Chemical vapor deposition equipment

Abstract

The utility model relates to chemical vapor deposition equipment which comprises a shell, an electrode assembly and a grounding wire, a deposition chamber is formed in the shell, a base is arranged at the bottom of the deposition chamber, the electrode assembly comprises a lower electrode, the lower electrode is arranged above the base in a lifting mode, and the two ends of the grounding wire are connected with the lower electrode and the base respectively. The base comprises a storage cavity and a take-up device arranged in the storage cavity, and part of the grounding wire is wound around the take-up device so that the redundant part of the grounding wire can be stored in the storage cavity. The redundant part of the grounding wire is accommodated in the accommodating cavity by using the take-up device, so that the grounding wire can be prevented from being repeatedly extruded and pulled between the lower electrode and the base, and the grounding reliability of the grounding wire is further prevented from being reduced due to metal fatigue damage.

Description

Technical Field

[0001] The utility model relates to the technical field of display device manufacturing, in particular to a chemical vapor deposition device. Background Art

[0002] With the development of semiconductor technology, the development and use of plasma enhanced chemical vapor deposition (PECVD) devices are becoming more and more widespread. This device uses glow discharge to ionize chemical gases and then form a thin film structure on a glass substrate. Figure 1 As shown, an existing chemical vapor deposition device includes a shell 1', an upper electrode 2', a lower electrode 3', a base 4', a support rod 5' and a sleeve 6'. The shell 1' has a deposition chamber 11' for accommodating a glass substrate, and the base 4' is arranged at the bottom of the deposition chamber 11'. The upper electrode 2' is arranged at the top of the shell deposition chamber 11', and the lower electrode 3' can be raised and lowered at the bottom of the deposition chamber 11'. When depositing a coating, the glass substrate is placed on the lower electrode 3' and is directly opposite to the upper electrode 2'. The top of the base 4' is provided with a receiving groove 41' for accommodating the lower electrode 3', and the bottom of the receiving groove 41' is provided with a blind hole 42'. The sleeve 6' is arranged at the bottom of the lower electrode 3', and the support rod 5' is passed through the sleeve 6' and the lower electrode 3'. When taking and placing the glass substrate, the lower electrode 3' descends and enters the receiving groove 41', and at the same time, the sleeve 6' is inserted into the blind hole 42'. The support rod 5′ slides upward relative to the sleeve 6′, and the top of the support rod 5′ protrudes from the surface of the lower electrode 3′. At this time, the glass substrate is placed on the top of the support rod 5′ to facilitate the robot to grab it. When depositing the coating, the lower electrode 3′ rises, the sleeve 6′ is separated from the base 4′, the support rod 5′ slides downward relative to the sleeve 6′, and the glass substrate is placed flat on the surface of the lower electrode 3′. The lower electrode 3′ is connected to a power supply, and a grounding wire 7′ is connected between the lower electrode 3′ and the base 4′. The base 4′ is electrically connected to the earth to achieve grounding of the lower electrode 3′.

[0003] The prior art has the following disadvantages: due to the long-term lifting and lowering movement of the lower electrode 3', the grounding wire 7' is frequently pulled and squeezed by the lower electrode 3' and the base 4', which causes metal fatigue damage to the grounding wire 7', affecting the reliable grounding of the equipment. Utility Model Content

[0004] The utility model aims to provide a chemical vapor deposition device, which can avoid fatigue damage of the grounding wire and ensure reliable grounding.

[0005] To achieve this purpose, the utility model adopts the following technical solutions:

[0006] A chemical vapor deposition device is provided, comprising a shell, an electrode assembly and a grounding wire, wherein a deposition chamber is formed in the shell, a base is arranged at the bottom of the deposition chamber, the electrode assembly comprises a lower electrode for supporting a glass substrate, the lower electrode is liftable and arranged above the base, two ends of the grounding wire are respectively connected to the lower electrode and the base, the base comprises a storage cavity and a wire taking-up device arranged in the storage cavity, a part of the grounding wire is wound around the wire taking-up device so that a redundant part of the grounding wire is stored in the storage cavity.

