Fingerprint identification assembly and electronic equipment

Abstract

The utility model relates to the technical field of electronic equipment, particularly provides a fingerprint identification assembly and electronic equipment, and aims to solve the problem that a fingerprint module of the existing electronic equipment adopting fingerprint identification is easily damaged when meeting water when adhesive dispensing cannot be carried out. In order to achieve the purpose, the fingerprint identification assembly comprises a fingerprint chip, a circuit substrate and a waterproof layer, the fingerprint chip is provided with a plurality of welding terminals, the circuit substrate is provided with a plurality of bonding pads, the welding terminals and the bonding pads are welded in a one-to-one correspondence mode, and the waterproof layer wraps the outer side of each pair of welding terminals and bonding pads which are correspondingly welded. And each pair of welding terminals and pads are isolated from the outside through the waterproof layer. The waterproof layers are arranged on the outer sides of each pair of welding terminals and bonding pads, so that each pair of welding terminals and bonding pads can be isolated from the outside through the waterproof layers, the waterproof effect after the fingerprint chip and the circuit substrate are connected is improved, and the fingerprint identification assembly is prevented from being short-circuited after meeting water.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and specifically provides a fingerprint recognition component and an electronic equipment. Background Art

[0002] At present, the fingerprint module of electronic devices using fingerprint recognition includes a circuit board and a fingerprint chip arranged on the circuit board. Generally, after the fingerprint module is connected to the circuit board, glue is dispensed around the circuit board. However, when the space around the circuit board is too small to dispense glue, the fingerprint module is easily damaged by water. Summary of the invention

[0003] The present application aims to solve the above technical problem, that is, to solve the problem that the fingerprint module of the existing electronic device using fingerprint recognition cannot be dispensed and is easily damaged when it comes into contact with water.

[0004] The present application provides a fingerprint recognition component, including: a fingerprint chip, provided with a plurality of welding terminals; and a circuit substrate, provided with a plurality of welding pads, wherein the welding terminals are welded to the welding pads in a one-to-one correspondence; and a waterproof layer, covering the outer side of each pair of welding terminals and welding pads that are welded in a corresponding manner, so that each pair of welding terminals and welding pads is isolated from the outside through the waterproof layer.

[0005] In the preferred technical solution of the above-mentioned fingerprint recognition component, the side surface of the fingerprint chip provided with the welding terminal and the welding terminal are both provided with the waterproof layer, and the side surface of the circuit substrate provided with the welding pad and the welding pad are both provided with a waterproof layer.

[0006] In the preferred technical solution of the above-mentioned fingerprint recognition component, all parts of the fingerprint chip, the circuit substrate, the welding terminal and the welding pad are provided with the waterproof layer.

[0007] In the preferred technical solution of the above-mentioned fingerprint recognition component, the circuit substrate is configured as a flexible circuit board, and the fingerprint recognition component further comprises a fixedly arranged reinforcement plate, which is supported on a side of the flexible circuit board facing away from the fingerprint chip and directly faces the fingerprint chip.

[0008] In the preferred technical solution of the above-mentioned fingerprint recognition component, the reinforcement plate is provided with weight-reducing holes.

[0009] In the preferred technical solution of the above-mentioned fingerprint recognition component, the edges of the fingerprint chip extend beyond the edges of the circuit substrate, and a glue layer is provided at the extending portion, the glue layer bonds the fingerprint chip to the circuit substrate and seals the gap between the fingerprint chip and the edges of the circuit substrate.

[0010] In the preferred technical solution of the above fingerprint recognition component, the adhesive layer is also covered with the waterproof layer.

[0011] In the preferred technical solution of the above-mentioned fingerprint recognition component, the width of the portion of the fingerprint chip that extends beyond the circuit substrate is not less than 0.4 mm.

[0012] In the preferred technical solution of the above-mentioned fingerprint recognition component, the waterproof layer is a coating formed by chemical vapor deposition or a fluorinated liquid layer formed by coating.

[0013] The present application also provides an electronic device, comprising a fingerprint recognition component according to any one of the above technical solutions.

