Array substrate, liquid crystal display panel and display device

Abstract

The utility model belongs to the technical field of display, and particularly relates to an array substrate, a liquid crystal display panel and a display device. The array substrate is provided with a first rigid substrate for supporting the opposed substrate; the flexible substrate is provided with a main bearing part located on the front face of the first rigid substrate and a side bearing part bent to the side face of the first rigid substrate. The circuit function layer is formed on the side, away from the first rigid substrate, of the flexible substrate and is provided with a pixel circuit part, a transition conductive part and a driving circuit part, the pixel circuit part is formed on the main bearing part, the driving circuit part is formed on the side bearing part, the transition conductive part is bent, one end of the transition conductive part is electrically connected with the pixel circuit part, and the other end of the transition conductive part is electrically connected with the first rigid substrate. And the other end is electrically connected with the driving circuit part. The flexible substrate and the first rigid substrate are arranged on the array substrate in a matched mode, so that the narrow frame of the array substrate is achieved, and meanwhile the stability of the box thickness between the array substrate and the opposite substrate is maintained.

Description

Technical Field

[0001] The present disclosure belongs to the field of display technology, and specifically relates to an array substrate, a liquid crystal display panel and a display device. Background Art

[0002] Currently, in order to achieve a narrow frame of the display panel, the driving circuit is usually bent. However, in a liquid crystal display panel, if the driving circuit is bent, the thickness of the liquid crystal box will easily change, thereby causing the angle of the liquid crystal molecules to change, resulting in abnormal problems such as uneven display. Utility Model Content

[0003] The purpose of the present application is to provide an array substrate, a liquid crystal display panel and a display device, which can achieve a narrow frame design of the array substrate while maintaining a stable cell thickness between the array substrate and an opposing substrate.

[0004] The present disclosure provides an array substrate, comprising:

[0005] a first rigid substrate, wherein the front surface of the first rigid substrate is used to support the counter substrate;

[0006] A flexible substrate having a main bearing portion located on the front side of the first rigid substrate and a side bearing portion bent to the side of the first rigid substrate;

[0007] A circuit function layer is formed on a side of the flexible substrate away from the first rigid substrate, the circuit function layer comprises a pixel circuit portion, a transition conductive portion and a driving circuit portion, the pixel circuit portion is formed on the main bearing portion, the driving circuit portion is formed on the side bearing portion, the transition conductive portion is bent, one end of the transition conductive portion is electrically connected to the pixel circuit portion, and the other end is electrically connected to the driving circuit portion.

[0008] In an exemplary embodiment of the present disclosure, the transition conductive portion includes at least one conductive structure, the conductive structure includes at least one conductive line, and the conductive line has a plurality of bending segments connected in sequence.

[0009] In an exemplary embodiment of the present disclosure, in the conductive structure: a plurality of conductive wires are provided, and any two of the conductive wires are connected to each other at the end points of the bending segments to form a plurality of parallel nodes arranged at intervals.

[0010] In an exemplary embodiment of the present disclosure, the conductive structure further includes:

[0011] A first collecting conductive line is formed on the main bearing portion, one end of the first collecting conductive line is electrically connected to the pixel circuit portion, and the other end of the first collecting conductive line is connected to a parallel node closest to the pixel circuit portion;

[0012] The second collecting conductive line is formed on the side bearing portion, one end of the second collecting conductive line is electrically connected to the driving circuit portion, and the other end of the second collecting conductive line is connected to the parallel node closest to the driving circuit portion.

[0013] In an exemplary embodiment of the present disclosure, the insulating film layers at the transition conductive portion are all organic film layers.

[0014] The present disclosure provides a liquid crystal display panel, comprising liquid crystal molecules, an opposing substrate, a frame sealant, and an array substrate as described above;

[0015] The counter substrate is supported on the front side of the array substrate by the frame-sealing glue and forms a receiving cavity with the array substrate. The liquid crystal molecules are filled in the receiving cavity, and the orthographic projection of the frame-sealing glue on the array substrate is located in the region of the transition conductive portion.

[0016] In an exemplary embodiment of the present disclosure, the liquid crystal display panel includes a flexible encapsulation layer, and the flexible encapsulation layer covers the transition conductive portion and a side of the driving circuit portion away from the flexible substrate.

[0017] The present disclosure provides a display device, comprising a backlight module and any one of the above-mentioned liquid crystal display panels, wherein the liquid crystal display panel is located at a light-emitting side of the backlight module.

[0018] In an exemplary embodiment of the present disclosure, the side bearing portion and the driving circuit portion are bent and extended to the side of the backlight module, and a shading layer is formed on the side of the side bearing portion close to the side of the backlight module, and the shading layer is used to block the light of the backlight module from irradiating the driving circuit portion.

[0019] In an exemplary embodiment of the present disclosure, the backlight module includes a light guide plate and a light-emitting component, the light guide plate has a light-entering side surface opposite to the driving circuit portion and a light-emitting front surface opposite to the first rigid base, the light-emitting component is arranged between the light-entering side surface and the side bearing portion, and a heat-conducting layer is provided between the light-emitting component and the side bearing portion.

