjusting mechanism and a buffer mechanism, and is characterized in that the bottom end of the heating plate main body is fixedly connected with the top end of the support mechanism; the inner wall of the side face of the supporting mechanism is fixedly connected with the side face of the buffering mechanism, and the top end of the adjusting mechanism is fixedly connected with the bottom end of the supporting mechanism. The buffering mechanisms are evenly distributed on the three faces of the installation base, the side faces of the buffering mechanisms are tightly attached to the inner wall of the base and movably connected with the inner wall of the base, the installation base is located in the center of the base, and when the heating disc body vibrates in the using process, the buffering mechanisms contract or stretch, and therefore the heating disc body is protected against vibration. The mounting base moves in the front-back direction, the left-right direction and the up-down direction in the base, impact force is absorbed through the buffering mechanism, damage to the heating disc body caused by mechanical impact is reduced, and the service life of the heating disc body is prolonged advantageously.
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Description

Technical Field

[0001] The utility model relates to the technical field of heating discs, and more specifically to a composite semiconductor ceramic heating disc structure. Background Art

[0002] Composite semiconductor ceramics refer to composite materials that combine semiconductor materials with ceramic materials. This combination can combine the advantages of semiconductors and ceramics and is widely used in electronic devices, high-temperature sensors, and heating elements. In terms of heating elements, composite semiconductor ceramic heating plates are a common application. By combining the rapid heating characteristics of semiconductors and the high-temperature resistance of ceramics, this heating plate can achieve rapid and uniform heating, and is suitable for a variety of scenarios such as laboratories, industrial production, and household appliances.

[0003] Deficiencies of existing technology: The structure of the composite semiconductor ceramic heating plate is relatively complex and is composed of a variety of materials. Therefore, it may be more susceptible to mechanical shock or thermal stress during use, thereby increasing the risk of damage. The existing composite semiconductor ceramic structure does not have a corresponding shock absorbing mechanism. When it is transported or items to be heated are placed on top for heating, there is impact that can easily cause damage; at the same time, the ground environment for placing the composite semiconductor ceramic heating plate is complex, and the ground is prone to unevenness, and it is easy to tilt when placed, affecting the stability of the equipment. Utility Model Content

[0004] In order to overcome the above defects of the prior art, the utility model provides a composite semiconductor ceramic heating plate structure to solve the problems existing in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a composite semiconductor ceramic heating plate structure, including a heating plate main body, and also including: a supporting mechanism, an adjusting mechanism and a buffer mechanism, the bottom end of the heating plate main body is fixedly connected to the top end of the supporting mechanism, the side inner wall of the supporting mechanism is fixedly connected to the side of the buffer mechanism, the top end of the adjusting mechanism is fixedly connected to the bottom end of the supporting mechanism, the supporting mechanism includes a mounting seat, the top end of the mounting seat is fixedly connected with a supporting column, the side of the mounting seat is fixedly connected to the side of the buffer mechanism, the side of the buffer mechanism is movably connected with a base, the top end of the base is provided with a through groove corresponding to the position of the supporting column, the top end of the support column is fixedly connected to the bottom end of the heating plate main body, the mounting seat and the base are both cylindrical structures, and the buffer mechanism is evenly distributed on the three surfaces of the mounting seat.

[0006] Furthermore, a buffer spring is fixedly connected to the inner wall of the bottom end of the base, a touch switch is fixedly connected to the top end of the buffer spring, and an indicator light is fixedly connected to the side of the base.

[0007] Furthermore, the buffer mechanism includes a mounting block, a side surface of the mounting block is fixedly connected to a side surface of the mounting seat, the side surface of the mounting block is movably connected to a support rod via a pin, the side surface of the support rod is movably connected to a shock-absorbing spring via a pin, and the side surface of the support rod is movably connected to a damper via a pin at a position corresponding to the shock-absorbing spring.

[0008] Furthermore, a connecting rod is movably sleeved on the side of the support rod, a mounting frame is movably sleeved on the side of the connecting rod, a roller is movably connected to the side of the mounting frame through a pin, and the side of the roller is movably connected to the side inner wall of the base.

[0009] Furthermore, the adjustment mechanism includes a threaded column, the top end of the threaded column is fixedly connected to the bottom end of the base, and the side surface of the threaded column is threadedly connected to an internal threaded sleeve.

[0010] Furthermore, the bottom end of the internal threaded sleeve is fixedly connected to a universal ball head, and the bottom end of the universal ball head is movably sleeved with an anti-slip seat.