[0007] As a preferred solution of the chemical vapor deposition equipment, the wire-taking device includes a counterweight wheel, and guide grooves are provided on two opposite walls of the storage cavity. The length of the guide grooves extends in the vertical direction. The two ends of the counterweight wheel are respectively inserted in the two guide grooves and can move along the length direction of the guide grooves. The end of the grounding wire facing away from the lower electrode bypasses the bottom of the counterweight wheel and extends upward.

[0008] As a preferred solution of the chemical vapor deposition equipment, the wire take-up device also includes an elastic member, two ends of which are respectively connected to the counterweight wheel and the bottom of the storage cavity, and the elastic member applies a downward pulling force to the counterweight wheel.

[0009] As a preferred solution of the chemical vapor deposition equipment, the counterweight wheel includes a wheel body and a rotating shaft arranged at both ends of the wheel body in the axial direction, the diameter of the wheel body is larger than the diameter of the rotating shaft, the rotating shaft is plugged into the guide groove, and the grounding wire is wound around the wheel body.

[0010] As a preferred solution of the chemical vapor deposition equipment, the wire taking-up device includes a winding wheel, which is rotatably arranged on the cavity wall of the storage cavity, and the grounding wire is wound on the winding wheel.

[0011] As a preferred solution of the chemical vapor deposition equipment, the base also includes a cover plate, which is penetrated by a wire hole for passing the grounding wire, and the storage cavity has an opening at one end facing the lower electrode, and the cover plate is inserted into the opening of the storage cavity.

[0012] As a preferred solution of the chemical vapor deposition equipment, the cover plate is detachably connected to the opening of the storage cavity.

[0013] As a preferred solution of the chemical vapor deposition equipment, a wiring terminal is provided at one end of the grounding wire, the wiring terminal is detachably connected to the lower electrode, and the wiring terminal can be plugged into the wire hole and seal the wire hole.

[0014] As a preferred solution of the chemical vapor deposition equipment, it also includes a sleeve and a support rod, the sleeve is arranged on a side of the lower electrode facing the base, the support rod is passed through the sleeve and the lower electrode, the support rod can move along the axial direction of the sleeve, and the base is provided with a blind hole for inserting the sleeve.

[0015] As a preferred solution of the chemical vapor deposition equipment, the electrode assembly further includes an upper electrode, and the upper electrode is spaced apart and arranged above the lower electrode.

[0016] Compared with the prior art, the utility model has the following beneficial effects:

[0017] The utility model provides a chemical vapor deposition device, which can prevent the grounding wire from being repeatedly squeezed and pulled between the lower electrode and the base by setting a storage cavity on the base and using a wire take-up device to store the redundant part of the grounding wire in the storage cavity, thereby preventing the grounding wire from being damaged by metal fatigue and reducing the reliability of grounding. At the same time, by setting a wire take-up device to store the redundant part of the grounding wire, the grounding wire between the base and the lower electrode can be in a straight state, avoiding the redundant grounding wire from shaking frequently due to the vacuuming of the deposition chamber during the chemical vapor deposition process, thereby preventing the grounding wire from being loosened or worn due to frequent shaking, and ensuring reliable grounding of the grounding wire. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The utility model is further described in detail below based on the drawings and embodiments.

[0019] Figure 1 It is a schematic diagram of a chemical vapor deposition device in the prior art.

[0020] Figure 2 It is a schematic diagram of a chemical vapor deposition device in a first state according to an embodiment of the present utility model.

[0021] Figure 3 It is a schematic diagram of the chemical vapor deposition equipment in the second state according to an embodiment of the present invention.

[0022] Figure 4 A partial cross-sectional view of a chemical vapor deposition device according to an embodiment of the present invention.

[0023] Figure 5 The figure is a schematic diagram of the installation of the counterweight wheel and the base according to one embodiment of the utility model.

[0024] Figure 6 A partial cross-sectional view of a chemical vapor deposition device according to another embodiment of the present invention.

[0025] Figure 1 middle:

[0026] 1′, shell; 11′, deposition chamber; 2′, upper electrode; 3′, lower electrode; 4′, base; 41′, receiving groove; 42′, blind hole; 5′, support rod; 6′, sleeve; 7′, grounding wire.

