Box body structure for installing novel micro-arc oxidation power supply
By designing a box structure, optimizing the layout and integrating an efficient heat dissipation system, the heat dissipation and electrical layout problems in traditional microarc oxidation power supply design are solved, efficient conversion and stable output of electrical energy are achieved, and the efficiency and reliability of the system are improved.
Patent Information
- Application Number
- CN202421692109.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-16
- Publication Date
- 2025-05-13
- Estimated Expiration
- 2034-07-16
AI Technical Summary
There are heat dissipation problems and electrical layout and connection problems in traditional microarc oxidation power supply design, which affects the stability and service life of the power supply.
A box structure is designed, including the first and second mounting brackets and the main control board, which is arranged close to the box. The first mounting bracket is equipped with a power interface row, the second mounting bracket is equipped with a voltage box and a water cooling device, the high-frequency voltage and the power interface row are connected by short-distance wires, and the main control board is close to the power interface row to optimize layout and heat dissipation.
By optimizing the layout, integrating efficient heat dissipation system and shortening the electrical connection path, efficient conversion and stable output of electrical energy are achieved, the conversion efficiency and energy utilization of the entire power supply system are improved, and the reliable power support of the microarc oxidation process is ensured.
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Figure CN222869231U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of micro-arc oxidation equipment, in particular to a box structure for installing a novel micro-arc oxidation power supply. Background Art
[0002] As an advanced metal surface treatment technology, micro-arc oxidation technology generates a dense oxide film on the metal surface through high-frequency micro-arc discharge, which significantly improves the hardness, wear resistance, corrosion resistance and insulation performance of the material. This technology has broad application prospects in aerospace, automobile manufacturing, electronic communications and other fields. However, the micro-arc oxidation process has extremely high requirements for the power system, requiring stable current and voltage output to ensure uniform growth and high quality of the oxide layer.
[0003] In the design of traditional micro-arc oxidation power supplies, the following challenges are often faced: First, the heat dissipation problem. Key components such as high-frequency transformers will generate a lot of heat during operation. If the heat cannot be dissipated in a timely and effective manner, it will seriously affect the stability and service life of the power supply. The second is the electrical layout and connection problem. Unreasonable layout and excessively long electrical connection paths will increase power loss and reduce system efficiency. Utility Model Content
[0004] In view of the above situation, it is necessary to provide a box structure for installing a new micro-arc oxidation power supply that solves at least one of the above problems, including a first mounting bracket, a second mounting bracket and a main control board, the first mounting bracket and the second mounting bracket are closely arranged in the box, the first mounting bracket is provided with a power interface row, the second mounting bracket is provided with a voltage device box, the voltage device box is provided with a high-frequency voltage device, the voltage device box is provided with a water cooling device, the high-frequency voltage device is connected to the power interface row with electric wires, and the main control board is fixedly arranged on one side of the box and close to the power interface row.
[0005] Preferably, it also includes an IGBT, which is arranged on the first mounting bracket and close to the main control board.
[0006] Preferably, the transformer housing is provided with at least one.
[0007] Preferably, a plurality of the transformer boxes are arranged in an array on the second mounting bracket.
[0008] Preferably, the water cooling device includes a water circuit, a water pipe and a water outlet. The water circuit is built into the voltage transformer case. The water outlet is arranged in the voltage transformer case and is connected to the water circuit. The water pipe is connected to the water outlet. The water pipe connects multiple water outlets on the voltage transformer case in series.
[0009] Preferably, it also includes a laminated plate, which is arranged on one side of the first mounting frame, and the laminated plate is provided with high-frequency clamping capacitors, chopping capacitors and isolation diodes from top to bottom, and the high-frequency clamping capacitors, the chopping capacitors and the isolation diodes are arranged in parallel. BRIEF DESCRIPTION OF THE DRAWINGS
[0010] 1. First mounting bracket; 11. Power interface row; 2. Second mounting bracket; 21. Voltage transformer housing; 3. Main control board; 4. Water cooling device; 41. Water pipe; 42. Water inlet; 5. IGBT; 6. Laminated board; 61. High-frequency clamping capacitor; 62. Chopper capacitor; 63. Isolation diode; 7. Housing.
[0011] Figure 1 It is a structural schematic diagram of a box body according to an embodiment of the utility model.
[0012] Figure 2 It is a schematic diagram of the internal structure of the box body of the embodiment of the utility model.
[0013] Figure 3 It is a schematic diagram of the internal structure of the box body of the embodiment of the utility model. DETAILED DESCRIPTION
[0014] In order to make the purpose, technical solution and advantages of the utility model more clear, the box structure for installing the novel micro-arc oxidation power supply of the utility model is further described in detail below in combination with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.
