Positioning tool

Abstract

The utility model provides a positioning tool, relates to the field of semiconductor or photovoltaic material processing, and solves the technical problem that a silicon wafer is easy to be clamped when the silicon wafer is loaded on a silicon wafer carrier. The positioning tool comprises a mounting frame assembly and at least one guide plate, each guide plate comprises a plurality of regular teeth arranged in the first direction, and a guide groove is formed between every two adjacent regular teeth. Due to the fact that the groove width of the first opening of the guide groove is larger than or equal to that of the first groove, the deformation degree of the two sheet materials passing through the same guide groove can be reduced, and the two sheet materials are smoothly inserted into one first groove after being tightly attached. Besides, the width of the second opening of the guide groove is larger than or equal to the width of the first groove, so that two sheet materials inserted into the same first groove can be arranged through the guide groove, other sheet materials to be inserted into other first grooves are prevented from being interfered by the sheet materials inserted into the first grooves, the sheet materials are prevented from being blocked, and the service life of the sheet materials is prolonged. And the efficiency of loading the silicon wafers to the silicon wafer carrier is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor or photovoltaic material processing, and in particular to a positioning tool. Background Art

[0002] At present, under the situation of global warming, shortage of conventional energy and environmental pollution, photovoltaic power generation has achieved rapid development as an important renewable energy power generation technology, and the demand for photovoltaic cells is increasing day by day. For photovoltaic cells based on silicon wafers, the quality of silicon wafers directly determines the conversion efficiency of photovoltaic cells. In the production process of photovoltaic cells, it is necessary to load and unload silicon wafers many times, that is, export the silicon wafers in the quartz boat after process treatment into the basket, and import the silicon wafers that have not been processed from the basket into the quartz boat.

[0003] In the related art, a quartz boat is placed in a tooling, and when the silicon wafer is introduced from the flower basket into the quartz boat, the silicon wafer is first sucked up by a suction cup, and then placed in a groove formed between two adjacent top teeth of a wafer picking and placing device. Usually two silicon wafers are placed in each groove, and when the top teeth fall, the carried silicon wafers can be driven to fall, and when the top teeth fall below the slot rod of the quartz boat, the silicon wafer can be inserted into the receiving groove of the slot rod of the quartz boat, so that two silicon wafers are inserted into each receiving groove.

[0004] However, as silicon wafers become thinner and larger, and as they deform during processing, they usually have a large deformation, so that two silicon wafers to be placed in the same receiving slot cannot fit together, and there is a large opening between the two silicon wafers; and because the width of the receiving slot of the quartz boat slot rod is extremely narrow, and the tooling needs to meet the compatible use of multiple quartz boats (due to errors in the manufacturing process, even if the specifications of multiple quartz boats are the same, there are certain errors in the width and position of the receiving slot), the two silicon wafers cannot smoothly enter the receiving slot of the slot rod when falling, and get stuck outside the receiving slot. Therefore, the card rate is high when loading the quartz boat, which reduces the loading efficiency. Utility Model Content

[0005] In order to solve the above technical problems, the present application is proposed. The embodiment of the present application provides a positioning tool, which is configured to accommodate a silicon wafer carrier and assist the silicon wafer carrier in loading sheet materials, the silicon wafer carrier includes two or more slot bars, the slot bars include a plurality of slot teeth arranged along its length direction, and a first groove is formed between adjacent slot teeth; it is characterized in that the positioning tool includes: a mounting frame assembly, which is configured to accommodate a silicon wafer carrier, the mounting frame assembly includes a pick-up and drop-out port, and the pick-up and drop-out port is configured to insert and place sheet materials; at least one guide plate, arranged at the pick-up and drop-out port of the mounting frame assembly, the guide plate includes a plurality of regular teeth arranged along a first direction, and a guide groove is formed between adjacent regular teeth; wherein, when the mounting frame assembly accommodates a silicon wafer carrier The arrangement direction of the groove teeth is parallel to the first direction, and the guide groove and the first groove are arranged one by one and connected, so that the sheet material can pass through the guide groove along the direction of taking and placing the sheet and then be inserted into the first groove; wherein, along the direction of taking and placing the sheet, the minimum groove width of the guide groove is defined as the first opening, the first opening is located at the end of the guide groove facing the corresponding first groove, and the groove width of the first opening is greater than or equal to the groove width of the first groove; along the second direction, the minimum groove width of the guide groove is defined as the second opening, the second opening is located at the guide groove close to the bottom of the groove, and the groove width of the second opening is greater than or equal to the groove width of the first groove; the second direction, the first direction and the direction of taking and placing the sheet intersect with each other.