[0014] When adopting the above technical solution, the present application can provide a waterproof layer on the outside of each pair of welding terminals and welding pads, so that each pair of welding terminals and welding pads can be isolated from the outside world through the waterproof layer, thereby increasing the waterproof effect after the fingerprint chip and the circuit substrate are connected, and avoiding short circuit of the fingerprint recognition component after contacting water. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The preferred embodiments of the present application are described below in conjunction with the accompanying drawings, in which:

[0016] Figure 1 It is a schematic diagram of the flexible circuit board and the fingerprint chip of the present application being wrapped by a waterproof layer after being welded;

[0017] Figure 2 It is a side view of the fingerprint recognition component of the present application with a reinforcement plate;

[0018] Figure 3 It is a schematic diagram of setting the adhesive layer of the fingerprint recognition component of the present application.

[0019] List of reference numerals:

[0020] 1. Fingerprint recognition component; 11. Fingerprint chip; 12. Flexible circuit board; 13. Waterproof layer; 14. Reinforcement plate; 141. Weight reduction hole; 15. Adhesive layer; d. The width of the fingerprint chip that exceeds the flexible circuit board; A. The welding position of the welding terminal and the welding pad. DETAILED DESCRIPTION

[0021] Here, exemplary embodiments will be described in detail, and examples thereof are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementations described in the following exemplary embodiments are only to present the concept of the present application and do not represent all implementations under the concept of the present application. Instead, they are only examples of devices and methods consistent with some aspects of the concept of the present application.

[0022] The terms used in this application are only for the purpose of describing specific embodiments and are not intended to limit this application. Unless otherwise defined, the technical terms or scientific terms used in this application should be understood by people with ordinary skills in the field to which this application belongs. The words "one" or "an" and the like used in this application specification and claims do not indicate a quantitative limitation, but indicate the presence of at least one.

[0023] Unless otherwise specified, the words "front", "rear", and the like are for convenience of description only and are not limited to a position or a spatial orientation. Words such as "include" or "comprise" and the like mean that the elements or objects appearing before "include" or "comprise" include the elements or objects listed after "include" or "comprise" and their equivalent elements or objects, and other elements or objects are not excluded in this application. "Connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection. For those skilled in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0024] The present application provides an electronic device, which is unlocked or locked by identifying a fingerprint, and the electronic device includes a fingerprint recognition component 1, and the fingerprint recognition component 1 recognizes the fingerprint to unlock or lock the electronic device, wherein the unlocking may be turning on the device or turning on the screen, etc., and the locking may be turning off the device or turning off the screen, etc., and the above is not restrictive and can be set according to the needs of technicians in this field and the electronic device. The electronic device can be a mobile phone, a tablet, a phone watch, etc., and the above is not restrictive. For the convenience of description, the following is an example of the electronic device being set as a mobile phone.

[0025] It should be noted that the fingerprint recognition component 1 can be arranged under the screen of the electronic device (the electronic device has a screen component), or on the side or back of the electronic device. Figures 1 to 3 The description is made by taking the fingerprint recognition component 1 as being arranged on the side of the electronic device. For example, the side frame of the electronic device is provided with a mounting hole, and the fingerprint recognition component 1 is arranged in the mounting hole. It should also be noted that the present application Figure 2 and Figure 3 A waterproof layer 13 is provided in each of the plurality of structures, but it is not indicated in the figure.

[0026] like Figure 1 As shown, the present application provides a fingerprint recognition component 1, which is used in the above electronic device, including a fingerprint chip 11, a circuit substrate ( Figure 1In the figure, the fingerprint chip 11 is provided with a plurality of welding terminals (not shown in the figure), and the circuit substrate is provided with a plurality of pads (not shown in the figure). The welding terminals and the pads are welded one by one, and the waterproof layer 13 is coated on the outside of each pair of welding terminals and pads that are welded correspondingly, so that each pair of welding terminals and pads are isolated from the outside through the waterproof layer 13. By providing the waterproof layer 13 on the outside of each pair of welding terminals and pads, it is possible to prevent water from entering the connection position of each pair of welding terminals and pads, thereby ensuring that each pair of welding terminals and pads are isolated from the outside through the waterproof layer 13, increasing the waterproof effect after the fingerprint chip 11 and the circuit substrate are connected, and preventing the fingerprint recognition component 1 from short-circuiting after encountering water.