[0020] This application scheme has the following beneficial effects:

[0021] The present disclosure forms a circuit function layer on a flexible substrate, so that the driving circuit part can be bent to the side of the substrate along with the side bearing part of the flexible substrate, so as to facilitate the realization of a narrow frame design. Furthermore, the present application uses a first rigid substrate to support the main bearing part of the flexible substrate, and at the same time, does not affect the bending of the side bearing part of the flexible substrate and the driving circuit part of the circuit function layer to the side of the first rigid substrate, and can also ensure the support strength of the pixel circuit part of the circuit function layer and the opposing substrate, thereby ensuring the stability of the box thickness between the array substrate and the opposing substrate. In this way, when the array substrate is applied to a liquid crystal display panel, it can avoid the situation that the angle of the liquid crystal molecules changes due to the change of the box thickness, thereby causing abnormal problems such as uneven display. That is, the array substrate provided by the present disclosure can achieve a narrow frame and ensure the stability of the box thickness, thereby ensuring the display effect.

[0022] Other features and advantages of the present application will become apparent from the following detailed description, or may be learned in part by the practice of the present application.

[0023] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The accompanying drawings herein are incorporated into and constitute a part of the specification, illustrate embodiments consistent with the present disclosure, and are used together with the specification to explain the principles of the present disclosure. Obviously, the accompanying drawings described below are only some embodiments of the present disclosure, and for ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without creative work.

[0025] Figure 1 A schematic diagram of a cross-sectional structure of an array substrate in an embodiment of the present disclosure.

[0026] Figure 2 FIG. 4 is a schematic diagram of another cross-sectional structure of an array substrate in an embodiment of the present disclosure.

[0027] Figure 3 Schematic diagram of the structure of the conductive wire in the embodiment of the present disclosure.

[0028] Figure 4 Schematic diagram of the conductive structure in the embodiment of the present disclosure.

[0029] Figure 5 It is a schematic diagram of the cross-sectional structure of the transition conductive portion in the embodiment of the present disclosure.

[0030] Figure 6 A schematic diagram of a cross-sectional structure of a liquid crystal display panel in an embodiment of the present disclosure.

[0031] Figure 7FIG. 4 is another schematic diagram of a cross-sectional structure of a liquid crystal display panel in an embodiment of the present disclosure.

[0032] Figure 8 FIG. 4 is a schematic diagram of the cross-sectional structure of the side support portion of the liquid crystal display panel after being bent in the embodiment of the present disclosure.

[0033] Fig. 9 Schematic diagram of the cross-sectional structure of the display device in the embodiment of the present disclosure.

[0034] Fig.10 It is a schematic cross-sectional structure diagram of a light shielding layer provided in a display device in an embodiment of the present disclosure.

[0035] Fig.11 It is a schematic cross-sectional structure diagram of a heat-conducting layer provided in a display device in an embodiment of the present disclosure.

[0036] Description of reference numerals:

[0037] 1. Array substrate;

[0038] 11. a first rigid substrate; 11a. a rigid substrate film layer;

[0039] 12. flexible substrate; 121. main bearing portion; 122. side bearing portion;

[0040] 13. Circuit function layer; 131. Pixel circuit portion; 132. Transition conductive portion; 1321. Conductive structure; 1322. Conductive wire; 1323. Bend segment; 1324. First collection conductive wire; 1325. Second collection conductive wire; 1326. Insulating film layer; 1327. Parallel node; 133. Driving circuit portion;

[0041] 2. Liquid crystal display panel; 21. Counter substrate; 22. Frame sealant; 23. Accommodating cavity; 24. Liquid crystal molecules; 25. Encapsulation layer;

[0042] 3. Display device; 31. Backlight module; 311. Light guide plate; 312. Light-emitting component; 32. Shading layer; 33. Heat-conducting layer. DETAILED DESCRIPTION

[0043] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be more comprehensive and complete and will fully convey the concept of the example embodiments to those skilled in the art.

[0044] In addition, the described features, structures or characteristics may be combined in one or more embodiments in any suitable manner. In the following description, many specific details are provided to provide a full understanding of the embodiments of the present disclosure. However, those skilled in the art will appreciate that the technical solutions of the present disclosure may be practiced without one or more of the specific details, or other methods, components, devices, steps, etc. may be adopted. In other cases, known methods, devices, implementations or operations are not shown or described in detail to avoid blurring the various aspects of the present disclosure.

[0045] The present disclosure is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the technical features involved in the various embodiments of the present disclosure described below can be combined with each other as long as they do not conflict with each other. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present disclosure, and should not be understood as limiting the present disclosure.

[0046] like Figure 1 and Figure 2 As shown, the present disclosure provides an array substrate 1, which includes: a first rigid substrate 11, a flexible substrate 12 and a circuit function layer 13, the front side of the first rigid substrate 11 is used to support an opposing substrate 21; the flexible substrate 12 has a main bearing portion 121 located on the front side of the first rigid substrate 11 and a side bearing portion 122 bent to the side of the first rigid substrate 11.

[0047] It should be noted that the front surface of the first rigid base 11 refers to a surface of the first rigid base 11 facing the counter base 21 , and the side surface of the first rigid base 11 refers to a surface surrounding the front surface of the first rigid base 11 .

[0048] Specifically, the main bearing portion 121 of the flexible substrate 12 has an orthographic projection on the first rigid substrate 11 that covers the front surface of the first rigid substrate 11, and the side bearing portion 122 of the flexible substrate 12 is connected to the main bearing portion 121, and the side bearing portion 122 is bent at the connection with the main bearing portion 121, so that the side bearing portion 122 on the first rigid substrate 11 can cover the side surface of the first rigid substrate 11.

[0049] The circuit function layer 13 is formed on a side of the flexible substrate 12 away from the first rigid substrate 11. The circuit function layer 13 has a pixel circuit portion 131, a transition conductive portion 132 and a driving circuit portion 133. The pixel circuit portion 131 is formed on the main bearing portion 121, and the driving circuit portion 133 is formed on the side bearing portion 122. The transition conductive portion 132 is bent, and one end of the transition conductive portion 132 is electrically connected to the pixel circuit portion 131, and the other end is electrically connected to the driving circuit portion 133.

