Novel semiconductor ice-water all-in-one machine device based on TEC

Abstract

A novel semiconductor ice-water all-in-one machine device based on a TEC comprises a shell assembly, and the shell assembly comprises a base and a shell; the water storage assembly is arranged in the shell assembly, the water storage assembly comprises a water storage tank body, and drinking water used for supplying water is stored in the water storage tank body; the refrigeration assembly is arranged in the shell assembly, communicates with the water storage assembly and is used for preparing ice water; the ice making assembly is arranged in the shell assembly and communicates with the refrigerating assembly, and when ice blocks are needed, ice water in the refrigerating assembly is conveyed into the ice making assembly to make the ice blocks; the heat dissipation assembly is respectively connected with the refrigeration assembly and the ice making assembly; and the discharging assembly is arranged on the shell assembly and is used for discharging media in the refrigerating assembly and the ice making assembly. According to the ice maker, static water is adopted for making ice, so that ice making water, ice making speed and ice making quality are improved; the utility model has the advantages of compact volume, low power, low cost, and high speed of refrigerating, ice making and ice unloading.

Description

Technical Field

[0001] The utility model relates to a new semiconductor ice-water integrated machine device based on TEC. Background Art

[0002] As people's living standards improve, their requirements for drinking water are also gradually increasing. In order to drink cold water, a water dispenser is needed; in summer, when drinks and beer need to be cooled quickly, an ice maker is also needed. However, the indoor space is limited, and the above-mentioned water dispenser and ice maker will take up a large space when arranged at the same time.

[0003] In addition, existing water chillers and ice makers mainly use compressors to work, which have the characteristics of low cooling water and ice making speed, high noise, etc. The types of ice cubes in existing ice makers are mainly bullet ice and grid ice. Bullet ice cubes are prone to form cavities in the center; while grid ice has a slow ice making speed and will have ice-linking phenomenon due to its water-flow refrigeration.

[0004] CN116262006A discloses an ice-making and heating water dispenser, including a fixed plastic part, the fixed plastic part is fixed with a water supply module, a control system circuit board, a heating module and a semiconductor refrigeration module, the water supply module transports normal temperature water to the heating module and the semiconductor refrigeration module through a silicone hose, the control system circuit board controls the heating module to heat the normal temperature water, the control system circuit board controls the semiconductor refrigeration module to freeze the normal temperature water, and a water box is connected to the water outlet of the heating module. This solution solves the problem of hot water and hot gas spraying and cold and hot water reflux, but does not provide any technical inspiration on how to improve the ice making rate and quality. Utility Model Content

[0005] The technical problem to be solved by the utility model is: how to improve the ice making rate and quality, and to provide a new semiconductor ice-water integrated machine device based on TEC.

[0006] The technical solution of the utility model is specifically as follows:

[0007] A new semiconductor ice-water integrated device based on TEC includes a housing assembly, the housing assembly includes a base and a shell, and a water storage assembly, a refrigeration assembly, an ice-making assembly, a discharging assembly, a heat dissipation assembly and an electrical control system are arranged on the base; wherein,

[0008] A water storage component is arranged in the housing component, and the water storage component includes a water storage tank body, and drinking water for water supply is stored in the water storage tank body;

[0009] A refrigeration component, disposed in the housing component and connected to the water storage component, for preparing ice water;

[0010] An ice-making assembly is disposed in the housing assembly and is in communication with the refrigeration assembly. When ice cubes are needed, ice water in the refrigeration assembly is transported to the ice-making assembly to make ice cubes.

[0011] The heat dissipation component is connected to the refrigeration component and the ice-making component respectively;

[0012] The discharging assembly is arranged on the shell assembly and is used for discharging the medium in the refrigeration assembly and the ice-making assembly.

[0013] The refrigeration component includes an ice container and a TEC refrigeration module connected to the ice container; wherein the ice container is connected to the water storage component through a pipeline; the TEC refrigeration module includes a first semiconductor refrigeration plate, a cold end fin is fixedly connected to the cold end of the first semiconductor refrigeration plate, the cold end fin is located inside the ice container and in contact with water, a first water cooling plate is arranged at the hot end of the first semiconductor refrigeration plate, and the first water cooling plate is externally connected to a heat dissipation component.

[0014] Heat-conducting material is evenly applied between the cold-end fin and the cold end of the first semiconductor refrigeration plate, and between the first water-cooling plate and the hot end of the first semiconductor refrigeration plate.

[0015] The ice-making component comprises a second semiconductor refrigeration plate, an ice tray is arranged at the cold end of the second semiconductor refrigeration plate, a second water-cooling plate is connected to the hot end of the second semiconductor refrigeration plate, and the second water-cooling plate is externally connected to the heat dissipation component.