[0006] In some embodiments, along the direction of placing and picking up the wafer, the end of the guide groove facing away from the groove tooth is defined as a third opening; wherein, along the direction from the third opening to the first opening, the width of the guide groove decreases; and / or, along the second direction, the end of the guide groove facing the inside of the silicon wafer carrier is defined as a fourth opening; wherein, along the direction from the fourth opening to the second opening, the width of the guide groove decreases.

[0007] In some embodiments, along the direction of taking and placing the sheet, the guide plate includes a surface facing the groove teeth, and the width of the guide groove remains unchanged from the connection between the first opening and the third opening to the area of ​​the surface; and / or along the second direction, the width of the guide groove remains unchanged from the connection between the second opening and the fourth opening to the bottom area of ​​the guide groove.

[0008] In some embodiments, the mounting frame assembly includes: a supporting assembly configured to accommodate a silicon wafer carrier; at least one clamping assembly slidably connected to the supporting assembly along a second direction, all the clamping assemblies are symmetrically arranged on both sides of the supporting assembly, and each clamping assembly is configured to clamp one side of the silicon wafer carrier.

[0009] In some embodiments, the clamping assembly includes: a connecting plate extending along a first direction, one end of the connecting plate being slidably connected to the supporting assembly along a second direction; a first clamping member extending along the second direction, one end of each first clamping member being connected to the connecting plate; a second clamping member extending along the second direction, one end of each second clamping member being connected to the connecting plate; wherein, along the first direction, the first clamping member and the second clamping member are relatively arranged on both sides of the connecting plate.

[0010] In some embodiments, the mounting frame assembly also includes: a slide rail extending along the second direction; at least one slider slidably connected to the slide rail, each slider being connected to at least one clamping assembly on the same side; and a first cylinder connected to the slider and configured to drive the slider to move along the slide rail.

[0011] In some embodiments, the positioning tool further includes: at least one driving source mounted to the mounting frame assembly, wherein the protruding end of each driving source is connected to a guide plate and is configured to drive the guide plate to move in the second direction.

[0012] In some embodiments, the number of the guide plates is two, and the two guide plates are symmetrically arranged relative to the central axis of the mounting frame assembly.

[0013] In some embodiments, the positioning tool further includes: a bearing assembly, the bearing assembly extends along a first direction, one end of the bearing assembly is connected to the mounting frame assembly, and the bearing assembly is located on a side of the mounting frame assembly away from the access port.

[0014] In some embodiments, the supporting assembly includes: at least one pallet extending along a first direction, one end of the pallet connected to the mounting frame assembly, the pallet having a plurality of support teeth arranged at intervals along the first direction, a second groove formed between adjacent support teeth, the plurality of second grooves corresponding to a plurality of guide grooves, any second groove and the corresponding guide groove enclose a placement space, and the placement space is configured to accommodate sheet materials.

[0015] The positioning tooling proposed in the embodiment of the present application can reduce the deformation of two sheets of sheet materials passing through the same guide groove because the width of the first opening of the guide groove is greater than or equal to the width of the first groove, and can be smoothly inserted into a first groove after being tightly fitted, thereby avoiding jamming and improving the efficiency of loading silicon wafers into the silicon wafer carrier. In addition, when loading sheet materials into the silicon wafer carrier, two batches of sheet materials are usually loaded in sequence, and the two batches of sheet materials are placed crosswise in the silicon wafer carrier. After loading one batch of sheet materials, since the width of the second opening of the guide groove is greater than or equal to the width of the first groove, the guide plate can be moved to insert the sheet material into the guide groove, so that the sheet materials of this batch are regularized by the narrower guide groove, avoiding the deformation of the sheet materials of another batch from being blocked by the sheet materials of this batch when loading, thereby causing jamming, thereby improving the efficiency of loading silicon wafers into the silicon wafer carrier. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] By describing the embodiments of the present application in more detail in conjunction with the accompanying drawings, the above and other purposes, features and advantages of the present application will become more apparent. The accompanying drawings are used to provide a further understanding of the embodiments of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation of the present application. In the accompanying drawings, the same reference numerals generally represent the same components or steps.