[0050] Specifically, the orthographic projection of the pixel circuit portion 131 on the first rigid substrate 11 is located in the main bearing portion 121, and the orthographic projection of the driving circuit portion 133 on the first rigid substrate 11 is located in the side bearing portion 122. A bending inflection point is formed at the connection between the main bearing portion 121 and the side bearing portion 122, so that the transition conductive portion 132 formed on the flexible substrate 12 and used to connect the pixel circuit portion 131 and the driving circuit portion 133 is bent at the corresponding bending inflection point of the flexible substrate 12 and forms a bending shape. When forming the transition conductive portion 132, the bending shape of the transition conductive portion 132 can be adapted to the shape of the bending inflection point at the connection between the main bearing portion 121 and the side bearing portion 122, so that the transition conductive portion 132 can be tightly connected to the flexible substrate 12, so as to improve the tightness of the connection between the circuit function layer 13 and the flexible substrate 12, and further improve the stability and reliability of the structure of the array substrate 1.

[0051] For example, the embodiment of the present disclosure may first provide a rigid substrate film layer 11a, form a flexible substrate 12 on the front of the rigid substrate film layer 11a, and form a circuit function layer 13 on the side of the flexible substrate 12 away from the rigid substrate film layer 11a. The rigid substrate film layer 11a is processed by cutting and laser processing to form a first rigid substrate 11, wherein the front of the formed first rigid substrate 11 on the circuit function layer 13 can overlap with the main bearing portion 121 on the circuit function layer 13. The side bearing portion 122 is bent, and the bending direction is the direction in which the flexible substrate 12 approaches the first rigid substrate 11. After bending, the side bearing portion 122 can cover the side of the first rigid substrate 11. Since the circuit function layer 13 is formed on the flexible substrate 12, when the side bearing portion 122 is bent, the driving circuit portion 133 and the transition conductive portion 132 formed on the side bearing portion 122 are also bent. The bent side support portion 122 and the driving circuit portion 133 may be parallel or approximately parallel to the side surface of the first rigid substrate 11 .

[0052] The material forming the first rigid substrate 11 may include glass, bismaleimide triazine resin (BT), ceramics and the like, but is not limited thereto. Other materials with good mechanical strength and stability may be used as the material for making the first rigid substrate 11 in the embodiment of the present disclosure.

[0053] In addition, the flexible substrate 12 may include materials such as polyvinyl alcohol (PVA), polyester (PET), polyimide (PI), polyethylene naphthalate (PEN), paper, textile materials, etc., but is not limited thereto. Other materials with good flexibility and fatigue resistance can be used as materials for making the flexible substrate 12 in the embodiments of the present disclosure.

[0054] It should be noted that, generally, the length of the driving circuit portion 133 is much greater than the thickness of the driving circuit portion 133. For example, the length of the driving circuit portion 133 in the embodiment of the present disclosure is greater than 5000 μm, and the thickness of the driving circuit portion 133 is 1 μm. Before the side bearing portion 122 is bent, the frame width of the array substrate 1 is the distance between the side of the pixel circuit portion 131 close to the transition conductive portion 132 and the side of the driving circuit portion 133 away from the transition conductive portion 132, and the frame width of the array substrate 1 is greater than 5000 μm. After the side bearing portion 122 is bent, the frame width of the array substrate 1 is the distance between the side of the pixel circuit portion 131 close to the transition conductive portion 132 and the side of the driving circuit portion 133 away from the first rigid substrate 11, and the frame width of the array substrate 1 is greatly reduced. Therefore, the embodiment of the present disclosure can facilitate the array substrate 1 to achieve a narrow frame by disposing the circuit function layer 13 on the flexible substrate 12 and bending the side bearing portion 122.

[0055] Furthermore, due to the poor mechanical strength of the flexible substrate 12, when the circuit function layer 13 is formed on the flexible substrate 12, it is difficult to provide a good support effect for the circuit function layer 13 relying solely on the flexible substrate 12, which causes the circuit function layer 13 to be easily deformed, thereby reducing the stability and reliability of the array substrate 1. In the embodiment of the present disclosure, a first rigid substrate 11 is arranged on a side of the flexible substrate 12 away from the circuit function layer 13, and the main bearing portion 121 of the flexible substrate 12 is supported by the first rigid substrate 11. While not affecting the bending of the side bearing portion 122 of the flexible substrate 12 and the driving circuit portion 133 of the circuit function layer 13 to the side of the first rigid substrate 11, the support strength of the pixel circuit portion 131 of the circuit function layer 13 and the opposing substrate 21 can be ensured, so that the cell thickness between the array substrate 1 and the opposing substrate 21 can be ensured to be stable. In this way, when the array substrate 1 is applied to the liquid crystal display panel 2, the deflection angle of the liquid crystal molecules 24 changes due to the change of the cell thickness, thereby preventing the occurrence of abnormal problems such as uneven display brightness of the liquid crystal display panel 2. That is, the array substrate provided by the present disclosure can achieve a narrow frame and ensure a stable cell thickness, thereby ensuring a display effect.

[0056] It should be noted that the side bearing portion 122 in the embodiment of the present disclosure can be arranged around the side of the main bearing portion 121, but is not limited to this. The side bearing portion 122 can also be arranged around part of the side of the main bearing portion 121, and can be set specifically according to actual conditions.