[0027] Figures 2 to 6 middle:

[0028] 1. Shell; 11. Deposition chamber; 2. Upper electrode; 3. Lower electrode; 4. Base; 40. Bottom plate; 41. Receiving groove; 42. Blind hole; 43. Storage chamber; 44. Cover plate; 441. Wire hole; 45. Guide groove; 46. Counterweight wheel; 461. Wheel body; 462. Rotating shaft; 47. Winding wheel; 48. Elastic part; 49. Bushing; 5. Support rod; 6. Sleeve; 7. Grounding wire; 71. Terminal block; 8. Glass substrate; 9. Lifting device. DETAILED DESCRIPTION

[0029] The advantages and features of the present invention and the methods for achieving them will become apparent with reference to the embodiments described in detail below in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various forms. The present embodiments are provided only to complete the disclosure of the present invention and to enable those skilled in the art to fully understand the scope of the present invention, and the present invention is limited only by the scope of the claims. The same reference numerals represent the same constituent elements throughout the specification.

[0030] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

[0031] like Figures 2 to 4As shown, a chemical vapor deposition device is provided for performing chemical vapor deposition on a glass substrate 8 to form a thin film structure on the glass substrate 8. The chemical vapor deposition device includes a shell 1, an electrode assembly, a grounding wire 7 and a base 4. Among them, the shell 1 is a hollow structure, and a deposition chamber 11 for performing chemical vapor deposition on the glass substrate 8 is formed in the shell 1. The electrode assembly includes an upper electrode 2 and a lower electrode 3. The upper electrode 2 is arranged at the top of the deposition chamber 11, and the lower electrode 3 is arranged at the bottom of the deposition chamber 11. The lower electrode 3 is connected to a lifting device 9, and the lifting device 9 can be a hydraulic cylinder, a cylinder or an electric telescopic part, etc., and the lifting device 9 is used to drive the lower electrode 3 to move up and down. The upper electrode 2 and the lower electrode 3 are both prior art, and the upper electrode 2 and the lower electrode 3 are parallel and spaced in the vertical direction. During the chemical vapor deposition process, the glass substrate 8 is placed on the lower electrode 3, and a resistance wire is arranged in the lower electrode 3 to heat the glass substrate 8 so that the temperature of the glass substrate 8 meets the process requirements. The upper electrode 2 inputs chemical gas into the deposition chamber 11, the upper electrode 2 is connected to the radio frequency current, and the lower electrode 3 is grounded. The chemical gas forms plasma in the electric field and is deposited on the glass substrate 8 to form a thin film structure. The base 4 is arranged at the bottom of the deposition chamber 11, and the lower electrode 3 is located above the base 4. By lifting and lowering the lower electrode 3, the lower electrode 3 can be close to or away from the base 4 in the vertical direction (Z direction shown in the figure). The two ends of the grounding wire 7 are respectively connected to the lower electrode 3 and the base 4 to achieve electrical connection between the base 4 and the lower electrode 3. The base 4 is grounded, so that the lower electrode 3 is grounded through the base 4. The base 4 includes a storage cavity 43 and a wire-receiving device arranged in the storage cavity 43, and part of the grounding wire 7 is wound around the wire-receiving device so that the redundant part of the grounding wire 7 can be received in the storage cavity 43.

[0032] It is understandable that, since the lower electrode 3 can move up and down above the base 4, the distance between the lower electrode 3 and the base 4 can be changed. The length of the grounding wire 7 should match the maximum distance between the lower electrode 3 and the base 4. The redundant part of the grounding wire 7 refers to the redundant part of the grounding wire 7 after satisfying the electrical connection between the lower electrode 3 and the base 4, that is, the redundant part is equal to the total length of the grounding wire 7 minus the distance between the lower electrode 3 and the base 4. In this embodiment, by providing a storage cavity 43 on the base 4 and using a wire-retracting device to store the redundant part of the grounding wire 7 in the storage cavity 43, the grounding wire 7 can be prevented from being repeatedly squeezed and pulled between the lower electrode 3 and the base 4, thereby preventing the grounding wire 7 from being damaged by metal fatigue and reducing the reliability of grounding. At the same time, by setting up a wire-retracting device to store the redundant part of the grounding wire 7, the grounding wire 7 located between the base 4 and the lower electrode 3 can be in a straight state, thereby avoiding frequent shaking of the redundant grounding wire 7 due to the evacuation of the deposition chamber 11 during the chemical vapor deposition process, thereby avoiding the loosening and wear of the interface of the grounding wire 7 due to frequent shaking, thereby ensuring that the grounding wire 7 is reliably grounded.