[0017] Figure 1 Shown is a front view of a guide plate provided by an exemplary embodiment of the present application.

[0018] Figure 2 An exemplary embodiment of the present application is shown. Figure 1 A partial enlarged view of area A in the middle.

[0019] Figure 3 Shown is a top view of a guide plate provided by an exemplary embodiment of the present application.

[0020] Figure 4 An exemplary embodiment of the present application is shown. Figure 3 A partial enlarged view of area B in the middle.

[0021] Figure 5 Shown is a schematic structural diagram of a positioning tool provided by an exemplary embodiment of the present application.

[0022] Figure 6 Shown is a schematic structural diagram of a positioning tool and a silicon wafer carrier provided by an exemplary embodiment of the present application.

[0023] Figure 7 An exemplary embodiment of the present application is shown. Figure 6 A partial enlarged view of area C in the middle.

[0024] Figure 8 Shown is a top view of a tidying tooth provided by an exemplary embodiment of the present application.

[0025] Fig. 9 An exemplary embodiment of the present application is shown. Figure 8 Cross-sectional view along MM direction.

[0026] Fig.10 Shown is a front view of a tidying tooth provided by an exemplary embodiment of the present application.

[0027] Fig.11 An exemplary embodiment of the present application is shown. Fig.10 Cross-sectional view along the NN direction.

[0028] Reference numerals:

[0029] 100, guide plate; 110, fixing member; 120, aligning tooth; 121, first section; 1211, first end; 1212, second end; 122, second section; 1221, third end; 1222, fourth end; 130, guide groove; 131, first opening; 132, second opening; 133, third opening; 134, fourth opening; 200, positioning tool; 210, mounting frame assembly; 211, supporting assembly; 212, clamping assembly; 2121, connecting plate; 2122, first clamping member; 2123, second clamping member; 213, slide rail; 214, slider; 215, first cylinder; 220, driving source; 230, bearing assembly; 231, support plate; 300, silicon wafer carrier; 310, groove rod; 311, groove tooth; 312, first groove. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0031] Exemplary Devices

[0032] Figure 1 FIG. 1 is a front view of a guide plate provided by an exemplary embodiment of the present application. Figure 2 An exemplary embodiment of the present application is shown. Figure 1 A partial enlarged view of area A in the middle. Figure 3 FIG. 1 is a top view of a guide plate provided by an exemplary embodiment of the present application. Figure 4 An exemplary embodiment of the present application is shown. Figure 3 A partial enlarged view of area B in the middle. Figure 5 FIG. 1 is a schematic diagram of the structure of a positioning tool provided by an exemplary embodiment of the present application. Figure 6 FIG. 1 is a schematic structural diagram of a positioning tool and a silicon wafer carrier provided by an exemplary embodiment of the present application. Figure 7 An exemplary embodiment of the present application is shown. Figure 6 A partial enlarged view of area C in the middle.