[0011] Furthermore, a fixed hexagonal block is fixedly connected to the side surface of the internal threaded sleeve, and a fastening nut is threadedly connected to the side surface of the threaded column.

[0012] Technical effects and advantages of the utility model:

[0013] 1. The utility model evenly distributes the buffer mechanism on the three surfaces of the mounting seat, and the side surfaces of the buffer mechanism are in close contact with the inner wall of the base and are movably connected, so that the mounting seat is located at the center of the base. When the heating plate body vibrates during use, the buffer mechanism contracts or stretches to move the mounting seat in the front-back, left-right and up-down directions inside the base, and absorbs the impact force through the buffer mechanism, thereby reducing the damage to the heating plate body caused by mechanical impact, which is beneficial to extending the service life of the heating plate body.

[0014] 2. The utility model places the equipment at a suitable position, adjusts the four adjustment mechanisms in sequence according to usage requirements, rotates the threads of the internal threaded sleeve to drive the internal threaded sleeve to move up and down along the side of the threaded column, so that the four anti-slip seats are in contact with the ground. When the anti-slip seats are in contact with the ground, the anti-slip seats rotate along the universal ball head so that the entire bottom of the anti-slip seats are in contact with the ground, so that the heating plate body is moved to a suitable height and kept level, which is beneficial to improving the stability of the equipment.

[0015] 3. The utility model places the object to be heated on the top of the heating plate body, and the mounting seat moves downward under the action of gravity. When the mounting seat contacts the touch switch, the touch switch control indicator light emits red light, indicating that the object on the heating plate body is overweight and the heating plate body cannot be used for heating, which is beneficial to avoid damage to the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 It is a cross-sectional schematic diagram of the support mechanism of the utility model;

[0018] Figure 3 This is a schematic diagram of the internal structure of the base of the utility model;

[0019] Figure 4 This is a schematic diagram of the structure of the buffer mechanism of the utility model;

[0020] Figure 5 It is a schematic diagram of the structure of the regulating mechanism of the utility model.

[0021] The accompanying drawings are marked as follows: 1. Heating plate body; 2. Support mechanism; 201. Base; 202. Support column; 203. Mounting seat; 204. Buffer spring; 205. Touch switch; 206. Through slot; 207. Indicator light; 3. Adjustment mechanism; 301. Internal threaded sleeve; 302. Threaded column; 303. Anti-slip seat; 304. Fixed hexagonal block; 305. Fastening nut; 306. Universal ball head; 4. Buffer mechanism; 401. Mounting block; 402. Support rod; 403. Shock-absorbing spring; 404. Damper; 405. Roller; 406. Mounting bracket; 407. Connecting rod. DETAILED DESCRIPTION

[0022] The technical solution of the present invention will be clearly and completely described below in conjunction with the drawings in the present invention. In addition, the forms of the various structures recorded in the following embodiments are merely illustrative. The composite semiconductor ceramic heating plate structure involved in the present invention is not limited to the various structures recorded in the following embodiments. All other implementations obtained by ordinary technicians in this field without making creative work belong to the scope of protection of the present invention.

[0023] Reference Figures 1 to 5The utility model provides a composite semiconductor ceramic heating plate structure, including a heating plate body 1, and also includes: a supporting mechanism 2, an adjusting mechanism 3 and a buffer mechanism 4, the bottom end of the heating plate body 1 is fixedly connected to the top end of the supporting mechanism 2, the side inner wall of the supporting mechanism 2 is fixedly connected to the side of the buffer mechanism 4, the top of the adjusting mechanism 3 is fixedly connected to the bottom end of the supporting mechanism 2, the supporting mechanism 2 includes a mounting seat 203, the top of the mounting seat 203 is fixedly connected with a supporting column 202, the side of the mounting seat 203 is fixedly connected to the side of the buffer mechanism 4, the side of the buffer mechanism 4 is movably connected with a base 201, the top of the base 201 corresponds to the position of the supporting column 202 and is provided with a through groove 206, the top of the supporting column 202 It is fixedly connected to the bottom end of the heating plate body 1, the mounting seat 203 and the base 201 are both cylindrical structures, the buffer mechanisms 4 are evenly distributed on the three surfaces of the mounting seat 203, the four supporting mechanisms 2 are evenly distributed on the bottom end of the heating plate body 1, the buffer mechanisms 4 are evenly distributed on the three surfaces of the mounting seat 203, and the side surfaces of the buffer mechanisms 4 are tightly attached to the inner wall of the base 201 and are movably connected, so that the mounting seat 203 is located at the center of the base 201. When the heating plate body 1 vibrates during use, the buffer mechanism 4 contracts or stretches, so that the mounting seat 203 moves in the front and back, left and right, and up and down directions inside the base 201, and absorbs the impact force through the buffer mechanism 4, thereby reducing the damage to the heating plate body 1 caused by mechanical shock.

