LED support

Abstract

The utility model relates to the technical field of medical appliances, and discloses an LED support used for bearing an LED chip set, the LED chip set comprises a first chip, a second chip and a third chip, the LED support comprises a support main body used for bearing the second chip and the third chip and a bonding pad main body embedded in the support main body and used for bearing the first chip, and the bonding pad main body is embedded in the support main body and used for bearing the second chip. The bracket main body comprises a fixed frame, a lead frame arranged at the bottom of the fixed frame and a fixed bonding pad extending towards one side of the fixed frame along the lead frame, the fixed bonding pad is horizontally higher than the lead frame, and the fixed bonding pad is used for bearing the second chip and the third chip. A barrier can be formed between the bracket main body and the bonding pad main body to isolate water vapor and limit a water vapor spreading path, so that the conditions of chip short circuit, serial connection and the like caused by contact between the water vapor and the first chip, the second chip and the third chip are avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of LED packaging, in particular to an LED bracket. Background Art

[0002] Light-emitting diodes are referred to as LEDs. Made of compounds containing gallium (Ga), arsenic (As), phosphorus (P), nitrogen (N), etc., they can radiate visible light when electrons and holes recombine, so they can be used to make light-emitting diodes, which are used as indicator lights in circuits and instruments, or to form text or digital displays. Gallium arsenide diodes emit red light, gallium phosphide diodes emit green light, silicon carbide diodes emit yellow light, and gallium nitride diodes emit blue light. Due to their chemical properties, they are divided into organic light-emitting diodes OLED and inorganic light-emitting diodes LED. LEDs have many advantages such as high light efficiency, long service life, energy saving, and environmental protection. They are increasingly widely used in many fields, such as indoor lighting, outdoor lighting, backlight sources, etc.

[0003] Conventional LED positive RGB lamp beads are usually arranged vertically or horizontally, with a metal pad at the bottom. The red light is connected to the upper and lower P / N pole structures by conductive glue, with a height of 130-150um. The green and blue chips have P / N poles on the chip surface and are fixed with insulating glue.

[0004] However, the existing LED brackets have poor bonding strength between the bracket hardware and the plastic shell, so water vapor will penetrate into the interior through the gaps between the lamp beads and the lamp feet, causing a large amount of water vapor to accumulate on the metal pads for a long time. When the water vapor accumulates to a certain amount, it will slowly penetrate into the surface of the blue-green chip, causing a short circuit between the P / N poles, causing migration between the positive and negative poles of the chip, or silver on the pad surface to migrate to the side and surface of the chip, also causing a short circuit. This leads to the phenomenon of stringing lights when in use, and the "caterpillar" phenomenon, which is mostly manifested in blue-green chips. Utility Model Content

[0005] Based on this, the purpose of the utility model is to provide an LED bracket, aiming to solve the short-circuit migration phenomenon caused by water vapor accumulation on the chip side or electrode surface during the use of the current LED bracket in the prior art.

[0006] The present utility model provides an LED bracket for carrying an LED chipset, wherein the LED chipset includes a first chip, a second chip and a third chip, and the LED bracket includes a bracket body for carrying the second chip and the third chip, and a pad body embedded in the bracket body for carrying the first chip;

[0007] The bracket body includes a fixing frame, a lead frame arranged at the bottom of the fixing frame, and a fixing pad extending along the lead frame toward one side of the fixing frame. The fixing pad is higher than the lead frame and is used to carry the second chip and the third chip.

[0008] As mentioned above, by using a fixed pad that is higher than the horizontal height of the lead frame, a barrier can be formed between the bracket body and the pad body to isolate water vapor and limit the water vapor spreading path, thereby preventing water vapor from contacting the first chip, the second chip and the third chip respectively to cause chip short circuits, series connection, etc. At the same time, the fixed pad is made of PPA material, which itself has good insulation properties and can further avoid short circuits or series connection between chips, improve the chip packaging quality, and solve the problem of short circuit migration on the chip side or electrode surface due to water vapor accumulation during the use of the current LED bracket.

[0009] In addition, the LED bracket proposed in the embodiment of the utility model may also have the following additional technical features:

[0010] Furthermore, the lead frame is provided with connection grooves around its periphery for accommodating at least a portion of the pad body.

[0011] Furthermore, the bracket body includes a first solder pad, a second solder pad, a third solder pad and a fourth solder pad respectively embedded in the four connection grooves.

[0012] Furthermore, the second pad and the third pad are arranged opposite to each other along the X-axis, the third pad and the fourth pad are arranged in parallel along the Y-axis, and the fourth pad and the second pad have the same structure.