[0033] Specifically, the chemical vapor deposition device also includes a support rod 5 and a sleeve 6. A plurality of sleeves 6 are arranged at intervals on a side of the lower electrode 3 facing the base 4 (i.e., the bottom surface of the lower electrode 3), and the function of the sleeve 6 is to be used for passing the support rod 5. The support rod 5 and the sleeve 6 are arranged one by one, and each sleeve 6 is passed through a support rod 5. The support rod 5 is passed through the sleeve 6 and the lower electrode 3 at the same time, so that one end of the support rod 5 can pass through the end of the sleeve 6 away from the lower electrode 3, and the other end of the support rod 5 can pass through the end of the lower electrode 3 away from the sleeve 6. The axis of the sleeve 6 extends in the vertical direction, and the support rod 5 can move relative to the sleeve 6 along the axial direction of the sleeve 6. It can also be understood that the support rod 5 can telescopically move relative to the sleeve 6 and the lower electrode 3. Correspondingly, a limit plate is provided at the top of the support rod 5, and the limit plate cannot pass through the lower electrode 3, so that when the bottom end of the support rod 5 is suspended, the support rod 5 will not fall freely. The base 4 is provided with a blind hole 42 for inserting the sleeve 6. The number and position of the blind holes 42 are arranged corresponding to the sleeve 6. During the process, the chemical vapor deposition device has a first state ( Figure 2 shown) and the second state ( Figure 3 As shown). In the first state, the glass substrate 8 is subjected to chemical vapor deposition treatment. In this state, the lifting device 9 drives the lower electrode 3 to rise to a certain height, and causes the sleeve 6 and the support rod 5 to be separated from the base 4. Under the self-weight of the support rod 5 and the glass substrate 8, the support rod 5 moves downward relative to the sleeve 6 until the glass substrate 8 is placed on the upper surface of the lower electrode 3. In the second state, the glass substrate 8 moves in or out of the housing 1. In this state, the lifting device 9 drives the lower electrode 3 to descend to a certain height, and causes the sleeve 6 to be inserted into the blind hole 42 of the base 4. At the same time, the bottom end of the support rod 5 contacts the bottom of the blind hole 42. Subsequently, the support rod 5 moves upward relative to the sleeve 6, and under the support of the support rod 5, the glass substrate 8 is lifted upward by the support rod 5, so that the glass substrate 8 is separated from the lower electrode 3. After the glass substrate 8 is lifted by the support rod 5, the gap between the two can be used to accommodate a manipulator, and then the manipulator is used to move the glass substrate 8 out of or into the housing 1.

[0034] Specifically, the base 4 includes a bottom plate 40 and a plurality of enclosures arranged around the bottom plate 40, and a receiving groove 41 is formed between the bottom plate 40 and the plurality of enclosures. The notch of the receiving groove 41 faces upward. In this embodiment, the bottom plate 40 and the enclosure are integrally formed. When the lower electrode 3 descends, the lower electrode 3 moves into the receiving groove 41. The blind hole 42 is opened on the bottom plate 40, that is, the blind hole 42 is opened at the bottom of the receiving groove 41.