[0027] In one embodiment, a waterproof layer 13 is provided on the surface of one side of the fingerprint chip 11 where the welding terminal is provided and the welding terminal, and a waterproof layer 13 is provided on the surface of one side of the circuit substrate where the pad is provided and the pad. The waterproof layer 13 is provided on the surface of one side of the fingerprint chip 11 where the welding terminal is located, which can increase the waterproof effect of the fingerprint chip 11 and prevent water from flowing along the surface of one side of the fingerprint chip 11 where the welding terminal is provided to the welding terminal. Similarly, the waterproof layer 13 is provided on the surface of one side of the circuit substrate where the pad is located, which can also prevent water from flowing along the surface of one side of the circuit substrate where the pad is provided to the pad position, thereby further preventing the problem of short circuit caused by water after the pad is connected to the welding terminal.

[0028] In one embodiment, if Figure 1 As shown, all parts of the fingerprint chip 11, the circuit substrate, the welding terminal and the pad are provided with a waterproof layer 13. At this time, the fingerprint recognition component 1 can be fully waterproofed through the waterproof layer 13, and the waterproof layer 13 completely isolates water from the fingerprint chip 11 or the circuit substrate, thereby further ensuring the waterproof effect of the fingerprint chip 11 and the circuit substrate, and preventing them from being damaged or short-circuited when exposed to water.

[0029] It should be noted that when the waterproof layer 13 is completely wrapped around the outer surface of the fingerprint chip 11 and the circuit substrate, the welding terminal and the pad, the installation and connection steps of the fingerprint recognition component 1 can be to first weld the pad of the circuit substrate and the welding terminal of the fingerprint chip 11 so that the circuit substrate and the fingerprint chip 11 form a whole, and then set the waterproof layer 13 on the formed whole, so as to achieve the full coverage of the fingerprint recognition component 1 by the waterproof layer 13. The above connection sequence can ensure the welding quality while also ensuring the waterproof effect of the whole formed by the circuit substrate and the fingerprint chip 11, and effectively avoid the problem of short circuit at the welding position of the fingerprint recognition component 1 when it encounters water. Of course, the installation and connection sequence of the circuit substrate, the fingerprint chip 11 and the waterproof layer 13 can also be set in other forms. For example, the fingerprint chip 11 and the circuit substrate are first respectively set with the waterproof layer 13, and then the fingerprint chip 11 is welded to the circuit substrate after the setting is completed. This connection sequence can also achieve the waterproof effect of the fingerprint chip 11 and the circuit substrate. The above is not restrictive and can be set according to the needs of those skilled in the art. The above are all within the scope of protection of this application.

[0030] In one embodiment, if Figure 2 , Figure 3 As shown, the circuit substrate is set as a flexible circuit board 12, and the fingerprint recognition component 1 also includes a fixed reinforcement plate 14, which is supported on the side of the flexible circuit board 12 facing away from the fingerprint chip 11 and directly opposite to the fingerprint chip 11. The circuit substrate is set as a flexible circuit board 12, which can greatly reduce the volume and weight occupied by the electronic device. The flexible circuit board 12 also has good heat dissipation and solderability, and can be conveniently connected to the fingerprint chip 11. Although the flexible circuit board 12 is thin and short, it is soft and easy to bend. Especially when the flexible circuit board 12 is welded with the fingerprint chip 11, the flexible circuit board 12 needs to be stressed and is more likely to be bent. Therefore, it is necessary to reinforce the side of the flexible circuit board 12 facing away from the fingerprint chip 11 and facing the fingerprint chip 11 to increase the mechanical strength of the flexible circuit board 12, so as to facilitate the installation of the fingerprint chip 11 on the flexible circuit board 12. There are many optional materials for the reinforcement plate 14, such as PI, FR4, steel sheet, etc. Taking the steel sheet as an example, 3D steel sheet reinforcement can be selected, which has high mechanical properties, dimensional stability, impact resistance, and moisture resistance.