[0013] Furthermore, the first pad is used to support the first chip, and the first pad and the fixed pad are arranged parallel to the Y-axis, so that the first chip on the first pad and the second chip and the third chip on the fixed pad are arranged parallel to the Y-axis.

[0014] Furthermore, the bracket body also includes a fixing platform arranged on the side of the lead frame away from the fixing frame, and a first buckle groove is opened around the fixing platform away from the lead frame, and a second buckle groove connected to the connecting groove is opened between the fixing platform and the lead frame.

[0015] Furthermore, the first solder pad, the second solder pad and the third solder pad all adopt a three-section structural design of a head section, a middle section and a tail section, the head section is embedded in the connecting groove, the middle section is buckled with the second buckling groove, and the tail section is buckled with the first buckling groove. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of a top view of an LED bracket proposed in an embodiment of the utility model;

[0017] Figure 2 This is a bottom-up structural schematic diagram of an LED bracket proposed in an embodiment of the utility model;

[0018] Figure 3 It is a schematic diagram of a partial top plan structure of an LED bracket and a first chip, a second chip and a third chip proposed in an embodiment of the utility model;

[0019] Figure 4 It is a schematic diagram of a partial top view of the structure of a bracket body in an LED bracket proposed in an embodiment of the utility model;

[0020] Figure 5 It is a schematic diagram of a partial bottom view of the structure of a bracket body in an LED bracket proposed in an embodiment of the utility model;

[0021] Figure 6 It is a partial structural schematic diagram of a soldering pad body in an LED bracket proposed in an embodiment of the utility model.

[0022] Description of main component symbols:

[0023]

[0024] The following specific implementation manner will further illustrate the present utility model in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0025] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0026] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0028] See also Figures 1 to 6 , shown is an LED bracket in an embodiment of the utility model, which is used to carry an LED chip group. The LED chip group includes a first chip 3, a second chip 4 and a third chip 5, wherein the first chip 3 is a red chip, the second chip 4 is a green chip, and the third chip 5 is a blue chip. The LED bracket includes a bracket body 1 for carrying the second chip 4 and the third chip 5, and a pad body 2 embedded in the bracket body 1 for carrying the first chip 3. The bracket body 1 includes a fixing frame 11, a lead frame 12 arranged at the bottom of the fixing frame 11, and a fixing pad 14 extending along the lead frame 12 toward one side of the fixing frame 11. The fixing pad 14 is higher in level than the lead frame 12, and the fixing pad 14 is used to carry the second chip 4 and the third chip 5.

[0029] Furthermore, the lead frame 12 is provided with connection grooves 15 for accommodating at least part of the pad body 2. The bracket body 1 includes a first pad 21, a second pad 22, a third pad 23 and a fourth pad 24 respectively embedded in the four connection grooves 15. The second pad 22 and the third pad 23 are arranged opposite to each other along the X-axis, the third pad 23 and the fourth pad 24 are arranged parallel to each other along the Y-axis, and the fourth pad 24 and the second pad 22 have the same structure. The first pad 21 is used to carry the first chip 3. The first pad 21 and the fixed pad 14 are arranged parallel to each other along the Y-axis so that the first chip on the first pad 21 3 and the second chip 4 and the third chip 5 on the fixing pad 14 are arranged in parallel on the Y axis, the bracket body 1 also includes a fixing platform 13 arranged on the side of the lead frame 12 away from the fixing frame 11, the fixing platform 13 is provided with a first buckle groove 16 around the side away from the lead frame 12, and a second buckle groove 17 connected to the connecting groove 15 is provided between the fixing platform 13 and the lead frame 12. The first pad 21, the second pad 22 and the third pad 23 are all designed with a three-section structure of a head section, a middle section and a tail section. The head section is embedded in the connecting groove 15, the middle section is buckled with the second buckle groove 17, and the tail section is buckled with the first buckle groove 16.

[0030] It should be noted that the fixing pad 14 is prepared by an injection molding process, and a boss with a height of 0.05-0.1 mm is formed by injection molding on the side of the lead frame 12 facing the fixing frame 11, and the boss is determined as the fixing pad 14, and the fixing pad 14 is made of an insulating plastic material PPA, wherein PPA is the abbreviation of polyphosphoric acid, i.e. polyphosphoric acid, and PPA has excellent strength, toughness and hardness, and has good heat resistance, chemical resistance and crack resistance.