[0033] like Figure 1 to Figure 7As shown, an embodiment of the present application provides a positioning tool 200, which is configured to accommodate a silicon wafer carrier 300 and assist the silicon wafer carrier 300 in loading sheet materials. The silicon wafer carrier 300 includes more than two slot bars 310, and the slot bars 310 include a plurality of slot teeth 311 arranged along its length direction, and a first groove 312 is formed between adjacent slot teeth 311. The positioning tool 200 includes: a mounting frame assembly 210 and at least one guide plate 100. The mounting frame assembly 210 is configured to accommodate a silicon wafer carrier 300, and the silicon wafer carrier 300 is exemplarily a basket or boat structure. The mounting frame assembly 210 includes a pick-and-place port, which is configured to insert and place sheet materials. When the positioning tool 200 is Figure 5 and Figure 6 The placement position shown in FIG. 2 is shown in FIG. 2 , and the access opening is exemplarily located at the upper end of the mounting frame assembly 210. At least one guide plate 100 is disposed at the access opening of the mounting frame assembly 210, and the guide plate 100 includes a first direction (such as Figure 1 , Figure 3 , Figure 5 and Figure 6 The plurality of regular teeth 120 are arranged in the X direction (in the X direction), and guide grooves 130 are formed between adjacent regular teeth 120. Wherein, when the mounting frame assembly 210 accommodates the silicon wafer carrier 300, the arrangement direction of the groove teeth 311 is parallel to the first direction, and the guide grooves 130 are arranged in a one-to-one correspondence with the first grooves 312 and are connected, so that the sheet material can pass through the guide grooves 130 along the direction of taking and placing the sheet and then be inserted into the first groove 312. The sheet material is exemplarily a silicon wafer or a glass substrate. Wherein, along the direction of taking and placing the sheet (such as Figure 1 , Figure 5 and Figure 6 The minimum slot width of the guide slot 130 is defined as the first opening 131, the first opening 131 is located at the end of the guide slot 130 facing the corresponding first groove 312, and the slot width of the first opening 131 is greater than or equal to the slot width of the first groove 312; along the second direction (such as Figure 5 and Figure 6 The second opening 132 is defined as the minimum slot width of the guide slot 130. The second opening 132 is located near the bottom of the guide slot 130, and the slot width of the second opening 132 is greater than or equal to the slot width of the first groove 312. The second direction, the first direction and the direction of placing and taking the sheet intersect each other. For example, Figure 7 As shown, the direction of taking and placing the sheet is a vertical direction, the first direction is a horizontal direction, and the second direction is perpendicular or approximately perpendicular to the first direction and the direction of taking and placing the sheet.

[0034] In the above embodiment, by providing the guide plate 100 at the access opening, the sheet material to be inserted into the silicon wafer carrier 300 can be first shaped by the guide plate 130 at the access opening and then inserted into the silicon wafer carrier 300 (i.e. Figure 6As shown, when falling from the top of the positioning tool 200, it first passes through the guide plate 100 and then is inserted into the silicon wafer carrier 300), so that the two pieces of sheet materials that have been regularized and bonded can smoothly enter the same first groove 312. Since the groove width of the first opening 131 of the guide groove 130 is greater than or equal to the groove width of the first groove 312, the deformation degree of the two pieces of sheet materials passing through the same guide groove 130 can be reduced, and they can be smoothly inserted into a first groove 312 after being tightly fitted, avoiding jamming and improving the efficiency of loading silicon wafers into the silicon wafer carrier 300. In addition, when loading sheet materials into the silicon wafer carrier 300, two batches of sheet materials are usually loaded in sequence, and the two batches of sheet materials are placed crosswise in the silicon wafer carrier 300. After loading one batch of sheet materials, since the groove width of the second opening 132 of the guide groove 130 is greater than or equal to the groove width of the first groove 312, the guide plate 100 can be moved to allow the sheet material to be inserted into the guide groove 130, so that the sheet materials of this batch are regulated by the narrower guide groove 130, avoiding that the sheet materials of another batch are blocked by the deformed sheet materials of this batch when loading, thereby causing jamming, thereby improving the efficiency of loading sheet materials into the silicon wafer carrier 300.

[0035] Figure 8 FIG9 is a top view of a tidying tooth provided by an exemplary embodiment of the present application, and FIG9 is a top view of a tidying tooth provided by an exemplary embodiment of the present application. Figure 8 The cross-sectional view along the MM direction, Fig.10 The figure is a front view of a tidying tooth provided by an exemplary embodiment of the present application. Fig.11 An exemplary embodiment of the present application is shown. Fig.10 Cross-sectional view along the NN direction.

[0036] In some embodiments, the first cross section 121 (eg, Fig. 9 ) comprises a first end 1211 and a second end 1212 which are arranged opposite to each other, the first plane is a plane perpendicular to the second direction, the first end 1211 is away from the slot rod 310, the second end 1212 is close to the slot rod 310, and the size of the first end 1211 in the first direction is smaller than the size of the second end 1212 in the first direction; the second cross section 122 (as shown in FIG. 122 ) parallel to the second plane of the regularized tooth 120 Fig.11 As shown in the figure, the third end 1221 and the fourth end 1222 are relatively arranged, the second plane is a plane perpendicular to the direction of taking and placing the sheet, the third end 1221 is far away from the mounting frame assembly 210, and the fourth end 1222 is close to the mounting frame assembly 210, and the size of the third end 1221 in the first direction is smaller than the size of the fourth end 1222 in the first direction.