[0015] In the description of the present invention, unless otherwise specified, "multiple" means two or more; the terms "center", "longitudinal", "lateral", "up", "down", "left", "right", "inside", "outside", "front end", "rear end", "head", "tail", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.
[0016] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this utility model can be understood by specific circumstances.
[0017] See also Figures 1 to 3 The box structure for installing a new micro-arc oxidation power supply of an embodiment of the utility model includes a first mounting bracket 1, a second mounting bracket 2 and a main control board 3. The first mounting bracket 1 and the second mounting bracket 2 are closely arranged in the box 7. The first mounting bracket 1 is provided with a power interface row 11, and the second mounting bracket 2 is provided with a voltage box 21. The voltage box 21 is provided with a high-frequency voltage. The voltage box 21 is provided with a water cooling device 4. The high-frequency voltage is connected to the power interface row 11 by wires. The main control board 3 is fixedly arranged on the box 7 and close to the power interface row 11.
[0018] In the above embodiment, the first mounting bracket 1 and the second mounting bracket 2 are placed closely adjacent to each other in the box 7 to make full use of the space. The first mounting bracket 1 is provided with a power interface row 11, which is responsible for receiving external power input. The second mounting bracket 2 carries the voltage box 21, and a high-frequency voltage is installed inside the box 7, which is the core component of power conversion. In order to cope with the high heat generated when the high-frequency voltage is running, the voltage box 21 is integrated with a water cooling device 4, which effectively dissipates heat through circulating water flow, ensures the stable operation of the high-frequency voltage, and reduces the volume occupation. The high-frequency voltage is connected to the power interface row 11 by a short-distance, high-quality wire, which reduces the loss in power transmission. The main control board 3, as the control center of the system, is fixed on one side of the box 7 near the power interface row 11. This layout arrangement is intended to reduce the interference of stray inductance on the drive signal, reduce signal transmission delay, and improve the system response speed. At the same time, the main control board 3 is close to the power input terminal, which is convenient for real-time monitoring of the power status and ensuring stable operation of the system. The design of the transformer box 21 close to the power interface row 11 not only shortens the length of the primary input wire, reduces the line resistance and energy loss, but also significantly reduces the leakage inductance of the high-frequency transformer. The reduction of leakage inductance means the reduction of losses in the energy conversion process, thereby improving the conversion efficiency and energy utilization of the entire power supply system. In summary, the structural design of the box structure 7 for installing the new micro-arc oxidation power supply achieves efficient conversion and stable output of electrical energy by optimizing the layout, integrating an efficient heat dissipation system and shortening the electrical connection path, providing reliable power support for processes such as micro-arc oxidation.
[0019] Please refer to Figures 1 to 3 In another embodiment, it further includes an IGBT5, which is arranged on the first mounting bracket 1 and close to the main control board 3.
[0020] In the above embodiment, IGBT5 is arranged on the first mounting bracket 1 and is located close to the main control board 3. As a power electronic device, IGBT5 is responsible for the rapid conversion and control of electric energy. Its layout design close to the main control board 3 facilitates the main control board 3 to monitor and accurately control IGBT5 in real time, reduces the signal transmission path, reduces the control delay, and improves the response speed and stability of the system. At the same time, this layout also optimizes the space utilization in the power box 7, making the overall structure more compact.
[0021] Please refer to Figures 1 to 3 In another embodiment, at least one of the transformer housings 21 is provided. A plurality of the transformer housings 21 are arranged on the second mounting bracket 2. The water cooling device 4 includes a water circuit, a water pipe 41 and a water inlet 42. The water circuit is built in the transformer housing 21. The water inlet 42 is provided in the transformer housing 21 and communicates with the water circuit. The water pipe 41 is connected to the water inlet 42. The water pipe 41 connects the water inlets 42 on the plurality of the transformer housings 21 in series.