[0057] For example, the main bearing portion 121 in the embodiment of the present disclosure may be rectangular, and the side bearing portion 122 may be disposed only on two shorter opposite sides of the main bearing portion 121. Since the driving circuit portion 133 is disposed on the side bearing portion 122, the driving circuit portion 133 on the circuit function layer 13 is also formed only on two opposite sides of the pixel circuit portion 131.

[0058] In order to reduce the risk of the circuit in the circuit function layer 13 being subjected to bending stress and breaking when the flexible substrate and the circuit function layer 13 are bent, the transition conductive portion 132 in the embodiment of the present disclosure includes at least one conductive structure 1321. When there are multiple conductive structures 1321, different conductive structures 1321 can be connected to different signals respectively.

[0059] like Figures 3 to 5 As shown, the conductive structure 1321 includes at least one conductive wire 1322, and the conductive wire 1322 has a plurality of bending segments 1323 connected in sequence. By connecting the plurality of bending segments 1323 to form the conductive wire 1322, the bending resistance of the conductive wire 1322 can be improved. When the circuit function layer 13 is bent, the conductive wire 1322 can distribute the bending stress received by the conductive wire 1322 to each bending segment 1323, and release the bending stress received by the conductive wire 1322 through each bending segment 1323, thereby reducing or avoiding the stress concentration phenomenon of the conductive wire 1322, and reducing or avoiding the risk of the conductive wire 1322 breaking.

[0060] Specifically, the conductive line 1322 in the embodiment of the present disclosure may be made of metal materials such as copper and aluminum, but is not limited thereto. Other materials that can achieve electrical connection between the driving circuit portion 133 and the pixel circuit portion 131 may be included in the scope of the embodiment of the present disclosure.

[0061] In addition, each bending segment 1323 in the conductive wire 1322 may be in a snake-like shape, a sawtooth-like shape, etc., which may be determined according to actual conditions.

[0062] Furthermore, the bending directions of two adjacent bending sections 1323 in the conductive wire 1322 can be opposite to each other, so as to enhance the ability of the bending section 1323 to disperse the bending stress on the conductive wire 1322, reduce the stress concentration problem of the conductive wire 1322, reduce the possibility of the conductive wire 1322 breaking, and thus extend the service life of the conductive wire 1322. However, the present invention is not limited thereto, and the bending directions of two adjacent bending sections 1323 in the conductive wire 1322 can also be the same, which can be determined according to actual conditions.

[0063] Only one conductive line 1322 may be provided in the conductive structure 1321, but the present invention is not limited thereto, and a plurality of conductive lines 1322 may be provided in the conductive structure 1321. When a plurality of conductive lines 1322 are provided in the conductive structure 1321, any two conductive lines 1322 may be connected to each other at the end points of the bending section 1323 to form a plurality of parallel nodes 1327 arranged at intervals.

[0064] Taking the conductive structure 1321 having two conductive lines 1322 as an example, the endpoints of at least two bending segments 1323 in one conductive line 1322 are connected to the endpoints of at least two bending segments 1323 in another conductive line 1322 in a one-to-one correspondence, and form at least two spaced parallel nodes 1327. However, it is not limited thereto, and the number of conductive lines 1322 in the conductive structure 1321 may also be three, four, five, six, etc., which may be determined according to actual conditions.

[0065] In the embodiment of the present disclosure, a plurality of conductive wires 1322 are arranged in the conductive structure 1321. When the transition conductive portion 132 is bent, the conductive structure 1321 can distribute the bending stress it is subjected to to each conductive wire 1322. Each conductive wire 1322 distributes the bending stress to each bending segment 1323, thereby reducing the risk of stress concentration in the conductive wire 1322. The bending resistance of the conductive structure 1321 can be enhanced to reduce the possibility of breakage of the conductive wire 1322 and extend the service life of the conductive wire 1322. In addition, since the multiple conductive wires 1322 in the conductive structure 1321 are arranged in parallel at the end points of the bending section 1323, when the bending section 1323 of one of the conductive wires 1322 breaks, the other conductive wires 1322 connected to the conductive wire 1322 can still release the bending stress at the corresponding position at the corresponding bending section 1323, and can maintain the electrical connection between the driving circuit part 133 and the pixel circuit part 131, while reducing the possibility of the conductive wire 1322 breaking and ensuring the stability of the operation of the array substrate 1.

[0066] It should be noted that the conductive structure 1321 may be provided with all the same conductive lines 1322 , or may be provided with different conductive lines 1322 , which may be determined according to actual conditions.

[0067] For example, when all the conductive wires 1322 in the conductive structure 1321 are the same, each end point of the bending segment 1323 in one of the conductive wires 1322 can be connected to each end point of the bending segment 1323 in another conductive wire 1322 in a one-to-one correspondence, and multiple conductive wires 1322 are arranged in parallel to form a plurality of parallel nodes 1327 arranged at intervals. Figure 4As shown, when the bending segments 1323 on the two conductive lines 1322 are both sawtooth-shaped, the two conductive lines 1322 are connected to each other to form a plurality of sequentially arranged rhombuses.

[0068] In addition, the conductive structure 1321 may also include a first collecting conductive line 1324 and a second collecting conductive line 1325, wherein the first collecting conductive line 1324 is formed on the main bearing portion 121, one end of the first collecting conductive line 1324 is electrically connected to the pixel circuit portion 131, and the other end is connected to the parallel node 1327 closest to the pixel circuit portion 131; the second collecting conductive line 1325 is formed on the side bearing portion 122, one end of the second collecting conductive line 1325 is electrically connected to the driving circuit portion 133, and the other end is connected to the parallel node 1327 closest to the driving circuit portion 133.