[0024] Among them, a buffer spring 204 is fixedly connected to the inner wall of the bottom end of the base 201, a touch switch 205 is fixedly connected to the top of the buffer spring 204, and an indicator light 207 is fixedly connected to the side of the base 201. The items to be heated are placed on the top of the heating plate body 1, and the mounting seat 203 moves downward under the action of gravity. When the mounting seat 203 contacts the touch switch 205, the touch switch 205 controls the indicator light 207 to emit red light, indicating that the items on the heating plate body 1 are overweight and will cause damage to the heating plate body 1.

[0025] Among them, the buffer mechanism 4 includes a mounting block 401, the side of the mounting block 401 is fixedly connected to the side of the mounting seat 203, the side of the mounting block 401 is movably connected to the support rod 402 through a pin, the side of the support rod 402 is movably connected to the shock-absorbing spring 403 through a pin, and the side of the support rod 402 is movably connected to the damper 404 through a pin corresponding to the position of the shock-absorbing spring 403. The shock-absorbing spring 403 pulls the support rods 402 on both sides to rotate along the pins on the side of the mounting block 401, so that the roller 405 is always close to the inner wall of the base 201. When vibration occurs, the shock-absorbing spring 403 contracts or pulls to support the support rod 402, and the damper 404 absorbs kinetic energy.

[0026] Among them, the side of the support rod 402 is movably connected with a connecting rod 407, and the side of the connecting rod 407 is movably connected with a mounting frame 406. The side of the mounting frame 406 is movably connected with a roller 405 through a pin. The side of the roller 405 is movably connected to the side inner wall of the base 201. When the support rod 402 rotates along the side pin of the mounting block 401, the roller 405 rolls along the inside of the base 201 to reduce the friction between the support rod 402 and the inner wall of the base 201. At the same time, the mounting frame 406 rotates along the connecting rod 407, so that the roller 405 can roll freely along the inner wall of the base 201.

[0027] Among them, the adjustment mechanism 3 includes a threaded column 302, the top of the threaded column 302 is fixedly connected to the bottom of the base 201, and the side of the threaded column 302 is threadedly connected with an internal threaded sleeve 301. According to the use requirements, the four internal threaded sleeves 301 are rotated in sequence to drive the internal threaded sleeves 301 to move up and down along the side of the threaded column 302 through the threads, so that the four anti-slip seats 303 are all in contact with the ground, so that the heating plate main body 1 is moved to a suitable height and kept level.

[0028] Among them, the bottom end of the internal threaded sleeve 301 is fixedly connected with a universal ball head 306, and the bottom end of the universal ball head 306 is movably connected with an anti-slip seat 303. When the anti-slip seat 303 contacts the ground, the anti-slip seat 303 rotates along the universal ball head 306, so that the entire bottom of the anti-slip seat 303 contacts the ground.

[0029] Among them, the side of the internal threaded sleeve 301 is fixedly connected with a fixed hexagonal block 304, and the side of the threaded column 302 is threadedly connected with a fastening nut 305. When adjusting the adjustment mechanism 3, the fastening nut 305 is rotated upward to separate the bottom of the fastening nut 305 from the top of the fixed hexagonal block 304, so as to facilitate the internal threaded sleeve 301 to rotate through the fixed hexagonal block 304. After the adjustment is completed, the fastening nut 305 is rotated downward to make the bottom end of the fastening nut 305 close to the top of the fixed hexagonal block 304 to fix the internal threaded sleeve 301 through friction.