[0016] The ice tray is fixedly connected to the rotating shaft, the rotating shaft is connected to the output shaft of the flip motor, and an ice storage box is arranged below the ice tray.

[0017] A water injection device is arranged above the ice tray, the water injection device is a water injection pipe, a plurality of water injection ports are arranged on the water injection pipe, the positions of the water injection ports correspond to the positions of the ice tray below, and the water injection pipe is connected with the refrigeration component.

[0018] The heat dissipation component includes a water-cooling row, which connects the first water-cooling plate of the refrigeration component and the second water-cooling plate of the ice-making component in series through a pipeline, and dissipates heat through the heat sink and cooling pipeline in the water-cooling row; the water-cooling row is also connected to a heat dissipation water pump and a heat dissipation water tank.

[0019] A fan is installed on the water cooling radiator to assist in heat dissipation.

[0020] The discharging assembly comprises a solid discharging device and a liquid discharging channel; the solid discharging device is arranged on the shell assembly and is used for discharging solid ice cubes; the liquid discharging channel is used for discharging liquid drinking water.

[0021] The beneficial effects of the utility model are as follows: the utility model uses static water to make ice, improves ice-making water, ice-making rate and ice-making quality, and improves the convenience and experience of users. The ice-making unit of the product includes two refrigeration plates, which are compact in size, low in power, low in cost, and fast in refrigeration, ice-making and ice-removing speeds. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0023] Figure 2 It is the internal structure diagram of the utility model;

[0024] Figure 3 It is a structural diagram of the refrigeration component;

[0025] Figure 4 This is a structural diagram of the ice-making component. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] like Figure 1 , Figure 2 As shown, a new semiconductor ice-water integrated device based on TEC includes a shell assembly, the shell assembly includes a base 41 and a shell 42, and a water storage assembly, a refrigeration assembly, an ice-making assembly, a discharging assembly, a heat dissipation assembly and an electrical control system are arranged on the base 41; wherein,

[0028] A water storage assembly 1 is disposed in the housing assembly, and the water storage assembly 1 comprises a water storage tank body, in which drinking water for water supply is stored;

[0029] A refrigeration component 5, disposed in the housing component and connected to the water storage component 1, for preparing ice water;

[0030] An ice-making assembly 8 is disposed in the housing assembly and is in communication with the refrigeration assembly 5. When ice cubes are needed, ice water in the refrigeration assembly is transported to the ice-making assembly to make ice cubes;

[0031] The heat dissipation component 3 is connected to the refrigeration component 5 and the ice making component 8 respectively;

[0032] A discharge assembly 2, arranged on the shell assembly, for discharging the medium in the refrigeration assembly and the ice-making assembly;

[0033] The electrical control system 9 is used to set and adjust the working parameters of the new integrated ice and water machine, and is responsible for monitoring and adjusting the operating status of the new integrated ice and water machine.

[0034] The refrigeration assembly 5 includes an ice container 51 and a TEC refrigeration module 52 connected to the ice container 51. The TEC refrigeration module 52 is used to reduce the temperature in the ice container 51, so that water at room temperature becomes ice water, thereby ensuring temperature control and cooling effects during the ice water making process.

[0035] Among them, the ice container 51 is connected to the water storage component 1 through a pipeline, that is, the water source of the ice container 51 is the water stored in the water storage component 1, and the water source in the water storage component 1 comes from an external water source, such as bottled water or tap water.

[0036] The TEC refrigeration module 52 includes a first semiconductor refrigeration sheet 524, a cold end fin 521 is fixedly connected to the cold end of the first semiconductor refrigeration sheet 524, the cold end fin 521 is located inside the ice chamber and in contact with water, and a heat conductive material is applied to the contact surface of the two; a first water cooling plate 523 is arranged at the hot end of the first semiconductor refrigeration sheet 524, and the first water cooling plate 523 is connected to a water inlet and outlet 522. The first water cooling plate 523 mainly dissipates heat and cools the hot surface of the first semiconductor refrigeration sheet 524, and the first water cooling plate 523 is externally connected to the heat dissipation component 3. The heat conductive material is evenly applied between the cold end fin 521 and the cold end of the first semiconductor refrigeration sheet 524, and between the first water cooling plate 523 and the hot end of the first semiconductor refrigeration sheet 524, so as to achieve sufficient heat conduction. The heat dissipation end is located on the side away from the cold end fin. By energizing the TEC refrigeration module 52, the temperature of the cold end of the TEC refrigeration module 52 is lower than the temperature of the hot end, so as to absorb the heat of the cold end fin 521.