[0069] In the embodiment of the present disclosure, by connecting the first collecting conductive line 1324 to the parallel node 1327 closest to the pixel circuit unit 131 and connecting the second collecting conductive line 1325 to the parallel node 1327 closest to the driving circuit unit 133, the length of the first collecting conductive line 1324 and the second collecting conductive line 1325 can be reduced to reduce the manufacturing cost of the array substrate 1. At the same time, by using the first collecting conductive line 1324 to realize the connection between the parallel node 1327 and the pixel circuit unit 131, and by using the second collecting conductive line 1325 to realize the connection between the parallel node 1327 and the driving circuit unit 133, the alignment accuracy when the parallel node 1327 is connected to the pixel circuit unit 131 and the driving circuit unit 133 can be reduced, so as to reduce the requirements for the accuracy of the equipment, thereby reducing the manufacturing difficulty and manufacturing cost of the array substrate 1.

[0070] It should be noted that when the conductive structure 1321 has two identical conductive wires 1322, and the endpoints of the bending sections 1323 located at the two end points of the two conductive wires 1322 are connected to each other, the parallel nodes 1327 formed at the two end points of the two conductive wires 1322 are respectively parallel nodes 1327 connected to the first collecting conductive wire 1324 and the second collecting conductive wire 1325.

[0071] Furthermore, the step of forming the transition conductive portion 132 in the embodiment of the present disclosure may include: forming a conductive structure 1321 between the pixel circuit portion 131 and the driving circuit portion 133; when there is only one conductive line 1322 in the conductive structure 1321, one end of the conductive line 1322 may be directly connected to the pixel circuit portion 131, and the other end of the conductive line 1322 may be connected to the driving circuit portion 133. When there are multiple conductive wires 1322 in the conductive structure 1321, the endpoints of the bending sections 1323 in each conductive wire 1322 are first connected to form a plurality of parallel nodes 1327 arranged at intervals, and then a first collecting conductive wire 1324 is formed on the main bearing portion 121, and one end of the first collecting conductive wire 1324 is electrically connected to the pixel circuit portion 131, and the other end is connected to the parallel node 1327 closest to the pixel circuit portion 131; a second collecting conductive wire 1325 is formed on the side bearing portion 122, and one end of the second collecting conductive wire 1325 is electrically connected to the driving circuit portion 133, and the other end is connected to the parallel node 1327 closest to the driving circuit portion 133, so that the pixel circuit portion 131 and the driving circuit portion 133 can be electrically connected through the conductive structure 1321 on the transition conductive portion 132.

[0072] However, the present disclosure is not limited to this. The parallel node 1327 closest to the pixel circuit unit 131 may be directly connected to the pixel circuit unit 131, and the parallel node 1327 closest to the driving circuit unit 133 may be directly connected to the driving circuit unit 133, so as to reduce the process of forming the first collecting conductive line 1324 and the second collecting conductive line 1325, thereby simplifying the manufacturing process of the array substrate 1.

[0073] In addition, if Figure 5 As shown, in the embodiment of the present disclosure, an insulating film layer 1326 may be provided at the transition conductive portion 132 to isolate the conductive structure 1321 from other conductive elements, thereby avoiding mutual interference between the conductive structure 1321 and the circuits on other conductive elements, so as to improve the safety and stability of the use of the array substrate 1.

[0074] When forming the transition conductive portion 132, the conductive structure 1321 may be formed first, and then an insulating film layer 1326 may be formed on the side of the conductive structure 1321 facing away from the flexible substrate 12, but the present invention is not limited thereto. The insulating film layer 1326 may be formed between the pixel circuit portion 131 and the driving circuit portion 133 first, and then the conductive structure 1321 may be formed within the insulating film layer 1326.

[0075] It should be noted that the insulating film layers 1326 in the circuit function layer 13 can all be organic film layers, that is, the materials of the insulating film layers 1326 in the circuit function layer 13 are all made of organic materials. The insulating film layers 1326 made of organic materials can provide flexible protection for the conductive wires 1322 to reduce the possibility of the conductive wires 1322 breaking due to stress concentration when the transition conductive part 132 is bent, thereby improving the circuit stability of the array substrate 1 and extending the service life of the array substrate 1.

[0076] like Figures 6 to 8 As shown, the present disclosure provides a liquid crystal display panel 2, including liquid crystal molecules 24, an opposing substrate 21, a sealing glue 22 and an array substrate 1 as described above, wherein the opposing substrate 21 may include a base formed of glass, wherein the opposing substrate 21 is supported on the front side of the array substrate 1 by the sealing glue 22, and forms a receiving cavity 23 with the array substrate 1, and the liquid crystal molecules 24 are filled in the receiving cavity 23.

[0077] Specifically, after forming the array substrate 1, glue can be applied on the front surface of the array substrate 1 to form a sealant 22. The sealant is supported between the array substrate 1 and the counter substrate 21. While forming a receiving space for receiving the liquid crystal molecules 24 to realize the display of the liquid crystal display panel 2, the sealant 22 can also form a support between the array substrate 1 and the counter substrate 21 to maintain the stability of the receiving cavity 23 structure, reduce the possibility of deformation of the receiving cavity 23 and change of the deflection angle of the liquid crystal molecules 24, thereby improving the display uniformity of the liquid crystal display panel 2.

[0078] The orthographic projection of the sealing glue 22 on the array substrate 1 can be located in the area of ​​the transition conductive portion 132, thereby preventing the sealing glue 22 from blocking the light emitted from the area where the pixel circuit portion 131 is located, thereby improving the pixel aperture ratio of the liquid crystal display panel 2 and the display brightness of the liquid crystal display panel 2.