[0031] In one embodiment, if Figure 2 As shown, the reinforcing plate 14 is provided with a weight-reducing hole 141 . The provision of the weight-reducing hole 141 can reduce the weight of the reinforcing plate 14 , and further reduce the weight of the electronic device, thereby achieving lightweighting of the electronic device.

[0032] In one embodiment, if Figure 3As shown, the edges of the fingerprint chip 11 extend beyond the edges of the circuit substrate, and a glue layer 15 is provided at the extended portion. The glue layer 15 bonds the fingerprint chip 11 to the circuit substrate and seals the gap between the fingerprint chip 11 and the edges of the circuit substrate. In order to further prevent the welding position A between the welding terminal and the welding pad from being exposed, thereby preventing the risk of short circuiting the welding position A between the welding pad and the welding terminal when encountering water, a glue layer 15 is provided at the extended portion. The glue layer can seal the gap between the edges of the fingerprint chip 11 and the circuit substrate, thereby preventing water from entering the gap between the edges of the fingerprint chip 11 and the circuit substrate. The provision of the glue layer 15 can further prevent the fingerprint recognition component 1 from entering with water, thereby preventing water from contacting the welding pad and the welding terminal, thereby further enhancing the waterproof effect of the fingerprint recognition component 1.

[0033] In one embodiment, the adhesive layer 15 is also covered with a waterproof layer 13. The adhesive layer 15 can be coated before the waterproof layer 13 is set on the fingerprint chip 11 and the circuit substrate, that is, after the circuit substrate and the fingerprint chip 11 are welded, the adhesive layer 15 is first coated in the gap around the edge of the fingerprint chip 11 and the circuit substrate, and then the waterproof layer 13 is set. The above-mentioned adhesive layer 15 can effectively prevent water from entering the welding position of the welding terminal and the welding pad. The setting of the waterproof layer 13 further increases the waterproof effect. The double waterproofing can effectively ensure the protection effect of the fingerprint recognition component 1.

[0034] Of course, the adhesive layer 15 can also be coated after the waterproof layer 13 is set. The above is not restrictive and can be set according to the needs of technical personnel in this field. The above are all within the protection scope of this application.

[0035] In one embodiment, if Figure 3 As shown, the width d of the portion of the fingerprint chip 11 that exceeds the circuit substrate is not less than 0.4 mm. Since a certain space is required for coating the adhesive layer 15, the adhesive layer 15 can be coated only when the width d of the portion of the fingerprint chip 11 that exceeds the circuit substrate is not less than 0.4 mm. When it is less than 0.4 mm, there is not enough space to coat the adhesive layer 15. In order to ensure the double waterproof effect of the fingerprint recognition component 1, the width d of the portion of the fingerprint chip 11 that exceeds the circuit substrate can be reserved to be greater than 0.4 mm.

[0036] It should be noted that, since the edges of the fingerprint chip 11 are beyond the edges of the circuit substrate, when the width of the portion of the fingerprint chip 11 that is beyond the circuit substrate is not less than 0.4 mm on only one side of the four sides, glue can be applied only on one side. When the width of the four sides is not more than 0.4 mm, there is no need to apply the glue layer 15. In the present application, the fingerprint recognition component 1 can still be waterproofed through the waterproof layer 13 without applying the glue layer 15 or only applying the glue layer 15 on one side.

[0037] In one embodiment, the waterproof layer 13 is a coating formed by chemical vapor deposition or a fluorinated liquid layer formed by coating. Chemical vapor deposition (CVD) is a method of using one or more gas phase compounds or single substances containing thin film elements to chemically react on the surface of a substrate to form a thin film. That is, the waterproof layer 13 is a coating formed on the surface of the fingerprint chip 11 and the circuit substrate by a chemical vapor deposition process. The material of the formed coating can be silicon oxide or silicon oxynitride. The coating is uniform and stable, has a good barrier function and protective effect, can effectively block water, and the coating is thin, with a thickness at the nanometer level, and does not occupy additional space, thereby further reducing the volume of the fingerprint recognition component 1. The following is the principle of coating the surface of the fingerprint chip 11 and the circuit substrate through the CVD process: the surface of the fingerprint chip 11 and the circuit substrate are cleaned and activated through plasma discharge, and energy is provided for opening chemical bonds of the coating raw material molecules to promote the polymerization reaction to continue. In addition, the excited electrons generated during the plasma discharge process ionize the monomer molecules, and the monomer molecules split to produce free electrons, ions, excited molecules and free radicals. In a vacuum environment, the free radicals undergo adsorption, condensation and polymerization reactions on the activated fingerprint chip 11 and the circuit substrate surface. The electrons and ions cross-link and form chemical bonds with the deposited molecules, continuously polymerize and grow, thereby forming a nano-level waterproof layer 13 with high structural strength and compactness.