[0035] In one embodiment, referring to Figure 4 and Figure 5As shown, the take-up device includes a counterweight wheel 46. Guide grooves 45 are provided on two opposite walls of the storage cavity 43, and the length of the guide grooves 45 extends in the vertical direction. The counterweight wheel 46 includes a wheel body 461 and two rotating shafts 462, and the two rotating shafts 462 are respectively provided at two ends of the axial direction of the wheel body 461, and the rotating shafts 462 are coaxial with the wheel body 461. The two rotating shafts 462 are respectively plugged into the two guide grooves 45, and the rotating shafts 462 can rotate in the guide grooves 45, and the rotating shafts 462 can move along the length direction of the guide grooves 45. It can also be understood that both ends of the entire counterweight wheel 46 are plugged into the guide grooves 45 through the rotating shafts 462. The counterweight wheel 46 has a certain weight, and under the action of its own gravity, the counterweight wheel 46 can move downward along the length direction of the guide groove 45. One end of the grounding wire 7 is connected to the lower electrode 3, and the end of the grounding wire 7 away from the lower electrode 3 is bypassed from the bottom of the wheel body 461 of the counterweight wheel 46 and extends upward. The end of the grounding wire 7 away from the lower electrode 3 is connected to the cavity wall of the storage cavity 43, and the connection position between the grounding wire 7 and the cavity wall is close to the top of the storage cavity 43. It can be understood that under the gravity of the counterweight wheel 46, the counterweight wheel 46 applies a downward pulling force to the grounding wire 7. The grounding wire 7 is bent into a "U" shape in the storage cavity 43, and under the downward pulling action of the counterweight wheel 46, the grounding wire 7 located outside the storage cavity 43 is straightened, which can prevent the grounding wire 7 from shaking when pumping air. At the same time, because the grounding wire 7 is wound around the wheel body 461, the cross-section of the wheel body 461 is circular, so that the bending area of ​​the grounding wire 7 is smooth, thereby preventing the grounding wire 7 from being excessively bent and fatigued.

[0036] Specifically, the diameter of the wheel body 461 is greater than the diameter of the rotating shaft 462. It is understandable that the larger the diameter of the wheel body 461, the larger the bending radius of the bending part of the grounding wire 7 to avoid excessive bending. The smaller the diameter of the rotating shaft 462, the smaller the size of the corresponding guide groove 45, thereby saving more space in the storage cavity 43.

[0037] Specifically, the take-up device also includes an elastic member 48. The elastic member 48 is a spring or an elastic rope. The two ends of the elastic member 48 are respectively connected to the counterweight wheel 46 and the bottom of the storage chamber 43. The elastic member 48 applies a downward pulling force to the counterweight wheel 46 to avoid the counterweight wheel 46 from getting stuck when it descends, and to compensate for the downward pulling force applied by the counterweight wheel 46 to the ground wire 7, so that the counterweight wheel 46 can move more smoothly in the storage chamber 43. The circumference of the rotating shaft 462 is sleeved with a shaft sleeve 49, and the shaft sleeve 49 can rotate relative to the rotating shaft 462. One end of the elastic member 48 is connected to the shaft sleeve 49, so that the elastic member 48 can maintain a vertically extended state during the movement and lifting of the counterweight wheel 46.

[0038] Specifically, the base 4 also includes a cover plate 44, and a wire hole 441 for passing the grounding wire 7 is provided on the cover plate 44. The storage chamber 43 has an opening at one end facing the lower electrode 3, and the opening is located at the upper end of the storage chamber 43, and the cover plate 44 is inserted into the opening of the storage chamber 43. One end of the grounding wire 7 passes through the wire hole 441 and is connected to the lower electrode 3. In order to facilitate the cleaning of the inside of the storage chamber 43, the cover plate 44 is fixed to the opening by means of a snap connection or a screw connection to facilitate the disassembly of the cover plate 44. A wiring terminal 71 is provided at one end of the grounding wire 7 facing the lower electrode 3, and the wiring terminal 71 is detachably connected to the lower electrode 3 by means of a plug-in connection or a screw connection. The wiring terminal 71 can be plugged into the wire hole 441 on the cover plate 44, so as to block the wire hole 441 with the wiring terminal 71. It can be understood that the air extraction will stop when the lower electrode 3 descends. When the lower electrode 3 descends to be close to the bottom plate 40 , the connection terminal 71 can block the wire hole 441 to prevent the residual gas from entering the receiving cavity 43 and being deposited to form a thin film structure.