[0079] In the embodiment of the present disclosure, the circuit function layer 13 is formed on the flexible substrate 12, so that the driving circuit part 133 can be bent to the side of the substrate along with the side bearing part 122 of the flexible substrate 12, so as to facilitate the design of the narrow frame of the liquid crystal display panel 2. Furthermore, in the embodiment of the present disclosure, the first rigid substrate 11 is arranged on the side of the flexible substrate 12 away from the circuit function layer 13, and the first rigid substrate 11 is used to provide support for the main bearing part 121 of the flexible substrate 12, so that the side bearing part 122 of the flexible substrate 12 and the driving circuit part 133 of the circuit function layer 13 are not affected. The bending to the side of the first rigid substrate 11 can ensure the support strength of the pixel circuit part 131 of the circuit function layer 13 and the opposite substrate 21, so as to ensure the stability of the cell thickness between the array substrate 1 and the opposite substrate 21, so as to avoid the change of the deflection angle of the liquid crystal molecules 24 due to the deformation of the accommodating cavity 23, and the abnormal problems such as uneven display brightness of the liquid crystal display panel 2, so as to ensure the display effect of the liquid crystal display panel 2.

[0080] Furthermore, the liquid crystal display panel 2 may also include a flexible packaging layer 25, which covers the side of the transition conductive portion 132 and the driving circuit portion 133 away from the flexible substrate 12, so as to isolate the transition conductive portion 132 and the driving circuit portion 133 from water vapor in the external environment, thereby reducing or avoiding the possibility of the transition conductive portion 132 and the driving circuit portion 133 being corroded and damaged by the external environment, thereby improving the reliability and stability of the circuit on the array substrate 1 and extending the service life of the liquid crystal display panel 2.

[0081] In the embodiment of the present disclosure, the flexible encapsulation layer 25 can be prepared on the side of the transition conductive portion 132 and the driving circuit portion 133 away from the flexible substrate 12 by atomic layer deposition (ALD) or multilayer deposition (MLD) technology, but is not limited to this. Other technologies that can form the flexible encapsulation layer 25 on the side of the transition conductive portion 132 and the driving circuit portion 133 away from the flexible substrate 12 can be included in the embodiment of the present disclosure.

[0082] It should be noted that the flexible encapsulation layer 25 can be formed by both inorganic materials and organic materials.

[0083] For example, the flexible encapsulation layer 25 in the embodiment of the present disclosure may include a first inorganic layer, an organic layer, and a second inorganic layer stacked, wherein the second inorganic layer is located on the side of the organic layer away from the flexible substrate 12. The first inorganic layer and the second inorganic layer can form a barrier between the transition conductive part 132 and the driving circuit part 133 and the external environment to reduce the risk of the circuits in the transition conductive part 132 and the driving circuit part 133 being corroded and damaged by the external environment. Since the surfaces of the structural layers such as the flexible substrate 12 and the first rigid substrate 11 may be uneven and defective, by providing an organic layer, these unevenness and defects can be filled, so that the surface of the entire flexible encapsulation layer 25 is flatter, which can help reduce the formation of water vapor penetration channels, so as to reduce the possibility of water vapor and oxygen from the external environment entering the transition conductive part 132 and the driving circuit part 133, thereby improving the barrier performance of the flexible encapsulation layer 25. The material of the organic layer is relatively soft and can be used as a buffer layer to reduce the interlayer stress of the flexible encapsulation layer 25 caused by temperature or stress, so as to improve the stability and reliability of the flexible encapsulation layer 25. In addition, the organic layer has good adhesion, which can enhance the bonding force with the inorganic layer, thereby reducing the risk of interlayer separation of the flexible encapsulation layer 25 .

[0084] The organic layer in the flexible encapsulation layer 25 may be made of organic materials such as soluble polytetrafluoroethylene (PFA) and epoxy resin, but is not limited thereto. The organic layer may be made of other organic materials with good chemical stability and thermal stability, which is also within the scope of the disclosed embodiments.

[0085] The first inorganic layer and the second inorganic layer in the flexible encapsulation layer 25 can be made of inorganic materials such as silicon nitride (SiNx) and aluminum oxide, but are not limited thereto. The first inorganic layer and the second inorganic layer can be made of other inorganic materials with good chemical stability and thermal stability, which is also included in the scope of the embodiments of the present disclosure.

[0086] However, it is not limited thereto. The flexible encapsulation layer 25 in the embodiment of the present disclosure may also only include an organic layer, that is, the flexible encapsulation layer 25 is entirely formed of organic materials to improve the bending resistance of the flexible encapsulation layer 25 and reduce the possibility of breakage of the flexible encapsulation layer 25 during the bending process.

[0087] It should be noted that the side bearing portion 122 in the embodiment of the present disclosure can be bent after the flexible packaging layer 25 is formed.

[0088] Specifically, after the array substrate 1 and the counter substrate 21 are arranged in a box, the rigid substrate and the counter substrate 21 can be cut so that the orthographic projections of the cut first rigid substrate 11 and the counter substrate 21 on the flexible substrate 12 are both located on the main bearing portion 121. The side bearing portion 122 is bent. Since the driving circuit portion 133 and the flexible encapsulation layer 25 are both formed on the side bearing portion 122, when the side bearing portion 122 is bent, the driving circuit portion 133 and the flexible encapsulation layer 25 can also be bent at the same time, so that the bending of the multi-layer structure of the side bearing portion 122, the driving circuit portion 133, the flexible encapsulation layer 25, etc. can be achieved through a single bending process, so as to reduce the manufacturing process of the liquid crystal display panel 2 and improve the manufacturing efficiency of the liquid crystal display panel 2. The disclosed embodiment arranges the driving circuit portion 133 on the side bearing portion 122 and bends the driving circuit portion 133 along with the side bearing portion 122 , thereby reducing the frame thickness of the liquid crystal display panel 2, thereby increasing the screen-to-body ratio of the displayed image in the liquid crystal display panel 2, reducing the volume of the liquid crystal display panel 2, and improving the image display effect of the liquid crystal display panel 2.