[0037] In some embodiments, Figure 1 , Figure 3 , Figure 5 and Figure 6 As shown, the guide plate 100 further includes: a fixing member 110, and one end of each regular tooth 120 is connected to the fixing member 110. The fixing member 110 is exemplarily a strip-shaped structure, and the fixing member 110 extends along the first direction.

[0038] In some embodiments, Figure 2 As shown, along the direction of taking and placing the sheet, the end of the guide groove 130 away from the groove teeth 311 is defined as the third opening 133; wherein, along the direction from the third opening 133 to the first opening 131, the groove width of the guide groove 130 decreases gradually. With this structure, two sheets of sheet materials entering the same guide groove 130 can be gradually regulated by the guide groove 130 when being loaded in the direction of taking and placing the sheet, thereby preventing the sheet materials from being stuck in the guide groove 130; and / or, as Figure 4 As shown, along the second direction, the end of the guide groove 130 facing the inside of the silicon wafer carrier 300 is defined as the fourth opening 134; wherein, along the direction of the fourth opening 134 pointing to the second opening 132, the groove width of the guide groove 130 decreases. Through this structure, when the guide plate 100 moves toward the sheet material inserted into the silicon wafer carrier 300, the two sheets of sheet materials entering the same guide groove 130 can be gradually regulated by the guide groove 130, thereby preventing the sheet materials from being stuck in the guide groove 130.

[0039] In actual applications, the groove width range of the third opening 133 and the groove width range of the fourth opening 134 can be set according to the groove width of the first groove 312 and the spacing between adjacent first grooves 312, so that the groove width of the third opening 133 and the groove width of the fourth opening 134 are as large as possible, thereby ensuring that the two deformed sheet materials can enter the guide groove 130; the groove width range of the first opening 131 and the groove width range of the second opening 132 can be set according to the thickness of the sheet material and the groove width of the first groove 312, thereby ensuring that the two sheets of sheet materials can be clamped to an appropriate degree by the guide groove 130, so as to enter the first groove 312.

[0040] In some embodiments, along the direction of placing and picking the sheet, the guide plate 100 includes a surface (eg, Figure 5 and Figure 6 , i.e. the lower surface of the guide plate 100), the area from the junction of the first opening 131 and the third opening 133 to the surface (i.e. Figure 2 The width of the guide groove 130 remains unchanged. With this structure, since the width of the groove in this area is relatively narrow, two sheets of sheet materials entering the same guide groove 130 can be continuously regularized to be close to each other when moving in the direction of taking and placing sheets, thereby improving the regularization effect; and / or along the second direction, the connection between the second opening 132 and the fourth opening 134 to the groove bottom area of ​​the guide groove 130 (i.e. Figure 4The width of the guide groove 130 remains unchanged. With this structure, since the width of the groove bottom area is relatively narrow, when the guide plate 100 moves toward the sheet material inserted into the silicon wafer carrier 300, the two sheet materials entering the same guide groove 130 can be continuously regulated by the groove bottom area.

[0041] In some embodiments, Figure 5 and Figure 6 As shown, the mounting frame assembly 210 includes: a supporting assembly 211, which is configured to accommodate a silicon wafer carrier 300; at least one clamping assembly 212, which is slidably connected to the supporting assembly 211 along the second direction, and all the clamping assemblies 212 are symmetrically arranged on both sides of the supporting assembly 211, and each clamping assembly 212 is configured to clamp one side of the silicon wafer carrier 300. Through this structure, the clamping assembly 212 can firmly clamp both sides of the silicon wafer carrier 300, and when the positioning tool 200 rotates, it can firmly drive the silicon wafer carrier 300 to rotate. Exemplarily, there are two clamping assemblies 212, and the two clamping assemblies 212 are respectively used to clamp the first side and the second side opposite to the silicon wafer carrier 300. If the silicon wafer carrier 300 is a boat structure, each clamping assembly 212 can specifically be a groove bar 310 for clamping the silicon wafer carrier 300.