[0022] In the above embodiment, in at least one transformer case 21, these boxes 7 are arranged in order and fixed on the second mounting bracket 2. Each transformer case 21 is integrated with a high-frequency transformer for the conversion, distribution or regulation of electric energy. In order to effectively manage the heat generated by these boxes 7 during operation and prevent performance degradation or equipment damage caused by overheating, a water cooling device 4 is specially designed for heat dissipation. The core components of the water cooling device 4 include a water circuit, a water pipe 41 and a water inlet 42. The water circuit is a cooling channel pre-designed and built into each transformer case 21, and its shape and layout are optimized to ensure that the heat generated inside the case 7 can be covered and absorbed to the greatest extent. The water inlet 42 is arranged on the outer wall of the transformer case 21, as the connection point between the water circuit and the external cooling system, they are directly connected to the inside of the water circuit to ensure that the cooling water can enter and exit smoothly. In order to achieve unified heat dissipation management between multiple transformer cases 21, the water pipe 41 is used to connect the water inlets 42 on each case 7 in series. This design allows cooling water to enter from the water inlet 42 of the first transformer box 21, flow through its internal water path, and then flow to the next box 7 through the water pipe 41, and so on, until it traverses all boxes 7 and completes the cycle. This series connection method not only simplifies the structure of the cooling system, but also improves the cooling efficiency, because the cooling water absorbs and takes away part of the heat when flowing through each box 7. As the cycle proceeds, the water temperature gradually increases, but its ability to carry heat is also fully utilized. In summary, by means of built-in water paths, setting water inlets 42, and using water pipes 41 to connect multiple transformer boxes 21 in series, the water cooling device 4 effectively achieves efficient heat dissipation of the electrical components in the transformer box 21, ensuring the stability and reliability of the equipment under long-term, high-load operation.
[0023] Please refer to Figures 1 to 3 In another embodiment, it also includes a laminated plate 6, which is arranged on one side of the first mounting frame. The laminated plate 6 is provided with a high-frequency clamping capacitor 61, a chopping capacitor 62 and an isolation diode from top to bottom. The high-frequency clamping capacitor 61, the chopping capacitor 62 and the isolation diode are arranged in parallel.
[0024] In the above embodiment, the laminated plate 6 is arranged on one side of the first mounting frame, and its vertical layout is from top to bottom, which is a high-frequency clamping capacitor 61, a chopping capacitor 62 and an isolation diode 63, which are connected in parallel. The high-frequency clamping capacitor 61 is designed to absorb high-frequency voltage fluctuations, protect the chopping capacitor 62 from spike voltage shocks, and ensure that it works in a stable voltage environment. The chopping capacitor 62 is responsible for storing and releasing energy to maintain the stable operation of the circuit. In the design of the laminated plate 6, the laminated busbar reduces the stray inductance through the opening technology. This measure optimizes the current path, reduces the energy loss and electromagnetic interference of the current during the transmission process, and further ensures the reliable operation of the chopping capacitor 62. The opening design also promotes the effective dissipation of heat and prevents performance degradation or damage caused by local overheating. In addition, as a key component in the parallel circuit, the unidirectional conductivity of the isolation diode 63 effectively prevents the current backflow phenomenon that may occur when the power supply is connected in parallel. When multiple power supplies are connected in parallel, if the output voltage of one power supply is higher than the others, the isolation diode 63 will prevent the current from flowing back into the low voltage power supply, especially avoiding the damage of the chopper capacitor 62 due to the reverse current, thereby ensuring the safety and stability of the entire power supply system.
[0025] The above description is only a preferred embodiment of the present invention and does not constitute any form of limitation to the present invention. Although the present invention has been disclosed as a preferred embodiment as above, it is not intended to limit the present invention. Any technician familiar with the profession can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still fall within the scope of the technical solution of the present invention.
Claims
1. A box structure for installing a new type of micro-arc oxidation power supply, characterized in that: It includes a first mounting bracket, a second mounting bracket and a main control board. The first mounting bracket and the second mounting bracket are closely arranged in a box. The first mounting bracket is provided with a power interface row. The second mounting bracket is provided with a voltage device box. The voltage device box is provided with a high-frequency voltage device. The voltage device box is provided with a water cooling device. The high-frequency voltage device is connected to the power interface row with electric wires. The main control board is fixedly arranged on one side of the box close to the power interface row.
2. The box structure for installing a novel micro-arc oxidation power source according to claim 1, characterized in that: It also includes an IGBT, which is arranged on the first mounting bracket and close to the main control board.
3. The box structure for installing a novel micro-arc oxidation power source according to claim 1, characterized in that: The transformer housing is provided with at least one.
4. The box structure for installing a novel micro-arc oxidation power source as claimed in claim 3, characterized in that: A plurality of the transformer boxes are arranged in an array on the second mounting bracket.
5. The box structure for installing a novel micro-arc oxidation power source according to claim 4, characterized in that: The water cooling device includes a water circuit, a water pipe and a water outlet. The water circuit is built into the voltage generator housing. The water outlet is arranged in the voltage generator housing and communicated with the water circuit. The water pipe is connected to the water outlet. The water pipe connects multiple water outlets on the voltage generator housing in series.
6. The box structure for installing a novel micro-arc oxidation power source according to claim 1, characterized in that: It also includes a laminated plate, which is arranged on one side of the first mounting frame. The laminated plate is provided with high-frequency clamping capacitors, chopping capacitors and isolation diodes from top to bottom. The high-frequency clamping capacitors, the chopping capacitors and the isolation diodes are arranged in parallel.