[0089] Specifically, the length of the driving circuit part 133 in the embodiment of the present disclosure is greater than 5000 μm, the thickness of the driving circuit part 133 and the transition conductive part 132 are both 1 μm, the thickness of the flexible substrate 12 is 5 μm, the width of the flexible encapsulation layer 25 is 2 μm, and the width of the frame sealant 22 is 500 μm. When the side bearing part 122 is not bent, the frame thickness of the liquid crystal display panel 2 is the distance between the side of the frame sealant 22 close to the accommodating cavity 23 and the side of the flexible encapsulation layer 25 away from the frame sealant 22, that is, the frame thickness of the liquid crystal display panel 2 is greater than 5000 μm; when the side bearing part 122 is bent, the frame thickness of the liquid crystal display panel 2 is the distance between the side of the frame sealant 22 close to the accommodating cavity 23 and the side of the flexible encapsulation layer 25 away from the driving circuit part 133, that is, the frame thickness of the liquid crystal display panel 2 is less than 510 μm.

[0090] In addition, the liquid crystal display panel 2 may also include a common electrode and a pixel electrode, and the common electrode and the pixel electrode are arranged on opposite sides of the accommodating cavity 23 to form a voltage field strength in the accommodating cavity 23. By controlling the magnitude of the voltage on the common electrode and the pixel electrode, the deflection angle of the liquid crystal molecules 24 in the accommodating cavity 23 can be controlled, thereby controlling the picture display effect of the liquid crystal display panel 2.

[0091] like Fig. 9As shown, the embodiment of the present disclosure further provides a display device 3, which includes a backlight module 31 and any one of the liquid crystal display panels 2 as described above, wherein the liquid crystal display panel 2 is located on the light emitting side of the backlight module 31, and the backlight module 31 is used to provide light for the liquid crystal display panel 2. By controlling the deflection of the liquid crystal molecules 24, the liquid crystal molecules 24 can refract the light, thereby enabling the display device 3 to realize a picture display function.

[0092] Further, such as Fig.10 As shown, a light shielding layer 32 may be formed between the driving circuit portion 133 and the backlight module 31 .

[0093] It should be noted that when the light from the backlight module 31 directly irradiates the driving circuit portion 133, it may cause the problem of electrical drift on the array substrate 1. The embodiment of the present disclosure forms a light shielding layer 32 between the driving circuit portion 133 and the backlight module 31 to shield the light irradiated to the driving circuit portion 133, thereby reducing the problem of electrical drift on the array substrate 1 and improving the circuit reliability of the array substrate 1.

[0094] Specifically, the side bearing portion 122 and the driving circuit portion 133 can be bent and extended to the side of the backlight module 31, and a shading layer 32 can be formed on the side of the side bearing portion 122 close to the side of the backlight module 31. The side bearing portion 122 can form a support for the shading portion, and the shading portion can be used to block the light of the backlight module 31 from irradiating the driving circuit portion 133; but not limited to this, the embodiment of the present disclosure can also form a shading layer 32 on the side of the side bearing portion 122 close to the driving circuit portion 133, which can be determined according to actual conditions.

[0095] In order to reduce or avoid the possibility of light from the backlight module 31 irradiating the driving circuit unit 133, the embodiment of the present disclosure can also enable the orthographic projection of the light shading layer 32 on the side bearing portion 122 to cover the orthographic projection of the driving circuit unit 133 on the side bearing portion 122, so as to improve the shielding performance of the light shading layer 32 against the light from the backlight module 31 irradiating the driving circuit unit 133, reduce the problem of electrical flutter in the array substrate 1, and improve the circuit reliability of the array substrate 1.

[0096] The light shielding layer 32 in the embodiment of the present disclosure may be a black light shielding tape, but is not limited thereto. Other light shielding materials that can be used to block the light of the backlight module 31 from irradiating the driving circuit portion 133 may be included in the scope of the embodiment of the present disclosure.

[0097] Further, if Fig.11As shown, the backlight module 31 in the embodiment of the present disclosure may include a light guide plate 311 and a light emitting component 312. The light guide plate 311 has a light incident side surface opposite to the driving circuit portion 133 and a light emitting front surface opposite to the first rigid substrate 11. The light emitting component 312 is arranged between the light incident side surface and the side bearing portion 122 to provide light for the liquid crystal display panel 2. A heat conductive layer 33 is arranged between the light emitting component 312 and the side bearing portion 122 to transfer the heat generated by the light emitting component 312 to the driving circuit portion 133.

[0098] It should be noted that in the liquid crystal display panel 2 using the amorphous silicon (a-si) process, since the mobility of the amorphous silicon array substrate 1 is relatively low, the driving circuit unit 133 needs to have a higher driving capability to ensure the display effect and performance of the high-frequency liquid crystal display panel 2. At the same time, in a low temperature environment, the mobility of the amorphous silicon array substrate 1 will decrease, which will in turn affect the low temperature operation capability.