[0042] In some embodiments, Figure 5 and Figure 6 As shown, the clamping assembly 212 includes: a connecting plate 2121 extending in a first direction, one end of the connecting plate 2121 being slidably connected to the supporting assembly 211 in a second direction; a first clamping member 2122 extending in the second direction, one end of each first clamping member 2122 being connected to the connecting plate 2121; a second clamping member 2123 extending in the second direction, one end of each second clamping member 2123 being connected to the connecting plate 2121; wherein, in the first direction, the first clamping member 2122 and the second clamping member 2123 are disposed oppositely on both sides of the connecting plate 2121. Through this structure, the connecting plate 2121, the first clamping member 2122 and the second clamping member 2123 can limit the posture and displacement of the silicon wafer carrier 300, and when the positioning tool 200 rotates, the first clamping member 2122 or the second clamping member 2123 can stably support and drive the silicon wafer carrier 300 to rotate.

[0043] In some embodiments, Figure 5 As shown, the mounting frame assembly 210 also includes: a slide rail 213 extending along the second direction; at least one slider 214 slidably connected to the slide rail 213, and each slider 214 is connected to at least one clamping assembly 212 on the same side; a first cylinder 215 connected to the slider 214 and configured to drive the slider 214 to move along the slide rail 213.

[0044] Specifically, the connecting plate 2121 of each clamping assembly 212 is connected to the slider 214. Two or more sliders 214 can be slidably connected to each slide rail 213. If there are two clamping assemblies 212 on the same side, the two clamping assemblies 212 can be connected to the same slider 214, and the slider 214 slides along the slide rail 213, so that one slider 214 can drive two clamping assemblies 212 to move, or, if there is only one clamping assembly 212 on each side of the supporting assembly 211, the number of the slide rails 213 is two or more, and the two or more slide rails 213 are arranged in sequence along the direction of taking and placing the sheet, each clamping assembly 212 is simultaneously connected to the sliders 214 slidably connected to the two or more slide rails 213, so that the two or more sliders 214 can jointly drive one clamping assembly 212 to move, so that the clamping assembly 212 can move more smoothly. Through this structure, the clamping assembly 212 can be driven to move in the second direction, so that the distance between the clamping assemblies 212 on both sides can be increased or decreased. When loading the silicon wafer carrier 300 into the positioning tool 200, the distance between the clamping assemblies 212 on both sides can be increased, thereby facilitating the insertion of the silicon wafer carrier 300. Then, after the silicon wafer carrier 300 is placed between the clamping assemblies 212 on both sides, the distance between the clamping assemblies 212 on both sides can be decreased, thereby clamping the silicon wafer carrier 300.

[0045] In some embodiments, Figure 5 and Figure 6 As shown, the positioning tool 200 also includes: at least one driving source 220, which is mounted to the mounting frame assembly 210, and the protruding end of each driving source 220 is connected to a guide plate 100, and is configured to drive the guide plate 100 to move along the second direction. Exemplarily, the driving source 220 is a second cylinder or a screw motor, and the protruding end of the second cylinder includes a cylinder rod, which is connected to the connecting member, and the connecting member is connected to the fixing member 110. Through this structure, when taking out the sheet material in the silicon wafer carrier 300, the driving source 220 can drive the guide plate 100 away from the silicon wafer carrier 300 to avoid the sheet material being blocked by the guide plate 100. When loading the silicon wafer carrier 300, the driving source 220 can drive the guide plate 100 close to the silicon wafer carrier 300, so that the sheet material to be inserted into the silicon wafer carrier 300 can be regularized so that the sheet material to be inserted into the silicon wafer carrier 300 can be smoothly inserted into the first groove 312, and the sheet material already inserted into the silicon wafer carrier 300 can be regularized to avoid blocking the insertion of the sheet material to be inserted into the silicon wafer carrier 300 due to the large degree of deformation of the sheet material already inserted into the silicon wafer carrier 300.

[0046] In some embodiments, Figure 5 and Figure 6As shown, there are two guide plates 100, and the two guide plates 100 are symmetrically arranged relative to the central axis of the mounting frame assembly 210. By arranging two guide plates 100, the sheet material can be regularized from both sides, thereby improving the regularization effect of the sheet material.

[0047] In some embodiments, Figure 5 and Figure 6 As shown, the positioning tool 200 also includes: a bearing assembly 230, the bearing assembly 230 extends along the first direction, one end of the bearing assembly 230 is connected to the mounting frame assembly 210, and the bearing assembly 230 is located on the side of the mounting frame assembly 210 away from the access port (such as Figure 5 and Figure 6 The middle bearing assembly 230 is located at the bottom of the positioning tool 200). By providing the bearing assembly 230, the sheet material inserted into the first groove 312 can be supported by the bearing assembly 230, so as to stably fix the sheet material after the sheet is inserted.