[0039] In another embodiment, referring to Figure 6 As shown, the wire-taking device includes a winding wheel 47, which is rotatably arranged on the cavity wall of the storage cavity 43, and the grounding wire 7 is wound on the winding wheel 47. The wire-taking device also includes a driving member connected to the winding wheel 47, and the driving member is used to drive the grounding wire 7 to rotate, so as to realize the winding of the grounding wire 7. The driving member can be a motor or a coil spring. In this embodiment, the driving member adopts a coil spring. The coil spring is used to apply a torque to the winding wheel 47, and the winding wheel 47 has a tendency to rotate in the clockwise direction shown in the figure. When the lower electrode 3 descends, the winding wheel 47 rotates clockwise under the drive of the coil spring, and the redundant part of the grounding wire 7 has been wound on the winding wheel 47.

[0040] Although the embodiments of the present invention have been described above with reference to the accompanying drawings, the present invention is not limited to the above embodiments, but can be manufactured in various forms, and those skilled in the art will understand that the present invention can be implemented in other specific forms without changing the technical spirit or basic features of the present invention. Therefore, it should be understood that the above embodiments are exemplary and not restrictive in all aspects.

Claims

1. A chemical vapor deposition device, characterized in that: The invention comprises a shell, an electrode assembly and a grounding wire, wherein a deposition chamber is formed in the shell, a base is arranged at the bottom of the deposition chamber, the electrode assembly comprises a lower electrode for supporting a glass substrate, the lower electrode is arranged to be raised and lowered above the base, two ends of the grounding wire are respectively connected to the lower electrode and the base, the base comprises a storage cavity and a wire taking-up device arranged in the storage cavity, a part of the grounding wire is wound around the wire taking-up device so that a redundant part of the grounding wire is stored in the storage cavity.

2. The chemical vapor deposition equipment according to claim 1, characterized in that: The wire-taking device includes a counterweight wheel, and guide grooves are provided on two opposite cavity walls of the storage cavity. The length of the guide grooves extends in the vertical direction. The two ends of the counterweight wheel are respectively inserted in the two guide grooves and can move along the length direction of the guide grooves. The end of the grounding wire that is away from the lower electrode bypasses the bottom of the counterweight wheel and extends upward.

3. The chemical vapor deposition equipment according to claim 2, characterized in that: The wire-receiving device further comprises an elastic member, two ends of which are respectively connected to the counterweight wheel and the bottom of the storage cavity, and the elastic member applies a downward pulling force to the counterweight wheel.

4. The chemical vapor deposition equipment according to claim 2, characterized in that: The counterweight wheel comprises a wheel body and rotating shafts arranged at two ends of the wheel body in the axial direction. The diameter of the wheel body is larger than the diameter of the rotating shaft. The rotating shaft is plugged into the guide groove. The grounding wire is wound around the wheel body.

5. The chemical vapor deposition equipment according to claim 1, characterized in that: The wire taking-up device comprises a winding wheel, which is rotatably arranged on the cavity wall of the storage cavity, and the grounding wire is wound on the winding wheel.

6. The chemical vapor deposition device according to any one of claims 1 to 5, characterized in that: The base further includes a cover plate, the cover plate is provided with a wire hole for passing the ground wire, the storage cavity has an opening at one end facing the lower electrode, and the cover plate is inserted into the opening of the storage cavity.

7. The chemical vapor deposition equipment according to claim 6, characterized in that: The cover plate is detachably connected to the opening of the storage cavity.

8. The chemical vapor deposition equipment according to claim 6, characterized in that: One end of the grounding wire is provided with a wiring terminal, the wiring terminal is detachably connected to the lower electrode, and the wiring terminal can be plugged into the wire hole and block the wire hole.

9. The chemical vapor deposition apparatus according to any one of claims 1 to 5, characterized in that: It also includes a sleeve and a support rod, wherein the sleeve is arranged on a side of the lower electrode facing the base, the support rod passes through the sleeve and the lower electrode, the support rod can move along the axial direction of the sleeve, and the base is provided with a blind hole for inserting the sleeve.

10. The chemical vapor deposition device according to any one of claims 1 to 5, characterized in that: The electrode assembly further includes an upper electrode, and the upper electrode is spaced apart and disposed above the lower electrode.

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