[0038] Of course, the waterproof layer 13 can also be a fluorinated liquid layer coated on the fingerprint chip 11 and the circuit substrate. The formation of the fluorinated liquid layer can also achieve a waterproof effect, wherein the fluorinated liquid is a solution mainly formed by three compounds: PAF (perfluoroalkyl fluorocarbon), PAFMA (perfluoroalkyl methacrylate) and PASS (perfluoroalkyl sulfonate). The mass proportion of the three compounds PAF, PAFMA and PASS can be set according to the needs of technicians in the field. For example, PAF accounts for 60% to 80% of the total components, PAFMA accounts for 10%-30% of the total components, and PASS accounts for 5%-10% of the total components. The proportion of each component of the above-mentioned fluorinated liquid layer is not restrictive and can be adjusted according to the needs of technicians in the field. The above are all within the scope of protection of this application. Of course, the components of the fluorinated liquid layer can also be adjusted and replaced according to the needs of technicians in the field, and the above are also within the scope of protection of this application.

[0039] In summary, by providing a waterproof layer 13 on the outside of each pair of welding terminals and the welding pad, water can be prevented from entering the connection position of each pair of welding terminals and the welding pad, thereby ensuring that each pair of welding terminals and the welding pad is isolated from the outside world through the waterproof layer 13, thereby increasing the waterproof effect after the fingerprint chip 11 and the circuit substrate are connected, and preventing the fingerprint recognition component 1 from short-circuiting when it encounters water.

[0040] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A fingerprint recognition component, characterized in that: include: The fingerprint chip is provided with a plurality of welding terminals; The circuit substrate is provided with a plurality of pads, and the welding terminals are welded to the pads in a one-to-one correspondence; The waterproof layer is coated on the outer side of each pair of welding terminals and welding pads corresponding to welding, so that each pair of welding terminals and welding pads are isolated from the outside through the waterproof layer.

2. The fingerprint recognition component according to claim 1, characterized in that: The waterproof layer is provided on one side surface of the fingerprint chip provided with the welding terminal and the welding terminal, and the waterproof layer is provided on one side surface of the circuit substrate provided with the welding pad and the welding pad.

3. The fingerprint recognition component according to claim 2, characterized in that: The waterproof layer is provided at all positions of the fingerprint chip, the circuit substrate, the welding terminal and the welding pad.

4. The fingerprint recognition component according to claim 1, characterized in that: The circuit substrate is configured as a flexible circuit board, and the fingerprint identification component further comprises a fixedly arranged reinforcing plate, wherein the reinforcing plate is supported on a side of the flexible circuit board facing away from the fingerprint chip and directly faces the fingerprint chip.

5. The fingerprint recognition component according to claim 4, characterized in that: The reinforcement plate is provided with weight-reducing holes.

6. The fingerprint recognition component according to claim 1, characterized in that: The edges of the fingerprint chip extend beyond the edges of the circuit substrate, and a glue layer is provided at the extending portion. The glue layer adheres the fingerprint chip to the circuit substrate and seals the gap between the fingerprint chip and the edges of the circuit substrate.

7. The fingerprint recognition component according to claim 6, characterized in that: The adhesive layer is also covered with the waterproof layer.

8. The fingerprint recognition component according to claim 6, characterized in that: The width of the portion of the fingerprint chip that extends beyond the circuit substrate is not less than 0.4 mm.

9. The fingerprint recognition component according to claim 2, characterized in that: The waterproof layer is a coating formed by chemical vapor deposition or a fluorinated liquid layer formed by coating.

10. An electronic device, characterized in that: The fingerprint recognition component comprises any one of claims 1 to 9.

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