[0099] In the embodiment of the present disclosure, the light-emitting assembly 312 is arranged on the light-incident side and the bracket of the side bearing portion 122, and a heat-conducting layer 33 is arranged between the light-emitting assembly 312 and the side bearing portion 122, so that the heat generated by the light-emitting assembly 312 can be transferred to the driving circuit portion 133 by the heat-conducting layer 33, and the temperature of the driving circuit portion 133 is increased, thereby improving the driving ability of the driving circuit portion 133. In addition, the heat-conducting member can also accelerate the heat dissipation of the light-emitting assembly 312 by absorbing the heat on the light-emitting assembly 312, so as to reduce the risk of shortening the service life of the light-emitting assembly 312 due to the light-emitting assembly 312 working at high temperature for a long time.

[0100] In the embodiment of the present disclosure, the thermal conductive layer 33 can be directly connected to the light-emitting component 312. At the same time, the orthographic projection of the thermal conductive layer 33 on the side bearing portion 122 can also cover the orthographic projection of the light-emitting component 312 on the side bearing portion 122, so as to increase the heat transfer area, improve the heat absorption capacity and heat transfer rate of the thermal conductive layer 33, and thus further improve the driving capability of the driving circuit portion 133 and the heat dissipation rate of the light-emitting component 312.

[0101] The display device 3 may further include a housing, wherein the liquid crystal display panel 2 is disposed in the housing, which can provide stable support for the structure inside the liquid crystal display panel 2 and reduce damage to the internal structure of the liquid crystal display panel 2 caused by the external environment.

[0102] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present disclosure, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0103] It should be noted that "upper", "lower" and the like are only used for distinction to facilitate description and do not limit the orientation of the embodiments of the present invention. In the present disclosure, unless otherwise clearly specified and limited, the terms "assembly", "connection" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral whole; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present disclosure can be understood according to the specific circumstances.

[0104] In the description of this specification, the description with reference to the terms "some embodiments", "exemplarily", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0105] Although the embodiments of the present disclosure have been shown and described above, it is to be understood that the above embodiments are exemplary and cannot be construed as limitations on the present disclosure. A person skilled in the art may change, modify, replace and modify the above embodiments within the scope of the present disclosure. Therefore, any changes or modifications made in accordance with the claims and specification of the present disclosure shall fall within the scope covered by the patent of the present disclosure.

Claims

1. An array substrate, characterized in that: include: a first rigid substrate, wherein the front surface of the first rigid substrate is used to support the counter substrate; A flexible substrate having a main bearing portion located on the front side of the first rigid substrate and a side bearing portion bent to the side of the first rigid substrate; A circuit function layer is formed on a side of the flexible substrate away from the first rigid substrate, the circuit function layer comprises a pixel circuit portion, a transition conductive portion and a driving circuit portion, the pixel circuit portion is formed on the main bearing portion, the driving circuit portion is formed on the side bearing portion, the transition conductive portion is bent, one end of the transition conductive portion is electrically connected to the pixel circuit portion, and the other end is electrically connected to the driving circuit portion.

2. The array substrate according to claim 1, characterized in that: The transition conductive portion includes at least one conductive structure, the conductive structure includes at least one conductive line, and the conductive line has a plurality of bending sections connected in sequence.

3. The array substrate according to claim 2, characterized in that: In the conductive structure: a plurality of conductive wires are provided, and any two of the conductive wires are connected to each other at the end points of the bending sections to form a plurality of parallel nodes arranged at intervals.

4. The array substrate according to claim 3, characterized in that: The conductive structure further comprises: A first collecting conductive line is formed on the main bearing portion, one end of the first collecting conductive line is electrically connected to the pixel circuit portion, and the other end of the first collecting conductive line is connected to a parallel node closest to the pixel circuit portion; The second collecting conductive line is formed on the side bearing portion, one end of the second collecting conductive line is electrically connected to the driving circuit portion, and the other end of the second collecting conductive line is connected to the parallel node closest to the driving circuit portion.

5. The array substrate according to claim 2, characterized in that: The insulating film layers at the transition conductive portion are all organic film layers.

6. A liquid crystal display panel, characterized in that: It comprises liquid crystal molecules, an opposing substrate, a frame sealant and an array substrate as claimed in any one of claims 1 to 5; The counter substrate is supported on the front side of the array substrate by the frame-sealing glue and forms a receiving cavity with the array substrate. The liquid crystal molecules are filled in the receiving cavity, and the orthographic projection of the frame-sealing glue on the array substrate is located in the region of the transition conductive portion.

7. The liquid crystal display panel according to claim 6, characterized in that: The liquid crystal display panel comprises a flexible encapsulation layer, and the flexible encapsulation layer covers the transition conductive portion and a side of the driving circuit portion away from the flexible substrate.

8. A display device, characterized in that: It comprises a backlight module and a liquid crystal display panel as claimed in claim 6 or 7, wherein the liquid crystal display panel is located at the light emitting side of the backlight module.

9. The display device according to claim 8, characterized in that: The side bearing part and the driving circuit part are bent and extended to the side of the backlight module, and a light shielding layer is formed on one side of the side bearing part close to the side of the backlight module, and the light shielding layer is used to block the light of the backlight module from irradiating the driving circuit part.

10. The display device according to claim 8, characterized in that: The backlight module includes a light guide plate and a light-emitting component, the light guide plate has a light-entering side surface opposite to the driving circuit portion and a light-emitting front surface opposite to the first rigid base, the light-emitting component is arranged between the light-entering side surface and the side bearing portion, and a heat-conducting layer is provided between the light-emitting component and the side bearing portion.

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