[0031] In the specific implementation, for the assembly operator of the bracket body 1 and the pad body 2, the head sections of the four pads can be inserted laterally into the second buckle groove 17 in turn and the pads can be adaptively rotated so that the bent part of the head section can completely enter the second buckle groove 17, and then the pads can be continuously pushed so that the middle section of the pads can reach the second buckle groove 17, and the current pads can be adaptively rotated so that the pads and the bracket body 1 are in a vertically parallel state, and then the pads can be pushed in the vertical direction so that the tail section of the pads can be embedded in the first buckle groove 16, and at the same time, the head section can be embedded in the connecting groove 15 and be at the same level as the lead frame 12, and the pads can be connected to the bracket body 1 in turn according to the above steps to complete the assembly of the bracket body 1 and the pad body 2. It should be noted that if Figure 6 As shown, an arc-shaped bending structure design is adopted at each node of the head section, middle section and tail section on the pad that needs adaptive rotation, and the installed pad will be adaptively limited by the connecting groove 15, the first buckle groove 16 and the second buckle groove 17 at the same time, which will generate a certain degree of tension and greatly improve the bonding force between the bracket body 1 and the pad body 2 to ensure the stability of the structure. In addition, in some optional embodiments, the bracket body 1 can also be injection molded around the formed pad body 2.

[0032] The operator can arrange the corresponding first chip 3 on the first pad 21 in a longitudinal or transverse arrangement according to the requirements of the formal RGB lamp beads, and arrange the second chip 4 and the third chip 5 on the fixed pad 14 which is relatively parallel to the first pad 21, so that the first chip 3, the second chip 4 and the third chip 5 are arranged longitudinally on the corresponding pads and implement the LED packaging operation. Further explained, the second pad 22 is connected to the cathode of the third chip 5, the third pad 23 is connected to the cathode of the second chip 4, and the fourth pad 24 is connected to the cathode of the first chip 3. During the packaging process, the fixed pad 14 that is higher than the horizontal height of the lead frame 12 can form a barrier between the first pad 21, the second pad 22, the third pad 23 and the fourth pad 24 to isolate water vapor and limit the water vapor propagation path, thereby preventing water vapor from contacting the first chip 3, the second chip 4 and the third chip 5 respectively to cause chip short circuit, migration, etc. At the same time, the fixed pad 14 is made of PPA material, which itself has good insulation properties and can further avoid short circuit or migration between the chip sides or electrode surfaces, thereby improving the chip packaging quality.

[0033] In summary, by using the fixed pad 14 that is higher than the horizontal height of the lead frame 12, a barrier can be formed between the bracket body 1 and the pad body 2 to isolate water vapor and limit the water vapor spreading path, thereby preventing water vapor from contacting the first chip 3, the second chip 4 and the third chip 5 respectively to cause chip short circuits, series connection, etc. At the same time, the fixed pad 14 is made of PPA material, which itself has good insulation properties and can further avoid short circuits or series connection between chips, thereby improving the chip packaging quality and solving the short circuit migration phenomenon on the chip side or electrode surface due to water vapor accumulation during the use of the current LED bracket.

[0034] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0035] The above-mentioned embodiments only express several implementation methods of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. An LED bracket for carrying an LED chipset, wherein the LED chipset comprises a first chip, a second chip and a third chip, wherein: The LED bracket comprises a bracket body for carrying the second chip and the third chip, and a pad body embedded in the bracket body for carrying the first chip; The bracket body includes a fixing frame, a lead frame arranged at the bottom of the fixing frame, and a fixing pad extending along the lead frame toward one side of the fixing frame. The fixing pad is higher than the lead frame and is used to carry the second chip and the third chip.

2. The LED bracket according to claim 1, characterized in that: The lead frame is provided with connection grooves around its periphery for accommodating at least a portion of the pad body.

3. The LED bracket according to claim 2, characterized in that: The bracket body includes a first soldering pad, a second soldering pad, a third soldering pad and a fourth soldering pad respectively embedded in the four connecting grooves.

4. The LED bracket according to claim 3, characterized in that: The second pad and the third pad are arranged opposite to each other along the X-axis, the third pad and the fourth pad are arranged in parallel along the Y-axis, and the fourth pad and the second pad have the same structure.

5. The LED bracket according to claim 4, characterized in that: The first pad is used to carry the first chip, and the first pad and the fixed pad are arranged parallel to the Y axis, so that the first chip on the first pad and the second chip and the third chip on the fixed pad are arranged parallel to the Y axis.

6. The LED bracket according to claim 5, characterized in that: The bracket body also includes a fixing platform arranged on the side of the lead frame away from the fixing frame, a first buckle groove is opened around the fixing platform away from the lead frame, and a second buckle groove connected to the connection groove is opened between the fixing platform and the lead frame.

7. The LED bracket according to claim 6, characterized in that: The first solder pad, the second solder pad and the third solder pad all adopt a three-section structural design of a head section, a middle section and a tail section, the head section is embedded in the connecting groove, the middle section is buckled with the second buckling groove, and the tail section is buckled with the first buckling groove.

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