[0048] In some embodiments, Figure 5 and Figure 6 As shown, the bearing assembly 230 includes: at least one support plate 231, the support plate 231 extends along the first direction, one end of the support plate 231 is connected to the mounting frame assembly 210, the support plate 231 has a plurality of support teeth arranged at intervals along the first direction, and a second groove is formed between adjacent support teeth, and the plurality of second grooves are arranged one-to-one with the plurality of guide grooves 130, and any second groove and the corresponding guide groove 130 (i.e., the guide groove 130 coplanar with the second groove) enclose to form a placement space (the placement space is also coplanar with the first groove 312 corresponding to the guide groove 130), and the placement space is configured to accommodate sheet materials. For example, as Figure 6 As shown, the side edge of each sheet material can be inserted into the first groove 312 and the guide groove 130 at the same time, and the bottom edge of each sheet material is inserted into the second groove and supported by the second groove. Therefore, through this structure, the sheet material can be stably supported.

[0049] In a specific application scenario, the first groove 312 includes a plurality of cross-arranged first sub-grooves and second sub-grooves. When two batches of sheet materials are loaded in the first groove 312 (i.e., the first sub-groove is loaded with one batch of sheet materials, and the second sub-groove is loaded with another batch of sheet materials. For the convenience of describing the two batches of sheet materials, they are respectively referred to as the first batch of sheet materials and the second batch of sheet materials), the driving source 220 drives the guide plate 100 to move away from the silicon wafer carrier 300, and the wafer picking and placing device lifts the first batch of sheet materials in the first sub-groove and drives it to rise above the picking and placing port, and the transport device transports the first batch of sheet materials to the flower basket, wherein keeping the guide plate 100 away from the silicon wafer carrier 300 can prevent the guide plate 100 from interfering with the wafer picking and placing device in lifting the first batch of sheet materials. shaped material and drives the first batch of sheet materials to rise; then the driving source 220 drives the guide plate 100 to move close to the silicon wafer carrier 300, and the second batch of sheet materials in the second sub-groove can be inserted into the guide groove 130 of the guide plate 100 from the fourth opening 134 of the guide plate 100, so as to regularize the second batch of sheet materials and avoid the third batch of sheet materials being blocked by the second batch of sheet materials when loading due to the large deformation of the second batch of sheet materials; finally, the transport device loads the third batch of sheet materials in the flower basket onto the sheet picking and placing device, and the sheet picking and placing device drives the third batch of sheet materials to descend, and the third batch of sheet materials will enter and pass through the guide groove 130 from the third opening 133 of the guide plate 100, and be regularized by the guide groove 130, and finally inserted into the first sub-groove.

[0050] The basic principles of the present application are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present application are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present application. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, not for limitation, and the above details do not limit the present application to being implemented by adopting the above specific details.

[0051] The block diagrams of the devices, apparatuses, equipment, and systems involved in this application are only illustrative examples and are not intended to require or imply that they must be connected, arranged, and configured in the manner shown in the block diagram. As will be appreciated by those skilled in the art, these devices, apparatuses, equipment, and systems can be connected, arranged, and configured in any manner. Words such as "including", "comprising", "having", etc. are open words, referring to "including but not limited to", and can be used interchangeably with them. The words "or" and "and" used here refer to the words "and / or" and can be used interchangeably with them, unless the context clearly indicates otherwise. The words "such as" used here refer to the phrase "such as but not limited to", and can be used interchangeably with them.

[0052] It should also be noted that in the apparatus, device and method of the present application, each component or each step can be decomposed and / or recombined. Such decomposition and / or recombination should be regarded as equivalent solutions of the present application.

[0053] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of the present application. Therefore, the present application is not intended to be limited to the aspects shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

[0054] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.