[0030] The working principle of the utility model is as follows: the equipment is placed in a suitable position, and the four adjustment mechanisms 3 are adjusted in sequence according to the use requirements, that is, the fastening nut 305 is turned upward to separate the bottom of the fastening nut 305 from the top of the fixed hexagonal block 304, which is convenient for driving the internal threaded sleeve 301 to rotate through the fixed hexagonal block 304, and the thread drives the internal threaded sleeve 301 to move up and down along the side of the threaded column 302, so that the four anti-slip seats 303 are all in contact with the ground. When the anti-slip seat 303 is in contact with the ground, the anti-slip seat 303 rotates along the universal ball head 306 so that the entire bottom of the anti-slip seat 303 is in contact with the ground, so that the heating plate body 1 is moved to a suitable height and kept horizontal. After the adjustment is completed, the fastening nut 305 is turned downward to make the bottom end of the fastening nut 305 close to the top of the fixed hexagonal block 304, and the internal threaded sleeve 301 is fixed by friction. During use, the heating plate body When vibration occurs, the buffer mechanism 4 contracts or stretches, so that the mounting seat 203 moves in the front-back, left-right and up-down directions inside the base 201, and the buffer mechanism 4 absorbs the impact force, thereby reducing the damage to the heating plate body 1 caused by mechanical impact. The object to be heated is placed on the top of the heating plate body 1, and the mounting seat 203 moves downward under the action of gravity. When the mounting seat 203 contacts the touch switch 205, the touch switch 205 controls the indicator light 207 to emit a red light, indicating that the object on the heating plate body 1 is overweight and the heating plate body 1 cannot be used for heating. When the buffer mechanism 4 absorbs shock, the shock-absorbing spring 403 pulls the support rods 402 on both sides to rotate along the pins on the side of the mounting block 401, so that the roller 405 is always close to the inner wall of the base 201. When vibration occurs, the shock-absorbing spring 403 contracts or pulls to support the support rod 402, and the damper 404 absorbs kinetic energy.

[0031] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A composite semiconductor ceramic heating plate structure, comprising a heating plate body (1), characterized in that: Also includes: A support mechanism (2), an adjustment mechanism (3) and a buffer mechanism (4), wherein the bottom end of the heating plate body (1) is fixedly connected to the top end of the support mechanism (2), the side inner wall of the support mechanism (2) is fixedly connected to the side of the buffer mechanism (4), the top end of the adjustment mechanism (3) is fixedly connected to the bottom end of the support mechanism (2), the support mechanism (2) comprises a mounting seat (203), the top end of the mounting seat (203) is fixedly connected to a support column (202), and the mounting seat (20 The side of the heating plate (3) is fixedly connected to the side of the buffer mechanism (4), the side of the buffer mechanism (4) is movably connected to the base (201), the top of the base (201) is provided with a through groove (206) at a position corresponding to the support column (202), the top of the support column (202) is fixedly connected to the bottom of the heating plate body (1), the mounting seat (203) and the base (201) are both cylindrical structures, and the buffer mechanism (4) is evenly distributed on three surfaces of the mounting seat (203).

2. The composite semiconductor ceramic heating plate structure according to claim 1, characterized in that: A buffer spring (204) is fixedly connected to the inner wall of the bottom end of the base (201), a touch switch (205) is fixedly connected to the top end of the buffer spring (204), and an indicator light (207) is fixedly connected to the side of the base (201).

3. The composite semiconductor ceramic heating plate structure according to claim 1, characterized in that: The buffer mechanism (4) comprises a mounting block (401), the side of the mounting block (401) being fixedly connected to the side of the mounting seat (203), the side of the mounting block (401) being movably connected to a support rod (402) via a pin, the side of the support rod (402) being movably connected to a shock absorbing spring (403) via a pin, and the side of the support rod (402) being movably connected to a damper (404) via a pin at a position corresponding to the shock absorbing spring (403).

4. The composite semiconductor ceramic heating plate structure according to claim 3, characterized in that: The side of the support rod (402) is movably sleeved with a connecting rod (407), the side of the connecting rod (407) is movably sleeved with a mounting frame (406), the side of the mounting frame (406) is movably connected to a roller (405) via a pin, and the side of the roller (405) is movably connected to the inner wall of the side of the base (201).

5. The composite semiconductor ceramic heating plate structure according to claim 1, characterized in that: The adjustment mechanism (3) comprises a threaded column (302), the top end of the threaded column (302) is fixedly connected to the bottom end of the base (201), and the side surface of the threaded column (302) is threadedly connected to an internal threaded sleeve (301).

6. The composite semiconductor ceramic heating plate structure according to claim 5, characterized in that: The bottom end of the internal thread sleeve (301) is fixedly connected to a universal ball head (306), and the bottom end of the universal ball head (306) is movably sleeved with an anti-slip seat (303).

7. The composite semiconductor ceramic heating plate structure according to claim 5, characterized in that: A fixed hexagonal clamping block (304) is fixedly connected to the side surface of the internal threaded sleeve (301), and a fastening nut (305) is threadedly connected to the side surface of the threaded column (302).