[0037] The ice-making assembly 8 includes a second semiconductor refrigeration sheet 83, an ice tray 82 is provided at the cold end of the second semiconductor refrigeration sheet 83, and a second water-cooled plate 84 is connected to the hot end of the second semiconductor refrigeration sheet 83. The ice-making assembly 8 is used to reduce the temperature in the ice tray 82, so that the ice water solidifies into ice cubes, and ensures the temperature control and cooling effect during the ice-making process. The second water-cooled plate 84 mainly dissipates heat and cools the hot surface of the second semiconductor refrigeration sheet 83, and the second water-cooled plate 84 is externally connected to the heat dissipation assembly 3. The heat-conducting material is evenly applied between the ice tray 82 and the cold end of the second semiconductor refrigeration sheet 83, and between the second water-cooled plate 84 and the hot end of the second semiconductor refrigeration sheet 83, so that sufficient heat conduction can be achieved. By energizing the second semiconductor refrigeration sheet 83, the temperature of the cold end is lower than the temperature of the hot end, so as to absorb the heat of the ice tray 82. By changing the current direction of the second semiconductor refrigeration sheet 83, the heating and cooling function of the ice tray 82 is realized.

[0038] Furthermore, the ice tray 82 may be provided with heat-insulating measures, and the main purpose of the heat-insulating layer is to reduce the heat loss at the cold end and further increase the ice-making speed.

[0039] Furthermore, the ice tray 82 is fixedly connected to the rotating shaft, and the rotating shaft is connected to the output shaft of the flipping motor 85. In this way, the flipping motor 85 works to rotate the rotating shaft, thereby realizing the flipping of the ice tray 82. An ice storage box 86 is arranged below the ice tray 82. After the ice cubes are flipped, they fall into the ice storage box 86. A solid discharging device 22 is arranged in front of the ice storage box 86. People can take out ice cubes from the solid discharging device 22. The ice taking port of the solid discharging device 22 is located on the shell 42. After the ice making is completed, the ice tray 82 is driven by the flipping motor 85 to reverse the ice tray by 150°C, and gravity is used to cause the ice cubes to peel off the ice tray. At the same time, the current direction of the second semiconductor refrigeration plate 83 is changed to heat the ice tray, ensuring that the ice cubes fall off quickly and completely.

[0040] Furthermore, a water injection device 81 is provided above the ice tray 82 , and the water injection device 81 is a water injection pipe, and a plurality of water injection ports are provided on the water injection pipe, and the positions of the water injection ports correspond to the positions of the ice tray below. The water injection pipe is connected to the ice container 51 in the refrigeration assembly 5 .

[0041] The refrigeration component 5 and the ice-making component 8 are core components of the novel ice-water integrated machine. The two can be connected to the heat dissipation component 3 separately, or they can share a set of heat dissipation components 3.

[0042] In the present invention, the heat dissipation component 3 adopts a closed-loop water cooling system to ensure that the heat source can effectively dissipate heat. The heat dissipation component 3 includes a water cooling row 32, which connects the first water cooling plate 523 of the refrigeration component 5 and the second water cooling plate 84 of the ice making component 8 in series through a pipeline, and dissipates heat through the heat sink and cooling pipeline in the water cooling row; the water cooling row 32 is also connected to a heat dissipation water pump 31 and a heat dissipation water tank 33.

[0043] Furthermore, a fan 34 is installed on the water cooling radiator 32 to assist in heat dissipation.

[0044] After the water absorbs heat through the first water cooling plate 523 and the second water cooling plate 84, it is transported to the water cooling radiator 32 through the heat dissipation water pump 31, and heat is exchanged with the surrounding air on the heat sink of the water cooling radiator 32. At the same time, a fan 34 is installed on the water cooling radiator 32 to accelerate the air flow and enhance the heat dissipation effect. The cooled water is transported back to the heat source again, and the cycle repeats. The heat dissipation water pump 31 is responsible for transporting water from the water cooling radiator to the heat source, and then transporting the hot water back to the water cooling radiator 32.

[0045] The water storage component 1 includes a water storage tank, a water storage inlet pipe, a water storage outlet pipe, an ice tank water pump, and an ice making water pump. The water storage outlet pipe is arranged at the bottom of the water storage tank. The water storage tank is used to store drinking water at room temperature, and the water storage tank supplies water to the refrigeration component 5 through the water storage delivery pipe and the ice tank water pump. The ice making water pump is responsible for sucking ice water from the ice tank 51 and then transporting it to the ice grid 82 through the pipeline. It should be noted that the connection between the water storage tank, the pipeline and the water pump is a technology well known to those skilled in the art, and how the pipeline is set can be arranged according to specific circumstances.

[0046] The discharge assembly 2 includes a solid discharge device 22 and a liquid discharge channel 21; the solid discharge device 22 is arranged on the shell assembly and is used for discharging solid ice cubes; the liquid discharge channel 21 is used for discharging liquid drinking water.

[0047] The electrical control system 9 mainly realizes functions such as driving operation, control logic, safety protection and fault diagnosis. It is responsible for driving, controlling and protecting the normal operation of the new ice and water integrated machine. Users can operate and set it through the control panel.