Claims

1. A positioning tool, which is configured to accommodate a silicon wafer carrier and assist the silicon wafer carrier in loading sheet materials, wherein the silicon wafer carrier comprises two or more slot bars, the slot bars comprise a plurality of slot teeth arranged along the length direction thereof, and a first groove is formed between adjacent slot teeth; characterized in that: The positioning tooling comprises: A mounting frame assembly, which is configured to accommodate the silicon wafer carrier, and the mounting frame assembly includes a take-and-place opening, and the take-and-place opening is configured to insert and place the sheet material; At least one guide plate, disposed at the access opening of the mounting frame assembly, the guide plate comprising a plurality of regular teeth arranged along a first direction, and guide grooves are formed between adjacent regular teeth; Wherein, when the mounting frame assembly accommodates the silicon wafer carrier, the arrangement direction of the groove teeth is parallel to the first direction, and the guide grooves are arranged in one-to-one correspondence with the first grooves and are connected, so that the sheet material can pass through the guide grooves along the direction of taking and placing the sheet and then be inserted into the first groove; Wherein, along the direction of placing and picking the sheet, the minimum slot width of the guide slot is defined as the first opening, the first opening is located at the end of the guide slot facing the corresponding first groove, and the slot width of the first opening is greater than or equal to the slot width of the first groove; Along the second direction, the minimum groove width of the guide groove is defined as the second opening, the second opening is located near the bottom of the guide groove, and the groove width of the second opening is greater than or equal to the groove width of the first groove; the second direction, the first direction and the direction of taking and placing the sheet intersect with each other.

2. The positioning tool according to claim 1, characterized in that: Along the direction of picking and placing the sheet, an end of the guide groove away from the groove teeth is defined as a third opening; Wherein, along the direction from the third opening to the first opening, the width of the guide groove decreases gradually; and / or, Along the second direction, an end of the guide groove facing the inside of the silicon wafer carrier is defined as a fourth opening; Wherein, along the direction from the fourth opening to the second opening, the width of the guide groove decreases gradually.

3. The positioning tool according to claim 2, characterized in that: Along the direction of taking and placing the sheet, the guide plate includes a surface facing the groove teeth, and the width of the guide groove remains unchanged in the area from the junction of the first opening and the third opening to the surface; and / or Along the second direction, from the junction of the second opening and the fourth opening to the groove bottom area of ​​the guide groove, the groove width of the guide groove remains unchanged.

4. The positioning tool according to claim 1 or 2, characterized in that: The mounting frame assembly comprises: A supporting assembly configured to accommodate the silicon wafer carrier; At least one clamping component is slidably connected to the supporting component along the second direction, all the clamping components are symmetrically arranged on both sides of the supporting component, and each of the clamping components is configured to clamp one side of the silicon wafer carrier.

5. The positioning tool according to claim 4, characterized in that: The clamping assembly comprises: A connecting plate extending along the first direction, one end of the connecting plate being slidably connected to the supporting assembly along the second direction; A first clamping member extending along the second direction, one end of each of the first clamping members being connected to the connecting plate; A second clamping member extending along the second direction, one end of each of the second clamping members being connected to the connecting plate; Wherein, along the first direction, the first clamping member and the second clamping member are arranged opposite to each other on two sides of the connecting plate.

6. The positioning tool according to claim 4, characterized in that: The mounting frame assembly further comprises: a slide rail extending along the second direction; At least one slider is slidably connected to the slide rail, and each slider is connected to at least one clamping assembly on the same side; The first cylinder is connected to the slider and is configured to drive the slider to move along the slide rail.

7. The positioning tool according to claim 1, characterized in that: Also includes: At least one driving source is mounted to the mounting frame assembly, and the protruding end of each driving source is connected to one of the guide plates and is configured to drive the guide plate to move along the second direction.

8. The positioning tool according to claim 1 or 2, characterized in that: The number of the guide plates is two, and the two guide plates are symmetrically arranged relative to the central axis of the mounting frame assembly.

9. The positioning tool according to claim 1 or 2, characterized in that: Also includes: A bearing assembly extending along the first direction, one end of the bearing assembly being connected to the mounting frame assembly, and the bearing assembly being located on a side of the mounting frame assembly away from the access opening.

10. The positioning tool according to claim 9, characterized in that: The bearing assembly comprises: At least one pallet, which extends along the first direction, one end of which is connected to the mounting frame assembly, the pallet having a plurality of teeth spaced apart along the first direction, a second groove formed between adjacent teeth, a plurality of the second grooves corresponding to a plurality of the guide grooves, any of the second grooves and the corresponding guide groove enclose a placement space, and the placement space is configured to accommodate the sheet material.

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