[0048] This utility model is a semiconductor-based TEC-based new type of ice-water integrated device designed based on semiconductor refrigeration chips. The cooling and heating of the device are achieved through semiconductor refrigeration chips. The ice-making unit of this product contains two refrigeration chips, which are compact in size, low in power, low in cost, and fast in refrigeration and ice-making and ice-removing speeds, greatly improving ice-making efficiency and user experience.

[0049] The above is only a preferred embodiment of the present invention. It should be pointed out that those skilled in the art can make several changes and improvements without departing from the overall concept of the present invention, and these should also be regarded as the protection scope of the present invention.

Claims

1. A new type of semiconductor ice-water integrated device based on TEC, characterized in that: The invention comprises a shell assembly, the shell assembly comprises a base (41) and an outer shell (42), and a water storage assembly, a refrigeration assembly, an ice making assembly, a discharging assembly, a heat dissipation assembly and an electrical control system are arranged on the base (41); wherein: A water storage component (1) is arranged in the housing component, the water storage component (1) comprising a water storage tank body, and drinking water for water supply is stored in the water storage tank body; A refrigeration component (5), arranged in the shell component and connected to the water storage component (1), and used for preparing ice water; An ice-making assembly (8) is arranged in the housing assembly and is in communication with the refrigeration assembly (5); when ice cubes are needed, ice water in the refrigeration assembly is transported to the ice-making assembly to make ice cubes; The heat dissipation component (3) is connected to the refrigeration component (5) and the ice-making component (8) respectively; A discharge assembly (2) is arranged on the shell assembly and is used to discharge the medium in the refrigeration assembly and the ice-making assembly.

2. According to the TEC-based semiconductor novel ice-water integrated device of claim 1, it is characterized by: The refrigeration component (5) comprises an ice bladder (51) and a TEC refrigeration module (52) connected to the ice bladder (51); wherein the ice bladder (51) is connected to the water storage component (1) via a pipeline; the TEC refrigeration module (52) comprises a first semiconductor refrigeration sheet (524); a cold end fin (521) is fixedly connected to the cold end of the first semiconductor refrigeration sheet (524); the cold end fin (521) is located inside the ice bladder and in contact with water; a first water cooling plate (523) is provided at the hot end of the first semiconductor refrigeration sheet (524); and the first water cooling plate (523) is externally connected to the heat dissipation component (3).

3. The semiconductor novel ice-water integrated device based on TEC according to claim 2 is characterized in that: Heat-conducting material is evenly applied between the cold-end fin (521) and the cold end of the first semiconductor refrigeration sheet (524), and between the first water-cooling plate (523) and the hot end of the first semiconductor refrigeration sheet (524).

4. The semiconductor novel ice-water integrated device based on TEC according to claim 1, characterized in that: The ice-making component (8) comprises a second semiconductor refrigeration sheet (83), an ice tray (82) is provided at the cold end of the second semiconductor refrigeration sheet (83), a second water-cooling plate (84) is connected to the hot end of the second semiconductor refrigeration sheet (83), and the second water-cooling plate (84) is externally connected to the heat dissipation component (3).

5. The semiconductor novel ice-water integrated device based on TEC according to claim 4 is characterized in that: The ice tray (82) is fixedly connected to the rotating shaft, the rotating shaft is connected to the output shaft of the flip motor (85), and an ice storage box (86) is arranged below the ice tray (82).

6. The semiconductor novel ice-water integrated device based on TEC according to claim 4 is characterized in that: A water injection device (81) is provided above the ice tray (82); the water injection device (81) is a water injection pipe, and a plurality of water injection ports are provided on the water injection pipe. The positions of the water injection ports correspond to the positions of the ice tray below, and the water injection pipe is connected to the refrigeration component (5).

7. The semiconductor novel ice-water integrated device based on TEC according to claim 1 is characterized in that: The heat dissipation component (3) comprises a water-cooling radiator (32), the water-cooling radiator (32) connecting the first water-cooling plate (523) of the refrigeration component (5) and the second water-cooling plate (84) of the ice-making component (8) in series via a pipeline, and dissipating heat via the heat sink and cooling pipeline in the water-cooling radiator; the water-cooling radiator (32) is also connected to a heat dissipation water pump (31) and a heat dissipation water tank (33).

8. The semiconductor novel ice-water integrated device based on TEC according to claim 7, characterized in that: A fan (34) is installed on the water cooling row (32) to assist in heat dissipation.

9. The semiconductor novel ice-water integrated device based on TEC according to claim 1, characterized in that: The discharge assembly (2) comprises a solid discharge device (22) and a liquid discharge channel (21); the solid discharge device (22) is arranged on the shell assembly and is used for discharging solid ice cubes; the liquid discharge channel (21) is used for discharging liquid drinking water.

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